Datasheet tda3868t DATASHEETS (Philips)

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INTEGRATED CIRCUITS

DATA SH EET

TDA3868T

Quasi-split sound processor for all standards

Preliminary speciﬁcation File under Integrated Circuits, IC02

January 1992

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Philips Semiconductors Preliminary speciﬁcation

Quasi-split sound processor for all standards TDA3868T

FEA TURES

• Quasi-split sound processor for all standards e. g. B/G (FM sound) and L (AM sound)

• Reduction of spurious video signals by tracking function

GENERAL DESCRIPTION

Separate symmetrical IF inputs for FM and AM sound. Gain controlled wideband IF amplifier and input select

switch.

and AFC for the vision carrier reference circuit; (indispensable for NICAM)

• AF2 signal automatically muted (at B/G) by input signal level

• AM signal processing for L standard and audio switching over

• Stereo-matrix correction

• AM output level typically 500 mV at m = 0.54 (+2.5 dB in

comparison to TDA3858)

AGC generation due to peak-sync for FM or mean signal level for AM.

Reference amplifier to regenerate the vision carrier. Limiting amplifier optimized for AM suppression of the

regenerated vision carrier signal and 90° phase shifter. Intercarrier mixer for FM sound, output with low-pass filter. Separate signal processing for 5.5 and 5.74 MHz

intercarriers. Wide supply voltage range, only 300 mW power

dissipation at 5 V.

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

Data at V

iIF

supply voltage (pin 24) 4.5 5 8.8 V

=5 V

supply current (pin 24) − 60 72 mA IF input sensitivity (−3 dB) − 70 100 µV audio output signal for FM standard B/G (RMS value) − 1 − V audio output signal for AM standard L (RMS value) − 0.5 − V

THD total harmonic distortion

for FM − 0.5 − % for AM − 1 − %

S/N (W) weighted signal-to-noise ratio

for FM − 68 − dB for FM with 6 kHz sinus vision modulation − 56 − dB for AM − 56 − dB

ORDERING AND PACKAGE INFORMATION

EXTENDED TYPE

NUMBER

TDA3868T 28 mini-pack plastic SOT136A

Note

1. SOT136-1; 1996 November 25.

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PACKAGE

PINS PIN POSITION MATERIAL CODE

(1)

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Philips Semiconductors Preliminary speciﬁcation

Quasi-split sound processor for all standards TDA3868T

January 1992 3

Fig.1 Block diagram (B/G and L standards).

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Philips Semiconductors Preliminary speciﬁcation

Quasi-split sound processor for all standards TDA3868T

PINNING

SYMBOL PIN DESCRIPTION

AMIF1 1 AM IF difference input 1 for L standard (32.4 MHz) AMIF2 2 AM IF difference input 2 for L standard (32.4 MHz) C

AGC

MODE 5 3-state input for standard select MATR 6 input for stereo matrix correction FM2R1 7 reference circuit for FM2 (5.74 MHz) FM2R2 8 reference circuit for FM2 (5,74 MHz) AF2 9 AF2 output (AF out of 5.74 MHz) AF1 10 AF1 output (AF out of 5.5 MHz or AM) FM1R1 11 reference circuit for FM1 (5.5 MHz) FM1R2 12 reference circuit for FM1 (5.5 MHz) n.c. 13 not connected VC-R1 14 reference circuit for the vision carrier (38.9 MHz) VC-R2 15 reference circuit for the vision carrier (38.9 MHz) TRACK 16 DC output level for tracking C

AFAM

FM1l 18 intercarrier input for FM1 (5.5 MHz) C

AF1

ICO 20 intercarrier output signal (5.5/5.74 MHz) C

AF2

FM2l 22 intercarrier input for FM2 (5.74 MHz) GND 23 ground (0 V) V

n.c. 25 not connected C

ref

FMIF1 27 IF difference input 1 (B/G standard, 38.9 MHz) FMIF2 28 IF difference input 2 (B/G standard, 38.9 MHz)

3 charge capacitor for AGC (FM and AM) 4 charge capacitor for AM AGC

17 DC-decoupling capacitor for AM demodulator (AF AM)

19 DC-decoupling capacitor for FM1 demodulator (AF1)

21 DC-decoupling capacitor for FM2 demodulator (AF2)

24 +5 to +8 V supply voltage

26 charge capacitor for reference voltage

Fig.2 Pin configuration.

