Datasheet TC7652CPD, TC7652CPA Datasheet (Microchip Technology)

y

TC7652

Low Noise, Chopper Stabilized Operational Amplifier

Features

• Low Offset Over Temperature Range: 10µV

• Ultra Low Long Term Drift: 150nV/Month

• Low Temperature Drift: 100nV/

°C

• Low DC Input Bias Current: 15pA

• High Gain, CMRR and PSRR: 110dB Min

• Low Input Noise Voltage: 0.2µV

p-p (DC to 1Hz)

• InternallyCompensated for Unity G ain Operation

• Clamp Circuit for Fast Overload Recovery

Applications

• Instrumentation

• Medical Instrumentation

• Embedded Control

• TemperatureSensor Amplifier

• Strain Gage Amplifier

Device Selection Table

Part Number Package

TC7652CPA 8-Pin Plastic DIP 0°C to +70°C

TC7652CPD 14-Pin Plastic DIP 0°C to +70°C

Temperature

Range

General Description

The TC7652 i s a lower noise version of the TC7650,
sacrificing some input specifications (bias current and
bandwidth) to achieve a 10x reduction in noise. All the
other benefits of the chopper technique are present,
(i.e, freedom from offset adjust, drift and reliability prob­lems from external trim components).LiketheTC7650,
the TC7652 requires only two noncritical external caps
for storing the chopped null potentials. There are no
significant chopping spikes, internal effects or over­range lockup problems.

Package Type

8-Pin DIP

C

1

A

-Input

2

TC7652CPA

3

+Input

4

V

SS

14-Pin DIP

C

B

1

C

A

2

NC

3

TC7652CPD

-Input

4

5

+Input

6

NC

7

V

SS

NC = No Internal Connection
(Ma



2002 Microchip TechnologyInc. DS21464B-page 1

Be Used As Input Guard)

8

7

6

5

14

13

12

11

10

9

8

C

B

V

DD

Output

Output
Clamp

INT/EXT

EXT CLK
In

INT CLK
Out

V

DD

Output

Output
Clamp

C

RETN

TC7652

S

Functional Block Diagram

Output Clamp

(Not On "Z" Pinout)

Inputs

A

Output Clamp

Circuit

Main
Amplifier

NULL

Intermod

Comparator

BB

NULL
Amplifier

Oscillator

BA

BA

TC7652

14-Pin DIP Only

INT/EXT
EXT CLK IN
CLK OUT

C

B

C

A

Output

NULL

NOTE 1: For 8-pin DIP connect to VSS, or to C

on "Z" pinout.

RET

C

RETN

(1)

V

S

DS21464B-page 2



2002 Microchip TechnologyInc.

TC7652

1.0 ELECTRICAL
CHARACTERISTICS

ABSOLUTE MAXIMUM RATINGS*

Total Supply Voltage (VDDto VSS) .......................+18V

Input Voltage.................... (V

Voltage on Oscillator Control Pins...............V

+0.3V)to (VSS–0.3V)

DD

DD

to V

SS

*Stresses above those listed under “Absolute M aximum
Ratings” may cause permanent damage to the dev ice.
These are stress ratings only and functional oper ation of the
device at these or any other conditions above those indi­cated in the operation sections of the specifications is not
implied. Exposure to Absolute Max imum Rating conditions
for ex tended periods my affect device reliability.

Duration of Output Short Circuit.....................Indefinite

Current Into Any Pin............................................10mA

WhileOperating(Note 1)............................100µA

Package Power Dissipation (T

< 70°C)

A

8-Pin Plastic DIP.......................................730mW

14-Pin Plastic DIP..................................... 800mW

StorageTemperature Range..............-65°C to +150°C

Operating Temperature Range

C Device .......................................... 0°C to +70°C

I Device.........................................-25°C to +85°C

TC7652 ELECTR ICAL SPECI FICATIONS

Electrical Characteristics: VDD=+5V,VSS=-5V,TA= +25°C, unless otherwise indicated.

