Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA3826
Single FM TV-sound demodulator
circuit
Product specification
File under Integrated Circuits, IC02
September 1988
Page 2
Philips Semiconductors Product specification
Single FM TV -sound demodulator circuit TDA3826
GENERAL DESCRIPTION
The TDA3826 is a single FM demodulator system with mute and 6 dB AF amplifier.
Features
• Supply voltage range from 4.5 V to 13.2 V
• AC coupled AF stage
• AF operational amplifier output with offset compensated input stage
• High AF output voltage with low distortion
• High ripple rejection
• Low switching noise between AF and mute
QUICK REFERENCE DATA
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage (pin 11) V
P
Supply current (pin 11)
= 5.0 V I
V
P
= 12 V I
V
P
P
P
FM demodulator
AF output voltage (pin 5)
(RMS value) ∆f = 50 kHz;
=11
Q
B
V
5-1
Signal plus weighted-noise
to weighted-noise ratio (S + W)/W 65 70 − dB
Total harmonic distortion THD − 0.3 − %
4.5 5.0 13.2 V
− 16 − mA
− 18 − mA
− 0.5 − V
AF switch
AF output voltage (pin 12)
(RMS value) THD ≤ 0.1%;
=6dB
G
v
PACKAGE OUTLINE
14-lead DIL; plastic (SOT27); SOT27-1; 1996 November 27.
September 1988 2
V
12-1
− 1.0 − V
Page 3
Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3826
September 1988 3
Fig.1 Block diagram.
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Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3826
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT
Supply voltage (pin 11) V
External DC load resistance R
Total power dissipation P
Storage temperature range T
Operating ambient temperature range T
P
L
tot
stg
amb
4.5 13.2 V
5 − kΩ
− 400 mW
−25 +125 °C
0 +70 °C
September 1988 4
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Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3826
CHARACTERISTICS
= 5 V; T
V
P
circuit of Fig.2; unless otherwise specified
Supply voltage (pin 11) V
Total current consumption I
Limiting amplifier
Input voltage (pin 14)
(RMS value)
DC voltages
pin 2 V
pin 13 V
pin 14 V
Input resistance R
FM demodulator
DC voltages
pin 7 V
pin 8 V
AF output voltage (pin 5)
(RMS value) Q
AM suppression f
Total harmonic distortion THD − 0.3 − %
Output impedance (pin 5) Z
Signal plus weighted-noise
to weighted-noise ratio in accordance with
Signal plus noise-to-noise ratio B
Residual RF signal (pin 5)
(RMS value) 2 × f
Ripple rejection f
= 25 °C; Vi = 10 mV; fo = 5.5 MHz; fAF = 1 kHz; ∆f = 50 kHz; all parameters were measured with the test
amb
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
4.5 5.0 13.2 V
− 16 20 mA
−−200 mV
−−50 µV
− 2 − V
− 2 − V
− 2 − V
− 620 −Ω
− 3.2 − V
− 3.2 − V
− 0.5 − V
50 −− dB
3 dB signal reduction V
= 11 V
B
= 400 Hz; m = 0.3;
AM
tot
V
α
P
14-1
14-1
2-1
13-1
14-1
14-13
7-1
8-1
5-1
AM
Vi = 500 µV(rms)
− 6 − kΩ
5-1
(S + W)/W 65 70 − dB
DIN4505; CCIR468-3
= 20 kHz (S+ N)/N 75 80 − dB
noise
o
V
5-1
− 30 − mV
without de-emphasis
= 70 Hz;
R
α
R
40 45 − dB
VR= 100 mV(p-p)
September 1988 5
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Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3826
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
AF switch (pin 12)
Open loop gain G
oI
Noise output voltage
(RMS value) B
Slew rate 2 −− V/µs
= 20 kHz V
noise
12-1
V
∆
12 1–
------------------t∆
Maximum AF output voltage
(RMS value) THD ≤ 0.1%; G
=
v
V
12-1
6dB
Input impedance
(pin 4) Z
(pin 10) Z
−1 dB small signal bandwidth B
DC output current I
Output load capacitance C
50 −− kΩ
4-1
50 −− kΩ
10-1
af
12
L
Feedback resistor
(pin 3 to pin 12) R
DC output voltage V
AF suppression in case of
α
3-12
12-1
mute
mute
Mute control
see Fig.3
Mute control voltage (pin 10)
Input (pin 4) active
input voltage V
input current I
10-1
10
Mute active
input voltage V
input current I
input voltage V
input current I
10-1
10
10-1
10
Input voltage at pin 10
for I10 = 0 µAV
10-1
50 60 − dB
− 20 −µV
1.1 −− V
100 −− kHz
−−1mA
−−500 pF
0 −− Ω
− 2.27 − V
70 76 − dB
1/3 V
P
− 2/3 VP−0.7 V
−200 −+200 µA
0 − 1/3 VP−1V
10 − 500 µA
2/3 VP+ 0.7 − V
P
V
−600 −−40 µA
−−V
V
0.7–
P
--------------------2
September 1988 6
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Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3826
Fig.2 Test circuit.
September 1988 7
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Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3826
Fig.3 Mute control logic diagram.
September 1988 8
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Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3826
September 1988 9
Fig.4 Input/output loading diagram.
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Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3826
APPLICATION INFORMATION
September 1988 10
Fig.5 Application diagram.
Page 11
Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3826
PACKAGE OUTLINE
DIP14: plastic dual in-line package; 14 leads (300 mil)
D
seating plane
L
Z
14
pin 1 index
e
b
SOT27-1
M
E
A
2
A
A
1
w M
b
1
8
E
c
(e )
1
M
H
1
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
max.
mm
OUTLINE
VERSION
SOT27-1
1 2
min.
max.
1.73
1.13
0.068
0.044
IEC JEDEC EIAJ
050G04 MO-001AA
b
b
1
0.53
0.38
0.021
0.015
0.014
0.009
REFERENCES
cD
0.36
0.23
(1) (1)
19.50
18.55
0.77
0.73
September 1988 11
7
L
Ee M
6.48
6.20
0.26
0.24
e
1
3.60
3.05
0.14
0.12
M
E
8.25
7.80
0.32
0.31
EUROPEAN
PROJECTION
H
10.0
8.3
0.39
0.33
w
max.
0.2542.54 7.62
0.010.10 0.30
0.0870.17 0.020 0.13
ISSUE DATE
92-11-17
95-03-11
(1)
Z
2.24.2 0.51 3.2
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Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3826
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up
to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
(order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
stg max
). If the
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
September 1988 12
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