Datasheet tda3840 DATASHEETS (Philips)

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Page 1

INTEGRATED CIRCUITS

DATA SH EET

TDA3840

TV IF amplifier and demodulator with TV signal identification

Preliminary speciﬁcation File under Integrated Circuits, IC02

April 1991

Page 2

Philips Semiconductors Preliminary speciﬁcation

TV IF ampliﬁer and demodulator with TV signal identiﬁcation

FEATURES

• Low supply voltage range, from 5.0 V to 8.0 V

• Low power dissipation, 200 mW at 5 V

• High supply ripple rejection

• Wide IF bandwidth of 80 MHz

• Synchronous demodulator with low differential phase

and gain

• Additional video buffer with a wide bandwidth of 10 MHz

• Video off switch

• Peak sync AGC

• Adjustable take-over point (TOP); positive AGC slope

• Switching to fast AGC dependent on TV identification

• Alignment free AFC detector with integrated phase shift

• ESD protection

• TV signal identification

• Options: tracking of reference circuit

TDA3840

GENERAL DESCRIPTION

The TDA3840 is a bipolar integrated circuit for vision IF-signal processing in TV and VTRs, designed for a supply voltage range from 5.0 V to 8.0 V.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1-20(rms)

supply voltage range (pin 15) 4.75 5.0 8.8 V supply current (pin 15) VP = 5.0 V − 42 − mA IF input signal for nominal video output

f = 38.9 MHz − 70 −µV

voltage at pin 14 (RMS value) minimum IF input signal for TV signal

maximum G

− 20 40 µV

identiﬁcation at pin 6 (RMS value)

S/N signal-to-noise ratio V V

AFC

video output signal (pin 12) buffered − 2.0 − V IF voltage gain control range − 66 − dB

= 10 mV 55 60 − dB

1-20

AFC output voltage swing − 4.0 − V AFC steepness (pin 8) − 2 −µA/kHz

RR supply voltage ripple rejection (pin 12) 30 35 − dB

ORDERING INFORMATION

EXTENDED

TYPE NUMBER

PINS PIN POSITION MATERIAL CODE

TDA3840 20 DIL plastic SOT146 TDA3840T 20 mini-pack plastic SO20L; SOT163A

PACKAGE

(1)

(2)

Note

1. SOT146-1; 1996 December 13.

2. SOT163-1; 1996 December 13.

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Philips Semiconductors Preliminary speciﬁcation

TV IF ampliﬁer and demodulator with TV signal identiﬁcation

TDA3840

PIN CONFIGURATION

Fig.2 Pin configuration.

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

IIF

TOP V

SYNC

IDENT

TV C

AFC

ADJ

IDENT

1 IF input (balanced) 2 tuner AGC take-over point adjustment 3 black level voltage 4 sync pulse amplitude voltage 5 identiﬁcation capacitor 6 video identiﬁcation output 7 AFC capacitor

8 AFC output signal n.c. 9 not connected L

REF

O BUF

STAB

10 LC reference tuned circuit

11 LC reference tuned circuit

12 buffered video output signal

13 video input signal for buffer

14 video output signal with intercarrier signal

15 supply voltage

16 supply voltage stabilization GND 17 ground C

AGC

O AGC

I IF

18 AGC capacitor

19 tuner AGC output signal

20 IF input (balanced)

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Philips Semiconductors Preliminary speciﬁcation

TV IF ampliﬁer and demodulator with TV signal identiﬁcation

FUNCTIONAL DESCRIPTION

The complete circuit consists of the following functional blocks as shown in Fig.1:

1. 3-stage gain controlled IF ampliﬁer

2. Overload detector

3. Reference ampliﬁer

4. Carrier signal reference limiter

5. Video demodulator

6. Video ampliﬁer

7. Video buffer ampliﬁer

8. AGC detector

9. IF and tuner AGC (with adjustable TOP)

10. Sync pulse separator

11. Video identiﬁcation

12. 90°phase shift and AFC demodulator

13. AFC gating, AFC ampliﬁer and AFC switch

14. Voltage stabilizer

1. 3-stage gain controlled IF ampliﬁer (pins 1 and 20)

The vision IF amplifier consists of three AC-coupled differential amplifier stages. Gain control is achieved by current divider stages. The emitter feedback resistors are optimized for low noise and signal handling capability.