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Philips Semiconductors Preliminary speciﬁcation

Quasi-split sound processor for all standards TDA3868T

FUNCTIONAL DESCRIPTION

The quasi-split sound processor is for all standards. Dependent on the voltage on pin 5 either FM mode (B/G) or AM mode (L) is selected.

B/G standard (FM mode): Pins 27 and 28 are active, AGC detector uses peak sync level. Sound carrier SC1 (5.5 MHz) provides AF1, sound carrier SC2 (5.74 MHz) provides AF2. With no sound carrier SC2 on pin 22, AF2 output is muted (in mid-position of the standard select switch FM mode without muting of AF2 is selected). The mute circuit prevents false signal recognition in the stereo decoder at high IF signal levels when no second sound carrier exists (mono) and an AF signal is present in the identification signal frequency range. With 1 mV on pin 22, under measurement conditions, AF2 is switched on (see limiting amplifier). Weak input signals on pins 27 and 28 generate noise on pin 22, which is present in the intercarrier signal and passes through the 5,74 MHz filter. Noise on pin 22 inhibits muting. No misinterpretation due to white noise occurs in the stereo decoder; when non-correlated noise masks the identification signal frequencies, which may be present in sustained tone signals. The stereo decoder remains switched to mono.

The series capacitor Cs in 38.9 MHz resonant circuit provides a notch at the sound carrier frequency in order to provide more attenuation for the sound carrier in the vision carrier reference channel. The ratio of parallel/series capacitor depends on the ratio of VC/SC frequency and has to be adapted to other TV transmission standards if necessary, according to

CSCPfVCfSC⁄()

.–=

The result is an improved “intercarrier buzz” (up to 10 dB improvement in sound channel 2 with 250 kHz video modulation for B/G stereo) or suppression of 350 kHz video modulated beat frequency in the digitally-modulated NICAM subcarrier. The picture carrier for quadrature demodulation in the intercarrier mixer is not exactly 90 degrees due to the shift variation in the integrated phase shift network. The tuning of the LC reference circuit to provide optimal video suppression at the intercarrier output is not the same as that to provide optimal intercarrier buzz suppression. In order to optimize the AF signal performance, a fine tuning for the optimal S/N at the sound channel 2 (from 5.74 MHz) may be performed with a 250 kHz square wave video modulation.

Measurements at the demodulators: For all signal-to-noise measurements the generator must meet the following specifications;

phase modulation errors<0.5 degree for B/W-jumps intercarrier signal-to-noise ratio as measured with “TV-demodulator AMF2” (weighted S/N) must be > 60 dB at 6 kHz sine wave modulation of the B/W-signal.

Signal-to-noise ratios are measured with ∆f=±50 kHz deviation and f

= 1 kHz; with a deviation of

±27 kHz the S/N ratio is deteriorated by 5.3 dB.

L standard (AM mode): Pins 1 and 2 are active, AGC detector uses mean signal level. The audio signal from the AM demodulator is output on AF1 with AF2 output muted.

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Philips Semiconductors Preliminary speciﬁcation

Quasi-split sound processor for all standards TDA3868T

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

tot

stg

amb

ESD

Note

1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.

supply voltages (pin 24) − 8.8 V voltage (pins 1, 2, 5, 9, 10, 18, 20, 22, 27 and 28) 0 V

V total power dissipation 0 635 mW storage temperature range −25 150 °C operating ambient temperature range 0 70 °C electrostatic handling

(1)

all pins except 1, 2, 27 and 28 ±500 − V pins 1, 2, 27 and 28 +400 − V pins 1, 2, 27 and 28 −500 − V

