Datasheet TDA4670 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA4670

Picture Signal Improvement (PSI)
circuit

Product specification
Supersedes data of May 1991
File under Integrated Circuits, IC02

1996 Dec 11

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4670

FEATURES

• Luminance signal delay from 20 to 1100 ns (minimum
step 45 ns)

• Luminance signal peaking with selectable symmetrical
overshoots

• 2.6 or 5 MHz peaking centre frequency and selectable
degree of peaking (−3, 0, +3 and +6 dB)

• Selectable noise reduction by coring

• Handles negative and positive colour-difference signals

• Selectable Colour Transient Improvement (CTI) to

decrease the colour-difference signal transient times to
those of the high frequency luminance signals

• Selectable 5 or 12 V sandcastle input voltage

2

• All controls selected via the I

C-bus

• Timing pulse generation for clamping and delay time
control synchronized by sandcastle pulse

• Automatic luminance signal delay correction using a
control loop

• Luminance and colour-difference input signal clamping
with coupling capacitor

• 4.5 to 8.8 V supply voltage range

• Minimum of external components required.

GENERAL DESCRIPTION

The TDA4670 delays the luminance signal and improves
colour-difference signal transients. Additionally, the
luminance signal can be improved by peaking and noise
reduction (coring).

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

P

I

P(tot)

t

d(Y)

V

i(VBS)

V

i(CD)(p-p)

supply voltage (pins 1 and 5) 4.5 5 8.8 V
total supply current 31 41 52 mA
Y signal delay time 20 − 1130 ns
composite Y input signal (peak-to-peak value, pin 16) − 450 640 mV
colour-difference input signal (peak-to-peak value)

±(R − Y) on pin 3 − 1.05 1.48 V
±(R − Y) on pin 7 − 1.33 1.88 V

G

Y

G

CD

T

amb

gain of Y channel −−1−dB
gain of colour-difference channel − 0 − dB
operating ambient temperature 0 − 70 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA4670 DIP18 plastic dual in-line package; 18 leads (300 mil) SOT102-1

1996 Dec 11 2

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4670

BLOCK DIAGRAM

nF

100 nF

15

1

= 5 to 8 V

P

V

SCL

ref

V

GENERATION

degree of

peaking

peaking

frequency

coring

on/off

ref

V

CORING

+

−0.5

5 MHz

90

2.6 MHz

ns

100

11

CORING

−0.5

5 MHz

C-BUS

2

I

2.6 MHz

PEAKING

C-BUS

2

I

BLACK

+

+1

LEVEL

100

CLAMP

ns

Y

12

TDA4670

analog switch

capacitors

comparator

−(B − Y)
6

MSA557

analog switch

= 5 to 8 V

P1

V

−(R − Y)
4

storage

C-BUS

2

I

T

V

9 10

SDA

100 nF

2

sandcastle

pulse

17

CTI

on/off

C-BUS RECEIVER

2

I

ref

5 V/12 V

V

sandcastle

Y delay

ref

CONTROL

V

DELAY TIME

C-BUS

2

I

BK, H + V

BK

DETECTOR

SANDCASTLE PULSE

ns

100

ref

V

CLAMP

BLACK LEVEL

16

control signal

ns

90

ns

45

ns

90

ns

180

LEVEL

BLACK

ns

180

ns

450

CLAMP

V

FILTER

HIGH-PASS

8 18 5

handbook, full pagewidth

Fig.1 Block diagram.

