Datasheet tda3755 DATASHEETS (Philips)

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Page 1

INTEGRATED CIRCUITS

DATA SH EET

TDA3755

PAL/NTSC/SECAM synchronization processor for video recorders

Product speciﬁcation File under Integrated Circuits, IC02

June 1986

Page 2

Philips Semiconductors Product speciﬁcation

PAL/NTSC/SECAM synchronization

TDA3755

processor for video recorders

GENERAL DESCRIPTION

The TDA3755 is a monolithic integrated circuit for PAL/NTSC SECAM synchronization processing in VHS video recorders.

Features

• Adaptive sync separator

• Internal vertical sync pulse integrator

• Composite sync and vertical pulse output

• Current controlled oscillator (CCO) with 320/321 times

horizontal frequency

QUICK REFERENCE DATA

Supply voltage (pin 13) V Supply current (pin 13) I

Sync separator

Sync pulse input voltage

(peak-to-peak value) V

Sync pulse output voltage

(peak-to-peak value) V

Vertical sync pulse

Output voltage

(peak-to-peak value) V

Phase detector

Catching range ∆f min. ± 3,0 %

• Horizontal phase detector with current output

• Video identification and mute circuit

• Burst gating pulse output (externally adjustable phase

relationship)

• Test-picture output

• Subcarrier frequency output switched in phase in

accordance with VHS standard

• Fast phase correction of subcarrier frequency

• Selection input to force PAL or NTSC function

• Still picture input

P=V13-15

= I

3-15(p-p)

1-15(p-p)

18-15(p-p)

typ. 10 V typ. 24 mA

typ. 300 mV

min. 7,3 V

min. 2,7 V

Oscillator

Oscillator frequency

PAL f NTSC f

Output frequency

PAL f NTSC f

Output sinewave

(peak-to-peak value) V

PACKAGE OUTLINE

18-lead DIL; plastic (SOT102); SOT102-1; 1996 December 11.

June 1986 2

osc osc

o o

8-15(p-p)

typ. 5,02 MHz typ. 5,04 MHz

typ. 627 kHz typ. 629 kHz

typ. 3 V

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Philips Semiconductors Product speciﬁcation

PAL/NTSC/SECAM synchronization processor for video recorders

TDA3755

June 1986 3

Fig.1 Block diagram

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Philips Semiconductors Product speciﬁcation

PAL/NTSC/SECAM synchronization processor for video recorders

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

Supply voltage (pin 13) V Voltage range at pins 2, 3, 4, 7, 9, 10, 11, 17 to pin 15 (ground) V Voltage range at pin 12 V Voltage range at pin 6 V

Currents

at pins 1, 5, 8, 14, 16, 18 ± I at pin 6 −I

at pin 12 I Total power dissipation P Storage temperature range T Operating ambient temperature range T

= V

n -15 12-15 6-15

tot stg amb

13-15

TDA3755

max. 13,2 V

0 to V

min. 0 V max. 8 V

max. 5 mA max. 1 mA max. 2 mA max. 1 W

−25 to + 150 °C 0 to + 70 °C

June 1986 4

Page 5

Philips Semiconductors Product speciﬁcation

PAL/NTSC/SECAM synchronization

TDA3755

processor for video recorders

CHARACTERISTICS

= 10 V; T

Supply (pin 13) Supply voltage range V

Supply current I Sync separator (pin 3) Colour composite video

input voltage (note 2) (peak-to-peak value)

Sync pulse amplitude

(peak-to-peak value) V

Slicing level, relative to

sync pulse amplitude (note 3) − 50 − % Internal resistance of video source R Sync output voltage HIGH

at −I

Sync output voltage LOW

= 1 mA V

at I

Delay between signal

at input pin 3 and sync pulse

at output pin 1

= 25 °C; measured in Fig.4; unless otherwise speciﬁed

amb

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

=1mA V

= V

= I

3-15(p-p)

