Datasheet tda1381 DATASHEETS (Philips)

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INTEGRATED CIRCUITS
DATA SH EET
TDA1381
DCC write amplifier (WRITE3)
Preliminary specification File under Integrated Circuits, IC01
Philips Semiconductors
September 1994
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Philips Semiconductors Preliminary specification
DCC write amplifier (WRITE3) TDA1381
FEATURES
• Single 3 V power supply
• Low standby current consumption
• 20 bidirectional current outputs (2 × nine heads)
• Single point main data and auxiliary current setting
• Reduction of power consumption between write pulses
• Soft switching of output currents
• Serial data input
• Timing is compatible with TDA1319T
• Uncommitted operational amplifier available.
GENERAL DESCRIPTION
The TDA1381 has been designed to drive an 18-channel inductive recording head which is suitable for the DCC (Digital Compact Cassette) system. The bidirectional current outputs are controlled by a two-wire serial bus. The amplitude of the write current pulses can be set by either voltage or current control. The circuit can be switched to standby mode to minimize supply current consumption.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
DD
I
DD
I
DD(av)
I
stb
I
WDAT(max)
supply voltage 2.7 3.0 4.0 V supply current note 1 − 912mA average supply current note 2 − 26.5 − mA total standby current − 0.1 0.3 mA maximum write current for main data
note 3 100 −−mA
channels 0 to 7
I
WAUX(max)
I
EAUX(max)
P
d(av)
T
amb
maximum write current for auxiliary channel note 3 115 −−mA maximum erase current for auxiliary channel note 3 153 −−mA average power dissipation note 2 − 80 − mW operating ambient temperature −30 − +85 °C
Notes
1. No head connected; all outputs unloaded; V
2. In the auxiliary and data write mode; writing DCC data; I f
= 3.072 MHz. Data channels resistively loaded with 6 Ω, auxiliary channel resistively loaded with 4 Ω between
clk
DD
=3V.
= 60 mA; VDD=3V;
WDAT
pins 23 and 24, and 37 and 38.
3. Resistors connected in accordance with test circuit of Fig.7.
ORDERING INFORMATION
TYPE
NUMBER
NAME DESCRIPTION VERSION
TDA1381H TQFP48
Note
1. When using IR reflow soldering it is recommended that the Drypack instructions in the (order number 9398 510 63011) are followed.
September 1994 2
PACKAGE
(1)
plastic thin quad flat package; 48 leads; body 7 × 7 × 1.4 mm SOT313-1
“Quality Reference Handbook”
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Philips Semiconductors Preliminary specification
DCC write amplifier (WRITE3) TDA1381
BLOCK DIAGRAM
September 1994 3
Fig.1 Block diagram.
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Philips Semiconductors Preliminary specification
DCC write amplifier (WRITE3) TDA1381
PINNING
SYMBOL PIN DESCRIPTION
V
DD
V
DD
AMP(pos) 3 operational amplifier non-inverting input WCLK 4 write clock input WDATA 5 write data input V
SS
STANDBY 7 standby mode control input AB 8 tape sector A or B select input AMPO 9 operational amplifier output AMP(neg) 10 operational amplifier inverting input V
DD
V
DD
BJ 13 sector B write pulse output J BI 14 sector B write pulse output I n.c. 15 not connected BH 16 sector B write pulse output H BG 17 sector B write pulse output G BF 18 sector B write pulse output F BE 19 sector B write pulse output E BD 20 sector B write pulse output D BC 21 sector B write pulse output C n.c. 22 not connected BB 23 sector B write pulse output B BA 24 sector B write pulse output A V
DD
V
DD
V
SET
V
CNTR
V
SS
I
SET
V
SS
V
ref
R
BIAS
V
DD
V
DD
n.c. 36 not connected AA 37 sector A write pulse output A AB 38 sector A write pulse output B n.c. 39 not connected AC 40 sector A write pulse output C
1 supply voltage 2 supply voltage
6 ground
11 supply voltage 12 supply voltage
25 supply voltage 26 supply voltage 27 control voltage input 28 voltage-to-current conversion setting input 29 ground 30 control current input 31 ground 32 reference voltage output 33 bias current resistor 34 supply voltage 35 supply voltage
September 1994 4
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Philips Semiconductors Preliminary specification
DCC write amplifier (WRITE3) TDA1381
SYMBOL PIN DESCRIPTION
AD 41 sector A write pulse output D AE 42 sector A write pulse output E AF 43 sector A write pulse output F AG 44 sector A write pulse output G AH 45 sector A write pulse output H n.c. 46 not connected AI 47 sector A write pulse output I AJ 48 sector A write pulse output J
September 1994 5
Fig.2 Pin configuration.
