Datasheet TC962 Datasheet

TC962

V

DD

1

2

3

4

5

6

7

8

16

13

12

11

10

9

NC

GND

C

OSC

NC

15

14

NC

NC

NC

TC962COE

NC

NC

Zener

Cathode

NC

FREQ x 2

16-Pin SOIC Wide

C

+

C

–

V

OUT

1

2

3

4

8

7

6

5

FREQ x 2

GND

TC962CPA
TC962EPA

TC962IJA

TC962MJA

C

+

C

–

V

OUT

8-Pin CERDIP

8-Pin DIP

•

Zener

Cathode

C

OSC

V

DD

High Current Charge Pump DC-to-DC Converter

Features:

• Pin Compatible With TC7662/ICL7662/SI7661

• High Output Current 80 mA

• No External Diodes Required

• Wide Operating Range 3V to 18V

• Low Output Impedance 28 Typ.

• No Low Voltage Terminal Required

• Application Zener On-Chip

• OSC Frequency Doubling Pin Option for Smaller
Output Capacitors

Applications:

• Laptop Computers

•Disk Drives

• Process Instrumentation

• P-Based Controllers

Device Selection Table

Part

Number

Package

TC962COE 16-Pin SOIC Wide 0°C to +70°C
TC962CPA 8-Pin Plastic DIP 0°C to +70°C
TC962EPA 8-Pin Plastic DIP -40°C to +85°C
TC962IJA 8-Pin CERDIP -25°C to +85°C
TC962MJA 8-Pin CERDIP -55°C to +1 25°C

Operating

Temp.

Range

General Description:

The TC962 is an advanced version of the industry
standard TC7662 high voltage DC-to-DC converter.
Using improved design techniques and CMOS
construction, the TC96 2 can sourc e as much as 80 mA
versus the 7662’s 20 mA capability.

As an inverter, the TC962 can put out voltages as high
as 18V and as low as 3V without the need for external
diodes. The output impedance of the device is a low
28 (with the proper capacitors), voltage conversion
efficiency is 99.9%, and power conversion efficiency is
97%.

The low voltage terminal (pin 6) required in some
TC7662 applications has been eliminated. Grounding
this terminal will double the oscill ator frequency fro m 12
kHz to 24 kHz. This will allow the use of smaller
capacitors for the same output current and ripple, in
most applications. Only two external capacitors are
required for inverter applications. In the event an
external clock is needed to drive the TC962 (such as
paralleling), driving this pin directly will cause the
internal oscillator to sync to the external clock.

Pin 1, which is used as a test pin on the 7662, is a
voltage reference Zener on the TC962. This Zener (6.4V
at 5 mA) has a dynamic impedance of 12 and is
intended for use where the TC962 is supplying current to
external regulator circuitry and a reference is needed for
the regulator circuit. (See Section 3.0 “Applications
Information” Applications Information).

The TC962 is compatible with the LTC1044, SI7661
and ICL7662. It should be used in designs that require
greater power and/or less input to output voltage drop.
It offers superior performance over the ICL7660S.

Package Type

 2001-2012 Microchip Technology Inc. DS21484D-page 1

TC962

Functional Block Diagram

FREQ x 2

OSC/C

Timing

Zener

Cathode

6

–

7

I I

+

–

Comparator
with Hysteresis

1

6.4V

8

V

DD

TC962

Level

Q

F/F

C

Q

V

REF

Shift

Level

Shift

Level

Shift

P SW1

N SW4

N SW2

2

+

CAP

C

P

External

OUT

+

GND

3

+

C

R

EXT

Level

Shift

N SW3

4

CAP

–

5

V

OUT

R

L

DS21484D-page 2  2001-2012 Microchip Technology Inc.