Symbol Parameter Min Typ Max Units Test Conditions

V

OS

TCV

OS

/DT Offset Voltage vs Time — 150 — nV/mo

V

OS

I

BIAS

I

BIAS

I

OS

R

IN

OL LargeSignal Voltage Gain 120 150 — dB R
V

OUT

CMVR Common Mode Voltage Range -4.3 — +3.5 V
MRR Common Mode Rejection Ratio 120 140 — dB CMVR = -4.3V to +3.5V
PSRR Power Supply 120 140 — dB ±3Vto ±8V
e

N

I

N

GBW Unity Gain Bandwidth — 0.4 — MHz
SR Slew Rate — 1 — V/µsec C

V

DD,VSS

Note 1: Limiting input current to 100µA is recommended to avoid latch-up problems. Typically 1mA is safe however,thisis not

Input Offset Voltage — ±2 ±5 µVTA=+25°C
Average Temperature Co-efficient of

Input Offset Voltage

Input Bias Current (CLK On) —

Input Bias Current (CLK Off) —

Input Offset Current — 25 150 pA
Input Resistance — 10

Output Voltage Swing (Note 2)±4.7—±4.85

InputNoiseVoltage —

InputNoiseCurrent — 0.01 — pA/

Overshoot — 15 — %
Operating SupplyRange 5 — 16 V

guaranteed.

2: Output clamp not connected. See typical characteristics curves for output swing versus clamp current characteristics.
3: See “OutputClamp” under detailed description.

—0.010.05µV/°C 0°C < TA<+70°C

30
—
—

—
—

—

100
250

15

35

100

12

±4.95

0.2

0.7

100

—

1000

30
—

1000

— Ω

—
—

1.5
5

pA TA=+25°C

0°C < T

-25°C < T

pA T

VRL=10kΩ

µV

P-P

µV

P-P

√Hz

=+25°C

A

0°C < T

-25°C < T

=10kΩ,V

L

R

= 100kΩ

L

RS=100Ω,DCto1Hz
DC to 10Hz

f =10Hz

= 50pF, RL=10kΩ

L

<+70°C

A

<+85°C

A

<+70°C

A

<+85°C

A

OUT

=±4V



2002 Microchip TechnologyInc. DS21464B-page 3

TC7652

TC7652 ELECTR ICAL SPECI FICATIONS (CONTINUED)

Electrical Characteristics: VDD=+5V,VSS=-5V,TA= +25°C, unless otherwise indicated.

Symbol Parameter Min Typ Max Units Test Conditions

I

S

f

CH

Note 1: Limiting input current to 100µA is recommended to avoid latch-up problems. Typically 1mA is safe however,thisis not

SupplyCurrent — 1 3 mA NoLoad
Internal ChoppingFrequency 100 275 — Hz Pins 12 – 14 Open (DIP)
ClampON Current(Note 3)25100—µAR
Clamp OFF Current (Note3)—1—pA-4V≤ V

guaranteed.

2: Output clamp not connected. See typical characteristics curves for output swing versus clamp current characteristics.
3: See “OutputClamp” under detailed description.

= 100kΩ

L

OUT

<+10V

DS21464B-page 4



2002 Microchip TechnologyInc.

2.0 PIN DESCRIPTIONS

ThedescriptionsofthepinsarelistedinTable2-1.

TABLE 2-1: PIN FUNCTION TABLE

TC7652

Pin Number

8-pin DIP 14-pin DIP

1,8 2,1 C

2 4 -INPUT Inverting Input
3 5 +INPUT Non-inverting Input
47 V
59OUTPUT

6 10 OUTPUT Output

711 V
— 3,6 NC No internal connection
—8C
— 12 INT CLK OUT Internal Clock Output
— 13 EXT CLK IN External Clock Input
— 14 INT/EXT

Symbol Description

A,CB

SS

CLAMP

DD

RETN

Nulling capacitor pins

Negative Power Supply
Output VoltageClamp

Positive Power Supply

Capacitor current return pin

Select Internal or External Clock



2002 Microchip TechnologyInc. DS21464B-page 5

TC7652

3.0 DETAILED DESCRIPTION

3.1 Capacitor Connection

Connect the null storage capacitors to the CAand C
pins with a common connection to the C
TC7652)ortoV
V

, avoid injecting load current IR drops into the

SS

capacitive circuitry by making this connection directly
via a separate wire or PC trace.