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Philips Semiconductors Preliminary specification
DCC write amplifier (WRITE3) TDA1381
FUNCTIONAL DESCRIPTION
The TDA1381 is designed to drive the elements of an 18-channel recording head, containing nine elements for tape sector A and nine elements for sector B. A brief functional description of each block (see Fig.1) is given below.
Decoder
The IC is controlled by the 32-bit wide serial data word which is clocked in at WDATA (pin 5). The clock frequency (WCLK, pin 4) is 3.072 MHz with a clock period of 325 ns. The write pulses are made available at the outputs AA to AJ when tape sector A is selected (pin 8 HIGH) or at the outputs BA to BJ when tape sector B is selected (pin 8 LOW). The principle of connection of the recording head to the IC is illustrated in Fig.4.
The timing sequence of the write pulses is shown in Fig.5. The operating mode of the IC can be set by the first 3 bits of WDATA. The signals TCH0 to TCH7 and TCHAUX determine the direction of the write current. When TCH
HIGH, the current flows as indicated in Fig.4. When TCH is LOW current flows in the opposite direction. The various modes of operation are given in Table 1. The standby mode can also be forced by setting the STANDBY input (pin 7) HIGH.
Current control
The write current at the outputs is regulated by the current control circuit. The principle of this circuit is shown in Fig.3.
The value of the current I voltage V
, connected between pin 27 and VSS. In this
SET
can be set using an external
WDAT
configuration, pin 28 has to be resistively loaded to another voltage source or V
(see Fig.7). The current
SS
control circuit regulates the voltage between pins 27 and 28 to zero. When a resistor R
is
n
pin 28 and V as: G
SS
I
WDAT
=
-------------------- -
if

V

------------- ­R

SET SET
, a current gain factor (Gif) can be defined
is connected between
set
Table 1 Modes of operation.
MODE WRITE CURRENT CONTROL BIT
MAIN DATA CHANNELS
AUXILIARY
CHANNEL
MAIN DATA CHANNELS
AUXILIARY
CHANNEL
(3)
PLAYBACK)
TDAPLB
CHANNEL
(DATA
(2)
TAUPLB
(AUXILIARY
CHANNEL
PLAYBACK)
Read read off off 1 1 X Write read I Write write I Write erase I
WDAT WDAT WDAT
Read write off AW × I Read erase off AE × I
off 0 1 X
AW × I
AE × I
WDAT
WDAT
WDAT
WDAT
000 001 100 101
(1)
(2)
n
TERAUX
(AUXILIARY
CHANNEL
ERASE)
Notes
1. Where 0 = LOW, 1 = HIGH and X = don't care.
2. When both TDAPLB and TAUPLB are HIGH, the IC is set to the standby mode.
and AE are multiplication factors (see Section “Current control”).
3. A
W
September 1994 6
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Philips Semiconductors Preliminary specification
DCC write amplifier (WRITE3) TDA1381
Fig.3 Principle of the write current control circuit.
It is also possible to set the write current by providing a current Ii into I be connected to V
The current gain factor is now defined as:
(pin 30). In this configuration pin 27 must
SET
and pin 28 must be connected to VDD.
SS
G
=
if
I
WDAT
--------------- ­I
i
During AUX write (outputs AA, AB or BA, BB active) the output current I
is increased by a factor AW. During
WDAT
the erase mode of the auxiliary channel (TERAUX = HIGH, see Table 1), the output current I
WDAT
is increased by a factor AE.