RECTIFIER

FULL-WAVE

ref

V

CLAMP

14

BLACK LEVEL

3

ref

RECTIFIER

FULL-WAVE

DIFFERENTIATOR

DIFFERENTIATOR

BK

BLACK LEVEL

7

CLAMP

ref

V

100 nF

Y

1996 Dec 11 3

100 nF13100 nF

−(R − Y)

10 nF

10 nF

−(B − Y)

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4670

PINNING

SYMBOL PIN DESCRIPTION

V

P1

C

DL

V

i(R − Y)

V

o(R − Y)

V

P2

V

o(B − Y)

V

i(B − Y)

GND2 8 ground 2 (0 V)
SDA 9 I
SCL 10 I
C

COR

V

oY

C

CLP1

C

CLP2

C

ref

V

iY

SAND 17 sandcastle pulse input
GND1 18 ground 1 (0 V)

1 positive supply voltage 1
2 capacitor of delay time control
3 ±(R − Y) colour-difference input signal
4 ±(R − Y) colour-difference output

signal
5 positive supply voltage 2
6 ±(B − Y) colour-difference output

signal
7 ±(B − Y) colour-difference input signal

2

C-bus serial data input/output

2

C-bus serial clock input
11 coring capacitor
12 delayed luminance output signal
13 black level clamping capacitor 1
14 black level clamping capacitor 2
15 capacitor of reference voltage
16 luminance input signal

handbook, halfpage

V

1

P1

C

2

DL

V

i(R − Y)

V

o(R − Y)

V

o(B − Y)

V

i(B − Y)

V

P2

GND2

SDA

3
4
5
6
7
8
9

TDA4670

Fig.2 Pin configuration.

MEH188

GND1

18

SAND

17

V

16

iY

C

15

ref

C

14

CLP2

C

13

CLP1

V

12

oY

C

11

COR

SCL

10

1996 Dec 11 4

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4670

FUNCTIONAL DESCRIPTION

The TDA4670 contains luminance signal processing and
colour-difference signal processing. The luminance signal
section comprises a variable integrated luminance delay
line with luminance signal peaking and noise reduction by
coring.

The colour-difference section consists of a transient
improvement circuit to decrease the rise and fall times of
the colour-difference signal transients. All functions and
parameters are controlled via the I2C-bus.

Y-signal path

The video and blanking signal is AC-coupled to the input
at pin 16. Its black porch is clamped to a DC reference
voltage to ensure the correct operating range of the
luminance delay stage.

The luminance delay line consists of all-pass filter sections
with delay times of 45, 90, 100, 180 and 450 ns
(see Fig.1). The luminance signal delay is controlled via

2

the I

C-bus in steps of 45 ns in the range of 20 to 1100 ns,
this ensures that the maximum delay difference between
the luminance and colour-difference signals is ±22.5 ns.

An automatic luminance delay time adjustment in an
internal control loop (with the horizontal frequency as a
reference) is used to correct changes in the delay time,
due to component tolerances. The control loop is
automatically enabled between the burst key pulses of
lines 16 (330) and 17 (331) during the vertical blanking
interval. The control voltage is stored in the capacitor C

DL

connected to pin 2.
The peaking section uses a transversal filter circuit with

selectable centre frequencies of 2.6 and 5 MHz.

The output buffer stage ensures a low-ohmic VBS output
signal on pin 12 (<160 Ω). The gain of the luminance
signal path from pin 16 to pin 12 is unity.

An oscillation signal of the delay time control loop is
present on output pin 12 instead of the VBS signal during
the vertical blanking interval in lines 16 (330) to 18 (332).
Therefore, this output signal should not be applied for
synchronization.

Colour-difference signal paths

The colour-difference input signals (on pins 3 and 7) are
clamped to a reference voltage.

Each colour-difference signal is fed to a transient detector
and to an analog signal switch with an attached voltage
storage stage.

The transient detectors consist of differentiators and
full-wave rectifiers. The output voltages of both transient
detectors are added and then compared in a comparator.
This comparator controls both following analog signal
switches simultaneously.

The analog signal switches are in an open position at a
certain value of transient time; the held value (held by
storage capacitors) is then applied to the outputs.
The switches close to rapidly accept the actual signal
levels at the end of these transients. The improved
transient time is approximately 100 ns long and
independent of the input signal transient time.

Colour-difference paths are independent of the input
signal polarity and have a gain of unity.

2

The CTI functions are switched on and off via the I

C-bus.

