Datasheet TDA4671-V1 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of June 1993
File under Integrated Circuits, IC02

1996 Dec 11

INTEGRATED CIRCUITS

TDA4671

Picture Signal Improvement (PSI)
circuit

1996 Dec 11 2

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4671

FEATURES

• Luminance signal delay from 20 to 1100 ns (minimum
step 45 ns)

• Luminance signal peaking with symmetrical overshoots
selectable

• Selectable 2.6 or 5 MHz peaking centre frequency and
degree of peaking (−3, 0, +3 and +6 dB)

• Selectable noise reduction by coring

• Handles negative as well as positive colour-difference

signals

• Selectable Colour Transient Improvement (CTI) to
decrease the colour-difference signal transient times to
those of the high frequency luminance signals

• Selectable 5 or 12 V sandcastle input voltage

• All controls selected via the I

2

C-bus

• Timing pulse generation for clamping and delay time
control synchronized by sandcastle pulse

• Automatic luminance signal delay correction using a
control loop

• Luminance and colour-difference input signal clamping
with coupling capacitor

• 4.5 to 8.8 V supply voltage range

• Minimum of external components.

GENERAL DESCRIPTION

The TDA4671 delays the luminance signal and improves
colour-difference signal transients. The luminance signal
can also be improved by peaking and noise reduction
(coring).

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

P

supply voltage (pins 1 and 5) 4.5 5 8.8 V

I

P(tot)

total supply current 31 41 52 mA

t

d(Y)

Y signal delay time 20 − 1130 ns

V

i(VBS)(p-p)

composite Y input signal (peak-to-peak value,
pin 16)

− 450 640 mV

V

i(CD)(p-p)

colour-difference input signal
(peak-to-peak value)

±(R − Y) on pin 3 − 1.05 1.48 V
±(R − Y) on pin 7 − 1.33 1.88 V

G

Y

gain of Y channel −−1−dB

G

CD

gain of colour-difference channel − 0 − dB

T

amb

operating ambient temperature 0 − 70 °C

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA4671 DIP18 plastic dual in-line package; 18 leads (300 mil) SOT102-1

1996 Dec 11 3

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4671

BLOCK DIAGRAM

handbook, full pagewidth

MED746

BLACK

LEVEL

CLAMP

180

ns

90

ns

45

ns

90

ns

100

ns

BLACK

LEVEL

CLAMP

450

ns

180

ns

control signal

100 nF13100 nF

14

10 nF

3

BLACK LEVEL

CLAMP

−(R − Y)

DIFFERENTIATOR

DIFFERENTIATOR

10 nF

7

BLACK LEVEL

CLAMP

−(B − Y)

V

ref

V

ref

V

ref

FULL-WAVE

RECTIFIER

FULL-WAVE

RECTIFIER

HIGH-PASS

FILTER

+1

−0.5

5 MHz

2.6 MHz

100

ns

90

ns

5 MHz

2.6 MHz

−0.5

V

ref

V

ref

DELAY TIME

CONTROL

BK

SANDCASTLE PULSE

DETECTOR

BLACK LEVEL

CLAMP

sandcastle

5 V/12 V

CTI

on/off

coring

on/off

peaking

frequency

degree of

peaking

I

2

C-BUS RECEIVER

9 10

Y delay

BK

BK, H + V

16

17

I

2

C-BUS

V

ref

V

ref

100 nF

Y

8 18 5

V

P2

= 5 to 8 V

100 nF

2

sandcastle

pulse

SDA

SCL

CORING

PEAKING

CORING

I

2

C-BUS

I

2

C-BUS

I

2

C-BUS

100

nF

100 nF

15

V

P1

= 5 to 8 V

V

ref

GENERATION

1

−(R − Y)

−(B − Y)

Y

11

12

4

6

storage

capacitors

analog switch

analog switch

V

T

comparator

TDA4671

+

+

Fig.1 Block diagram.