1-15

9,6 − 13,2 V

13-15

− 24 − mA

− 1 − V

75 − 600 mV

−− 1kΩ

7,8 −− V

−− 0,5 V

− 0,2 −µs

Vertical sync pulse (pin 18; note 4) Output voltage HIGH

= 1 mA V

at −I

Output voltage LOW

= 1,6 mA V

at I

Duration of HIGH state

of internally generated output pulse t Delay between leading edge of input

signal at pin 3 and leading edge of

output pulse at pin 18 Selection input (pin 4) Input voltage for NTSC state V

Input current

at V

= 0 V −I

4-15

Input voltage for PAL state

pin 4 open circuit V

18-15

4-15

2,7 − 5,0 V

−− 0,5 V

− 190 −µs

32 − 64 µs

−− 0,3 V

−− 20 µA

2 −− V

June 1986 5

Page 6

Philips Semiconductors Product speciﬁcation

PAL/NTSC/SECAM synchronization

TDA3755

processor for video recorders

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

Test picture/mute/synthetic sync pulse

Minimum voltage at pin 11 for

test picture mode active (note 5) V

11-15

Maximum voltage at pin 11 for

test picture mode inactive V

11-15

Output voltage at pin 16

at test picture “black” or at mute V

at test picture “white” V

at “in sync condition” V Input current (pin 11) −I

16-15 16-15 16-15

Oscillator/phase detector

Oscillator frequency (note 6)

PAL f

NTSC f Oscillator conversion gain k D.C. control voltage V Input current for f = 5,016 MHz −I

osc osc

6-15

Holding range (note 7) ∆f ± 3,2 −− % Catching range (note 7) ∆f ± 3,0 −− % Control loop gain k

Output of lower subcarrier (note 8)

(peak-to-peak value) V Output current I D.C. output voltage V

8-15(p-p)

8-15

2nd harmonic suppression

without switching α

2nd

Switching position prior to centre

of sync pulse (pin 3) t

Output peak current of phase detector

during sync pulse ±I Output voltage range (note 9) V

5-15

4,8 −− V

−− 3,8 V

− 2,75 − V

− 4,50 − V

−− 0,5 V

−− 25 µA

− 5,02 − MHz

− 5,04 − MHz

− 16,13 − MHz/mA

− 2,1 − V

− 310 −µA

− 380 − s

× 10

−1

− 3 − V

−− 2mA

− 3,1 − V

20 −− dB

− 2 −µs

− 3,78 − mA

1,4 − 2,8 V

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Philips Semiconductors Product speciﬁcation

PAL/NTSC/SECAM synchronization processor for video recorders

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

Sandcastle pulse (pin 14; note 10)

Output voltage HIGH (note 11)

=1 mA V

at −I

Output voltage INTERMEDIATE

= 1 mA V

at −I

Output voltage LOW

at I14=1 mA V Lower part is starting prior to the

centre of sync pulse at pin 3 t

and ending with the upper part

Fast phase correction/head pulse

Threshold voltage

for fast phase correction (note 12) V Input current −I Threshold voltage

of head pulse input V Input current −I D.C. input voltage V Input resistance R

Subcarrier phase switching (note 13) Phase switching of subcarrier phase

in accordance with head pulse V LOW state of still picture input V Continuous phase switching

voltage V

14-15

14-3

10-15

9-15

9 7-15 7-15

7-15 7-15

7-15

TDA3755

7,8 −− V

2,3 3,0 3,7 V

−− 0,5 V

− 2,6 −µs

− 7,2 − V

−− 20 µA

− 1,4 − V

−− 20 µA

− 5,6 − V 3 −− kΩ

− 5,6

−− 0,5 V

− V

(1)

− V

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Philips Semiconductors Product speciﬁcation

PAL/NTSC/SECAM synchronization

TDA3755

processor for video recorders

Notes to the characteristics

1. Or not connected.

2. The sync separator input signal is shown in Fig.2.

3. The black level and the top sync level are detected internally and stored in capacitors at pin 2 and pin 3 respectively.