TC962

1.0 ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings*

Supply Voltage (VDD to GND)..............................+18V

Input Voltage Any Pin

.........................(V

Current Into Any Pin...........................................10 mA

ESD Protection ................................................±2000V

Output Short Circuit ........... Continuous (at 5.5V Input)

Package Power Dissipation (T

SOIC.......................................................760 mW

PDIP........................................................730 mW

CERDIP ..................................................800 mW

Package Thermal Resistance
CERDIP, R
PDIP, R

J-A

............................................140°C/W

J-A

Operating Temperature Range

CPA, COE .......................................0°C to +70°C

IJA................................................-25°C to +85°C

EPA .............................................. -40°C to +85°C

MJA............................................-55°C to +125°C

Storage Temperature Range .............-65°C to +150°C

+0.3) to (VSS -0.3) (Note 1)

DD

70°C)

A

.........................................90°C/W

*Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. Thes e are stress ratin gs only and functional
operation of the devic e at these or an y other con ditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
affect device reliability.

TC962 ELECTRICAL SPECIFICATIONS

Electrical Characteristics: VDD = 15V, TA = 25°C (See Figure ) unless otherwise noted.

Symbol Parameter Min Typ Max Units Tes t Conditions

V

DD

I

S

R

O

F

OSC

P

EFF

V

DEF

V

Z

Z

ZT

Note 1: Connecting any input terminal to voltages greater than V+ or less than GND may cause destructive latch-up. It is recommended that no

Supply Voltage 3 — 18 V
Supply Current

V

= 15V

DD

= 5V

V

DD

Output Source
Resistance

Oscillator Frequency —

Power Efficiency 93

Voltage Efficiency 99

Zener Voltage 6.0 6.2 6.4 V IZ = 5 mA
Zener Impedance — 12 —  IL = 2.5 mA to 7.5 mA

inputs from sources operating from external supplies be applied prior to “power-up” of the TC962.

—
—
—
—
—
—
—

—
—
—

—

—

—
96

—
510
560
650
190
210
210

32

35

—

12

24

97

—

99.9
—
—

—

700

—
—
—
—
—

37
40
50

—
—

—
—

—
—
—

AR

 I

kHz Pin 6 Open

%RL = 2 k

%RL = 

= 

L

T

= +25°C

A

70°C

0 T

A

= +25°C

70°C

A

125°C

A

125°C

A

-55°C T
T

A

0 T

-55°C T
= 20 mA, VDD = 15V

L

= 80 mA, VDD = 15V

I

L

= 3 mA, VDD = 5V

I

L

Pin 6 GND

Over temperature range

 2001-2012 Microchip Technology Inc. DS21484D-page 3

TC962

2.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1.

TABLE 2-1: PIN FUNCTION TABLE

Pin No.

(8-Pin DIP)

(8-Pin CERDIP)

1 Zener Cathode Cathode of internal Zener diode.
2C
3 GND Ground terminal.
4C
5V
6 FREQ x 2 If grounded, frequency doubles.
7C
8V

Symbol Description

+

-

OUT

OSC

DD

Positive side of external CP capacitor (pump cap).

Negative side of external CP capacitor (pump cap).
Output voltage.

Capacitor to GND will decrease frequency.
Input voltage.

Pin No.

(16-Pin SOIC)

1 Zener Cathode Cathode of internal Zener diode.
2 NC No connect.
3C
4 NC No connect.
5 GND Ground terminal.
6 NC No connect.
7C
8 NC No connect.

9 NC No connect.
10 V
11 NC No connec t.
12 FREQ x 2 If grounded, frequency doubles.
13 NC No connect.
14 C
15 NC No connect.
16 V

Symbol Description

+

-

OUT

OSC

DD

Positive side of external CP capacitor (pump cap).

Negative side of external CP capacitor (pump cap).

Output voltage.

Capacitor to GND will decrease frequency.

Input voltage.

DS21484D-page 4  2001-2012 Microchip Technology Inc.

TC962

TC962

1

2

3

4

8

690

7

5

C

P

+

10 μF

C

OSC

R

L

V

OUT

(–5V)

10 μF

C

R

I

L

I

S

V
(+5V)

