Datasheet TC1173-2.5VOA, TC1173-5.0VUA, TC1173-5.0VOA, TC1173-3.3VUA, TC1173-3.3VOA Datasheet (TelCom Semiconductor)
...
300mA CMOS LDO with Shutdown, ERROR Output and Bypass
TC1173
FEATURES
■ Extremely Low Supply Current for Longer Battery
Life!
■ Very Low Dropout Voltage
■ Guaranteed 300mA Output
■ Standard or Custom Output Voltages
■ ERROR Output Can be Used as a Low Battery
Detector or Processor Reset Generator
■ Power-Saving Shutdown Mode
■ Bypass Input for Ultra-Quiet Operation
■ Over-Current and Over-Temperature Protection
■ Space-Saving MSOP Package Option
APPLICATIONS
■ Battery-Operated Systems
■ Portable Computers
■ Medical Instruments
■ Instrumentation
■ Cellular / GSM / PHS Phones
■ Linear Post-Regulator for SMPS
■ Pagers
TYPICAL APPLICATION
8
V
IN
7
NC
6
SHDN
5
ERROR
Shutdown Control
(from Power Control Logic)
R3
1M
V
IN
ERROR
C1
1µF
1
V
OUT
2
GND
TC1173
3
NC
4
Bypass
C
BYPASS
470pF
(Optional)
GENERAL DESCRIPTION
The TC1173 is a precision output (typically ±0.5%)
CMOS low dropout regulator. Total supply current is typically 50µA at full load
regulators
!).
(20 to 60 times lower than in bipolar
TC1173 key features include ultra low noise operation
(plus optional Bypass input); very low dropout voltage
(typically 240mV at full load) and internal feed-forward
compensation for fast response to step changes in load. An
error output (ERROR) is asserted when the TC1173 is outof-regulation (due to a low input voltage or excessive output
current). ERROR can be set as a low battery warning or as
a processor RESET signal (with the addition of an external
RC network). Supply current is reduced to 0.05µA (typical)
and V
and ERROR fall to zero when the shutdown input
OUT
is low.
The TC1173 incorporates both over-temperature and
over-current protection. The TC1173 is stable with an output
capacitor of only 1µF and has a maximum output current of
300mA.
ORDERING INFORMATION
Part Junction
Number Package Temp. Range
TC1173-xxVOA 8-Pin SOIC – 40°C to +125°C
TC1173-xxVUA 8-Pin MSOP – 40°C to +125°C
Available Output Voltages:
2.5, 2.8, 3.0, 3.3, 5.0
xx indicates output voltages
Other output voltages are available. Please contact TelCom
Semiconductor for details.
PIN CONFIGURATION
MSOP
V
OUT
GND
NC
Bypass
1
2
3
TC1173VUA
4
8
V
7
NC
6
SHDN
5
ERROR
IN
SOIC
TC1173-2 2/2/00 TelCom Semiconductor reserves the right to make changes in the circuitry and specifications of its devices.
V
OUT
GND
NC
Bypass
1
2
3
TC1173VOA
4
8
7
6
5
V
IN
NC
SHDN
ERROR
TC1173
300mA CMOS LDO With Shutdown,
ERROR Output, And Bypass
ABSOLUTE MAXIMUM RATINGS*
Storage Temperature ............................– 65°C to +150°C
Maximum Voltage on Any Pin ............ VIN +0.3V to – 0.3V
Input Voltage ..............................................................6.5V
Output Voltage ........................... (V
– 0.3) to (VIN + 0.3)
SS
Power Dissipation ....................Internally Limited (Note 7)
Operating Temperature.................... – 40°C < TJ < 125°C
ELECTRICAL CHARACTERISTICS:
V
= V
IN
+ 1V, IL = 0.1µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted.
OUT
BOLDFACE type specifications apply for junction temperatures of – 40°C to +125°C
Lead Temperature (Soldering, 10 Sec.)................ +300°C
*Absolute Maximum Ratings indicate device operation limits beyond damage may occur. Device operation beyond the limits listed in
Characteristics
is not recommended.