1996 Dec 11 4

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4671

PINNING

SYMBOL PIN DESCRIPTION

V

P1

1 positive supply voltage 1

C

DL

2 capacitor of delay time control

V

i(R − Y)

3 ±(R − Y) colour-difference input signal

V

o(R − Y)

4

±(R − Y) colour-difference output
signal

V

P2

5 positive supply voltage 2

V

o(B − Y)

6

±(B − Y) colour-difference output
signal

V

i(B − Y)

7 ±(B − Y) colour-difference input signal
GND2 8 ground 2 (0 V)
SDA 9 I

2

C-bus serial data input/output

SCL 10 I

2

C-bus serial clock input

C

COR

11 coring capacitor

V

oY

12 delayed luminance output signal

C

CLP1

13 black level clamping capacitor 1

C

CLP2

14 black level clamping capacitor 2

C

ref

15 capacitor of reference voltage

V

iY

16 luminance input signal
SAND 17 sandcastle pulse input
GND1 18 ground 1 (0 V)

Fig.2 Pin configuration.

handbook, halfpage

TDA4671

MED747

1
2
3
4
5
6
7
8
9

18
17
16
15
14
13
12
11
10

V

P1

V

P2

C

DL

GND2

SDA

V

i(R − Y)

V

o(R − Y)

V

o(B − Y)

V

i(B − Y)

GND1
SAND
V

iY

V

oY

C

ref

C

CLP2

C

CLP1

C

COR

SCL

1996 Dec 11 5

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4671

FUNCTIONAL DESCRIPTION

The TDA4671 contains luminance signal processing and
colour-difference signal processing. The luminance signal
section comprises a variable, integrated luminance delay
line with luminance signal peaking and a noise reduction
by coring.

The colour-difference section consists of a transient
improvement circuit to decrease the rise and fall times of
the colour-difference signal transients. All functions and
parameters are controlled via the I2C-bus.

Y-signal path

The video and blanking signal is AC-coupled to the input
pin 16. Its black porch is clamped to a DC reference
voltage to ensure the correct operating range of the
luminance delay stage.

The luminance delay line consists of all-pass filter sections
with delay times of 45, 90, 100, 180 and 450 ns
(see Fig.1). The luminance signal delay is controlled via
the I

2

C-bus in steps of 45 ns in the range of 20 to 1100 ns,
this ensures that the maximum delay difference between
the luminance and colour-difference signals is ±22.5 ns.

An automatic luminance delay time adjustment in an
internal control loop (with the horizontal frequency as a
reference) is used to correct changes in the delay time,
due to component tolerances. The control loop is
automatically enabled between the burst key pulses of
lines 16 (330) and 17 (331) during the vertical blanking
interval. The control voltage is stored in capacitor C

DL

connected to pin 2.
The peaking section is using a transversal filter circuit with

selectable centre frequencies of 2.6 and 5.0 MHz.
It provides selectable degrees of peaking of −3, 0, +3 and

+6 dB and noise reduction by coring, which attenuates the
high-frequency noise introduced by peaking.

The output buffer stage ensures a low-ohmic VBS output
signal on pin 12 (<160 Ω). The gain of the luminance
signal path from pin 16 to pin 12 is unity.

An oscillation signal of the delay time control loop is
present on output pin 12 instead of the VBS signal. It is
present during the vertical blanking interval of the burst key
pulses in lines 16 (330) to 18 (332). This sync should not
be applied for synchronization.

Colour-difference signal paths

The colour-difference input signals (on pins 3 and 7) are
clamped to a reference voltage.

Each colour-difference signal is fed to a transient detector
and to an analog signal switch with an attached voltage
storage stage.

The transient detectors consist of differentiators and
full-wave rectifiers. The output voltages of both transient
detectors are added and then compared. The comparator
controls both following analog signal switches
simultaneously.

The analog signal switches are in open position at a
certain value of transient time; the held value (held by
capacitors) is then applied to the outputs. The switches
close to rapidly accept the actual signal levels at the end
of these transients. The improved transient time is
approximately 100 ns long independent of the input
transient time.

