Datasheet tda3833 DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA3833

BTSC-stereo/SAP/DBX decoder
and DBX expander

Product specification
File under Integrated Circuits, IC02

September 1992

Philips Semiconductors Product specification

BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833

FEATURES

• DBX decoder, MPX decoder
and SAP decoder on chip

• Extensive switching
possibilities for the AF outputs
and the extra headphone
output

• Stereo and SAP signal
available simultaneously

• Reliable stereo/SAP
identification by means of the
noise detector

• Integrated filters

• DAC control possible for most

alignments

• Few external components

• Low power consumption

(200 mW)

•+5 V supply voltage

GENERAL DESCRIPTION

QUICK REFERENCE DATA

SYMBOL PARAMETER TYP. UNIT

V

P

I

P

V

i

positive supply voltage (pin 32) 5 V
supply current 42 mA
input signal, 100% modulated, mono

100 mV

(RMS value, pin 1)

V

o

AF output signal (RMS value, pins 7, 23 and 24) 550 mV
S/N(W) signal-to-noise ratio, weighted 50 dB
S/N signal-to-noise ratio 60 dB

α

CH

α

CR

stereo channel separation 26 dB

crosstalk attenuation 60 dB
THD total harmonic distortion 0.2 %

ORDERING INFORMATION

PACKAGE

EXTENDED

TYPE NUMBER

PINS

TDA3833 32 SDIL plastic SOT232AG
TDA3833T 32 SO plastic SOT287AH

PIN

POSITION

MATERIAL CODE

(1)
(2)

The TDA3833 is a sound
processor for stereo/second
audio program (SAP) baseband
signals in accordance with the
BTSC standard for television
receivers and video tape
recorders.

Note

1. SOT232-1; 1996 December 13.

2. SOT287-1; 1996 December 13.

September 1992 2

Philips Semiconductors Product specification

BTSC-stereo/SAP/DBX decoder and DBX
expander

TDA3833

(1) control possible by DAC

(2) DBX encoded

Fig.1 Block diagram, test and application circuit.

September 1992 3

Philips Semiconductors Product specification

BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833

PINNING

SYMBOL PIN DESCRIPTION

V

i

ILV 2 input level control
f

ref

C

SAP

C

ND

SAPI 6 SAP indicator output (sink)
V

oHP

V

o SAP

SAPLV 9 SAP level control
LRLV 10 (L-R) level control
MODE 11 4-state mode control
C1

SPB

DBXLV 13 DBX spectral adjust
C1

WB

DBXT 15 DBX timing adjust
C2

SPB

C2

WB

C1

DC

C2

DC

EMPH1 20 time constant for variable emphasis
DBXIN 21 DBX signal input
EMPH2 22 time constant for variable emphasis
V

oAF1

V

oAF2

GND 25 ground (0 V)
C

ref

VCO 27 VCO free running frequency adjustment
LOOP 28 phase detector loop filter
STERI 29 stereo indicator output (sink)
PILOT 30 pilot cancel adjustment
C

pil

V

P

1 composite input signal (MPX/SAP)

3 adjustment of filter reference
4 SAP identity smoothing capacitor
5 SAP noise detector smoothing capacitor

7 SAP/mono headphone output
8 output signal SAP/(L-R) without DBX

12 spectral band timing capacitor

14 wideband timing capacitor

16 spectral RMS-detector smoothing capacitor
17 wideband RMS-detector smoothing capacitor
18 DC decoupling capacitor 1 for offset compensation
19 DC decoupling capacitor 2 for offset compensation

23 AF output signal right/SAP or mono
24 AF output signal left/SAP or mono

26 smoothing capacitor for internal reference voltage

31 pilot detector smoothing capacitor, VCO/4 output
32 +5 V supply voltage

Fig.2 Pin configuration.

September 1992 4

Philips Semiconductors Product specification

BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC134)

SYMBOL PARAMETER MIN. MAX. UNIT

V

P

V

1

V

11

I

7,23,24

I

6,29

P

tot

T

stg

T

amb

V

ESD

Note to the limiting values

1. Equivalent to discharging a 100 pF capacitor through an 1.5 kΩ series resistor.

supply voltage (pin 32) 0 8 V
composite input voltage 0 V

P

V
MODE input voltage 0 8 V
output current (AF outputs) 0 5 mA
output current (indication outputs) 0 5 mA
total power dissipation 0 500 mW
storage temperature range −55 +150 °C
operating ambient temperature range 0 +70 °C
electrostatic handling for all pins (note 1) −±4000 V

CHARACTERISTICS

= 5 V; T

V

P

= 1 kHz, unless otherwise specified. Measurements taken in Fig. 1 including all adjustments.