2. Overload detector

The overload detector is fed from the output of the third IF amplifier. As soon as the IF voltage exceeds the overload threshold in the detector, its output current reduces the IF amplification by discharging the AGC capacitor.

3. Reference ampliﬁer

For passive video carrier regeneration an integrated differential amplifier with resistive load allows capacitive coupling of the resonant

circuit for notch and tracking functions.

4. Carrier signal reference limiter

A limiter stage after the reference amplifier eliminates amplitude modulation. Its output is fed to the video demodulator.

5. Video demodulator

The video demodulator receives both the limited reference carrier signal and the IF signal. The video signal can also be switched off.

6. Video ampliﬁer

The video amplifier is an operational amplifier with internal feedback and wide bandwidth.

7. Video buffer ampliﬁer

The video buffer amplifier is an operational amplifier with internal feedback, wide bandwidth and frequency compensation; gain and input impedance are adapted to operate with a ceramic sound trap. The load for the sound trap is an integrated resistive divider.

8. AGC detector

The peak sync AGC detector generates a fast current pulse to discharge the AGC capacitor (gain reduction). This minimizes the video signal distortion. To filter out the sound carrier the video signal is fed through low pass filters. After the low pass filters the video signal with attenuated sound carrier, is fed to the AGC detector. The charging current of the AGC capacitor is optimized for minimum distortion of the video signal. With positive modulation the charging current is very low and consequently the AGC time constant is large. When the video identification circuit does not detect a video signal, the charging current is increased.

TDA3840

9. IF and tuner AGC

The voltage on the AGC capacitor is used to control the gain of the three IF amplifier stages and to supply the tuner AGC current (open-collector). The tuner AGC TOP potentiometer at pin 2 adjusts the IF signal level from the tuner. To stabilize the IF output voltage of the tuner, IF slip (= variation of IF gain over the total tuner range) is kept at a minimum.

10. Sync pulse separator

The sync pulse separator supplies two internally-used pulses using the bandwidth limited video signal. These are the composite sync for the AFC detector and the vertical sync for the video identification output. The bandwidth is limited to reduce the noise and increase the identification sensitivity.

11. Video identiﬁcation

An analog integrator monitors the duty cycle of the vertical sync pulses to identify the video signal. The integrator output is fed to a window comparator which has an open collector output stage to provide the video ident signal. The complete circuit operates in combination with the sync separator and is optimized for high sensitivity.

12. 90° phase shift and AFC demodulator

The AFC demodulator needs a 90° phase-shifted carrier. The output of the carrier signal reference limiter is fed to an active 90° phase-shift circuit. The 90° (lead) phase-shifted carrier and the IF signal are fed to the AFC demodulator. The demodulated signal and the IF signal are fed to the AFC gating stage.

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Philips Semiconductors Preliminary speciﬁcation

TV IF ampliﬁer and demodulator with TV signal identiﬁcation

13. AFC gating, AFC ampliﬁer and AFC switch

With negative modulated video IF signals the output of the AFC detector is gated by composite sync pulses to prevent video modulation on the AFC output. The gated signal is integrated by an AFC capacitor. The AFC amplifier converts the capacitor voltage to an AFC current (open collector sink/source output). The AFC function can be externally switched off for test purposes.

TDA3840

For high-performance signal handling the AFC signal can be used to track the resonant circuit as shown in Fig.11.

14. Voltage stabilizer

An integrated bandgap voltage stabilizer generates an internal supply voltage of 4 V. A decoupling capacitor reduces noise and supply voltage ripple.

April 1991 5

Fig.3 Internal circuits.