(8-pinTC7652).W hen connecting to

SS

3.2 Output Clamp

In chopper stabilized amplifiers, the output clamp pin
reduces overload recovery time. When a connection is
made to the inverting input pin (summing junction), a
current path is created between that point and the out­put pin, just before the device output saturates. This
prevents uncontrolled differential input voltages and
charge build-up on correction storage capacitors. O ut­put swing is reduced.

3.3 Clock

The TC7652 has a 550Hz internal oscillator, which i s
divided by two before clocking the input chopper
switches. The 275Hz c hopping frequency is available
at INT CLK OUT (Pin 12) on 14-pin devices. In normal
operation,INT/EXT(Pin14),whichhasan internal pull­up, can be left open.

An external clock can also be used. To disable the
internalclockanduse an external one, the INT/EXT pin
must be tied to V
applied to the EXT CLK IN input (Pin 1 3). An internal
divide-by-twoprovides a 50%switchingdutycycle.The
capacitorsare only charged when EXT CLK IN is high,
so a 50% to 80% positive duty cycle is recommended
for higher clock frequencies. The external clock can
swing between V
about 2.5V below V

The output of the internal oscillator, before the divide­by-two circuit, is available at EXT CLK I N when INT/
EXT is high or unconnected. This output can serve as
the clock input for a second TC7652 (operating in a
master/slavemode), so that both op amps will clock at
the same frequency. This prevents clock i ntermodula­tion effects when two TC7652's are used in a differen­tial amplifier configuration.

. The external clock signal is then

SS

and VSS, with the logic threshold

DD

.

DD

RET

pin (14-pin

FIGURE 3-1: TEST CIRCUIT

R2

1MΩ

B

If the TC7652's output saturates, error voltages on the
external capacitors will slow overload recovery. This
condition can be avoided i f a strobe signal is available.
The strobe signal is applied to EXT CLK IN and the
overload signal is applied to the amplifier while the
strobe is LOW. In this case, neither capacitor will be
charged. The low leakage of the capacitor pins allow
long measurements to be made within eligible errors
(typicalcapacitor drift is 10µV/sec).

R

1

1kΩ

TC7652

-

+

0.1µF 0.1µF

C

R

C

Output

4.0 TYPICAL APPLICATIONS

4.1 Component Selection

CAand CB(external capacitors)should be i n the 0.1µF
to 1µF range. For minimum clock ripple noise, use a
1µF capacitor in broad bandwidth circuits. For limited
bandwidth applications where clock ripple is filtered
out, use a 0.1µF capacitor for slightly lower offset volt­age. High quality, film type capacitors (polyester or
polypropylene) are recommended, although a lower
grade ceramic may work in some applications. For
quickest settling after initial turn-on, use low dielectric
absorption capacitors (e.g., polypropylene). With
ceramic capacitors, settling to 1µV takes several sec­onds.

4.2 Static Protection

Although input diodes static protect all device pins,
avoid strong electrostatic fields and discharges that
can cause degraded diode junctioncharacteristics and
produce increased input-leakage currents.

DS21464B-page 6



2002 Microchip TechnologyInc.

TC7652

4.3 Output Stage/Load Driving

The output circuit is high impedance (about 18kΩ).
With lesser loads, the chopper amplifier behaves
somewhat like a transconductance amplifier with an
open-loop gain proportional to load resistance. (For
example, the open-loop gain is 17dB lower with a 1kΩ.
load than with a 10kΩ load.) If the amp is used only for
DC, the DC gain is typically greater than 120dB (even

FIGURE 4-1: CONNECTION OF INPUT GUARDS

Inverting Amplifier

R

2

TC7652

-

+

Output

Noninverting Amplifier

TC7652

R

1

R

2

-

+

Input

R

1

witha1kΩ load),andthislowergainisinconsequential.
For wide band, t he best frequency response occurs
with a load resistor of at least 10kΩ. This produces a
6dB/octave response from 0.1Hz to 2MHz, with phase
shifts of less than 2 degrees in the t ransition region,
where the main amplifiertakesoverfromthenullampli­fier.