Electrical
Symbol Parameter Test Conditions Min Typ Max Units
V
IN
IOUT
MAX
V
OUT
∆V
/∆TV
OUT
∆V
/∆V
OUT
∆V
OUT/VOUT
V
– V
IN
OUT
I
SS1
I
SS2
PSRR Power Supply Rejection Ratio FRE ≤ 1kHz — 60 — dB
IOUT
SC
∆V
OUT∆PD
eN Output Noise F = 1kHz, C
Input Operating Voltage — — 6.0 V
Maximum Output Current 300 ——mA
Output Voltage Note 1 — VR ± 0.5% — V
VR - 2.5% VR + 2.5%
Temperature Coefficient Note 2 — — — ppm/°C
OUT
40
Line Regulation (VR + 1V) < VIN < 6V — 0.05 0.35 %
IN
Load Regulation IL = 0.1mA to I
OUT
(Note 3) — 0.5 2.0 %
MAX
Dropout Voltage (Note 4) IL = 0.1mA — 20 30 mV
I
= 100mA 80 160
L
IL = 300mA 240 480
Supply Current SHDN = V
IH
—5090 µA
Shutdown Supply Current SHDN = 0V — 0.05 0.5 µA
Output Short Circuit Current V
= 0V — 550 650 mA
OUT
Thermal Regulation Note 5 — 0.04 — V/W
= 1µF, — 260 — nV/√Hz
R
LOAD
OUT
= 50Ω
SHDN Input
V
IH
V
IL
SHDN Input High Threshold 45 ——%V
SHDN Input Low Threshold — — 15 %V
IN
IN
ERROR Output
V
MIN
V
OL
V
TH
V
OL
NOTES: 1. VR is the user-programmed regulator output voltage setting.
Minimum Operating Voltage 1.0 — — V
Output Logic Low Voltage 1mA Flows to ERROR — — 400 mV
ERROR Threshold Voltage — 0.95 x V
R
—V
ERROR Positive Hysteresis Note 7 — 50 — mV
2. TC V
3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA
to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification.
4.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential.
5. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load
or line regulation effects. Specifications are for a current pulse equal to I
6. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the
thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see
7. Hysteresis voltage is referenced to VR.
= (V
OUT
OUT
V
MAX –
V
OUT
OUT
x
MIN)
∆T
6
x 10
Thermal Considerations
at VIN = 6V for T = 10msec.
LMAX
section of this data sheet for more details.
TC1173-2 2/2/00
2
300mA CMOS LDO With Shutdown,
ERROR Output, And Bypass
DETAILED DESCRIPTION
The TC1173 is a fixed output, low drop-out regulator.
Unlike bipolar regulators, the TC1173 supply current does not
increase with load current. In addition, V
within regulation at very low load currents (an important consideration in RTC and CMOS RAM battery back-up applications).
TC1173 pin functions are detailed below:
PIN DESCRIPTIONS
Pin
No. Symbol Description
1V
OUT
2 GND Ground terminal
3 NC No connect
4 Bypass Reference bypass input. Connecting a 470pF
5 ERROR Out-of-Regulation Flag (Open Drain Out-
6 SHDN Shutdown control input. The regulator is fully
7 NC No connect
8VINUnregulated supply input
Regulated voltage output
to this input further reduces output noise.
put). This output goes low when V
of-tolerance by approximately -5%.
enabled when a logic high is applied to this
input. The regulator enters shutdown when a
logic low is applied to this input. During
shutdown, output voltage falls to zero and
supply current is reduced to 0.05µA (typical).
remains stable and
OUT
OUT
is out-
TC1173
SHDN may be controlled by a CMOS logic gate, or I/O port
of a microcontroller. If the SHDN input is not required, it
should be connected directly to the input supply. While in
shutdown, supply current decreases to 0.05µA (typical),
V
falls to zero and ERROR is disabled.
OUT
ERROR Output
ERROR is driven low whenever V
lation by more than – 5% (typical). This condition may be
caused by low input voltage, output current limiting, or
thermal limiting.