It provides selectable degrees of peaking of −3, 0, +3
and +6 dB and a noise reduction by coring, which
attenuates the high-frequency noise introduced by
peaking.

1996 Dec 11 5

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4670

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134). V
connected together.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V
V
P
T
T
V

P1
P2
tot
stg
amb
ESD

supply voltage (pin 1) 0 8.8 V
supply voltage (pin 5) 0 8.8 V
total power dissipation 0 0.97 W
storage temperature −25 +150 °C
operating ambient temperature 0 70 °C
electrostatic handling note 1

for pins 9 and 10 − +300 V

for other pins −±500 V

Note

1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.

and VP2 as well as GND1 and GND2

P1

−−500 V

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air 82 K/W

CHARACTERISTICS

V

P1=VP2

= 5 V; nominal video amplitude VVB= 315 mV; tH=64µs; tBK=4µs (burst key); T

amb

=25°C;

measurements taken in Fig.4; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P1

V

P2

I

P(tot)

supply voltage (pin 1) 4.5 5 8.8 V
supply voltage (pin 5) 4.5 5 8.8 V
total supply current 31 41 52 mA

Y-signal path

V

i(Y)(p-p)

VBS input signal on pin 16

− 450 640 mV

(peak-to-peak value)

V

16

I

16

black level clamping voltage − 3.1 − V
input current during clamping ±95 −±190 µA

outside clamping −−±0.1 µA

R

16

C

16

t

d(Y)(max)

t

d(Y)(min)

input resistance outside clamping 5 −−MΩ
input capacitance − 310pF
maximum Y delay time set via I2C-bus 1070 1100 1130 ns
minimum Y delay time set via I2C-bus − 20 − ns

1996 Dec 11 6

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4670

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

∆ t

d(Y)

t

d(peak)(min)

G

Y

I

12

R

12

f

res

LIN signal linearity for α

Luminance peaking, selected via I

f

peak

V

peak

V

n(rms)

COR coring of peaking (coring part

minimum delay step set via I2C-bus 40 45 50 ns
group delay time difference f = 0.5 to 5 MHz;

− 0 ±25 ns

maximum delay

delay time difference between Y

Y delay; CTI and peaking off 70 100 130 ns

and colour-difference signals
minimum delay time for peaking 185 215 245 ns
VBS signal gain measured on

output pin 12 (composite signal,

Vo/Vi; f = 500 kHz;
maximum delay

−2 −10 dB

peak-to-peak value)
output current (emitter-follower

with constant current source)

source current −1 −−mA

sink current 0.4 −−mA
output resistance −−160 Ω
frequency response for maximum delay

f = 0.5 to 3 MHz −2 −10 dB
f = 0.5 to 5 MHz −4 −3 −1dB

min/αmax

video contents of 315 mV (p-p) V
video contents of 450 mV (p-p) V

2

C-bus

;

= 450 mV (p-p) 0.85 −−−

VBS

= 640 mV (p-p) 0.60 −−−

VBS

peaking frequency fC1; LCF-bit = 0 4.5 5 5.5 MHz

; LCF-bit = 1 2.3 2.6 2.9 MHz

f

C2

peaking amplitude for grade of
peaking (fC amplitude/0.5 MHz
amplitude)

selectable values −−3−dB

− 0 − dB

− +3 − dB

− +6 − dB

limitation of peaking (positive

− 20 − %
amplitude of correction signal
referenced to 315 mV)

noise voltage on pin 12
(RMS value)

without peaking;
f=0to5MHz

−−1mV

COR-bit = 1 − 20 − %

referenced to 315 mV)

1996 Dec 11 7

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4670

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Colour-difference paths measured with transient times tr=tf=1µs; t
pins 3 and 7 and with burst key pulse t

V

i(CD)(p-p)

