YY = Year Sealed
WW = Week Sealed
L = Lot Number
= “Green” Packaging
YY WW
C1550
L L LL
Enhancement-Mode Dual MOSFET
TC1550
Features
500V breakdown voltage
►
Independent N- and P-channels
►
Electrically isolated N- and P-channels
►
Low input capacitance
►
Fast switching speeds
►
Free from secondary breakdowns
►
Low input and output leakage
►
General Description
The Supertex TC1550 consists of a high voltage N-channel and
P-channel MOSFET in an 8-Lead SOIC package. This is an
enhancement-mode (normally-off) transistor utilizing an advanced
vertical DMOS structure and Supertex’s well-proven silicon-gate
manufacturing process. This combination produces a device with
the power handling capabilities of bipolar transistors and with the
high input impedance and positive temperature coefficient inherent
in MOS devices. Characteristic of all MOS structures, this device
Applications
is free from thermal runaway and thermally induced secondary
breakdown.
High voltage pulsers
►
Amplifiers
►
Buffers
►
Piezoelectric transducer drivers
►
General purpose line drivers
►
Supertex’s vertical DMOS FETs are ideally suited to a wide range
of switching and amplifying applications where very low threshold
voltage, high breakdown voltage, high input impedance, low input
capacitance, and fast switching speeds are desired.
Ordering Information
R
DS(ON)
(Max)
Device
Package OptionBV
8-Lead SOIC
4.90x3.90mm body
1.75mm height (max)
1.27mm pitch
N-Channel
(V)
DSS
/BV
DGS
P-Channel
(V)
N-Channel
(Ω)
TC1550TC1550TG-G500-50060125
-G indicates package is RoHS compliant (‘Green’)
P-Channel
(Ω)
Absolute Maximum Ratings
ParameterValue
Drain-to-source voltageBV
Drain-to-gate voltageBV
Gate-to-source voltage±20V
Operating and storage temperature-55°C to + 150°C
Soldering temperature
Absolute Maximum Ratings are those values beyond which damage to the device
may occur. Functional operation under these conditions is not implied. Continuous
operation of the device at the absolute rating level may affect device reliability. All
voltages are referenced to device ground.
Supertex inc. does not recommend the use of its products in life support applications, and will not knowingly sell them for use in such applications unless it receives an
adequate “product liability indemnification insurance agreement.” Supertex inc. does not assume responsibility for use of devices described, and limits its liability to the
replacement of the devices determined defective due to workmanship. No responsibility is assumed for possible omissions and inaccuracies. Circuitry and specifications
are subject to change without notice. For the latest product specifications refer to the Supertex inc. website: http//www.supertex.com
This chamfer feature is optional. If it is not present, then a Pin 1 identifier must be located in the index area indicated. The Pin 1 Identifier can be:
1.
a molded mark/identifier; an embedded metal marker; or a printed indicator.
SymbolAA1A2bDEE1ehLL1L2θθ1
MIN1.35*0.101.250.314.80* 5.80* 3.80*
Dimension
(mm)
JEDEC Registration MS-012, Variation AA, Issue E, Sept. 2005.
* This dimension is not specified in the original JEDEC drawing. The value listed is for reference only.
Drawings are not to scale.
Supertex Doc. #: DSPD-8SOLGTG, Version G090808.
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline
NOM----4.906.003.90----
MAX1.750.251.65*0.515.00* 6.20* 4.00*0.501.278O15
information go to http://www.supertex.com/packaging.html.)
1.27
BSC
0.250.40
1.04
REF
0.25
BSC
Doc.# DSFP-TC1550
A091608
5
O
0
O
5
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