The ERROR threshold is 5% below rated V
less of the programmed output voltage value (e.g., ERROR
= VOL at 4.75V (typ) for a 5.0V regulator and 2.85V (typ) for
a 3.0V regulator). ERROR output operation is shown in
Figure 2. Note that ERROR is active when V
below VTH, and inactive when V
OUT
As shown in Figure 1, ERROR can be used as a battery
low flag, or as a processor RESET signal (with the addition
of timing capacitor C2). R1 x C3 should be chosen to
maintain ERROR below VIH of the processor RESET input
for at least 200msec to allow time for the system to stabilize.
Pull-up resistor R1 can be tied to V
voltage less than (VIN + 0.3V.)
V
OUT
V
TH
falls out of regu-
OUT
regard-
OUT
is at or
OUT
is above VTH + VH.
, VIN or any other
OUT
Hysteresis (VH)
Figure 1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is above
VIH, and shutdown (disabled) when SHDN is at or below VIL.
V
OUT
TC1173-2 2/2/00
1
V
C1
1µF
Figure 1: Typical Application Circuit
OUT
2
GND
TC1173
3
NC
4
Bypass
C
BYPASS
470pF
(Optional)
8
V
IN
7
NC
6
SHDN
5
ERROR
Shutdown Control
(from Power Control Logic)
R3
1M
V
IN
ERROR
ERROR
V
IH
V
OL
Figure 2: ERROR Output Operation
Output Capacitor
A 1µF (min) capacitor from V
to ground is recom-
OUT
mended. The output capacitor should have an effective
series resistance of 5Ω or less. A 1µF capacitor should be
connected from VIN to GND if there is more than 10 inches
of wire between the regulator and the AC filter capacitor, or
if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many
aluminum electrolytic capacitors freeze at approximately –
30°C, solid tantalums are recommended for applications
operating below – 25°C.) When operating from sources
other than batteries, supply-noise rejection and transient
response can be improved by increasing the value of the
input and output capacitors and employing passive filtering
techniques.
3
TC1173
300mA CMOS LDO With Shutdown,
ERROR Output, And Bypass
Bypass Input
A 470pF capacitor connected from the Bypass input to
ground reduces noise present on the internal reference,
which in turn significantly reduces output noise. If output
noise is not a concern, this input may be left unconnected.
Larger capacitor values may be used, but results in a longer
time period to rated output voltage when power is initially
applied.
Thermal Considerations
Thermal Shutdown
Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 150°C. The regulator
remains off until the die temperature drops to approximately
140°C.
Power Dissipation
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current.
The following equation is used to calculate worst case
power dissipation:
PD ≈ (VIN
Where: PD= worst case actual power dissipation
VIN
MAX
VOUT
MIN
ILOAD
MAX
The maximum
– VOUT
MAX
= maximum voltage on V
MIN
)ILOAD
MAX
IN
= minimum regulator output voltage
= maximum output (load) current
Equation 1.
allowable
power dissipation (Equation 2)
is a function of the maximum ambient temperature (TA
the maximum allowable die temperature (125°C), and the
thermal resistance from junction-to-air (JA). The 8-Pin
SOIC package has a JA of approximately
while the 8-Pin MSOP package has a JA of approximately
200°C/Watt
; both when mounted on a single layer FR4
dielectric copper clad PC board.
P
= (T
D
MAX
J
MAX
– T
JA
A
MAX
)
Where all terms are previously defined.
actual
MAX
160°C/Watt,
Equation 1 can be used in conjunction with Equation 2
to ensure regulator thermal operation is within limits. For
example:
GIVEN: VIN
VOUT
I
LOADMAX
TJ
TA
= 3.0V ± 10%
MAX
= 2.7V ± 0.5%
MIN
= 250mA
= 125°C
MAX
= 55°C
MAX
= 200°C/W
JA
8-Pin MSOP Package
FIND: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD≈ (VIN
= [(3.0 x 1.1) - (2.7 x .995)]250 x 10
MAX
- VOUT
MIN
)ILOAD
MAX
-3
= 155mW
Maximum allowable power dissipation:
PD ≈ (T
J
MAX
– T
JA
A
MAX
)
= (125 – 55)
200
= 350mW
In this example, the TC1173 dissipates a maximum of
only 155mW; far below the allowable limit of 350mW. In a
similar manner, Equation 1 and Equation 2 can be used to
calculate maximum current and/or input voltage limits. For
),
example, the maximum allowable VIN is found by substituting the maximum allowable power dissipation of 350mW
into Equation 1, from which VIN
MAX
= 4.1V.
