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查询TDA1519A供应商
INTEGRATED CIRCUITS
DATA SH EET
TDA1519A
22 W BTL or 2 x 11 W stereo car
radio power amplifier
Product specification
File under Integrated Circuits, IC01
May 1992
Page 2
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
TDA1519A
power amplifier
GENERAL DESCRIPTION
The TDA1519A is an integrated class-B dual output amplifier in a 9-lead single in-line (SIL) plastic power package.
The device is primarily developed for car radio applications.
Features
• Requires very few external components for Bridge Tied
Load (BTL)
• Stereo or BTL application
• High output power
• Low offset voltage at output (important for BTL)
• Fixed gain
• Good ripple rejection
• Mute/stand-by switch
• Load dump protection
• AC and DC short-circuit-safe to ground and V
P
QUICK REFERENCE DATA
• Thermally protected
• Reverse polarity safe
• Capability to handle high energy on outputs (VP= 0 V)
• No switch-on/switch-off plop
• Protected against electrostatic discharge
• Low thermal resistance
• Identical inputs (inverting and non-inverting)
• Compatible with TDA1519B (except output power).
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage range
operating V
non-operating V
load dump protected V
Repetitive peak output current I
Total quiescent current I
Stand-by current I
Switch-on current I
P
P
P
ORM
tot
sb
sw
6.0 14.4 17.5 V
−−30 V
−−45 V
−−4A
− 40 80 mA
− 0.1 100 µA
−−40 µA
Input impedance
BTL |ZI|25−−kΩ
stereo |Z
|50−−kΩ
I
Stereo application
Output power THD = 10%; 4 Ω P
THD = 10%; 2 Ω P
o
o
− 6 − W
− 11 − W
Channel separation α 40 −−dB
Noise output voltage V
no(rms)
− 150 −µV
May 1992 2
Page 3
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
BTL application
Output power THD = 10%; 4 Ω P
Supply voltage ripple rejection R
DC output offset voltage |∆V
Crystal temperature T
PACKAGE OUTLINES
9 lead SIL; plastic power (SOT131); SOT131-2; 1996 July 22.
9-lead SIL-bent-to-DIL; plastic power (SOT157); SOT157-2; 1996 July 22.
= 0 Ω
S
f = 100 Hz RR 34 −−dB
f = 1 kHz to 10 kHz RR 48 −−dB
o
| −−250 mV
0
c
TDA1519A
− 22 − W
−−150 °C
May 1992 3
Page 4
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
Fig.1 Block diagram.
May 1992 4
Page 5
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
TDA1519A
power amplifier
PINNING
1 NINV non-inverting input
2 GND1 ground (signal)
3 RR supply voltage ripple rejection
4 OUT1 output 1
5 GND2 ground (substrate)
6 OUT2 output 2
7V
P
8 M/SS mute/stand-by switch
9 INV inverting input
FUNCTIONAL DESCRIPTION
The TDA1519A contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB.
A special feature of this device is the mute/stand-by switch which has the following features:
• Low stand-by current (< 100 µA)
• Low mute/stand-by switching current (low cost supply switch)
• Mute condition.
positive supply voltage
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT
Supply voltage
operating V
non-operating V
load dump protected during 50 ms;
t
≥ 2.5 ms
r
AC and DC short-circuit-safe voltage V
Reverse polarity V
Energy handling capability at outputs V
= 0 V − 200 mJ
P
Non-repetitive peak output current I
Repetitive peak output current I
Total power dissipation see Fig.2 P
Crystal temperature T
Storage temperature range T
P
P
V
P
PSC
PR
OSM
ORM
tot
c
stg
− 17.5 V
− 30 V
− 45 V
− 18 V
− 6V
− 6A
− 4A
− 25 W
− 150 °C
−55 + 150 °C
May 1992 5
Page 6
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
Fig.2 Power derating curve.
DC CHARACTERISTICS
= 14.4 V; T
V
P
= 25 °C; measurements taken using Fig.3; unless otherwise specified
amb
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply
Supply voltage range note 1 V
Total quiescent current I
DC output voltage note 2 V
DC output offset voltage |∆V
Mute/stand-by switch
Switch-on voltage level V
Mute condition V
Output signal in mute position V
= 1 V (max.);
I
f = 20 Hz to
15 kHz V
DC output offset voltage |∆V
P
tot
O
| −− 250 mV
4-6
ON
mute
O
| −− 250 mV
4-6
6.0 14.4 17.5 V
− 40 80 mA
− 6.95 − V
8.5 −−V
3.3 − 6.4 V
−− 20 mV
May 1992 6
Page 7
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Stand-by condition
DC current in stand-by condition I
Switch-on current I
AC CHARACTERISTICS
= 14.4 V; RL= 4 Ω; f = 1 kHz; T
V
P
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Stereo application
Output power note 3
Output power at R
= 2 Ω note 3
L
Total harmonic distortion P
Low frequency roll-off note 4
= 25 °C; measurements taken using Fig.3; unless otherwise specified
amb
THD = 0.5% P
THD = 10% P
THD = 0.5% P
THD = 10% P
= 1 W THD − 0.1 − %