±(R − Y) input signal

BK

=4µs

75% colour bar − 1.05 1.48 V

(peak-to-peak value; pin 3)
±(B − Y) input signal

75% colour bar − 1.33 1.88 V

(peak-to-peak value; pin 7)
input transient sensitivity V

V

3,7

I

3,7

internal clamping voltage level − 2.45 − V
input current outside clamping −−±1µA

/δt 0.15 −−V/µs

3,7

during clamping ±100 −±190 µA

C

3,7

V

4,6

∆V

4,6

input capacitance − 612pF
DC output voltage − 2 − V
output offset voltage RS≤ 300 Ω; note 1 −−±5mV

during and after storage time −−±18 mV

V

spike

spurious spike signals on pins 4

RS≤ 300 Ω; note 1 −−±30 mV

and 6

I

4,6

R

4,6

G

v

∆G

v

LIN signal linearity for α

∆V

o

output current (emitter-follower
with constant current source)

source current −1 −−mA

sink current 0.4 −−mA
output resistance −−100 Ω
signal gain in each path Vo/V

i

gain difference −(R − Y)/−(B − Y) − 0 ±0.3 dB

;

= 1.33 V (p-p) 0.90 −−−

i

= 1.88 V (p-p) 0.65 −−−

i

= 50 ns;

p H

nominal signal V
+3 dB signal V

signal reduction at higher
frequency (output signal ratio

min/αmax

signal with t

tr=tf=1µs
Vi/Vo)

2

Sandcastle pulse, input voltage selectable via I

V

17

input voltage threshold for

C-bus

SC5-bit = 0 (+12 V) 1.1 1.5 1.9 V
H and V sync

input voltage threshold for burst SC5-bit = 0 (+12 V) 5.5 6.5 7.5 V
input voltage threshold for

SC5-bit = 1 (+5 V) 1.1 1.5 1.9 V
H and V sync

input voltage threshold for burst SC5-bit = 1 (+5 V) 3.0 3.5 4.0 V

R

17

input resistance +12 V input level 30 40 50 kΩ

+5 V input level 15 20 25 kΩ

C

17

t

BK

t

d

input capacitance − 48pF
burst key pulse width 3.0 4.0 4.6 µs
leading edge delay for clamping

referenced to t

BK

pulse

n

p

number of required burst key

note 2 4 − 31 −
pulses vertical blanking interval

≥ 1 µs; Vi= 1.33 V (p-p) on

p H

−1 0 +1 dB

−1.5 −−dB

− 1 −µs

1996 Dec 11 8

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4670

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

2

C-bus control, SDA and SCL

I

V

IH

HIGH level input voltage on
pins 9 and 10

V

IL

I

9,10

V

o(ACK)

LOW level input voltage 0 − 1.5 V
input current −−±10 µA
output voltage at acknowledge on

I

=3mA −−0.4 V

o(ACK)

pin 9

I

o(ACK)

output current at acknowledge on

sink current 3 −−mA
pin 9

Notes

1. Crosstalk on output, measured in the unused channel when the other channel is provided with a nominal input signal
(CTI active).

2. A number of more than 31 burst key pulses repeats the counter cycle of delay time control.

3 − 5V

2

C-BUS FORMAT

I

(1)

S

SLAVE ADDRESS

(2)

ACK

(3)

SUBADDRESS

(4)

ACK

(3)

DATA

(5)

P

Notes

1. S = START condition.

2. SLAVE ADDRESS = 1000 100X.

3. ACK = acknowledge, generated by the slave.

4. SUBADDRESS = subaddress byte, see Table 1.

5. DATA = data byte, see Table 1.

6. P = STOP condition.

7. X = read/write control bit.

X = 0, to write (the circuit is slave receiver only).

If more than 1 byte DATA is transmitted, then auto-increment of the subaddress is performed.