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Philips Semiconductors Preliminary speciﬁcation

TV IF ampliﬁer and demodulator with TV

TDA3840

signal identiﬁcation

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134)

SYMBOL PARAMETER MIN. MAX. UNIT

stg

amb

ESD

CHARACTERISTICS

= 5 V and T

amb

unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

RR ripple rejection (pin 12) 30 35 − dB

supply voltage at pin 15: SOT146 − 8.8 V

SOT163A − 6.0 V tuner AGC voltage − 13.2 V permissible voltage at AFC output − V

V supply current − 55 mA storage temperature range −25 + 150 °C operating ambient temperature range 0 + 70 °C ESD sensitivity −±300 V

= 25 °C; fVC = 38.9 MHz; all voltages are measured to GND (pin 17); measured in test circuit of Fig.4;

supply voltage range (pin 15) DIL-package 4.75 5.0 8.8 V

SO-package 4.75 5.0 6.0 V

supply current (pin 15) VP = 5.0 V − 42 − mA

IF ampliﬁer

B bandwidth −3dB − 80 − MHz R

1-20(rms)

input resistance (pins 1 and 20) − 2 − kΩ input capacitance (pins 1 and 20) − 1.5 − pF IF input signal (RMS value) video output −1dB − 70 −µV maximum IF input signal minimum G

; note 1 100 −−mV

gain control range 63 66 − dB

IF AGC

leakage current AGC capacitor −− 1µA charging current AGC capacitor with video identiﬁcation − 13 −µA charging current AGC capacitor without video

− 35 −µA

identiﬁcation

18M

discharging peak current capacitor − 2 − mA responsible time of IF input signal

change

50 dB increasing step − 1 − ms 50 dB decreasing step − 150 − ms

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Philips Semiconductors Preliminary speciﬁcation

TV IF ampliﬁer and demodulator with TV

TDA3840

signal identiﬁcation

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Tuner AGC (note 2)

1-20(rms)

lower IF input signal for starting point of tuner take-over; see Fig.5 (RMS value)

upper IF input signal for starting point of tuner take-over; see Fig.5 (RMS value)

TOP variation 60 K temperature range − 23dB

tuner AGC output current V19 = 0.5 V 1 2 − mA Synchronous demodulator and video ampliﬁer (note 3) V

composite video output signal 0.9 1.0 1.1 V

sync level voltage − 1.5 − V

zero carrier level voltage − 2.6 − V I

output current DC and AC −− ±1.0 mA

output resistance − 75 −Ω B video bandwidth at −1 dB (pin 14) C V

upper video clipping level − 3.6 − V

lower video clipping level − 0.3 − V

R2 = 22 kΩ−−1mV

R2 = 0 Ω 50 −−mV

≤ 20 pF 7 8 − MHz

load

Buffered video output signal (see Fig.6) G gain of video buffer 6.5 7.0 − dB

sync level clamping voltage − 1.35 − V

upper video clipping level − 4.25 − V

lower video clipping level − 0.3 − V I

B video bandwidth at −1 dB (pin 12) C R

output current DC and AC −− ±1.0 mA

output resistance −− 10 Ω

≤ 20 pF − 10 − MHz

load

input resistance (pin 13) − 3.3 − kΩ

input capacitance (pin 13) − 2 − pF

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Philips Semiconductors Preliminary speciﬁcation

TV IF ampliﬁer and demodulator with TV

TDA3840

signal identiﬁcation

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Overall video performance (see Fig.6)

video output signal (pin 12) negative modulation;

note 3 B video bandwidth at −2 dB (pin 12) C S/N signal-to-noise ratio (see Fig.7) V

intermodulation for blue (note 5) f = 1.1 MHz 56 58 − dB

≤ 20 pF 7 8 − MHz

load

= 10 mV; note 4 55 60 − dB

1-20

f = 3.3 MHz 62 −−dB

intermodulation for yellow (note 5) f = 1.1 MHz 53 56 − dB

f = 3.3 MHz 60 −−dB

signal harmonic suppression − 26 − dB video switch off voltage note 6 −− 1V attenuation of video signal (pin 14) video signal switched off 50 60 − dB

∆G differential gain EBU test line 330 − 2 − % ∆Φ differential phase EBU test line 330 − 2 − deg ∆V/V variation of video output signal

(pin 14)

res1

res2

residual vision carrier (pin 12) − 1 − mV residual second harmonic of the

gain control 50 dB;

