Datasheet TDA4663T Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA4663T

Baseband delay line

Product specification
Supersedes data of September 1993
File under Integrated Circuits, IC02

1996 Nov 22

Philips Semiconductors Product specification

Baseband delay line TDA4663T

FEATURES

• Two delay lines, using the switched-capacitor
technique, for a delay time of one horizontal line (1H)
minus 55 ns (64 µs − 55 ns)

GENERAL DESCRIPTION

The TDA4663T is an integrated baseband delay line circuit
with a delay time of one horizontal line (1H) minus 55 ns
(64 µs − 55 ns).

• Adjustment-free application

• Handles negative or positive colour-difference input

signals

• Clamping of AC-coupled input signals [mostly
colour-difference signals ±(R−Y) and ±(B−Y)]

• VCO without external components

• 3 MHz internal clock signal derived from a 6 MHz CCO,
line-locked by the sandcastle pulse (64 µs line)

• Sample-and-hold circuits and low-pass filters to

suppress the 3 MHz clock signal

• Output buffer amplifiers.

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

P1

V

P2

I

P(tot)

V

i(p-p)

analog supply voltage (pin 9) 4.75 5 5.25 V
digital supply voltage (pin 1) 4.75 5 5.25 V
total supply current − 5.9 7.0 mA
input signal PAL/NTSC (peak-to-peak value)

±(R−Y); pin 16 − 1.3 − V
±(B−Y); pin 14 − 1.3 − V

G

v

V

o

gain of colour-difference output signals for PAL and NTSC

-----­V

i

V

11

-------- ­V

16

V

12

-------- ­V

14

−1 0 +1 dB

−1 0 +1 dB

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA4663T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

1996 Nov 22 2

Philips Semiconductors Product specification

Baseband delay line TDA4663T

BLOCK DIAGRAM

±(R−Y)

11

LP

SAMPLE-

AND-HOLD

LINE

MEMORY

mostly

output signals

colour-difference

output

buffers

pre-amplifiers

±(B−Y)

12

LP

SAMPLE-

AND-HOLD

LINE

MEMORY

n.c.

n.c.13n.c.15n.c.

2

6

TDA4663T

3 MHz shifting clock

BY-192

DIVIDER

PHASE

DETECTOR

FREQUENCY

BY-2

DIVIDER

CCO

6 MHz

LP

MED800

4, 8
3

GND2

1

P2

V

digital supply

Fig.1 Block diagram.

clamping pulse

SIGNAL

CLAMPING

16

±(R−Y)

handbook, full pagewidth

mostly

colour-difference

SIGNAL

CLAMPING

14

±(B−Y)

input signals

1996 Nov 22 3

analog supply

5

9

P1

V

DETECTOR

SANDCASTLE

sandcastle

pulse input

107GND1

Philips Semiconductors Product specification

Baseband delay line TDA4663T

PINNING

SYMBOL PIN DESCRIPTION

V

P2

n.c. 2 not connected
GND2 3 ground for digital part (0 V)
i.c. 4 internally connected
SAND 5 sandcastle pulse input
n.c. 6 not connected
V

CL

i.c. 8 internally connected
V

P1

GND1 10 ground for analog part (0 V)
V

o(R−Y)

V

o(B−Y)

n.c. 13 not connected
V

i(B−Y)

n.c. 15 not connected
V

i(R−Y)

1 supply voltage for digital part (+5 V)

7 clamping pulse input

9 supply voltage for analog part (+5 V)

11 ±(R−Y) output signal
12 ±(B−Y) output signal

14 ±(B−Y) input signal

16 ±(R−Y) input signal

handbook, halfpage

V

1

P2

n.c.

2
3

GND2

4

i.c.

TDA4663T

5

SAND

6

n.c.

7

V

CL

8

i.c.

MED801

Fig.2 Pin configuration.

16

V

i(R−Y)

15

n.c.

14

V

i(B−Y)

13

n.c.