+

NC

+

1

2

3

TC962

4

8

7

6

5

C

P2

C

P1

C

R1

10 μF

V

+

+

+

+

10 μF

V

OUT

= –V

+

V

D1

V

D2

V

OUT

=

+

10 μF

Combined Negative Converter and Positive Multiplier

+

C

P

10 μF

+

1

2

3

4

8

7

6

5

10 μF

C

R

+

V

OUT

=

V
2

+

Split V+ In Half

TC962

Positive Voltage MultiplierLowering Output Resistance by Paralleling Devices

2V –2V

D

TC962

1

2

3

4

8

7

6

5

10 μF

10 μF

V

OUT

=

+

V

D2

V

D1

++

V

+

C

P

C

P

2V –2V

D

C

P1

10 μF

+

C

P2

10 μF

+

TC962

TC962

1

2

3

4

8

7

6

5

1

2

3

4

8

7

6

5

+

V

+

V

OUT

10 μF

C

R

V

+

3.0 APPLICATIONS INFORMATION

3.1 Theory of Operation

The TC962 is a capacitive pump (sometimes called a
switched capacitor circuit), where four MOSFET
switches control the charge and discharge of a
capacitor.

The functional block diag ram sho w s how the switc hing
action works. SW1 and SW2 are turned on simultane­ously, charging C
assumes that the on resistance of the MOSFETs in
series with the capacitor results in a charging time
(3 time constants) that is less than the on tim e provided
by the oscillator frequency as shown:

3 (R

DS(ON) CP

In the next cycle, SW1 and SW2 are turned off and af ter
a very short interval of all switches being off (this
prevents large currents from occurring due to cross
conduction), SW3 and SW4 are turn ed o n. Th e c harg e

is then transferred to CR, but with the polarity

in C

P

inverted. In this way, a negative voltage is now derived.
An oscillator supplies pulses to a flip-flop that is then

fed to a set of level shifters. These level shifters then
drive each set of switches at one-half the oscillator
frequency.

The oscillator has two pins that control the frequency of
oscillation. Pin 7 can have a capacitor added that is
returned to ground. This w ill lo w er th e freq uen cy of th e
oscillator by adding cap acit ance to th e timing c apa citor
internal to the TC962. Grounding pin 6 will turn on a

to the supply voltage, VIN. This

P

) < CP/(0.5 f

OSC

)

current source and double the frequency. This will
double the charge current going into the internal
capacitor, as well as any capacitor added to pin 7.

A Zener diode has been a dded to the TC962 fo r use as
a reference in building external regulators. This Zener
runs from pin 1 to ground.

3.2 Latch-Up

All CMOS structures contain a parasitic SCR. Care
must be taken to preven t any input from going ab ove or
below the supply rail, or latch-up will occur. The result
of latch-up is an effective short between V
Unless the power supply input has a current limit, this
latch-up phenomena will result in damage to the
device. (See AN763, Latch-up Protection for MOSFET
Drivers.)

FIGURE 3-1: Test Circuit

and VSS.

DD

FIGURE 3-2: Typical Applications

 2001-2012 Microchip Technology Inc. DS21484D-page 5

TC962

-60 -40 -20 0 20 40 60 80 100 120 140

TEMPERATURE (°C)

80

70

60

50

40

30

20

OUTPUT RESISTANCE ( )

Output Resistance vs. Temperature

10

Ω

50

4.5

ZENER VOLTAGE (V)

CURRENT (mA)

Current vs. Zener Voltage

4.0

5.5 6.0 6.5 7.0

40

30

20

10

0

100

LOAD CURRENT (mA)

POWER CONVERSION EFFICIENCY (%)

Power Conversion Efficiency vs. I

16 32 48 64 80

80

60

40

20

90

70

50

30

10

0

824405672

LOAD

150

120

90

60

30

135

105

75

45

15

0

SUPPLY CURRENT (mA)

V = 5V IL = 3 mA

+

V = 15V IL = 20 mA

+

TA = +25°C

TA = +25°C

EFFICIENCY

SUPPLY
CURRENT

100

INPUT VOLTAGE (V)

OUTPUT RESISTANCE (Ω)

Output Resistance vs. Input Voltage

4 8 12 16 20

80

60

40

20

90

70

50

30

10

2 6 10 14 180

110

TA = +25°C

3 μA

20 μA

4.0 TYPICAL CHARACTERISTICS

Note: The graphs and tables provided following this note are a statistical summary based on a limit ed n um ber o f

samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Circuit of Figure , CP = CR = 10 F, C

PESR

 C

RESR

 1.