1-20(rms)

= 0.3 to 100 mV

vision carrier (pin 12)

− 2 − V

−− 0.5 dB

− 1 − mV

Video identiﬁcation

1-20(rms)

minimum IF input signal for TV identiﬁcation at pin 14 (RMS value)

video identiﬁcation voltage (signal unidentiﬁed)

video identiﬁcation voltage (signal identiﬁed)

sync/Tﬁeld

vertical pulse duty cycle 4.5 8 16 x 10

C/N carrier-to-noise ratio

(pin 1 and pin 20)

allowed leakage current −− 3µA sync pulse suppression for

correct TV signal identiﬁcation

delay time of mute output signal − 100 150 ms

maximum G

= < 40 µV

1-20

rms

− 20 40 µV

−− 0.4 V

I6= 0.5 mA

1-20

= ≥ 40 µV

rms

4.5 −−V

I6= −1 µA

note 7 − 8 − dB

−− 70 %

−3

April 1991 8

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Philips Semiconductors Preliminary speciﬁcation

TV IF ampliﬁer and demodulator with TV

TDA3840

signal identiﬁcation

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

AFC (see Fig.9 and Fig.10); note 8

S control steepness QB= 40;

Notes to the characteristics

1. The video signal is still gain-controlled, V

2. The starting point of tuner AGC can be adjusted by the resistor at pin 2. Fig.5 shows the AGC characteristic.

3. IF input signals are RMS values measured at TOP sync (standard B/G) and with a vision carrier of 38.9 MHz (see Fig.4). The IF input signal is fed from 50 Ω via a 1:1 transformer, DSB, to pins 1 and 20. With a 10 mV input signal, the residual vision carrier is: = 10 % for white (standard B/G).

4. In the test circuit of Fig.4, measured and weighted according to CCIR Recommendation 567:

SN⁄

AFC source current output 0.16 0.19 0.22 mA AFC sink current output 0.16 0.19 0.22 mA upper output voltage 4.3 − 4.7 V lower output voltage 0.3 − 0.7 V

− 2 −µA/kHz

1-20(rms)

=10mV

leakage current at AFC gating −− ±1µA

= 1 V, but intermodulation figures are degraded.

14(p-p)

14 (black to white)

------------------------------------------------------- V

14 noise

(RMS, black)

RMS

at 4.4 MHz

5. Intermodulation figures are defined as follows:

at 4.4 MHz

and

6. When V

< 1 V (short-circuited identification capacitor at pin 5) the video output signal at pin 14 is switched off.

----------------------------------- -log×= at 3.3 MHz

----------------------------------- -log 3.6 dB+×= at 1.1 MHz

V14shifts to “zero carrier level” (“ultra white” (2.6 V) for negative modulation). During normal operation the capacitor at pin 5 should not be loaded (I5≤3µA).

7. The C/N at the IF input (pins 1 and 20) for TV identification is defined as the RMS sync level of the vision IF signal input, relative to the RMS value of a superimposed white noise signal, with a bandwidth limited to 5 MHz.

8. The values for the AFC measurements depend on the QB of the reference circuit at pins 10 and 11. The internal phase shift is matched to a vision carrier of 38.9 MHz. The AFC function can be switched off for test purposes when pin 7 is connected to ground (V7= 0 V).

April 1991 9

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Philips Semiconductors Preliminary speciﬁcation

TV IF ampliﬁer and demodulator with TV signal identiﬁcation

TDA3840

April 1991 10

Fig.4 Test circuit.

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Philips Semiconductors Preliminary speciﬁcation

TV IF ampliﬁer and demodulator with TV signal identiﬁcation

TDA3840

Fig.5 AGC characteristics with different values of R2.

Fig.6 Video waveforms at intercarrier (pin 14) and

buffered video (pin 12) outputs.

SC = sound carrier level; with respect to TOP sync level CC = chrominance carrier level; with respect to TOP sync level

PC = picture carrier level; with respect to TOP sync level

Fig.7 Signal-to-noise ratio as a function of IF input

voltage (RMS value) at pins 1 and 20.