f

mod

= +25 °C; for MPX: ∆f = 25 kHz for L+R (100% modulation); f

amb

= 1 kHz; and for SAP: ∆f = 10 kHz;

mod

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

I

P

V

n

supply voltage range (pin 32) 4.75 5 5.35 V
supply current − 42 − mA
DC input/output voltage at pins 1, 7, 8,

− VP/2 − V

18, 19, 21, 23 and 24

MODE select 4-state input (see Table 1)

V

11

I

11

input voltage for

mono/SAP 0− V
SAP V
stereo V
mono V

/2-0.4 − VP/2+0.4 V

P

/2+1 − V

P

+1.4 − 8V

P

/2−1V

P

P

input current for

V

mono/SAP −− 15 µA
SAP −− 15 µA
stereo −− 5 µA
mono V

= 7.2 V −− 300 µA

11

September 1992 5

Philips Semiconductors Product specification

BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Composite input (pin 1)

R

i

V

i

V

i

G

v

V

2

I

2

Voltage controlled oscillator (VCO) (pin 27)

f

VCO

∆f

29

TC temperature coefficient −− 50 10

input resistance on pin 1 14 20 26 kΩ
input signal on pin 1 (RMS value) see note 1
L+R (all other signals in accordance

70 100 140 mV

with BTSC system specification)
pilot threshold for MPX

stereo on −− 16 mV

stereo off 5 −−mV
hysteresis of threshold MPX − 2.5 − dB
pilot threshold for SAP

SAP on −− 37 mV

SAP off 16 −−mV
hysteresis of threshold SAP − 2 − dB
gain control range dependent on V

±5 ±7.5 − dB

2

control voltage range (pin 2) − 1 to 4 − V
input current (pin 2) V2=VP/2 −− 5 µA

nominal VCO frequency (4fH) see note 2 − 62.94 − kHz
capture range nominal pilot −− 1 kHz

−6

/K

Stereo indication output (pin 29)

V

29

output voltage range

stereo present −− 0.5 V

stereo not present V

I

29

output current active LOW stereo present 3 −−mA

SAP/mono output (pin 7)

V

o

output signal (RMS value, pin 7) see note 3 − 550 − mV
output signal headroom mono − 9.5 − dB

R

7

R

L

C

L

output resistance − 100 200 Ω
load resistance 10 −−kΩ
load capacitance −− 500 pF

THD total harmonic distortion

SAP signal − 0.5 − %

mono signal − 0.2 − %

B frequency response 50 to 10000 Hz mono; external

75 µs de-emphasis

S/N(W) weighted signal-to-noise ratio

(CCIR468-3)

mono; external

75 µs de-emphasis

−0.5 − V

P

P

V

−3 −−dB

− 50 − dB

September 1992 6

Philips Semiconductors Product specification

BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

SAP indication output (pin 6)

V

6

I

6

Audio outputs (pins 23 and 24)

V

o

∆V

L,R

∆V

o

∆V

23,24

R

23,24

R

L

C

L

THD total harmonic distortion

B L and R frequency response

output voltage range

SAP present −− 0.5 V

SAP not present V

-0.5 − V

P

P

V

output current active LOW SAP present 3 −−mA

output signal

see note 3 − 550 − mV
(RMS value, pins 23 and 24)

output signal headroom − 9.5 − dB
output signal difference between L and R f = 250 to 6300 Hz −− 3dB
output signal difference after switching

f = 250 to 6300 Hz −− 3dB
from L or R to SAP

DC offset voltage after switching stereo/mono/SAP −− ±100 mV
output resistance − 200 300 Ω
load resistance 10 −−kΩ
load capacitance −− 500 pF

L and R signal − 0.2 − %

SAP signal − 0.5 − %

f = 50 to 10000 Hz

12 kHz related to

−3 −−dB

−−3 − dB

1 kHz
SAP frequency response f = 50 to 8000 Hz −3 −−dB

S/N(W) weighted signal-to-noise ratio L + R signal;

CCIR468-3

S/N unweighted signal-to-noise ratio

(RMS value)

α

CR

crosstalk

L + R signal;

f = 20 to 20000 Hz

L or R into SAP 50 63 − dB

SAP into L or R 50 70 − dB

α

CH

channel separation
(according to DBX requirements)

f = 100 to 5000 Hz

10% 75 µs

equivalent input

modulation

1 to 100% 75 µs15 20 − dB

equivalent input

modulation

September 1992 7

− 50 − dB

− 60 − dB

20 26 − dB

Philips Semiconductors Product specification

BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

DBX section

V

9

V

10

V

13

I

9,10,13

S

1

I

12

S

2

I

14

V15timing adjustment − 1.5 to 3.8 − V

SAP level control voltage range − 1 to 4 − V
(L - R) level control voltage range − 1 to 4 − V
spectral band level control voltage range − 1.8 to 3.2 − V
input current VI= 0.5V

