Product specification
File under Integrated Circuits, IC01
April 1992
Page 2
Philips SemiconductorsProduct specification
Double-deck playback/record IC (DDPR)TDA1602A
FEATURES
• Two stereo playback preamplifiers
• Stereo playback amplifier
• High speed dubbing headswitch for channel A
• Record/playback headswitch for channel B
• Dubbing switch
• Stereo record amplifier
• Automatic level control
• Erase and bias oscillator
• Tape selector
• Reference voltage source (1/2 VP)
• Logic part.
ORDERING INFORMATION
EXTENDED TYPE
NUMBER
TDA1602A40DILplasticSOT129
Note
1. SOT129-1; 1996 August 29.
PINSPIN POSITIONMATERIALCODE
GENERAL DESCRIPTION
The TDA1602A is a Dolby B compatible recorder IC, which
has been designed for use in double-deck recorders for
Ferro/Chrome with high speed dubbing. The device
performs all the basic recorder functions and needs only a
very simple peripheral circuit of a few components. The
DDPR may also be used in applications with automatic
reverse.
All functions of the DDPR are selected by externally
applied DC voltage levels. The circuit is designed for use
with a mains-fed asymmetrical power supply but can also
be used with a symmetrical power supply (because of its
own 1/2 VP reference voltage source).
PACKAGE
(1)
April 19922
Page 3
Philips SemiconductorsProduct specification
Double-deck playback/record IC (DDPR)TDA1602A
QUICK REFERENCE DATA
All voltages referenced to pin 12, all currents positive into the IC
LOL1line out left
LOR2line out right
LIR3line in right
SOR4source-selector out right
SOL5source-selector out left
LIL6line in left
S/M7signal/mute input for line out
A/B8channel selection input
TS9tape selection input
P/R/HSR10playback/record/high-speed record selection input
EQUADJ11equalization adjustment
V
ref
GND13ground; substrate
V
P
OSCCON15amplitude control input for oscillator
OSCO116oscillator output 1
OSCGND17oscillator ground
OSCO218oscillator output 2
ADJRT19adjustment of release time
ADJLST20adjustment of limiting and setting time
RECERLF21record equalization right: LF adjustment
RECELLF22record equalization left: LF adjustment
BRIP23deck B right input: connection input playback
BRIBHF24deck B right input: connection HF biasing
SGNDB25signal ground for deck B
BLIBHF26deck B left input: connection HF biasing
BLIP27deck B left input: connection input playback
RECOL28record amplifier left output
RECOR29record amplifier right output
RECELHF30record equalization left: HF adjustment
RECERHF31record equalization right: HF adjustment
PERHF32playback equalization right: HF adjustment
PELHF33playback equalization left: HF adjustment
ARI34deck A right input
HSDR35connection for high speed dubbing capacitor right
SGNDA36signal ground for deck A
HSDL37connection for high speed dubbing capacitor left
ALI38deck A left input
PELLF39playback equalization left: LF adjustment
PERLF40playback equalization right: LF adjustment
The playback preamplifier is a linear low-noise amplifier
with an internal fixed gain of 26.4 dB. The relevant
preamplifier for playback of channel A or B can be selected
externally.
Playback amplifier
The frequency response of the playback amplifier is
determined by two external capacitors (Right: C6 and C21,
Left: C5 and C20). The different equalization curves for
Ferro and Chrome (with time constants of 120 µs and 70
µs respectively) are controlled by the logic part of the
circuit.
High speed dubbing headswitch
This electronic switch is used to connect, or disconnect, an
extra external capacitor (Right: C4, Left: C1) in parallel
with the gap-loss correction capacitor.
Record/playback headswitch
This is a two position electronic switch which switches the
relevant side of the head to the signal ground.
ECORD POSITION
R
In the record mode the input of the playback amplifier is
switched to the signal ground. In this way the bias and
audio signal current can be applied to the head.
LAYBACK POSITION
P
Automatic level control
The automatic level control (ALC) has a control range of 20
dB. The variation in the output voltage is less than 2 dB
(see Fig.5). The attack and recovery time of the ALC can
be adjusted externally.
Erase and bias oscillator
The erase and bias oscillator provides the following:
A high frequency bias current to enable a linear magnetic
recording process on the tape.
A sinusoidal voltage, the amplitude of which is determined
by the applied voltage at pin 15 (see also Fig.6).
The necessary current for erasing the tape which is only
activated when the circuit is switched to the record mode.
Reference voltage source
This circuit delivers an output voltage which is half the
supply voltage. The output voltage can be taken as signal
ground. In this way a symmetrical power supply is
available for the total recorder application.
Logic part
The logic part converts the incoming information from the
logic input into the necessary switching signals, used in the
analog parts of the circuit. The conversion is determined
by the level of the input signal (see Fig.7). The logic inputs
(pins 8 and 10) are independent of signal rise and fall
times. The inputs at pins 7 and 9 enable smooth switching
between signal/mute and Ferro/Chrome respectively.
In the playback mode the biasing side of the head is
switched to the signal ground.
Record amplifier
The frequency response of the record amplifier is
determined by means of two external capacitors (Right:
C11 and C12; Left: C17 and C18).
By omitting these capacitors a flat frequency response is
obtained for Dolby application.