September 1994 7
Outputs
Each channel of the chosen sector is selected in sequence. Depending on the data word, the current is directed forward or reversed through the heads. The outputs that are not selected are kept floating to prevent any incorrect current flow. In HIGH state (one of the switches P is closed) the output is internally connected to
. In the LOW state (one of the switches N is closed) the
V
DD
output is connected to a current source.
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Philips Semiconductors Preliminary specification
DCC write amplifier (WRITE3) TDA1381
Fig.4 Definition of the output currents.
Voltage reference
A reference voltage is available at pin 32. This voltage is derived from a bandgap reference source, and can be used to derive a control voltage for the current control circuit.
Standby
The circuit is set to the standby mode when TDAPLB = 1 and TAUPLB = 1 (see Table 1), or when a HIGH level is applied to pin 7. After a HIGH-to-LOW transition at pin 7,
the IC will remain in the standby mode until TDAPLB = 0 or TAUPLB = 0. When the IC is in the standby mode, the current amplifier is switched off to minimize the power consumption, all write current outputs are floating, and the voltage reference is switched off.
Operational amplifier
An uncommitted operational amplifier is available for use in a tape head temperature compensation circuit with the read IC TDA1380.
September 1994 8
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Philips Semiconductors Preliminary specification
DCC write amplifier (WRITE3) TDA1381
September 1994 9
Fig.5 Data format and timing sequence of the write pulses.
(1) Erase pulses are inverted every other cycle of 32 clock pulses.
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Philips Semiconductors Preliminary specification
DCC write amplifier (WRITE3) TDA1381
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); all voltages referenced to VSS (pins 6, 29 and 31); all currents are positive into the IC.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DD
V
I
V
n
I
IW(max)
I
I(max)
I
n(max)
T
stg
T
amb
V
es
supply voltage −0.3 5.5 V input voltage pins 4, 5, 7 and 8 −0.3 5.5 V input voltage on other pins VDD+ 0.3 V < 5.5 V −0.3 VDD+ 0.3 V maximum input current on write pulse
−200 +200 µA outputs (pins 13, 14, 16 to 21, 23, 24, 37, 38, 40 to 45, 47 and 48)
maximum input current on supply and
−250 +250 µA ground pins (pins 1, 2, 6, 11, 12, 25, 26, 29, 31, 34 and 35)
maximum input current on other pins
−10 +10 µA (pins 3 to 5, 7 to 10, 27, 28, 30, 32 and 33)
storage temperature −55 +150 °C operating ambient temperature −30 +85 °C electrostatic handling note 1 −3000 +3000 V
note 2 −300 +300 V
Notes
1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
2. Machine model: equivalent to discharging a 200 pF capacitor through a 25 Ω series resistor and a 2.5 µH series inductor.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER VALUE UNIT
R
th j-a
thermal resistance from junction to ambient in free air 65 K/W
September 1994 10
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Philips Semiconductors Preliminary specification
DCC write amplifier (WRITE3) TDA1381
CHARACTERISTICS
VDD= 3 V (pins 1, 2, 11, 12, 25, 26, 34 and 35 tied together externally); T test circuit of Fig.7; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
DD
I
DD
I
stb
P
d(av)
supply voltage 2.7 3.0 4.0 V supply current note 1 − 912mA total standby current standby mode − 0.1 0.3 mA average power dissipation note 2 − 120 − mW
Digital inputs (pins 4, 5, 7 and 8)
V
IH
V
IL
I
LI
t
su
t
h
HIGH level input voltage 0.7V LOW level input voltage −0.3 0 0.3V input leakage current −10 0 +10 µA WDATA set-up time see Fig.6 30 −−ns WDATA hold time see Fig.6 30 −−ns
Analog inputs/output (pins 27, 28, 30, 32 and 33)
V V V G
SET CNTR ref
if