12

V

o(B−Y)

11

V

o(R−Y)

10

GND1

9

V

P1

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134). Ground pins 3 and 10 connected together.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P1

V

P2

V

5

V

n

I

n

T

stg

T

amb

P

tot

V

es

supply voltage (pin 9) −0.5 +7 V
supply voltage (pin 1) −0.5 +7 V
voltage on pin 5 −0.5 VP+ 1.0 V
voltage on pins 7, 11, 12, 14 and 16 −0.5 V

P

V
current on pins 7, 11 and 12 − 20 mA
storage temperature −25 +150 °C
operating ambient temperature −20 +70 °C
total power dissipation − 100 mW
electrostatic handling for all pins note 1 −±500 V

Note

1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air 220 K/W

1996 Nov 22 4

Philips Semiconductors Product specification

Baseband delay line TDA4663T

CHARACTERISTICS

VP= 5.0 V; input signals as specified in characteristics with 75% colour bars;
super-sandcastle frequency of 15.625 kHz; T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P1

V

P2

I

P1

I

P2

analog supply voltage (pin 9) 4.75 5 5.25 V
digital supply voltage (pin 1) 4.75 5 5.25 V
supply current − 5.1 5.9 mA
supply current − 0.8 1.1 mA

Colour-difference input signals

V

i(p-p)

input signal (peak-to-peak value)

pin 16 − 1.3 − V
pin 14 − 1.3 − V

V

i(max)(p-p)

maximum symmetrical input signal
(peak-to-peak value)

pin 16 before clipping 1.6 −−V
pin 14 before clipping 1.6 −−V

I

14, 16

input leakage current

(during picture content)
R
C
V

14, 16
14, 16

14, 16

input resistance during clamping −−40 kΩ

input capacitance −−10 pF

input clamping voltage proportional to V

Colour-difference output signals

V

o(p-p)

output signal (peak-to-peak value)

pin 11 − 1.3 − V
pin 12 − 1.3 − V

V

11/V12

ratio of output amplitudes at equal

input signals
V

11, 12

R
G

V

n(rms)

11, 12
v

DC output voltage proportional to V

output resistance − 300 400 Ω

V

voltage gain

------

o

V

i

noise voltage

(RMS value; pins 11 and 12)
S/N(W) weighted signal-to-noise ratio

(pins 11 and 12)
t

j

α

ct(11, 12)

α

ct(12, 11)

α

ct(14, 12)

jitter of output signal to external

sandcastle reference V

5

crosstalk between channels V14=0V; RS= 300 Ω;

crosstalk between channels V16=0V; RS= 300 Ω;

crosstalk direct from input to output

signal

=25°C; measurements taken in Fig.3; unless otherwise specified.

amb

0.06 0.085 0.1 µA

1.3 1.5 1.7 V

2.5 2.9 3.3 V

V

i14, 16

P

= 665 mV (p-p) −0.4 0 +0.4 dB

P

−1 0 +1 dB

V

V

= 0 V; note 1 −−1.2 mV

i14, 16

= 1 V (p-p); note 1 − 54 − dB

o

−−20 ns

30 −−dB

V11= 1.35 V (p-p)

30 −−dB

V12= 1.35 V (p-p)
V16=0V; RS= 300 Ω;

30 −−dB

V14= 1.35 V (p-p)

1996 Nov 22 5

Philips Semiconductors Product specification

Baseband delay line TDA4663T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

α

ct(16, 11)

crosstalk direct from input to output

signal
SVRR supply voltage ripple rejection

∆V

11, 12/VR

V

11,12(p-p)

clamping offset during H-clamp

(peak-to-peak value)
V

11,12(p-p)

unwanted signals (line-locked)

(peak-to-peak value)

residual clock (3 MHz) −−6.25 mV
meander −−1.5 mV
needles −−2.5 mV

t

d

line delay time for PAL signals 64 − 0.125 64 − 0.055 64 + 0.015 µs

Sandcastle pulse input (pin 5)

f

BK

burst-key frequency/sandcastle

frequency
V

5

t

BK

V

slice

I

i

C

i

t

li

top pulse voltage note 2 4.0 − VP+ 1.0 V

top pulse duration − 2.5 −µs

internal slicing level V5− 1.0 − V5− 0.5 V

input current −−10 µA

input capacitance −−10 pF

lock-in time for PLL −−1ms

Clamping pulse input (pin 7)