Colour-difference paths are independent of the input
signal polarity and have a nominal unity gain.

The CTI functions are switched on and off via the I

2

C-bus.

1996 Dec 11 6

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4671

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134). V

P1

and VP2 as well as GND1 and GND2

connected together.

Note

1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.

THERMAL CHARACTERISTICS

CHARACTERISTICS

V

P1=VP2

= 5 V; nominal video amplitude VVB= 315 mV; tH=64µs; tBK=4µs (burst key); T

amb

=25°C and

measurements taken in Fig.4; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P1

supply voltage (pin 1) 0 8.8 V

V

P2

supply voltage (pin 5) 0 8.8 V

P

tot

total power dissipation 0 0.97 W

T

stg

storage temperature −25 +150 °C

T

amb

operating ambient temperature 0 70 °C

V

ESD

electrostatic handling note 1

for pins 9 and 10 − +300 V

−−500 V

for other pins −±500 V

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air 82 K/W

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P1

supply voltage (pin 1) 4.5 5 8.8 V

V

P2

supply voltage (pin 5) 4.5 5 8.8 V

I

P(tot)

total supply current 31 41 52 mA

Y-signal path

V

i(Y)(p-p)

VBS input signal on pin 16
(peak-to-peak value)

− 450 640 mV

V

16

black level clamping voltage − 3.1 − V

I

16

input current during clamping ±95 −±190 µA

outside clamping −−±0.1 µA

R

16

input resistance outside clamping 5 −−MΩ

C

16

input capacitance − 310pF

t

d(Y)(max)

maximum Y delay time set via I2C-bus 1070 1100 1130 ns

t

d(Y)(min)

minimum Y delay time set via I2C-bus − 20 − ns

1996 Dec 11 7

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4671

∆ t

d(Y)

minimum delay step set via I2C-bus 40 45 50 ns
group delay time difference f = 0.5 to 5 MHz;

maximum delay

− 0 ±25 ns

delay time difference between Y
and colour-difference signals

Y delay;
CTI and peaking off

70 100 130 ns

t

d(peak)

minimum delay time for peaking 185 215 245 ns

G

Y

VBS signal gain measured on
output pin 12 (composite signal,
peak-to-peak value)

Vo/Vi; f = 500 kHz;
maximum delay

−2 −10 dB

I

12

output current (emitter-follower with
constant current source)

source current −1 −−mA
sink current 0.4 −−mA

R

12

output resistance −−160 Ω

f

res

frequency response for maximum delay

f = 0.5 to 3 MHz −2 −10 dB
f = 0.5 to 5 MHz −4 −3 −1dB

LIN signal linearity for α

min/αmax

;

video contents of 315 mV (p-p) V

VBS

= 450 mV (p-p) 0.85 −−−

video contents of 450 mV (p-p) V

VBS

= 640 mV (p-p) 0.60 −−−

Luminance peaking, selected via I

2

C-bus

f

peak

peaking frequency fC1; LCF-bit = 0 4.5 5 5.5 MHz

f

C2

; LCF-bit = 1 2.3 2.6 2.9 MHz

V

peak

peaking amplitude for grade of
peaking (fC amplitude over 0.5 MHz
amplitude)

selectable values −−3−dB

− 0 − dB

− +3 − dB

− +6 − dB

limitation of peaking (positive
amplitude of correction signal
referred to 315 mV)

− 20 − %

V

n(rms)

noise voltage on pin 12
(RMS value)

without peaking;
f=0to5MHz

−−1mV

COR coring of peaking

(coring part referred to 315 mV)

COR-bit = 1 − 20 − %

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1996 Dec 11 8

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4671

Colour-difference paths measured with transient times tr=tf=1µs; t

p H

≥ 1 µs; Vi= 1.33 V (p-p) on

pins 3 and 7 and with burst key pulse t

BK

=4µs

V

i(CD)(p-p)

±(R − Y) input signal
(peak-to-peak value; pin 3)

