The TD62001P / AP / F / AF Series are high−voltage, high−current
darlington drivers comprised of seven NPN darlington pairs.
All units feature integral clamp diodes for switching inductive
loads.
Applications include relay, hammer, lamp and display (LED)
drivers.
FEATURES
l Output current (single output) 500 mA MAX.
l High sustaining voltage output
35 V MIN. (TD62001P / F Series)
50 V MIN. (TD62001AP / AF Series)
l Output clamp diodes
l Inputs compatible with various types of logic
l Package Type−P, AP : DIP−16 pin
l Package Type−F, AF : SOP−16 pin
TYPE
TD62001P / AP / F / AF External General Purpose
TD62002P / AP / F / AF
TD62003P / AP / F / AF 2.7 kΩTTL, 5 V CMOS
TD62004P / AP / F / AF 10.5 kΩ6~15 V PMOS, CMOS
PIN CONNECTION
INPUT BASE
RESISTOR
10.5−kΩ + 7 V
Zenner diode
(TOP VIEW)
DESIGNATION
14~25 V PMOS
Weight
DIP16−P−300−2.54A : 1.11 g (Typ.)
SOP16−P−225−1.27 : 0.16 g (Typ.)
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Page 2
TD62001~004P/AP/F/AF
SCHEMATICS
(EACH DRIVER)
TD62001P / AP / F / AF TD62002P / AP / F / AF TD62003P / AP / F / AF
TD62004P / AP / F / AF
Note: The input and output parasitic diodes cannot be used as clamp diodes.
MAXIMUM RATINGS
(Ta = 25°C)
CHARACTERISTIC SYMBOL RATING UNIT
Output Sustaining
Voltage
Output Current I
Input Voltage V
Input Current I
Clamp Diode
Reverse Voltage
Clamp Diode Forward Current I
Power Dissipation
Operating
Temperature
Storage Temperature T
P, F −0.5~35
AP, AF
P, F 35
AP, AF
P 1.0
AP 1.47
F, AF
P −30~75
AP, F, AF
V
CE (SUS)
OUT
(Note 1)−0.5~30 V
IN
(Note 2)25 mA
IN
V
R
F
P
D
T
opr
stg
−0.5~50
0.54 / 0.625
(Note 3)
−40~85
−55~150 °C
Note 1: Except TD62001P / AP / F / AF
Note 2: Only TD62001P / AP / F / AF
Note 3: On glass epoxy PCB (30 × 30 × 1.6 mm Cu 50%)
V
500 mA / ch
V
50
500 mA
W
°C
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Page 3
RECOMMENDED OPERATING CONDITIONS
(Ta = −40~85°C and Ta = −30~75°C for only Type−P)
CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAXUNIT
TD62001~004P/AP/F/AF
Output Sustaining
Voltage
Output Current
Input Voltage
Input Voltage
(Output On)
Input Voltage
(Output Off)
Input Current Only TD62001 I
Voltage
Clamp Diode Forward Current I
Power Dissipation
P, F 0 ― 35
AP, AF
AP
P
F, AF
Except
TD62001P /
AP / F / AF
TD62002 14.5 ― 24
TD62003 2.8 ― 24
TD62004
TD62001 0 ― 0.6
TD62002 0 ― 7.4
TD62003 0 ― 0.7
TD62004
P, F ― ― 35 Clamp Diode Reverse
AP, AF
P ― ― 0.6
AP
AF, F
V
CE (SUS)
V
IN (ON)
V
IN (OFF)
I
OUT
V
IN
V
P
IN
F
Duty = 10% 0 ― 370
Tpw = 25 ms
7 Circuits
Ta = 85°C
T
= 120°C
j
0 ― 24 V
I
= 400 mA
OUT
h
= 800
FE
0 ― 1.0
0 ― 10 mA
R
D
―― 50
―― 350mA
Ta = 85°C
Ta = 85°C (Note)― ― 0.325
Duty = 50% 0 ― 130
Duty = 10% 0 ― 295
Duty = 50% 0 ― 95
Duty = 10% 0 ― 233
Duty = 50% 0 ― 70
0 ― 50
6.2 ― 24
―― 0.76
V
mA /
ch
V
V
V
W
Note: On glass epoxy PCB (30 × 30 × 1.6 mm Cu 50%)
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Page 4
TD62001~004P/AP/F/AF
ELECTRICAL CHARACTERISTICS
CHARACTERISTIC SYMBOL
AP, AF
Output Leakage
Current
F
P
Collector−Emitter Saturation Voltage V
DC Current Transfer Ratio h
TD62002 VIN = 20 V, I
Input Current
(Output On)
TD62003 VIN = 2.4 V, I
TD62004
Input Current
(Output Off)
P I
AP, F, AF