2

Table 1 I

C-bus transmission; see Table 2

DATA

FUNCTION SUBADDRESS

D7 D6 D5 D4 D3 D2 D1 D0

Y delay/CTI/SC 00010000 0 SC5 CTI DL4 DL3 DL2 DL1 DL0
Peaking and coring 00010001 COR PEAK LCF 0 0 0 PCON1 PCON0

(6)

1996 Dec 11 9

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4670

Table 2 Function of the bits

DATA FUNCTION LOGIC 1 LOGIC 0

DL0 set delay in luminance channel 45 ns 0 ns
DL1 90 ns 0 ns
DL2 180 ns 0 ns
DL3 180 ns 0 ns
DL4 450 ns 0 ns
CTI set colour transient improvement active inactive
SC5 select sandcastle pulse voltage +5 V +12 V
LCF set peaking frequency response 2.6 MHz 5.0 MHz
PEAK set peaking delay active inactive
COR set coring control active inactive
PCONx set peaking amplification see Table 3

Table 3 Peaking amplification

PCON1 PCON0

00 −3
01 0
10 +3
11 +6

Remarks to the subaddress bytes

Subaddresses 00H to 0FH are reserved for colour decoders and RGB processors.
Subaddresses 10 and 11 only are acknowledged.
General call address is not acknowledged.
Power-on-reset: D7 to D1 bits of data bytes are set to logic 0, D0 bit is set to logic 1.

GRADE OF PEAKING

(dB)

1996 Dec 11 10

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4670

INTERNAL CIRCUITRY

12

Y output

CLP

13

C

CLP

14

C

COR

C

11

+

SCL10

MEH238

9

SDA

+

+

+

8

GND

+

+

7

6

5

CD input

CD output

P

V

handbook, full pagewidth

+

ref

C

Y input

SC

TDA4670

4

15

CD output

Fig.3 Internal circuit.

+

+

+

16

18

GND

all input

and output

pins without

pins 9 and 10

1

P

V

+

17

3

2

CD input

DL

C

1996 Dec 11 11

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4670

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

(VBS)

(VBS)

sandcastle
pulse input

2

I

SDA

C-bus

0.1 µF

0.1 µF

0.1 µF

0.1 µF

0.1 µF

SCL

C

COR

V

C

CLP1

C

CLP2

C

SAND

GND1

MEH189

9

8

7

6

5

4

3

2

1

SDA

GND2

V

i(B − Y)

V

o(B − Y)

V

P2

V

o(R − Y)

V

i(R − Y)

C

DL

V

P1

10 nF

10 nF

0.1 µF
+5 V

47 µF

15 Ω
V

B

10

11

oY

12

13

TDA4670

14

ref

15

V

iY

16

17

18

Fig.4 Test and application circuit.

1996 Dec 11 12

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4670

PACKAGE OUTLINE

DIP18: plastic dual in-line package; 18 leads (300 mil)

D

seating plane

L

Z

18

pin 1 index

e

b

SOT102-1

M

E

A

2

A

A

1

w M

b

1

b

2

10

E

c

(e )

1

M

H

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

max.

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

SOT102-1

12

min.

max.

IEC JEDEC EIAJ

b

1.40

1.14

0.055

0.044

b

1

0.53

0.38

0.021

0.015

b

cD E e M

2

0.32

1.40

0.23

1.14

0.013

0.055

0.009

0.044

REFERENCES

21.8

21.4

0.86

0.84

1996 Dec 11 13

9

(1) (1)

6.48

6.20

0.26

0.24

L

e

1

M

3.9

8.25

3.4

7.80

0.15

0.32

0.13

0.31

EUROPEAN

PROJECTION

E

0.37

0.33

H

9.5

8.3

w

max.

0.2542.54 7.62

0.854.7 0.51 3.7

0.010.10 0.30

0.0330.19 0.020 0.15

ISSUE DATE

93-10-14
95-01-23

(1)

Z

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4670

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds.
The total contact time of successive solder waves must not
exceed 5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

2

PURCHASE OF PHILIPS I

C COMPONENTS

Purchase of Philips I

2

C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

1996 Dec 11 14

Philips Semiconductors Product specification

Picture Signal Improvement (PSI) circuit TDA4670

NOTES

1996 Dec 11 15

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]/xxx
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1996 SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 537021/1200/03/pp16 Date of release: 1996Dec 11 Document order number: 9397 750 01471