April 1991 11

Sound trap attenuation: 17 dB

Fig.8 Input conditions for intermodulation

measurements.

Page 12

Philips Semiconductors Preliminary speciﬁcation

TV IF ampliﬁer and demodulator with TV signal identiﬁcation

APPLICATION INFORMATION

TDA3840

Fig.9 AFC interfacing for analog tuning systems

and AFC characteristic.

Fig.10 AFC interfacing for µP controlled systems.

(1) Without automatic tracking

delete dashed lines with components. C increased to 68 pF.

must be

Fig.11 Application circuit with automatic tracking function and notch filter (dashed lines).

April 1991 12

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Philips Semiconductors Preliminary speciﬁcation

TV IF ampliﬁer and demodulator with TV signal identiﬁcation

TDA3840

Fig.12 Reference circuit with notch filter for improved pulse response and better signal linearity.

Note to ﬁgure 12

Recommended for reception of data signals e.g. in Teletext. Values in combination with SAW filter OFW G 1956 (Siemens). Curve shows combined frequency response of SAW filter and reference circuit.





For different standards C

and Cp are calculated as follows:

---------- -



1–

April 1991 13

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Philips Semiconductors Preliminary speciﬁcation

TV IF ampliﬁer and demodulator with TV signal identiﬁcation

PACKAGE OUTLINES

DIP20: plastic dual in-line package; 20 leads (300 mil)

seating plane

TDA3840

SOT146-1

w M

(e )

pin 1 index

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A 

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

OUTLINE

VERSION

SOT146-1

1 2

min.

max.

1.73

1.30

0.068

0.051

IEC JEDEC EIAJ

  SC603

0.53

0.38

0.021

0.015

0.36

0.23

0.014

0.009

REFERENCES

cD E e M

(1) (1)

26.92

26.54

1.060

1.045

6.40

6.22

0.25

0.24

(1)

3.60

8.25

3.05

7.80

0.14

0.32

0.12

0.31

EUROPEAN

PROJECTION

10.0

0.2542.54 7.62

8.3

0.39

0.010.10 0.30

0.33

ISSUE DATE

92-11-17 95-05-24

Z

max.

2.04.2 0.51 3.2

0.0780.17 0.020 0.13

April 1991 14

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Philips Semiconductors Preliminary speciﬁcation

TV IF ampliﬁer and demodulator with TV signal identiﬁcation

SO20: plastic small outline package; 20 leads; body width 7.5 mm

TDA3840

SOT163-1

v M

pin 1 index

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

max.

2.65

0.10

0.30

0.10

0.012

0.004

2.45

2.25

0.096

0.089

0.25

0.01

0.49

0.36

0.32

0.23

0.013

0.009

0.019

0.014

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

w M

scale

(1)E(1) (1)

13.0

12.6

0.51

0.49

eHELLpQ

7.6

1.27

7.4

0.30

0.050

0.29

10.65

10.00

0.42

0.39

1.4

0.055

1.1

0.4

0.043

0.016

detail X

1.1

1.0

0.043

0.039

(A )

0.25

0.01

0.25 0.1

0.01

ywv θ

0.9

0.4

0.004

0.035

0.016

o o

OUTLINE

VERSION

SOT163-1

April 1991 15

REFERENCES

IEC JEDEC EIAJ

075E04 MS-013AC

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17 95-01-24

Page 16

Philips Semiconductors Preliminary speciﬁcation

TV IF ampliﬁer and demodulator with TV signal identiﬁcation

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

DIP

OLDERING BY DIPPING OR BY WAVE

S The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

REFLOW SOLDERING Reflow soldering techniques are suitable for all SO

packages.

(order code 9398 652 90011).

). If the

stg max

TDA3840

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.

AVE SOLDERING

W Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.

• The longitudinal axis of the package footprint must be parallel to the solder flow.

• The package footprint must incorporate solder thieves at the downstream end.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

April 1991 16

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Philips Semiconductors Preliminary speciﬁcation

TV IF ampliﬁer and demodulator with TV

TDA3840

signal identiﬁcation

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

April 1991 17