75% colour bar − 1.05 1.48 V

±(B − Y) input signal
(peak-to-peak value; pin 7)

75% colour bar − 1.33 1.88 V

input transient sensitivity V

3,7

/δt 0.22 −−V/µs

V

3,7

internal clamping voltage level − 2.45 − V

I

3,7

input current outside clamping −−±1µA

during clamping ±100 −±190 µA

C

3,7

input capacitance − 612pF

V

4,6

DC output voltage − 2 − V

∆V

4,6

output offset voltage RS≤ 300 Ω; note 1 −−±5mV

during and after storage time −−±18 mV

V

spike

spurious spike signals on pins 4
and 6

RS≤ 300 Ω; note 1 −−±30 mV

I

4,6

output current (emitter-follower with
constant current source)

source current −1 −−mA
sink current 0.4 −−mA

R

4,6

output resistance −−100 Ω

G

v

signal gain in each path Vo/V

i

−1 0 +1 dB

∆G

v

gain difference −(R − Y)/−(B − Y) − 0 ±0.3 dB

LIN signal linearity for α

min/αmax

;

nominal signal V

i

= 1.33 V (p-p) 0.90 −−−

+3 dB signal V

i

= 1.88 V (p-p) 0.65 −−−

∆V

o

signal reduction at higher frequency
(output signal ratio Vi/Vo)

signal with t

p H

= 50 ns;

tr=tf=1µs

−1.5 −−dB

Sandcastle pulse, input voltage selectable via I

2

C-bus

V

17

input voltage threshold for H and V
sync

SC5-bit = 0 (12 V) 1.1 1.5 1.9 V

input voltage threshold for burst SC5-bit = 0 (12 V) 5.5 6.5 7.5 V
input voltage threshold for H and V

sync

SC5-bit = 1 (5 V) 1.1 1.5 1.9 V

input voltage threshold for burst SC5-bit = 1 (5 V) 3.0 3.5 4.0 V

R

17

input resistance +12 V input level 30 40 50 kΩ

+5 V input level 15 20 25 kΩ

C

17

input capacitance − 48pF

t

BK

burst key pulse width 3.0 4.0 4.6 µs

t

d

leading edge delay for clamping
pulse

referred to t

BK

− 1 −µs

n

p

number of required burst key pulses
vertical blanking interval

note 2 4 − 31 −

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1996 Dec 11 9

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4671

Notes

1. Crosstalk on output, measured in the unused channel when the other channel is provided with a nominal input signal

(CTI active).

2. A number of more than 31 burst key pulses repeats the counter cycle of delay time control.

I

2

C-BUS FORMAT

Notes

1. S = START condition.

2. SLAVE ADDRESS = 1000 100X.

3. ACK = acknowledge, generated by the slave.

4. SUBADDRESS = subaddress byte, see Table 1.

5. DATA = data byte, see Table 1.

6. P = STOP condition.

7. X = read/write control bit.

X = 0, order to write (the circuit is slave receiver).
X = 1, order to read (the circuit is slave transmitter).

If more than 1 byte of DATA is transmitted, then auto-increment of the subaddress is performed.

Table 1 I

2

C-bus transmission; see Table 2

I

2

C-bus control, SDA and SCL

V

IH

HIGH level input voltage on pins 9
and 10

3 − 5V

V

IL

LOW level input voltage 0 − 1.5 V

I

9,10

input current −−±10 µA

V

o(ACK)

output voltage at acknowledge on
pin 9

I

o(ACK)

=3mA −−0.4 V

I

o(ACK)

output current at acknowledge on
pin 9

sink current 3 −−mA

S

(1)

SLAVE ADDRESS

(2)

ACK

(3)

SUBADDRESS

(4)

ACK

(3)

DATA

(5)

P

(6)

FUNCTION SUBADDRESS

DATA

D7 D6 D5 D4 D3 D2 D1 D0

Y delay/CTI/SC 00010000 0 SC5 CTI DL4 DL3 DL2 DL1 DL0
Peaking and coring 00010001 COR PEAK LCF 0 0 0 PCON1 PCON0

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1996 Dec 11 10

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4671

Table 2 Function of the bits

Table 3 Peaking amplification

Remarks to the subaddress bytes

Subaddresses 00H to 0FH are reserved for colour decoders and RGB processors.
Subaddresses 10 and 11 only are acknowledged.
General call address is not acknowledged.
Power-on-reset: D7 to D1 bits of data bytes are set to logic 0, D0 bit is set to logic 1.