Supply Current vs. Temperature

700

600

500

+

400

300

200

SUPPLY CURRENT (μA)

100

0

-60 -40 -20 0 20 40 60 80 100 120 140

TEMPERATURE (°C)

V = 15V

+

V = 15V

Oscillator Frequency vs. C

10k

1k

100

FREQUENCY (Hz)

10

10 100 1000 10,000

1

CAPACITANCE (pF)

OSC

TA = +25°C

Frequency vs. Temperature

20

18

16

14

12

10

FREQUENCY (kHz)

8

6

-60 -40 -20 0 20 40 60 80 100 120 140

C

= FREQ x 2 = OPEN

OSC

TEMPERATURE (°C)

DS21484D-page 6  2001-2012 Microchip Technology Inc.

5.0 PACKAGING INFORMATION

Component Taping Orientation for 16-Pin SOIC (Wide) Devices

W

Pin 1

User Direction of Feed

Standard Reel Component Orientation
for 713 Suffix Device

P

Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size

16-Pin SOIC (W) 16 mm 12 mm 1000 13 in

Carrier Tape, Number of Components Per Reel and Reel Size

.400 (10.16)

.370 (9.40)

.300 (7.62)
.230 (5.84)

.065 (1.65)
.045 (1.14)

.055 (1.40) Max.

.020 (0.51) Min.

Pin 1

.200 (5.08)
.160 (4.06)

.200 (5.08)
.125 (3.18)

.110 (2.79)
.090 (2.29)

.020 (0.51)
.016 (0.41)

.040 (1.02)
.020 (0.51)

.320 (8.13)
.290 (7.37)

.150 (3.81)

Min.

3° Min.

8-Pin CDIP (Narrow)

.015 (0.38)
.008 (0.20)

.400 (10.16)

.320 (8.13)

Dimensions: inches (mm)

Note: For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.m ic roc hip.c om /p a ckagi ng

5.1 Package Marking Information

Package marking data not available at this time.

5.2 Taping Form

TC962

5.3 Package Dimensions

 2001-2012 Microchip Technology Inc. DS21484D-page 7

TC962

3° Min.

Pin 1

.260 (6.60)
.240 (6.10)

.045 (1.14)
.030 (0.76)

.070 (1.78)
.040 (1.02)

.400 (10.16)

.348 (8.84)

.200 (5.08)
.140 (3.56)

.150 (3.81)
.115 (2.92)

.110 (2.79)

.090 (2.29)

.022 (0.56)
.015 (0.38)

.040 (1.02)
.020 (0.51)

.015 (0.38)
.008 (0.20)

.310 (7.87)
.290 (7.37)

.400 (10.16)

.310 (7.87)

8-Pin Plastic DIP

Dimensions: inches (mm)

Note: For t he mo s t c ur re nt pac ka g e d raw in gs , pl ea se see th e M ic r oc hi p Pa c ka gi n g Specif ic ati on lo c at ed

at http://www.microchip.com/packaging

Note: For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging

Package Dimensions (Continued)

16-Pin SOIC (Wide)

Pin 1

.413 (10.49)

.050 (1.27) Typ.

DS21484D-page 8  2001-2012 Microchip Technology Inc.

.398 (10.10)

.019 (0.48)
.014 (0.36)

.299 (7.59)
.291 (7.40)

.419 (10.65)
.398 (10.10)

.104 (2.64)
.097 (2.46)

.012 (0.30)
.004 (0.10)

8°

Max.

.050 (1.27)
.016 (0.40)

Dimensions: inches (mm)

.013 (0.33)
.009 (0.23)

6.0 REVISION HISTORY

Revision D (December 2012)

Added a note to each package outline drawing.

TC962

 2001-2012 Microchip Technology Inc. DS21484D-page 9

TC962

NOTES:

DS21484D-page 10  2001-2012 Microchip Technology Inc.

TC962

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 2001-2012 Microchip Technology Inc. DS21484D-page 11

TC962

TO: Technical Publications Manager
RE: Reader Response

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From:

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Address
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Telephone: (_______) _________ - _________

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DS21484DTC962

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
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DS21484D-page 12  2001-2012 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

YSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
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Printed on recycled paper.

ISBN: 9781620768808

EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

32

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 2001-2012 Microchip Technology Inc. DS21484D-page 13

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11/29/12

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