P

−− 5 µA
spectral RMS-detector release rate 343 381 419 dB/s
timing current for nominal release

see note 4 − 22.5 −µA

rate of spectral RMS-detector
current adjustment range − 11 to 45 µA
wideband RMS-detector release rate 112.5 125 137.5 dB/s
timing current for nominal release rate

0.33l12; see note 4 − 7.5 −µA

of wideband RMS-detector
current adjustment range − 4 to 15 −µA

Notes to the characteristics

1. Requirements for the MPX/SAP input signal to ensure correct system performance:
a) Maximum variation of MPX/SAP signal under operating conditions: to be found (1 dB).
b) 3 dB bandwidth ≥ 130 kHz (∆f = 25 kHz).
c) THD (L + R, ∆f = 25 kHz, f
d) S/N(W), weighted in accordance with CCIR468-3 (L + R, ∆f = 25 kHz for sound carrier, f

= 1 kHz): 0.2%.

mod

= 1 kHz, 75 µs

mod

de-emphasis; with critical picture modulation): S/N(W) > 44 dB; with sync only: S/N(W)> 54 dB.

e) Spectral spurious attenuation: 40 dB (mainly n × fH; L + R, ∆f = 25 kHz for sound carrier f

= 1 kHz, 50 Hz to

mod

100 kHz, no de-emphasis).

f) Maximum white noise level (unweighted, 200 Hz to 100 kHz) to avoid malfunctioning of the identification circuits:

500 mV (RMS).

2. Adjustable on pin 27, measurement (fH) on pin 7 with a 2.7 kΩ resistor connected between VP and pin 31.

3. Can also be aligned to 600 mV (RMS), then identification threshold and AF output headroom will be decreased by

1.6 dB.

4. I12 and I14 can be measured via an ammeter connected to 4 V (3.5 to 4.1 V).

September 1992 8

Philips Semiconductors Product specification

BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833

Table 1 MODE select; 4-state pin 11

MODE

V11(VP= 5 V)

SAP CARRIER

AF OUTPUTS SAP/MONO OUTPUT

(V) PIN 23 PIN 24 PIN 7

mono 8 on mono mono SAP without DBX
stereo V
SAP V

P

/2 on SAP SAP mono

P

on right left SAP without DBX

mono/SAP 0 on SAP mono SAP without DBX
mono 8 off mono mono mono
stereo V
SAP V

P

/2 off right left mono

P

off right left mono

mono/SAP 0 off mute mono mono

September 1992 9

Philips Semiconductors Product specification

BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833

PACKAGE OUTLINES

SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)

D

seating plane

L

Z

32

pin 1 index

e

b

SOT232-1

M

E

A

2

A

A

1

w M

b

1

17

E

c

(e )

M

1

H

1

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

A

A

A

UNIT b

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

mm

OUTLINE
VERSION

SOT232-1

max.

4.7 0.51 3.8

12

min.

max.

IEC JEDEC EIAJ

1.3

0.8

b

1

0.53

0.40

REFERENCES

cEe M

0.32

0.23

(1) (1)

D

29.4

28.5

September 1992 10

9.1

8.7

16

(1)

Z

L

3.2

2.8

EUROPEAN

PROJECTION

M

10.7

10.2

E

12.2

10.5

e

1

w

H

0.181.778 10.16

ISSUE DATE

92-11-17
95-02-04

max.

1.6

Philips Semiconductors Product specification

BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833

SO32: plastic small outline package; 32 leads; body width 7.5 mm

D

y

Z

32

pin 1 index

1

e

17

16

w M

b

p

SOT287-1

E

c

H

E

A

2

A

1

L

detail X

A

X

v M

A

Q

(A )

L

p

A

3

θ

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT287-1

A

A1A2A3b

max.

0.3

2.65

0.1

0.012

0.10

0.004

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

September 1992 11

0 5 10 mm

(1)E(1)

cD

p

2.45

2.25

0.096

0.086

IEC JEDEC EIAJ

0.25

0.01

0.49

0.36

0.02

0.01

0.27

0.18

0.011

0.007

20.7

7.6

20.3

7.4

0.30

0.81

0.29

0.80

REFERENCES

scale

eHELLpQZywv θ

1.27

0.050

10.65

10.00

0.42

0.39

1.4

0.055

1.1

0.4

0.043

0.016

1.2

1.0

0.047

0.039

0.25 0.1

0.25

0.010.01

EUROPEAN

PROJECTION

0.004

(1)

0.95

0.55

0.037

0.022

ISSUE DATE

92-11-17
95-01-25

o

8

o

0

Philips Semiconductors Product specification

BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

(order code 9398 652 90011).

SDIP

OLDERING BY DIPPING OR BY WAVE

S
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING

method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R
Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating

September 1992 12

Philips Semiconductors Product specification

BTSC-stereo/SAP/DBX decoder and DBX expander TDA3833

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

September 1992 13