Follower

TC7652

Input

Output

-

+

Output

Input

4.4 Thermoelectric Effects

The thermoelectric (Seebeck) effects in thermocouple
junctions of dissimilar metals, alloys, silicon, etc. limit
ultra high precision DC amplifiers. Unless all junctions
are at the same temperature, thermoelectric voltages
around 0.1µV/°C (up to tens of µV/°C for some materi­als) are generated.To realize the low offset voltages of
the chopper, avoid temperature gradients. Enclose
componentstoeliminate air movement, especiallyfrom
power dissipating elements in the system. Where pos­sible, use low thermoelectric co-efficient connections.
Keep power supply voltages and power dissipation to a
minimum. Use high impedance loads and seek maxi­mum separation from surrounding heat disipating ele­ments.

4.5 Guarding

To benefit from TC7652 low input currents, take care
assembling pr inted circuit boards. Clean boards with
alcohol or TCE and blow dry with compressed air. To
prevent contamination, coat boards with epoxy or sili­cone rubber.

Even if boards are cleaned and coated, leakage cur­rents may occur because input pins are next to pins at
supplypotentials.To reducethisleakage,use guarding
to lower the voltage difference between the inputs and
adjacent metal runs. The guard (a conductive ring sur­roundinginputs)isconnectedto a low i mpedance point
at about the same voltage as inputs. The guard
absorbs leakage currents from high voltage pins.

The 14-pin dual-in-line arrangement simplifies guard­ing. Like the LM108 pin configuration (but unlike the
101A and 741), pins next to inputs are not used.



2002 Microchip TechnologyInc. DS21464B-page 7

TC7652

4.6 Pin Compatibility

Where possible, the 8-pin device pinout conforms to
such industrystandardsastheLM101and LM741. Null
storing external capacitors connect to Pins 1 and 8,
whichareusuallyforoffsetnullor compensationcapac­itors. Output clamp (Pin 5) is similarly used. For OP05
and OP07 devices, replacement of the offset null
potentiometer (connected between Pins 1 and 8 and
V

by two capacitorsfrom those pins to VSS) provides

DD

compatibility. Replacing the compensation capacitor
between Pins 1 and 8 by two capacitors to V

SS

required. The same operation(with the removal of any
connection to Pin 5) works for LM101, µA748 and sim­ilar parts.

Because NC pins provide guarding between input and
otherpins,the 14-pin device pinout conforms closelyto
theLM108. Becausethisdevicedoesnotuseany extra
pins and does not provide offset nulling (but requires a
compensation capacitor), some layout changes are
necessary to convert to the TC7652.

4.7 Some Applications

Figures 4-2 and 4-3 show basic inverting and nonin­verting amplifier circuits using the output clamping cir­cuit to enhance overload recovery performance. The
only limitations on replacing other op amps with the
TC7652 are s upply voltage (±8Vmaximum)and output
drive capability (10kΩ load f or full swing). Overcome
these l imitations with a booster circuit (Figure 4-4) to
combine output capabilities of the LM741 (or other
standard device) with input capabilities of the TC7652.
These two form a composite device, therefore, when
adding the feedback network, t he monitor loop gains
stability.

FIGURE 4-2: NONINVERTING

AMPLIFIER W ITH
OPTIONAL CLAMP

Clamp

0.1µF

R

2

TC7652

Output

Input

0.1µF

+

–

FIGURE 4-3: INVERTING AMPLIFIER

WITH OPTIONAL CLAMP

R

2

Input

R

1

–

+

Clamp

TC7652

Output

is

0.1µF 0.1µF

FIGURE 4-4: USING 741 TO BOOST

OUTPUT DRIVE
CAPABILITY

TC7652

-7.5V

+

In

-7.5V

0.1
µF

–

0.1
µF

Figure4-5 shows the clamp circuit of a zero offsetcom­parator. Because the clamp circuit requires the invert­ing input to follow the input signal, problems with a
chopper stabilized op amp are avoided. The threshold
input must tolerate the output clamp current ≈V
without disrupting other parts of the system.

Figure 4-6 shows h ow the TC7652 can offset null high
slew rate and wideband amplifiers.