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Philips Semiconductors Preliminary speciﬁcation

Quasi-split sound processor for all standards TDA3868T

CHARACTERISTICS

= 5 V and T

Vision carrier (VC) modulated with different video signals, modulation depth 100 % (proportional to 10 % residual carrier). Vision carrier amplitude (RMS value) V VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation ∆f=±50 kHz unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

IF input not activated (pins 1-2 or 27-28)

1,2-27.28

IF source control (pin 5)

IF ampliﬁer (pins 27-28 or 1-2)

IF maximum input signal (RMS value) Vo= +1 dB 70 100 − mV

∆G

B IF bandwidth −3 dB 50 70 − MHz V

Resonance ampliﬁer (pins 14-15)

14−15

L inductance Fig.3 and 5 − 0.247 −µH C capacitance C

= 25 °C, measurements taken in Fig.3 with fVC= 38.9 MHz, f

amb

= 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and

iVC

= 33.4 MHz and f

SC1

= 33.158 MHz.

SC2

supply voltage.range (pin 24) 4.5 5 8.8 V supply current (pin 24) VP=5 V 486072mA

input resistance −−100 Ω DC input voltage (pins 1-2 or 31-32) LOW internal set −−0.1 V crosstalk attenuation of IF input switch note 1 50 56 − dB

input voltage in order to obtain standards

B/G (FM) with automatic muting pin 5 connected 2.8 − V

pin 5 open-circuit − 2.8 − V

B/G (FM) without muting pin 5 connected 1.3 − 2.3 V

or alternative measure:

22 kΩ to GND L (AM sound) pin 5 connected 0 − 0.8 V input current V5=V

=0 −−−300 µA

−−100 µA

input resistance 2.75 2.2 2.65 kΩ input capacitance 1.0 1.5 2.2 pF DC potential, voltage (pins 1, 2, 27, 28) − 1.75 − V

input signal sensitivity B/G standard (RMS value, pins 27-28)

input signal sensitivity L standard (RMS value, pins 1-2)

−3 dB intercarrier signal

reduction on pin 20

−3 dB intercarrier signal

reduction on pin 10

− 70 100 µV

IF gain control range 60 63 − dB

voltage range for gain control (pin 3) G

vision carrier amplitude

min−Gmax

fo= 38.9 MHz − 270 − mV

1.7 − 2.6 V

(peak-to-peak value) operating resistance − 4 − kΩ

= 27 pF − 68 − pF

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Philips Semiconductors Preliminary speciﬁcation

Quasi-split sound processor for all standards TDA3868T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

14, 15

Intercarrier mixer output (pin 20)

B IF bandwidth −1 dB − 8.5 − MHz

VID/V20

Limiting ampliﬁers (pins 18 and 22)

18, 22

∆V

Tracking automatic frequency control (AFC) of the vision carrier reference circuit.

S AFC steepness (open loop) for

Q-factor of resonant circuit Qo=90 − 40 − DC voltage (pins 14 and 15) − Vp−1 − V

output signal for 5.5 MHz (RMS value) 71 95 125 mV output signal for 5.74 MHz (RMS value) 32 43 56 mV

−3dB − 10 − MHz residual video AM on intercarrier note 2 − 310% residual vision carrier (RMS value) 1st/2nd harmonic;

− 0.5 1 mV

(38.9/77.8 MHz) output resistance (emitter follower) 1 mA emitter current − 30 −Ω allowable AC output current (pin 20) −−±0.7 mA allowable DC output current −−−2mA DC voltage − 1.75 − V

minimum input signal (RMS value) −3 dB AF signal − 300 450 µV maximum input signal (RMS value) 200 −−mV input resistance − 560 −Ω DC voltage − 0 − V level detector threshold for no muting

only 5.74 MHz channel − 1 − mV (RMS value, pin 22)

hysteresis of level detector − 5 − dB

tracking output voltage range (pin 16) note 3 VP1−3.3 − VP1−1V tracking reducing factor for

black picture − 9 − white test picture − 4 − 50 % grey picture − 6 −

black picture −−8−mV/kHz white test picture −−3−mV/kHz 50 % grey picture −−5.5 − mV/kHz