input voltage (pin 27) 0.4 − VDD− 1.3 V input voltage (pin 28) 0.4 − VDD− 1.3 V output reference voltage (pin 32) Io< 500 µA 1.95 2.05 2.15 V current gain factor with voltage input 550 700 850
with current input 590 720 850
amb
=25°C; f
DD
= 3.072 MHz; measured in
clk
V
DD
5.5 V
DD
V
Write pulse outputs (pins 13, 14, 16 to 21, 23, 24, 37, 38, 40 to 45, 47 and 48)
I
WDAT(min)
minimum output current channels
f
= 6.15 MHz −−20 mA
clk
0to7
I
WDAT(max)
maximum output current channels
note 3 100 −−mA
0to7
I
AUX(max)
maximum output current auxiliary
note 3 153 −−mA
channel
A
W
relative auxiliary write current
1.0 1.2 1.4 dB
increase
A
E
relative auxiliary erase current
3.0 3.7 4.4 dB
increase
∆I
WDAT
deviation between main data
note 4 −−0.5 dB
channels per sector
∆I
WDAT
------------------- ­∆T
temperature coefficient of the output currents
note 5 − 200 × 10
−6
− K
−1
September 1994 11
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Philips Semiconductors Preliminary specification
DCC write amplifier (WRITE3) TDA1381
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Operational amplifier (pins 3, 9 and 10); note 6
G
o
B
G
V
o
V
i(cm)
Notes
1. No head connected, all outputs unloaded.
2. Auxiliary and data write mode; I
3. Maximum resistive load of auxiliary channel is 6.5 Ω; maximum resistive load of data channels is 10 Ω.
4. for channels 0 to 7, I
20 log
5. With constant V
6. RL> 100 kΩ; CL< 100 pF; load connected between pin 9 and VSS.
DC open loop gain − 45 − dB gain bandwidth − 1 − MHz output voltage (pin 9) 0.5 − VDD− 1.3 V common mode input voltage
0.85 − V
DD
(pins 3 and 10)
= 100 mA.
WDAT
I
WDAT max()
-----------------------------­I
WDAT min()
SET
or I
(see Fig.7).
SET
WDAT
= 100 mA.
V
Fig.6 Timing relationship between the edges of
WCLK and WDATA.
September 1994 12
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Philips Semiconductors Preliminary specification
DCC write amplifier (WRITE3) TDA1381
TEST AND APPLICATION INFORMATION
September 1994 13
Fig.7 Test circuit.
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Philips Semiconductors Preliminary specification
DCC write amplifier (WRITE3) TDA1381
September 1994 14
Fig.8 Application diagram.
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Philips Semiconductors Preliminary specification
DCC write amplifier (WRITE3) TDA1381
PACKAGE OUTLINE
handbook, full pagewidth
seating plane
9.3
8.7
48 37
1
pin 1 index
12
13
0.26
0.5
0.14
7.1
6.9
0.1 S
24
0.15MA
36
25
0.95
0.55
A
S
0.26
0.14
0.95
0.55
0.5
0.15MB
7.1
6.9
B
9.3
8.7
X
Dimensions in mm.
Fig.9 Plastic thin quad flat package; 48 leads; body 7 × 7 × 1.4 mm (TQFP48; SOT313-1).
September 1994 15
1.5
1.3
MSA396
0.20
0.04
detail X
0.7
0.3
0.66
0.56
0.18
0.12
0 to 7
o
1.70
1.35
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Philips Semiconductors Preliminary specification
DCC write amplifier (WRITE3) TDA1381
SOLDERING Plastic quad flat-packs
YWAVE
B During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 °C within 6 s. Typical dwell time is 4 s at 250 °C.
A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications.
Y SOLDER PASTE REFLOW
B Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 °C.
EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
R
IRON OR PULSE
-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 °C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 °C. (Pulse-heated soldering is not recommended for SO packages.)
For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement.
September 1994 16
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Philips Semiconductors Preliminary specification
DCC write amplifier (WRITE3) TDA1381
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
The Digital Compact Cassette logo is a registered trade mark of Philips Electronics N.V.
September 1994 17
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