Mixing the TC7652 with circuits operating at ±15V
requiresalowersupplyvoltage divider withtheTC7660
voltage converter circuit operated "backwards." Figure
4-7 shows an approximate connection.

+15V

+

–

-15V

10kΩ

741

Out

/R

IN

FIGURE 4-5: LOW OFFSET

COMPARATOR

DS21464B-page 8

R

3

R

1

0.1µF 0.1µF

V

IN

+

–

200kΩ to 2mΩ

TC7652

V

OUT

Clamp

V

TH



2002 Microchip TechnologyInc.

FIGURE 4-6: 1437 OFFSET NULLED BY

t

TC7652

TC7652

22kΩ

TC7652

+

–

Fast

22kΩ

Ou

+

–

In

Amplifier

FIGURE 4-7: SPLITTING +15V WITH

THE 7660 AT >95%
EFFICIENCY

2

TC7660

10µF

45

6

8

3

1MW

+15V

+7.5V

10µF

0V



2002 Microchip TechnologyInc. DS21464B-page 9

TC7652

(

g)

5.0 TYPICAL CHARACTERISTICS

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. I n some graphs or tables, the data presented may be outside the specified
operating range ( e.g., outside specified power supply range) and therefore outside the warranted range.

Supply Current

1400

1200

1000

SUPPLY CURRENT (µA)

1mA

0.1mA

0.01mA

1µA

0.1µA

0.01µA

1nA

CLAMP CURRENT

0.1nA

0.01nA

1pA

vs ± Supply Voltage

800

600

400

200

0

2345678

± SUPPLY VOLTAGE (V)

Negative Clamp Current

4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0
OUTPUT VOLTAGE (V)

Output Resistance

vs Output Voltage

-5.0

SINK

-4.0

SOURCE

OUTPUT VOLTAGE (V)

-3.0

100

1k 10k 100k 1M

OUTPUT RESISTANCE (W)

Noise at 0.1Hz to 100Hz

1 µV/DIV

1 sec/DIV

Positive Clamp Current

1 mA

0.1mA

0.01mA

1µA

0.1µA

0.01µA

1nA

CLAMP CURRENT

0.1nA

0.01nA

1pA

4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0
OUTPUT VOLTAGE (V)

Noise at 0.1Hz to 10Hz

2 µV/DIV

1 sec/DIV

Noise at 0.1Hz to 1Hz

1 µV/DIV

1 sec/DIV

DS21464B-page 10

0.5V/DIV

Slew Rate

5 µsec/DIV

Phase Gain (Bode Plot)*

GAIN

60

50

PHASE

40

30

20

GAIN (dB)

10

0

-10

-20
1 10 100 1k 10k 100k 1M

*NOTE:

FREQUENCY (Hz)

±5V, ±2.5V supplies; no load to 10k load.



2002 Microchip TechnologyInc.

+240

+180

+120

+60

0

-60

-120

-180

de

PHASE

Input Offset Voltage vs Common Mode Voltage

4.0

3.5

3.0

2.5

2.0

1.5

VOLTAGE (µV)

INPUT OFFSET

1.0

0.5

-6

-4

-2 0 2 4

COMMON MODE VOLTAGE (V)

TC7652



2002 Microchip TechnologyInc. DS21464B-page 11

TC7652

)

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

Package marking information not available at this time.

6.2 Package Dimensions

8-Pin Plastic DIP

PIN 1

.260 (6.60)
.240 (6.10)

.045 (1.14)
.030 (0.76)

.400 (10.16)

.348 (8.84)

.200 (5.08)
.140 (3.56)

.150 (3.81)
.115 (2.92)

.110 (2.79)
.090 (2.29)

.022 (0.56)
.015 (0.38)

14-Pin PDIP (Narrow)

.070 (1.78)
.040 (1.02)

.040 (1.02)
.020 (0.51)

.015 (0.38)
.008 (0.20)

.260 (6.60)
.240 (6.10)

.310 (7.87)
.290 (7.37)

3˚MIN.