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Philips Semiconductors Preliminary speciﬁcation

Quasi-split sound processor for all standards TDA3868T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

FM1 and FM2 demodulators

Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with V

i IF (rms)

= 10 mV (f ∆f=±50 kHz) at pins 18 and 22 without ceramic ﬁlters, RS=50Ω. De-emphasis 50 µs and VS=VP(B/G standard). QL-factor = 11 for resonant circuits at pins 7-8 and 11-12.

intercarrier signals

− 100 − mV

(RMS values, pins 7-8 and 11-12)

DC voltage (pins 7, 8, 11 and 12) − 1.8 − V AF output signals

0.75 0.95 1.20 V

(RMS values, pins 9 and 10)

∆V

9, 10

difference of AF signals between channels (pins 9 and 10)

output resistance − 100 −Ω DC voltage − 2.1 − V allowed AC current of emitter output

pin 6 open-circuit;

−−1dB

note 4

note 5 −−±1.5 mA

(peak value)

9, 10

maximum allowed DC output current −−−2mA THD total harmonic distortion − 0.5 1.0 % V

AF output signal (RMS value) THD = 1.5 % 1.25 −−V

AM suppression 1 kHz, m = 0.3 48 54 − dB S/N(W) weighted signal-to-noise ratio CCIR 468-3 64 68 − dB B AF bandwidth −3 dB 0.02 − 100 kHz

∆G

AF2

19, 21

crosstalk attenuation (pins 9-10) 60 70 − dB

adjusting voltage for AF2 signal (pin 6) note 6 0 − 5V

minimum gain range due to V

typical gain range due to V

6 6

−1.5 − 1.0 dB

−2.5 − 1.5 dB

DC voltage (pins 19 and 21) − 1.7 − V

AM mode, input signal at pins 1-2 SC = 32.4 MHz;

= 1 kHz, m = 0.54;

mod

= 10 mV rms

iAM

AF output signal on pin 10 (RMS value) 400 500 600 mV

output resistance (pin 10) − 100 −Ω

maximum AC output current

note 5 −−±1.5 mA

(peak value) I

maximum DC output current −−−2mA

DC voltage − 2.1 − V THD total harmonic distortion Fig.4 − 12% S/N(W) weighted signal-to-noise ratio CCIR 468-3 50 56 − dB B AF bandwidth −3 dB 0.02 − 100 kHz V

DC voltage (pin 17) − 2 − V

= 1 kHz, deviation

mod

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Philips Semiconductors Preliminary speciﬁcation

Quasi-split sound processor for all standards TDA3868T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Audio frequency performance for FM operation in B/G standard (V Measurements on AF outputs (pins 9 and 10)

9, 10

signal attenuation of AF signal switches

mute: AF2 on pin 9 V AM mode: not required signal

AF1 on pin 10 (from FM) FM mode: not required signal

AF1 on pin 10 (from AM)

=0 70 −−dB

5.5 MHz on pin 18; = 0; Vi= 10 mV

signal for L standard (pins 1-2); V

5=VP

DC level deviation (pins 9 and 10) when switching to FM

or AM sound or Mute

S/N(W) weighted signal-to-noise ratio CCIR 468-3

on output pin 10 de-emphasis 50 µs

black picture f 2T/20T pulses with white bar f 6 kHz sine wave, B/W-modulated f 250 kHz square wave B/W-modulated f

= 5.5 MHz 59 63 − dB

= 5.5 MHz 57 61 − dB

= 5.5 MHz 52 56 − dB

= 5.5 MHz 50 56 − dB

on output pin 9

black picture f 2T/20T pulses with white bar f 6 kHz sine wave, B/W-modulated f 250 kHz square wave B/W-modulated f

= 5.742 MHz 57 61 − dB

= 5.742 MHz 55 59 − dB

= 5.742 MHz 50 54 − dB

= 5.742 MHz 50 56 − dB

RR ripple rejection allstandards;

= 70 Hz;

VR= 200 mV (p-p)

= VP) unless otherwise speciﬁed.