V

clamp

clamping pulse ON 3.5 VP− 0.1 V

clamping pulse OFF −0.5 +0.1 +1.5 V
I

i

C

i

t

clamp

t

r

t

f

input current −−10 µA

input capacitance −−10 pF

clamping pulse duration 0.1 2 3 µs

rise time 10 −−ns

fall time 10 −−ns

Notes

1. Noise voltage at f = 10 kHz to 1 MHz; RS< 300 Ω.

2. The leading edge of the burst-key pulse or H-blanking pulse is used for timing.

V14=0V; RS= 300 Ω;

30 −−dB

V16= 1.35 V (p-p)
VR= 100 mV (p-p);

34 −−dB
fR= 10 Hz to 1 kHz;
V

= 1.35 V (p-p)

11, 12

V14=V16=0V;

−−5mV

RS= 300 Ω
V14=V16=0V;

active video;
RS= 300 Ω

for NTSC signals 63.555 −

0.125

14.2 15.625 17.0 kHz

63.555 −

0.055

63.555 +

0.015

P

µs

V

1996 Nov 22 6

Philips Semiconductors Product specification

Baseband delay line TDA4663T

APPLICATION INFORMATION

handbook, full pagewidth

1 nF

1 nF

SSC
(5 V)

colour-

difference

signals

V

i(R−Y)

V

i(B−Y)

TDA4663T

16

14

5

LINE DELAY

LINE DELAY

LINE-LOCKED PLL /

PULSE PROCESSING

+5.1 V +5.1 V

9

10

(1) (1)

100

nF

22 µF

VCO

10 Ω

10 Ω

11

V

o(R−Y)

12

V

o(B−Y)

4
8

clamping pulse

7

(CMOS)

n.c.

2

n.c.

6

n.c.

13

n.c.

15

1

3

100

nF

560 Ω

+12 V

5.1 V

MED802

(1) Positioned close to pins.

Fig.3 Application circuit.

1996 Nov 22 7

Philips Semiconductors Product specification

Baseband delay line TDA4663T

PACKAGE OUTLINE

SO16: plastic small outline package; 16 leads; body width 3.9 mm

D

c

y

Z

16

pin 1 index

1

e

9

8

w M

b

p

SOT109-1

E

H

E

A

2

A

1

L

detail X

A

X

v M

A

Q

(A )

L

p

A

3

θ

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT109-1

A

max.

1.75

0.069

A

1

0.25

0.10

0.0098

0.0039

A2A

1.45

1.25

0.057

0.049

IEC JEDEC EIAJ

076E07S MS-012AC

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.0098

0.019

0.0075

0.014

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

10.0

4.0

9.8

3.8

0.39

0.16

0.15

0.050

0.38

REFERENCES

1996 Nov 22 8

eHELLpQZywv θ

1.27

6.2

5.8

0.24

0.23

1.0

 0.7

1.05

0.4

0.039

0.041

0.016

0.25

0.6

0.028

0.01 0.004

0.020

EUROPEAN

PROJECTION

0.25 0.1

0.01

0.7

0.3

0.028

0.012

ISSUE DATE

91-08-13
95-01-23

o

8

o

0

Philips Semiconductors Product specification

Baseband delay line TDA4663T

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

(order code 9398 652 90011).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

Wave soldering

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

1996 Nov 22 9

Philips Semiconductors Product specification

Baseband delay line TDA4663T

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 Nov 22 10

Philips Semiconductors Product specification

Baseband delay line TDA4663T

NOTES

1996 Nov 22 11

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]/xxx
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1996 SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 537021/1200/02/pp12 Date of release: 1996 Nov 22 Document order number: 9397 750 01375