DATA FUNCTION LOGIC 1 LOGIC 0

DL0 set delay in luminance channel 45 ns 0 ns
DL1 90 ns 0 ns
DL2 180 ns 0 ns
DL3 180 ns 0 ns
DL4 450 ns 0 ns
CTI set colour transient improvement active inactive
SC5 select sandcastle pulse voltage +5 V +12 V
LCF set peaking frequency response 2.6 MHz 5.0 MHz
PEAK set peaking delay active inactive
COR set coring control active inactive
PCONx set peaking amplification see Table 3

PCON1 PCON0

GRADE OF PEAKING

(dB)

00 −3
01 0
10 +3
11 +6

1996 Dec 11 11

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4671

INTERNAL CIRCUITRY

handbook, full pagewidth

MED749

+

+

+

+

13

C

CLP

+

14

C

CLP

15

C

ref

C

COR

11

SCL10

12

Y output

9

SDA

8

GND

7

CD input

6

CD output

5

V

P

+

+

4

CD output

3

CD input

2

1

18

C

DL

+

+

+

+

16

Y input

17

SC

TDA4671

V

P

GND

all input

and output

pins without

pins 9 and 10

Fig.3 Internal circuit.

1996 Dec 11 12

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4671

handbook, full pagewidth

MED748

V

P1

+5 V

V

B

18

17

16

15

14

13

12

11

10

V

P2

C

DL

GND2

SDA

SDA

I

2

C-bus

0.1 µF

0.1 µF

15 Ω

TDA4671

V

i(R − Y)

V

o(R − Y)

V

o(B − Y)

V

i(B − Y)

GND1

SAND

sandcastle
pulse input

(VBS)

(VBS)

V

iY

V

oY

C

ref

C

CLP2

C

CLP1

C

COR

SCL

1

2

3

4

5

6

7

8

9

0.1 µF

0.1 µF

0.1 µF

0.1 µF

10 nF

10 nF

47 µF

TEST AND APPLICATION INFORMATION

Fig.4 Test and application circuit.

1996 Dec 11 13

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4671

PACKAGE OUTLINE

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

SOT102-1

93-10-14
95-01-23

UNIT

A

max.

12

b

1

(1) (1)

(1)

b

2

cD E e M

Z

H

L

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

min.

A

max.

b

max.

w

M

E

e

1

1.40

1.14

0.53

0.38

0.32

0.23

21.8

21.4

6.48

6.20

3.9

3.4

0.2542.54 7.62

8.25

7.80

9.5

8.3

0.854.7 0.51 3.7

inches

0.055

0.044

0.021

0.015

0.013

0.009

1.40

1.14

0.055

0.044

0.86

0.84

0.26

0.24

0.15

0.13

0.010.10 0.30

0.32

0.31

0.37

0.33

0.0330.19 0.020 0.15

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

b

2

e

D

A

2

Z

18

1

10

9

b

E

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

DIP18: plastic dual in-line package; 18 leads (300 mil)

SOT102-1

1996 Dec 11 14

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4671

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

2

C COMPONENTS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

2

C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

1996 Dec 11 15

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4671

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1996 SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. [phone], Fax. [phone]

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. [phone], Fax. [phone]

Norway: Box 1, Manglerud 0612, OSLO,
Tel. [phone], Fax. [phone]

Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]/xxx
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]
Middle East: see Italy

Printed in The Netherlands 537021/1200/03/pp16 Date of release: 1996 Dec 11 Document order number: 9397 750 01472