70 −−dB

− 525mV

30 40 - dB

Notes

1. Crosstalk attenuation of IF input switch, measured at R

= 470 Ω (instead of LC circuit); input signal Vi= 20 mV

14−15

rms (pins 27−28). AGC voltage V3 set to a value to achieve Vo= 20 mV rms (pins 14−15). After switching (V5=(0 V) measure attenuation. IF coupling with OFWG3203 and OFWL9350 (Siemens).

2. Spurious intercarrier AM: m = (A−B)/A (wherein A = signal at sync; B = signal with 100 % picture modulation.)

3. Automatic frequency control (AFC) of the vision carrier reference circuit (pins 14 and 15) for reducing spurious video signals in the stereo/dual sound modes. The factor of reducing FTR at a deviation ∆fVC specifies the ratio of spurious signals with/without tracking function.

4. AF2 signal can be adjusted by V

5. For larger current: RL> 2.2 kΩ (pin 9 or 10 to GND) in order to increase the bias current of the output emitter follower.

6. If not used, pin 6 should not be connected.

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Philips Semiconductors Preliminary speciﬁcation

Quasi-split sound processor for all standards TDA3868T

Fig.3 Test and application circuit for standards B/G and L (for application SAW-filters must be used).

Fig.4 Total harmonic distortion (THD) as a function of audio frequency at AM standard (V5= 0).

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Philips Semiconductors Preliminary speciﬁcation

Quasi-split sound processor for all standards TDA3868T

APPLICATION INFORMATION

(1) simple resonance circuit (without CS) (2) resonance circuit with CS = 27 pF CS = CP ( fVC / fSC)2 - C CS = 27 pF (Fig.3)

Fig.5 Frequency response of the 38.9 MHz reference circuit.

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Philips Semiconductors Preliminary speciﬁcation

Quasi-split sound processor for all standards TDA3868T

January 1992 13

Fig.6 Internal circuits; (continued in Fig.7).

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Philips Semiconductors Preliminary speciﬁcation

Quasi-split sound processor for all standards TDA3868T

January 1992 14

Fig.7 Internal circuits; (continued from Fig.6).

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Philips Semiconductors Preliminary speciﬁcation

Quasi-split sound processor for all standards TDA3868T

PACKAGE OUTLINE

SO28: plastic small outline package; 28 leads; body width 7.5 mm

pin 1 index

w M

SOT136-1

detail X

(A )

v M

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

OUTLINE VERSION

SOT136-1

max.

2.65

0.10

0.30

0.10

0.012

0.004

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

January 1992 15

0 5 10 mm

A2A3b

2.45

0.25

2.25

0.096

0.01

0.089

IEC JEDEC EIAJ

075E06 MS-013AE

0.49

0.36

0.019

0.014

0.32

0.23

0.013

0.009

(1)E(1) (1)

18.1

17.7

0.71

0.30

0.69

0.29

REFERENCES

scale

eHELLpQ

7.6

7.4

1.27

0.050

10.65

10.00

0.42

0.39

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

0.25

0.25 0.1

0.01

EUROPEAN

PROJECTION

ywv θ

0.9

0.4

0.035

0.004

0.016

ISSUE DATE

91-08-13

95-01-24

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Philips Semiconductors Preliminary speciﬁcation

Quasi-split sound processor for all standards TDA3868T

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

Reﬂow soldering

Reflow soldering techniques are suitable for all SO packages.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.

(order code 9398 652 90011).

Wave soldering

Wave soldering techniques can be used for all SO packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.

• The longitudinal axis of the package footprint must be parallel to the solder flow.

• The package footprint must incorporate solder thieves at the downstream end.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

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Philips Semiconductors Preliminary speciﬁcation

Quasi-split sound processor for all standards TDA3868T

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

January 1992 17