.400 (10.16)

.310 (7.87)

Dimensions: inches (mm

PIN 1

.200 (5.08)
.140 (3.56)

.150 (3.81)
.115 (2.92)

DS21464B-page 12

.110 (2.79)
.090 (2.29)

.770 (19.56)
.745 (18.92)

.070 (1.78)
.045 (1.14)

.022 (0.56)
.015 (0.38)

.040 (1.02)
.020 (0.51)

.310 (7.87)
.290 (7.37)

.015 (0.38)
.008 (0.20)

.400 (10.16)

.310 (7.87)

Dimensions: inches (mm)



2002 Microchip TechnologyInc.

3

˚MIN.

TC7652

SALES AND SUPPORT

Data Sheets

Products supportedby a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom­mendedworkarounds.To determine if an erratasheet exists for a particulardevice, please contactoneof the following:

1. Your local Microchip sales office

2. The MicrochipCorporate Literature Center U.S. FAX:[phone]

3. The Microchip Worldwide Site (www.microchip.com)
Pleasespecify which device, revision of silicon and Data Sheet (includeLiterature #) you are using.

New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

 2002 Microchip Technology Inc. DS21464B-page13

TC7652

NOTES:

DS21464B-page 14  2002 Microchip Technology Inc.

Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com­ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con­veyed, implicitly or otherwise, under any intellectual property
rights.

Trademarks

TheMicrochipnameandlogo,theMicrochiplogo,FilterLab,
K

EELOQ,microID,MPLAB,PIC,PICmicro,PICMASTER,

PICSTART, PRO MATE, SEEVAL and The Embedded Control
SolutionsCompany areregiste red trademarksof MicrochipTech­nologyIncorp or ated in the U.S.A. and other countries .

dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPA SM, MPLIB, MPLINK, MPSIM,
MXDEV, PICC, PICDEM, PICDE M.net, rfPIC, Select M ode
and Total EndurancearetrademarksofMicrochipTechnology
Incorporated in the U.S.A.

Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip TechnologyIncorporated in t he U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

Printed on recycled paper.

Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its

®

PICmicro
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.

8-bit MCUs, KEELOQ®code hopping

 2002 Microchip Technology Inc. DS21464B - page 15

WORLDWIDE SALES AND SERVICE

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: [phone] Fax: [phone]
Technical Support: 480-792-7627
Web Address: http://www.microchip.com

Rocky Mountain

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: [phone] Fax: [phone]

Atlanta

500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Tel: [phone] Fax: [phone]

Boston

2 Lan Drive, Suite 120
Westford, MA 01886
Tel: [phone] Fax: [phone]

Chicago

333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: [phone] Fax: [phone]

Dallas

4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: [phone] Fax: [phone]

Detroit

Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: [phone] Fax: [phone]

Kokomo

2767 S. Albright Road
Kokomo, Indiana 46902
Tel: [phone] Fax: [phone]

Los Angeles

18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: [phone] Fax: [phone]

New York

150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: [phone] Fax: [phone]

San Jose

Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: [phone] Fax: [phone]

Toronto

6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: [phone] Fax: [phone]

ASIA/PACIFIC

Australia

Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: [phone] Fax: [phone]

China - Beijing

Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: [phone] Fax: [phone]

China - Chengdu

Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: [phone] Fax: [phone]

China - Fuzhou

Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: [phone] Fax: [phone]

China - Shanghai

Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: [phone] Fax: [phone]

China - Shenzhen

Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F , Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: [phone] Fax: [phone]

Hong Kong

Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: [phone] Fax: [phone]

India

Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: [phone] Fax: [phone]

Japan

Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: [phone] Fax: [phone]

Korea

Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: [phone] Fax: [phone]

Singapore

Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: [phone] Fax: [phone]

Taiwan

Microchip Technology Taiwan
11F-3, No. 207
Tung HuaNorth Road
Taipei, 105, Taiwan
Tel: [phone] Fax: [phone]

EUROPE

Denmark

Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: [phone] Fax: [phone]

France

Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: [phone] Fax: [phone]

Germany

Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: [phone] Fax: [phone]

Italy

Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: [phone] Fax: [phone]

United Kingdom

Arizona Microchip Technology Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG415TU
Tel: [phone] Fax: [phone]

03/01/02

DS21464B-page 16



2002 Microchip Technology Inc.