Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA3825
Single FM TV-sound demodulator
circuit
Product specification
File under Integrated Circuits, IC02
September 1988
Page 2
Philips Semiconductors Product specification
Single FM TV -sound demodulator circuit TDA3825
GENERAL DESCRIPTION
The TDA3825 is a single FM demodulator system with external AF input and mute.
Features
• Supply voltage range from 4.5 V to 13.2 V
• AC coupled AF stage
• Multiple input AF operational amplifier with offset compensation
• External AF input
• High AF output voltage with low distortion
• AF gain of 0 dB without external components
• Frequency response can be determined by external components
• High ripple rejection
• Low switching noise between AF and mute
QUICK REFERENCE DATA
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage (pin 11) V
P
4.5 5.0 13.2 V
Supply current (pin 11)
= 5.0 V I
V
P
= 12 V I
V
P
P
P
− 16 − mA
− 18 − mA
FM demodulator
AF output voltage (pin 5)
(RMS value) ∆f = 50 kHz;
=11
Q
B
V
5−1
− 0.5 − V
Signal plus weighted-noise
to weighted-noise ratio (S + W)/W 65 70 − dB
Total harmonic distortion THD − 0.3 0.5 %
Source selector
AF output voltage (pin 12)
(RMS value) THD ≤ 0.1%;
= 6 dB
V
u
V
12−1
− 1.0 − V
PACKAGE OUTLINE
14-lead DIL; plastic (SOT27); SOT27-1; 1996 November 25.
September 1988 2
Page 3
Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3825
September 1988 3
Fig.1 Block diagram.
Page 4
Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3825
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT
Supply voltage (pin 11) V
External DC load resistance R
Total power dissipation P
Storage temperature range T
Operating ambient temperature range T
P
L
tot
stg
amb
4.5 13.2 V
5 − kΩ
− 400 mW
−25 + 125 °C
0 + 70 °C
September 1988 4
Page 5
Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3825
CHARACTERISTICS
=5 V; T
V
P
circuit of Fig. 2; unless otherwise specified
Supply voltage (pin 11) V
Total current consumption I
Limiting amplifier
Input voltage (pin 14)
(RMS value)
DC voltages
pin 2 V
pin 13 V
pin 14 V
Input resistance R
Input capacitance C
FM demodulator
DC voltages
pin 7 V
pin 8 V
AF output voltage (pin 5)
(RMS value) Q
AM suppression f
Total harmonic distortion THD − 0.3 0.5 %
Output impedance (pin 5) Z
Signal plus weighted-noise
to weighted-noise ratio in accordance with
Signal plus noise-to-noise
ratio
Residual RF signal (pin 5)
(RMS value) 2 x f
Ripple rejection f
Source selector (pin 12)
Open loop gain G
Noise output voltage
(RMS value) B
=25°C; Vi= 10 mV; fo= 5.5 MHz; fAF= 1 kHz; ∆f = 50 kHz; all parameters were measured with the test
amb
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
4.5 5.0 13.2 V
− 16 20 mA
−−200 mV
−−50 µV
− 2 − V
− 2 − V
− 2 − V
15 −− kΩ
−−6pF
− 3.2 − V
− 3.2 − V
− 0.5 − V
50 −− dB
3 dB signal reduction V
=11 V
B
= 400 Hz; m = 0.3;
AM
tot
V
α
P
14-1
14-1
2-1
13-1
14-1
14-13
14-13
7-1
8-1
5-1
AM
Vi= 500 µV(rms)
− 6 − kΩ
5-1
(S + W)/W 65 70 − dB
DIN4505; CCIR468-3
= 20 kHz (S + N)/N 75 80 − dB
B
noise
o
V
5−1
− 30 − mV
without de-emphasis
= 70 Hz;
R
VR= 100 mV
= 20 kHz V
noise
(p-p)
αR40 45− dB
ol
12-1
50 60 − dB
− 20 −µV
September 1988 5
Page 6
Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3825
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Slew rate 2 −− V/µs
Maximum AF output voltage
(RMS value) THD ≤ 0.1%;
= 6 dB
V
u
Input impedance
(pin 4) Z
(pin 10) Z
−1 dB small signal bandwidth B
DC output current I
Output load capacitance C
Feedback resistor
(pin 3 to pin 6) R
(pin 3 to pin 12) R
DC output voltage V
AF suppression for mute α
Crosstalk attenuation α
Offset voltage between any
two source selector
positions
Source selector control
see Fig.3
Source coltrol voltage (pin 9)
Mute active
input voltage V
input current I
Input 1 active (pin 4)
input voltage V
input current I
Input 2 active (pin 10)
input voltage V
input current I
Input voltage at pin 9
=0µAV
for I
9
V
∆
12 1–
------------------t∆
V
12-1
50 −− kΩ
4-1
50 −− kΩ
10-1
af
12
L
3-6
3-12
12-1
mute
4/10
V
12-6
9-1
9
9-1
9
9-1
9
9-1
1.1 −− V
100 −− kHz
−−1mA
−−500 pF
−−10 kΩ
0 −− Ω
− 2.27 − V
70 76 − dB
64 70 − dB
−−50 mV
0 − 1/3VP−1V
10 − 500 µA
1/3 V
P
− 2/3 VP−0.7 V
−200 −+200 µA
2/3 VP+ 0.7 − V
P
V
−600 −−40 µA
−−V
VP0.7–
--------------------2
Reference source (pin 6)
Reference voltage input V
Output current I
September 1988 6
ref
− 250 −µA
6
2.17 2.27 2.37 V
Page 7
Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3825
September 1988 7
Fig.2 Test circuit.
Page 8
Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3825
Fig.3 Source selector logic diagram.
September 1988 8
Page 9
Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3825
September 1988 9
Fig.4 Input/output loading diagram.
Page 10
Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3825
APPLICATION INFORMATION
Fig.5 Application diagram.
September 1988 10
Page 11
Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3825
PACKAGE OUTLINE
DIP14: plastic dual in-line package; 14 leads (300 mil)
D
seating plane
L
Z
14
pin 1 index
e
b
SOT27-1
M
E
A
2
A
A
1
w M
b
1
8
E
c
(e )
1
M
H
1
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
max.
mm
OUTLINE
VERSION
SOT27-1
1 2
min.
max.
1.73
1.13
0.068
0.044
IEC JEDEC EIAJ
050G04 MO-001AA
b
b
1
0.53
0.38
0.021
0.015
0.014
0.009
REFERENCES
cD
0.36
0.23
(1) (1)
19.50
18.55
0.77
0.73
September 1988 11
7
L
Ee M
6.48
6.20
0.26
0.24
e
1
3.60
3.05
0.14
0.12
M
E
8.25
7.80
0.32
0.31
EUROPEAN
PROJECTION
10.0
8.3
0.39
0.33
H
0.2542.54 7.62
ISSUE DATE
w
0.010.10 0.30
92-11-17
95-03-11
Z
max.
2.24.2 0.51 3.2
0.0870.17 0.020 0.13
(1)
Page 12
Philips Semiconductors Product specification
Single FM TV-sound demodulator circuit TDA3825
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
(order code 9398 652 90011).
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
September 1988 12
Loading...