Page 1
.SUPPLYVOLTAGEDOWNTO3 V
.HIGH SVR
.LOW CROSSOVERDISTORTION
.LOW QUIESCENTCURRENT
.BRIDGEORSTEREO CONFIGURATION
TDA2824
DUALPOWER AMPLIFIER
Po w erdip (12+2+2)
DES CRIP TI ON
The TDA2824 is a monolithic integrated circuit in
12+2+2 powerdip, intended for use as dual audio
poweramplifier in portableradiosand TVsets.
TYPICAL APPL IC ATION CIRCUIT (Stereo)
ORDERINGNUMBER : TDA2824
January1995
R2
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Page 2
TDA2824
PI N CONNECTION
SCHE MATIC DIAG RAM
ABSOLUTEMAXIMUMRATINGS
Symbol Parameter Value Unit
SupplyVoltage 16 V
S
OutputPeak Current 1.5 A
O
TotalPower Dissipation at T
tot
T
amb
amb
=50°C
=70°C
1.25
4
Storageand Junction Temperature -40 to 150 °C
2/10
V
P
T
stg,Tj
I
W
W
Page 3
TDA 2824
THERMAL DATA
Symbol Parameter Value Unit
R
thj-amb
R
th j-case
ThermalResistance Junction-ambient Max. 80 °C/W
ThermalResistance Junction-case Max. 20 °C/W
ELECTRICALCHARACTERISTICS (VS=6V, T
=25°C, unless otherwise specified)
amb
Symbol Parameter Test Conditions Min. Typ. Max. Unit
STEREO(test circuitof fig. 1)
V
V
P
G
e
SVR Supply Voltage Rejection f = 100Hz 40 50 dB
CS Channel Separation
Supply Voltage 3 15 V
S
Quiescent Output Voltage VS=9V
O
Quiescent Drain Current 6 12 mA
I
d
InputBias Current 100 nA
I
b
Output Power
O
(eachchannel)
d Distortion V
Closed Loop Voltage
V
V
=9V
S
d =10% f= 1KHz
=9V RL=4Ω
V
S
=6V RL=4Ω
V
S
V
= 4.5V RL=4Ω
S
= 9V, f = 1KHz
S
=8Ω,PO= 0.5W
R
L
1.3
0.45
f = 1KHz 36 39 41 dB
4
2.7
1.7
0.65
0.32
0.2 %
Gain
InputResistance f = 1KHz 100
R
i
TotalInput Noise
N
=10KΩ B =22Hz to 22KHz 2.5 µV
R
S
Curve A 2
=10KΩ f = 1KHz
R
S
50 dB
KΩ
BRIDGE(test circuitof fig.2)
V
V
W
W
W
µV
V
V
P
G
Supply Voltage 3 15 V
S
Output OffsetVoltage
OS
Imput Bias Current 100 nA
I
b
Output Power d =10%
O
d Distortion (f = 1KHz)
Closed Loop Voltage
V
=8Ω 60 mV
R
L
f =1KHz
V
=9V
S
V
=6V
S
V
= 4.5V
S
R
=8Ω PO= 0.5W
L
R
R
R
=8Ω
L
=8Ω
L
=4Ω
L
2.5
0.9
3.2
1.35
1
0.2 %
f = 1KHz 39 dB
W
W
W
Gain
e
TotalInput Noise
N
=10KΩ B =22Hz to 22KHz 3 mV
R
S
Curve A 2.5 µ
SVR Supply Voltage Rejection f = 100Hz 48 60 dB
V
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Page 4
TDA2824
Figure1 : TestCircuit (stereo).
R2
Figure2: P.C.Boardand ComponentLayoutof theCircuit of Figure 1.(1:1scale)
4/10
Page 5
Figure3 : TestCircuit (bridge).
TDA 2824
Figure4: P.C.BoardandComponentLayoutof theCircuit ofFigure 3. (1:1scale)
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Page 6
TDA2824
Figure3 : Output Powervs. SupplyVoltage
(Stereo).
Figure4 : OutputPower vs. SupplyVoltage
(Bridge).
Figure5 : Distortionvs. Output Power (Bridge). Figure6 : Distortionvs. OutputPower(Bridge).
Figure7 : SupplyVoltageRejection vs.
Frequency(Stereo)
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Figure8 : QuiescentCurrentvs. Supply
Voltage.
Page 7
TDA 2824
Figure9 : QuiescentCurrent vs. SupplyVoltage.
Figure11 : TotalPowerDissipationvs. Output
Power(Bridge).
Figure10 : TotalPower Dissipationvs.Output
Power(Stereo).
Figure12 : TotalPower Dissipationvs.Output
Power(Bridge).
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Page 8
TDA2824
MOUNTIN G INS TRUCTION
TheR
deringthe GNDpinstoa suitablecopperareaofthe
printed circuit board (Figure 13) or to an external
heatsink(Figure14).
The diagramof Figure15 showsthe maximum dissipablepowerP
theside”∂” oftwoequalsquarecopperareashaving
a thicknessof35 µ (1.4 mils).
Figure13 : Exampleof P.C. Board CopperArea
ofthe TDA2824canbereducedbysol-
thj-amb
andthe R
tot
as a functionof
thj-amb
which isused asHeatsink.
Duringsolderingthe pinstemperaturemustnot exceed 260 °C and the soldering time must not be
longer than12 seconds.
The externalheatsinkor printedcircuit copperarea
mustbe connectedto electrical ground.
Figure 14 : ExternalHeatsinkMountingExample.
Figure15 : Maximum Dissipable Power and
Junctionto AmbientThermal
Resistancevs. Side”∂”.
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Figure 16 : MaximumAllowable Power Dissipa-
tionvs. AmbientTemperature.
Page 9
POWERDIP12+2+2PACKAGEMECHANICAL DATA
DIM. mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
a1 0.51 0.020
B 0.85 1.40 0.033 0.055
b 0.50 0.020
b1 0.38 0.50 0.015 0.020
D 20.0 0.787
E 8.80 0.346
e 2.54 0.100
e3 17.78 0.700
F 7.10 0.280
I 5.10 0.201
TDA 2824
L 3.30 0.130
Z 1.27 0.050
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Page 10
TDA2824
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use.
No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously
supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life supportdevices or systems
without express writtenapproval of SGS-THOMSON Microelectronics.
1995SGS-THOMSON Microelectronics - All Rights Reserved
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