o
TDA1519A
V
sb
sb
sw
o
o
o
o
0 − 2V
−− 100 µA
− 12 40 µA
45 − W
5.5 6.0 − W
7.5 8.5 − W
10 11 − W
−3 dB f
High frequency roll-off −1 dB f
Closed loop voltage gain G
L
H
v
− 45 − Hz
20 −−kHz
39 40 41 dB
Supply voltage ripple rejection
ON notes 5 and 6 RR 40 −−dB
ON notes 5 and 7 RR 45 −−dB
mute notes 5 and 8 RR 45 −−dB
stand-by notes 5 and 8 RR 80 −−dB
Input impedance |Z
|506075kΩ
i
Noise output voltage
(RMS value) note 9
ON R
ON R
mute note 10 V
Channel separation R
Channel unbalance |∆G
= 0 Ω V
S
= 10 kΩ V
S
= 10 kΩα 40 −−dB
S
no(rms)
no(rms)
no(rms)
| − 0.1 1 dB
v
− 150 −µV
− 250 500 µV
− 120 −µV
May 1992 7
Page 8
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
TDA1519A
power amplifier
AC CHARACTERISTICS
= 14.4 V; RL= 4 Ω; f = 1 kHz; T
V
P
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
BTL application
Output power note 3
Output power at V
= 13.2 V note 3
P
Total harmonic distortion P
Power bandwidth THD = 0.5%;
Low frequency roll-off note 4
High frequency roll-off −1 dB f
Closed loop voltage gain G
Supply voltage ripple rejection
ON notes 5 and 6 RR 34 −−dB
ON notes 5 and 7 RR 48 −−dB
mute notes 5 and 8 RR 48 −−dB
stand-by notes 5 and 8 RR 80 − -dB
Input impedance |Z
Noise output voltage
(RMS value) note 9
ON R
ON R
mute note 10 V
= 25 °C; measurements taken using Fig.4; unless otherwise specified
amb
THD = 0.5% P
THD = 10% P
THD = 0.5% P
THD = 10% P
= 1 W THD - 0.1 − %
o
= −1 dB; 35 to
P
o
w.r.t. 15 W B
−1 dB f
= 0 Ω V
S
= 10 kΩ V
S
o
o
o
o
w
L
H
v
| 253038kΩ
i
no(rms)
no(rms)
no(rms)
15 17 − W
20 22 − W
− 13 − W
− 17.5 - W
− 15 000 − Hz
− 45 − Hz
20 −−kHz
45 46 47 dB
− 200 −µV
− 350 700 µV
− 180 −µV
Notes to the characteristics
1. The circuit is DC adjusted at V
= 6 V to 17.5 V and AC operating at VP = 8.5 V to 17.5 V.
P
2. At 17.5 V < VP< 30 V the DC output voltage ≤ VP/2.
3. Output power is measured directly at the output pins of the IC.
4. Frequency response externally fixed.
5. Ripple rejection measured at the output with a source impedance of 0 Ω (maximum ripple amplitude of 2 V).
6. Frequency f = 100 Hz.
7. Frequency between 1 kHz and 10 kHz.
8. Frequency between 100 Hz and 10 kHz.
9. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.
10. Noise output voltage independent of RS (VI = 0 V).
May 1992 8
Page 9
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
APPLICATION INFORMATION
TDA1519A
Fig.3 Stereo application circuit diagram.
Fig.4 BTL application circuit diagram.
May 1992 9
Page 10
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
Fig.5 Total quiescent current (I
) as a function of supply voltage (VP).
tot
Fig.6 Output power (Po) as a function of supply voltage (VP) for BTL application at RL= 4 Ω; f = 1 kHz.
May 1992 10
Page 11
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
TDA1519A
Fig.7 Total harmonic distortion (THD) as a function of output power (Po) for BTL application at RL= 4 Ω;
f = 1 kHz.
Fig.8 Total harmonic distortion (THD) as a function of operating frequency (f) for BTL application at RL= 4 Ω;
Po= 1 W.
May 1992 11
Page 12
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
PACKAGE OUTLINES
SIL9P: plastic single in-line power package; 9 leads
D
d
TDA1519A
SOT131-2
non-concave
x
E
h
view B: mounting base side
A
B
j
D
h
2
E
seating plane
b
19
Z
DIMENSIONS (mm are the original dimensions)
A
UNIT A
mm
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1
max.
2.0
OUTLINE
VERSION
SOT131-2
4.6
4.2
e
b
b
cD
max.
1.1
p2
0.75
0.48
0.60
0.38
IEC JEDEC EIAJ
b
p
(1)
24.0
23.6
REFERENCES
w M
0 5 10 mm
scale
deD
h
20.0
19.6
10 2.54
E
12.2
11.8
A
1
L
c
Q
(1)
E
h
6
3.4
3.1
Lj
Q
17.2
2.1
16.5
1.8
EUROPEAN
PROJECTION
0.25w0.03
ISSUE DATE
92-11-17
95-03-11
(1)
Z
x
2.00
1.45
May 1992 12
Page 13
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm)
non-concave
D
d
x
E
h
D
h
view B: mounting base side
A
2
TDA1519A
SOT157-2
j
19
e
0.75
0.60
1
e
cD
0.48
24.0
0.38
23.6
(1)
deD
20.0
19.6
Z
DIMENSIONS (mm are the original dimensions)
UNIT A A e
17.0
15.5
4.6
4.2
mm
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
w M
b
p
E
h
12.2
10 5.08
11.8
0 5 10 mm
scale
(1)
12bp
2.54
e
5.08
B
E
A
L
3
L
E
2
h
6
Q
LL3m
3.4
12.4
3.1
11.0
c
2.4
1.6
e
4.3
Qj
2.1
1.8
v M
v
0.8
x
0.25w0.03
(1)
Z
2.00
1.45
2
m
OUTLINE
VERSION
SOT157-2
IEC JEDEC EIAJ
REFERENCES
May 1992 13
EUROPEAN
PROJECTION
ISSUE DATE
92-10-12
95-03-11
Page 14
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
(order code 9398 652 90011).
TDA1519A
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
May 1992 14
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