Preliminary specification
File under Integrated Circuits, IC01
Philips Semiconductors
September 1994
Page 2
Philips SemiconductorsPreliminary specification
DCC write amplifier (WRITE3)TDA1381
FEATURES
• Single 3 V power supply
• Low standby current consumption
• 20 bidirectional current outputs (2 × nine heads)
• Single point main data and auxiliary current setting
• Reduction of power consumption between write pulses
• Soft switching of output currents
• Serial data input
• Timing is compatible with TDA1319T
• Uncommitted operational amplifier available.
GENERAL DESCRIPTION
The TDA1381 has been designed to drive an 18-channel
inductive recording head which is suitable for the DCC
(Digital Compact Cassette) system. The bidirectional
current outputs are controlled by a two-wire serial bus. The
amplitude of the write current pulses can be set by either
voltage or current control. The circuit can be switched to
standby mode to minimize supply current consumption.
QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
DD
I
DD
I
DD(av)
I
stb
I
WDAT(max)
supply voltage2.73.04.0V
supply currentnote 1−912mA
average supply currentnote 2−26.5−mA
total standby current−0.10.3mA
maximum write current for main data
note 3100−−mA
channels 0 to 7
I
WAUX(max)
I
EAUX(max)
P
d(av)
T
amb
maximum write current for auxiliary channelnote 3115−−mA
maximum erase current for auxiliary channelnote 3153−−mA
average power dissipationnote 2−80−mW
operating ambient temperature−30−+85°C
Notes
1. No head connected; all outputs unloaded; V
2. In the auxiliary and data write mode; writing DCC data; I
f
= 3.072 MHz. Data channels resistively loaded with 6 Ω, auxiliary channel resistively loaded with 4 Ω between
clk
DD
=3V.
= 60 mA; VDD=3V;
WDAT
pins 23 and 24, and 37 and 38.
3. Resistors connected in accordance with test circuit of Fig.7.
ORDERING INFORMATION
TYPE
NUMBER
NAMEDESCRIPTIONVERSION
TDA1381HTQFP48
Note
1. When using IR reflow soldering it is recommended that the Drypack instructions in the
(order number 9398 510 63011) are followed.
AMP(pos)3operational amplifier non-inverting input
WCLK4write clock input
WDATA5write data input
V
SS
STANDBY7standby mode control input
AB8tape sector A or B select input
AMPO9operational amplifier output
AMP(neg)10operational amplifier inverting input
V
DD
V
DD
BJ13sector B write pulse output J
BI14sector B write pulse output I
n.c.15not connected
BH16sector B write pulse output H
BG17sector B write pulse output G
BF18sector B write pulse output F
BE19sector B write pulse output E
BD20sector B write pulse output D
BC21sector B write pulse output C
n.c.22not connected
BB23sector B write pulse output B
BA24sector B write pulse output A
V
DD
V
DD
V
SET
V
CNTR
V
SS
I
SET
V
SS
V
ref
R
BIAS
V
DD
V
DD
n.c.36not connected
AA37sector A write pulse output A
AB38sector A write pulse output B
n.c.39not connected
AC40sector A write pulse output C
1supply voltage
2supply voltage
6ground
11supply voltage
12supply voltage
25supply voltage
26supply voltage
27control voltage input
28voltage-to-current conversion setting input
29ground
30control current input
31ground
32reference voltage output
33bias current resistor
34supply voltage
35supply voltage
September 19944
Page 5
Philips SemiconductorsPreliminary specification
DCC write amplifier (WRITE3)TDA1381
SYMBOLPINDESCRIPTION
AD41sector A write pulse output D
AE42sector A write pulse output E
AF43sector A write pulse output F
AG44sector A write pulse output G
AH45sector A write pulse output H
n.c.46not connected
AI47sector A write pulse output I
AJ48sector A write pulse output J
September 19945
Fig.2 Pin configuration.
Page 6
Philips SemiconductorsPreliminary specification
DCC write amplifier (WRITE3)TDA1381
FUNCTIONAL DESCRIPTION
The TDA1381 is designed to drive the elements of an
18-channel recording head, containing nine elements for
tape sector A and nine elements for sector B. A brief
functional description of each block (see Fig.1) is given
below.
Decoder
The IC is controlled by the 32-bit wide serial data word
which is clocked in at WDATA (pin 5). The clock frequency
(WCLK, pin 4) is 3.072 MHz with a clock period of 325 ns.
The write pulses are made available at the outputs
AA to AJ when tape sector A is selected (pin 8 HIGH) or at
the outputs BA to BJ when tape sector B is selected
(pin 8 LOW). The principle of connection of the recording
head to the IC is illustrated in Fig.4.