4. The vertical sync pulse output is disabled by mute.

5. In test picture mode the synthetic sync pulse is fed to output pin 1 and the vertical pulse consists of an uninterrupted block pulse of 192 µs triggering at every transition of head pulse (HP) at pin 9. The timing of test picture and synthetic sync pulse is shown in Fig.3.

6. Oscillator adjustment during test picture mode made only, at V circuit; measurement is f

7. The holding range and catching range are both determined by the resistor connected between pin 5 and pin 6.

8. The phase of the lower subcarrier is switched in accordance with the VHS standard. PNP emitter follower, internal resistive load of 10 kΩ (typ.) to V

9. The output voltage at pin 5 is disabled during test picture mode.

10. The burst gating pulse is superimposed on an uninterrupted horizontal pulse. It is suppressed 16 times starting with every transition of the head pulse at pin 9. If a vertical pulse is detected during that time the burst gating pulses are additionally suppressed until line 12 and line 324 respectively. In any event the number of suppressed burst gating pulses is even.

11. The timing of the upper part of the sandcastle pulse is determined by the components connected to pin 12 (Fig.4) and is independent of supply voltage variations.

12. The fast phase correction pulses have to be in the burst gating reference pulse. For any HIGH to LOW transitions of the correction pulse the phase is corrected by−90° if the head pulse input is LOW and by +90° if the head pulse input is HIGH.

13. Subcarrier phase switching is detailed in Table 1. Subcarrier is 40,000 × fH for NTSC state and 40,125 × fH for PAL state.

/ 8 at output pin 8.

osc

11-15

> 4,8 V, V

= 0 V and V

7-15

> 2 V or open

4-15

Table 1 Subcarrier phase switching

STILL PAL NTSC

PICTURE INPUT HP = HIGH HP = LOW HP = HIGH HP = LOW

HIGH −90°−90°−90°−90° not connected 0°−90°+90°−90° LOW 0° 0°+90°+90°

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Philips Semiconductors Product speciﬁcation

PAL/NTSC/SECAM synchronization processor for video recorders

TDA3755

Fig.2 Colour composite video input signal at pin 3.

Where: The value of t1 is dependent upon adjustment of the burst gating pulse delay.

is the burst gating pulse duration.

Time t

June 1986 9

Fig.3 Timing of test picture and synthetic sync pulse.

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Philips Semiconductors Product speciﬁcation

PAL/NTSC/SECAM synchronization processor for video recorders

APPLICATION INFORMATION

TDA3755

June 1986 10

Fig.4 Application circuit diagram.

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Philips Semiconductors Product speciﬁcation

PAL/NTSC/SECAM synchronization processor for video recorders

PACKAGE OUTLINE

DIP18: plastic dual in-line package; 18 leads (300 mil)

seating plane

TDA3755

SOT102-1

w M

(e )

pin 1 index

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

max.

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE VERSION

SOT102-1

min.

max.

IEC JEDEC EIAJ

1.40

1.14

0.055

0.044

0.53

0.38

0.021

0.015

0.32

1.40

0.23

1.14

0.013

0.055

0.009

0.044

REFERENCES

(1) (1)

cD E e M

21.8

21.4

0.86

0.84

6.48

6.20

0.26

0.24

(1)

3.9

8.25

3.4

7.80

0.15

0.32

0.13

0.31

EUROPEAN

PROJECTION

0.37

0.33

9.5

8.3

max.

0.2542.54 7.62

0.854.7 0.51 3.7

0.010.10 0.30

0.0330.19 0.020 0.15

ISSUE DATE

93-10-14 95-01-23

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Philips Semiconductors Product speciﬁcation

PAL/NTSC/SECAM synchronization

TDA3755

processor for video recorders

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“IC Package Databook”

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T be necessary immediately after soldering to keep the temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

(order code 9398 652 90011).

). If the printed-circuit board has been pre-heated, forced cooling may

stg max

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

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