TD62002
Input Voltage
(Output On)
TD62003
TD62004
AP, AF
Clamp Diode
Reverse Current
F
P
Clamp Diode Forward Voltage V
Input Capacitance C
P, F
Turn−On Delay
AP, AF
P, F
Turn−Off Delay
AP, AF
I
CEX
CE (sat)
FE
I
IN (ON)
I
IN (OFF)
V
IN (ON)
I
R
F
IN
t
ON
t
OFF
(Ta = 25°C unless otherwise noted)
TEST
CIR−
TEST CONDITION MIN TYP. MAXUNIT
CUIT
VCE = 50 V, Ta = 25°C ― ― 50
V
= 50 V, Ta = 85°C ― ― 100
CE
VCE = 35 V, Ta = 25°C ― ― 50
1
V
= 35 V, Ta = 85°C ― ― 100
CE
VCE = 35 V, Ta = 25°C ― ― 50
= 35 V, Ta = 75°C ― ― 100
V
CE
I
= 350 mA, IIN = 500 µA― 1.3 1.6
OUT
2
I
= 200 mA, IIN = 350 µA― 1.1 1.3
OUT
I
= 100 mA, IIN = 250 µA― 0.9 1.1
OUT
2 VCE = 2 V, I
3
V
= 9.5 V, I
IN
= 500 µA, Ta = 75°C 50 65 ―
OUT
4
5
= 500 µA, Ta = 85°C 50 65 ―
I
OUT
V
= 2 V
CE
h
= 800
FE
= 350 mA 1000 ― ―
OUT
= 350 mA ― 1.1 1.7
OUT
= 350 mA ― 0.4 0.7
OUT
= 350 mA ― 0.8 1.2
OUT
I
= 350 mA― ― 13.7
OUT
= 200 mA― ― 11.4
I
OUT
I
= 350 mA― ― 2.6
OUT
= 200 mA― ― 2.0
I
OUT
I
= 350 mA― ― 4.7
OUT
= 200 mA― ― 4.4
I
OUT
VR = 50 V, Ta = 25°C ― ― 50
= 50 V, Ta = 85°C ― ― 100
V
R
VR = 35 V, Ta = 25°C ― ― 50
6
V
= 35 V, Ta = 85°C ― ― 100
R
VR = 35 V, Ta = 25°C ― ― 50
V
= 35 V, Ta = 75°C ― ― 100
R
7 IF = 350 mA ― ― 2.0 V
―― 15 ― pF
= 35 V, RL = 87.5 Ω
V
OUT
C
= 15 pF
L
8
8
= 50 V, RL = 125 Ω
V
OUT
C
= 15 pF
L
= 35 V, RL = 87.5 Ω
V
OUT
C
= 15 pF
L
= 50 V, RL = 125 Ω
V
OUT
C
= 15 pF
L
― 0.1 ―
― 0.1 ―
― 0.2 ―
― 0.2 ―
µA
V
mA
µA
V
µA
µs
4
2001-06-27
Page 5
TEST CIRCUIT
TD62001~004P/AP/F/AF
1. I
CEX
4. I
IN (OFF)
7. VF
2. V
5. V
CE (sat)
IN (ON)
, h
FE
3.
IIN (ON)
6. IR
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Page 6
TD62001~004P/AP/F/AF
8. tON, t
Note 1: Pulse width 50 µs, duty cycle 10%
Note 2: See below
INPUT CONDITION
OFF
Output impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns
TYPE NUMBER R1 V
TD62001P / AP / F / AF 2.7 kΩ 3 V
TD62002P / AP / F / AF 0 13 V
TD62003P / AP / F / AF 0 3 V
TD62004P / AP / F / AF 0 8 V
Note 3: CL includes probe and jig capacitance.
IH
PRECAUTIONS for USING
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed
due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
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TD62001~004P/AP/F/AF
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TD62001~004P/AP/F/AF
8
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TD62001~004P/AP/F/AF
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TD62001~004P/AP/F/AF
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TD62001~004P/AP/F/AF
PACKAGE DIMENSIONS
DIP16−P−300−2.54A Unit : mm
Weight: 1.11 g (Typ.)
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Page 12
TD62001~004P/AP/F/AF
PACKAGE DIMENSIONS
SOP16−P−225−1.27 Unit : mm
Weight: 0.16 g (Typ.)
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Page 13
TD62001~004P/AP/F/AF
A
RESTRICTIONS ON PRODUCT USE
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
· The products described in this document are subject to the foreign exchange and foreign trade laws.
· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
000707EB
· The information contained herein is subject to change without notice.
13
2001-06-27
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