The timing sequence of the write pulses is shown in Fig.5.
The operating mode of the IC can be set by the first 3 bits
of WDATA. The signals TCH0 to TCH7 and TCHAUX
determine the direction of the write current. When TCH
HIGH, the current flows as indicated in Fig.4. When TCH
is LOW current flows in the opposite direction. The various
modes of operation are given in Table 1. The standby
mode can also be forced by setting the STANDBY input
(pin 7) HIGH.
Current control
The write current at the outputs is regulated by the current
control circuit. The principle of this circuit is shown in Fig.3.
The value of the current I
voltage V
, connected between pin 27 and VSS. In this
SET
can be set using an external
WDAT
configuration, pin 28 has to be resistively loaded to
another voltage source or V
(see Fig.7). The current
SS
control circuit regulates the voltage between pins 27 and
28 to zero. When a resistor R
2. When both TDAPLB and TAUPLB are HIGH, the IC is set to the standby mode.
and AE are multiplication factors (see Section “Current control”).
3. A
W
September 19946
Page 7
Philips SemiconductorsPreliminary specification
DCC write amplifier (WRITE3)TDA1381
Fig.3 Principle of the write current control circuit.
It is also possible to set the write current by providing a
current Ii into I
be connected to V
The current gain factor is now defined as:
(pin 30). In this configuration pin 27 must
SET
and pin 28 must be connected to VDD.
SS
G
=
if
I
WDAT
--------------- I
i
During AUX write (outputs AA, AB or BA, BB active) the
output current I
is increased by a factor AW. During
WDAT
the erase mode of the auxiliary channel
(TERAUX = HIGH, see Table 1), the output current I
WDAT
is increased by a factor AE.
September 19947
Outputs
Each channel of the chosen sector is selected in
sequence. Depending on the data word, the current is
directed forward or reversed through the heads. The
outputs that are not selected are kept floating to prevent
any incorrect current flow. In HIGH state (one of the
switches P is closed) the output is internally connected to
. In the LOW state (one of the switches N is closed) the
V
DD
output is connected to a current source.
Page 8
Philips SemiconductorsPreliminary specification
DCC write amplifier (WRITE3)TDA1381
Fig.4 Definition of the output currents.
Voltage reference
A reference voltage is available at pin 32. This voltage is
derived from a bandgap reference source, and can be
used to derive a control voltage for the current control
circuit.
Standby
The circuit is set to the standby mode when TDAPLB = 1
and TAUPLB = 1 (see Table 1), or when a HIGH level is
applied to pin 7. After a HIGH-to-LOW transition at pin 7,
the IC will remain in the standby mode until TDAPLB = 0
or TAUPLB = 0. When the IC is in the standby mode, the
current amplifier is switched off to minimize the power
consumption, all write current outputs are floating, and the
voltage reference is switched off.
Operational amplifier
An uncommitted operational amplifier is available for use
in a tape head temperature compensation circuit with the
read IC TDA1380.
September 19948
Page 9
Philips SemiconductorsPreliminary specification
DCC write amplifier (WRITE3)TDA1381
September 19949
Fig.5 Data format and timing sequence of the write pulses.
(1) Erase pulses are inverted every other cycle of 32 clock pulses.
Page 10
Philips SemiconductorsPreliminary specification
DCC write amplifier (WRITE3)TDA1381
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); all voltages referenced to VSS (pins 6, 29 and 31);
all currents are positive into the IC.
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
DD
V
I
V
n
I
IW(max)
I
I(max)
I
n(max)
T
stg
T
amb
V
es
supply voltage−0.35.5V
input voltage pins 4, 5, 7 and 8−0.35.5V
input voltage on other pinsVDD+ 0.3 V < 5.5 V−0.3VDD+ 0.3 V
maximum input current on write pulse
−200+200µA
outputs (pins 13, 14, 16 to 21, 23, 24, 37,
38, 40 to 45, 47 and 48)
1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
2. Machine model: equivalent to discharging a 200 pF capacitor through a 25 Ω series resistor and a 2.5 µH series
inductor.
THERMAL CHARACTERISTICS
SYMBOLPARAMETERVALUEUNIT
R
th j-a
thermal resistance from junction to ambient in free air65K/W
September 199410
Page 11
Philips SemiconductorsPreliminary specification
DCC write amplifier (WRITE3)TDA1381
CHARACTERISTICS
VDD= 3 V (pins 1, 2, 11, 12, 25, 26, 34 and 35 tied together externally); T
test circuit of Fig.7; unless otherwise specified.