April 19927
Page 8
Philips SemiconductorsProduct specification
Double-deck playback/record IC (DDPR)TDA1602A
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134). All voltages referenced to pin 12; all currents positive into
the IC
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
V
V
V
V
T
T
P
P
7-10
15
16,18
28,30
stg
j
tot
positive supply voltage−18V
logic input voltage (pins 7 to 10)0V
control input voltage (pin 15)0V
P
P
V
V
oscillator output voltage (pins 16 and 18)036V
headswitch voltage (pins 28 and 30)−45+45V
storage temperature range−55+150°C
junction temperature−+150°C
total power dissipationT
= +60 °C−1.8W
amb
April 19928
Page 9
Philips SemiconductorsProduct specification
Double-deck playback/record IC (DDPR)TDA1602A
DC CHARACTERISTICS
All voltages referenced to pin 12; all currents positive into the IC; All parameters are measured in the test circuit (Fig.1 1)
at nominal supply voltage (V
= 25 °C; unless otherwise specified
T
amb
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supplies
V
P
I
P
supply voltage range7.0−18.0V
supply currentnote 1
Playback amplifier (Fe02/Cr02)
Ggain at normal speedf = 315 Hz555759dB
Bfrequency response with respect to gainf = 30 Hz101214dB
left/right balance−10+1dB
A/B balance−10+1dB
Ggain at double speedf = 630 Hz495153dB
Bfrequency response with respect to gainf = 60 Hz101214dB
oscillator frequencynote 11−80−kHz
maximum output current pins 16 and 18
(peak-to-peak value)
V
OSC
output voltage pins 16 to 17 and pins 17 to VP= 18 V−−36V
18 (peak-to-peak value)
V
V
I
15
OSC
I
voltage control rangenote 122.0−13.0V
peak output voltagesee Fig.6;
input current of control inputs−0.1−µA
THDtotal harmonic distortion between pins 16
and 18
−300−mV
1.351.51.65V
V
= 300 mV
OseI
= 330 mV
OseI
= 10 dB−0.21dB
∆V
OseI
= 20 dB−1−dB
∆V
OseI
= 10 dB−1−ms
OseI
140−−mA
−8.0−V
V
= VP−8 V
control
between pins 16 and 18
= 80 mA−0.5−%
I
O
April 199211
Page 12
Philips SemiconductorsProduct specification
Double-deck playback/record IC (DDPR)TDA1602A
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Reference voltage source
V
12
∆V
12
Logics inputs (pins 7 to 10); see Figs 7, 8 and 9
I
7
V
7
I
8
I
9
V
9
I
10
V
10
output voltagenote 13;
no external load
output voltage deviation∆I
= 1 mA−100−+100mV
ref
signal/mute input currentV7= V
signal/mute input voltage
signal0−0.3V
mute6.0−15.0V
input current for channel A/B selectionV8= V
input voltage for channel A/B selection
deck A0−3.0V
mute5.0−10.0V
deck B12.0−15.0V
input current for tape selectionV9= V
input voltage for tape selection
Cr020−0.3V
Fe026.0−15.0V
input current for mode selectionV10= V
input voltage for mode selection
playback0−4.0V
record6.0−9.0V
high-speed record11.0−15.0V
7.257.57.75V
P
P
P
P
−−900µA
−100150µA
−−900µA
−100150µA
Notes to the characteristics
1. The supply current is measured in the test circuit without an additional load of the 1/2 VPreference voltage source.
In the record mode the tape selector is at position Cr02; the oscillator is OFF.
2. The output impedance of the output buffer is typical ZO= 1 kΩ.
3. The signal-to-noise ratio is related to an output signal VO= 150 mV with Rs= 1 kΩ. The circuit is switched at normal
speed and the tape selector is at position Cr02.
4. Channel A is switched in the playback mode, at deck B a signal of VI= 200 µV (f = 315 Hz) is applied. The output
voltage at the playback amplifier is not measured selectively (bandwidth = 20 Hz to 20 kHz).
5. Deck B is switched in the record mode, at pins 24 and 26 a signal of II= 1 mA (f = 80 kHz) is applied.
6. Line input selected, measured relative to source selector output.
7. Switched in dubbing mode, measured relative to line output.
8. The signal-to-noise ratio is related to an output signal VO= 1.5 V. The circuit is switched at normal speed.
9. Measured with f = 80 kHz and II= 1 mA.
10. The signal-to-noise ratio is related to an output signal VO= 300 mV.
11. The oscillator frequency is determined by LLand CLand may be adjusted between 60 kHz and 120 kHz.
12. For stable oscillator operation the control voltage must be greater than 1 V.
13. The output voltage is independent of the operating mode (playback/record).
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
max.
mm
OUTLINE
VERSION
SOT129-1
12
min.
max.
1.70
1.14
0.067
0.045
IEC JEDEC EIAJ
051G08MO-015AJ
b
b
1
0.53
0.38
0.021
0.015
0.36
0.23
0.014
0.009
REFERENCES
cD E eM
52.50
51.50
2.067
2.028
April 199222
14.1
13.7
0.56
0.54
20
(1)(1)
e
L
1
3.60
3.05
0.14
0.12
M
E
15.80
15.24
0.62
0.60
EUROPEAN
PROJECTION
17.42
15.90
0.69
0.63
H
w
0.2542.5415.24
0.010.100.60
ISSUE DATE
92-11-17
95-01-14
max.
2.254.70.514.0
0.089 0.190.0200.16
(1)
Z
Page 23
Philips SemiconductorsProduct specification
Double-deck playback/record IC (DDPR)TDA1602A
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
(order code 9398 652 90011).
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
April 199223
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