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supply
V
DD
I
DD
I
stb
P
d(av)
supply voltage2.73.04.0V
supply currentnote 1−912mA
total standby currentstandby mode−0.10.3mA
average power dissipationnote 2−120−mW
Digital inputs (pins 4, 5, 7 and 8)
V
IH
V
IL
I
LI
t
su
t
h
HIGH level input voltage0.7V
LOW level input voltage−0.300.3V
input leakage current−100+10µA
WDATA set-up timesee Fig.630−−ns
WDATA hold timesee Fig.630−−ns
Analog inputs/output (pins 27, 28, 30, 32 and 33)
V
V
V
G
SET
CNTR
ref
if
input voltage (pin 27)0.4−VDD− 1.3V
input voltage (pin 28)0.4−VDD− 1.3V
output reference voltage (pin 32)Io< 500 µA1.952.052.15V
current gain factorwith voltage input550700850
with current input590720850
amb
=25°C; f
DD
= 3.072 MHz; measured in
clk
V
DD
5.5V
DD
V
Write pulse outputs (pins 13, 14, 16 to 21, 23, 24, 37, 38, 40 to 45, 47 and 48)
I
WDAT(min)
minimum output current channels
f
= 6.15 MHz−−20mA
clk
0to7
I
WDAT(max)
maximum output current channels
note 3100−−mA
0to7
I
AUX(max)
maximum output current auxiliary
note 3153−−mA
channel
A
W
relative auxiliary write current
1.01.21.4dB
increase
A
E
relative auxiliary erase current
3.03.74.4dB
increase
∆I
WDAT
deviation between main data
note 4−−0.5dB
channels per sector
∆I
WDAT
------------------- ∆T
temperature coefficient of the
output currents
note 5−200 × 10
−6
−K
−1
September 199411
Page 12
Philips SemiconductorsPreliminary specification
DCC write amplifier (WRITE3)TDA1381
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Operational amplifier (pins 3, 9 and 10); note 6
G
o
B
G
V
o
V
i(cm)
Notes
1. No head connected, all outputs unloaded.
2. Auxiliary and data write mode; I
3. Maximum resistive load of auxiliary channel is 6.5 Ω; maximum resistive load of data channels is 10 Ω.
4. for channels 0 to 7, I
20 log
5. With constant V
6. RL> 100 kΩ; CL< 100 pF; load connected between pin 9 and VSS.
DC open loop gain−45−dB
gain bandwidth−1−MHz
output voltage (pin 9)0.5−VDD− 1.3V
common mode input voltage
0.85−V
DD
(pins 3 and 10)
= 100 mA.
WDAT
I
WDAT max()
-----------------------------I
WDAT min()
SET
or I
(see Fig.7).
SET
WDAT
= 100 mA.
V
Fig.6 Timing relationship between the edges of
WCLK and WDATA.
September 199412
Page 13
Philips SemiconductorsPreliminary specification
DCC write amplifier (WRITE3)TDA1381
TEST AND APPLICATION INFORMATION
September 199413
Fig.7 Test circuit.
Page 14
Philips SemiconductorsPreliminary specification
DCC write amplifier (WRITE3)TDA1381
September 199414
Fig.8 Application diagram.
Page 15
Philips SemiconductorsPreliminary specification
DCC write amplifier (WRITE3)TDA1381
PACKAGE OUTLINE
handbook, full pagewidth
seating plane
9.3
8.7
4837
1
pin 1 index
12
13
0.26
0.5
0.14
7.1
6.9
0.1 S
24
0.15MA
36
25
0.95
0.55
A
S
0.26
0.14
0.95
0.55
0.5
0.15MB
7.1
6.9
B
9.3
8.7
X
Dimensions in mm.
Fig.9 Plastic thin quad flat package; 48 leads; body 7 × 7 × 1.4 mm (TQFP48; SOT313-1).
September 199415
1.5
1.3
MSA396
0.20
0.04
detail X
0.7
0.3
0.66
0.56
0.18
0.12
0 to 7
o
1.70
1.35
Page 16
Philips SemiconductorsPreliminary specification
DCC write amplifier (WRITE3)TDA1381
SOLDERING
Plastic quad flat-packs
YWAVE
B
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
Y SOLDER PASTE REFLOW
B
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
R
IRON OR PULSE
-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
September 199416
Page 17
Philips SemiconductorsPreliminary specification
DCC write amplifier (WRITE3)TDA1381
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
The Digital Compact Cassette logo is a registered trade mark of Philips Electronics N.V.
September 199417
Page 18
Philips Semiconductors – a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. (02)805 4455, Fax. (02)805 4466
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,
Tel. (01)60 101-1236, Fax. (01)60 101-1211
Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,
CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (02)70-4044, Fax. (02)92 0601
For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BE-p,
P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. +31-40-724825
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Printed in The Netherlands
Philips Semiconductors
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