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a ground
plane, wide traces at the pads, and wide power supply bus
lines combine to lower JA and, therefore, increase the
maximum allowable power dissipation limit.
TC1173-2 2/2/00
Equation 2.
4
300mA CMOS LDO With Shutdown,
ERROR Output, And Bypass
TYPICAL CHARACTERISTICS
Line Regulation
0.012
0.010
0.008
0.006
0.004
0.002
0.000
LINE REGULATION (%)
–0.002
–0.004
–40 –20
0 20 40 60 80 100 120
TEMPERATURE (°C)
10.0
Noise (µV/√/ HZ)
1.0
0.1
0.0
0.01
Output Noise
0.01 1
FREQUENCY (KHz)
10
R
C
LOAD
OUT
= 50Ω
= 1µF
100 1000
TC1173
Load Regulation
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
LOAD REGULATION (%)
0.40
0.20
0.00
–40 –20 0 20 40 60 80 100 120
1 to 300mA
1 to 100mA
TEMPERATURE (°C)
1 to 50mA
100.0
90.0
80.0
70.0
60.0
SUPPLY CURRENT (µA)
50.0
40.0
–40 –20
–30dB
–35dB
–40dB
–45dB
–50dB
–55dB
PSRR (dB)
–60dB
–65dB
–70dB
–75dB
–80dB
Supply Current
0 20 40 60 80 100 120
TEMPERATURE (°C)
Power Supply Rejection Ratio
V
= 5V
OUT
R
= 50Ω
LOAD
V
= 50mV p-p
INAC
C
= 1µF
OUT
1K
100
FREQUENCY (KHz)
10K10
100K
1M
Dropout Voltage vs. Load Current
0.40
0.35
0.30
0.25
0.20
0.15
0.10
DROPOUT VOLTAGE (V)
0.05
0.00
0
25°C
0°C
50
100
LOAD CURRENT (mA)
125°C
85°C
70°C
150
–40°C
200 250 300
3.075
3.025
(V)
OUT
V
2.975
2.925
VIN = 4V
I
LOAD
C
–40 –20
V
vs. Temperature
OUT
= 100µA
= 3.3µF
LOAD
0 20 40 60 80 100 120
TEMPERATURE (°C)
TC1173-2 2/2/00
5
TC1173
TAPE AND REEL DIAGRAMS
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
300mA CMOS LDO With Shutdown,
ERROR Output, And Bypass
PIN 1
User Direction of Feed
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin SOIC (N) 12 mm 8 mm 2500 13 in
Reverse Reel Component Orientation
for RT Suffix Device
User Direction of Feed
PIN 1
P
Component Taping Orientation for 8-Pin MSOP Devices
W
PIN 1
TC1173-2 2/2/00
User Direction of Feed
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin MSOP 12 mm 8 mm 2500 13 in
6
Reverse Reel Component Orientation
for RT Suffix Device
User Direction of Feed
PIN 1
P
W
300mA CMOS LDO With Shutdown,
ERROR Output, And Bypass
PACKAGE DIMENSIONS
8-Pin SOIC (Narrow)
PIN 1
TC1173
.050 (1.27) TYP.
.197 (5.00)
.189 (4.80)
.020 (0.51)
.013 (0.33)
.157 (3.99)
.150 (3.81)
.010 (0.25)
.004 (0.10)
.122 (3.10)
.114 (2.90)
.069 (1.75)
.053 (1.35)
PIN 1
.244 (6.20)
.228 (5.79)
.197 (5.00)
.189 (4.80)
8° MAX.
.050 (1.27)
.016 (0.40)
8-Pin MSOP
.010 (0.25)
.007 (0.18)
Sales Offices
TelCom Semiconductor, Inc.
1300 Terra Bella Avenue
P.O. Box 7267
Mountain View, CA 94039-7267
TEL: 650-968-9241
FAX: 650-967-1590
E-Mail: liter@telcom-semi.com
TC1173-2 2/2/00
.026 (0.65) TYP.
.122 (3.10)
.114 (2.90)
.016 (0.40)
.010 (0.25)
.006 (0.15)
.002 (0.05)
.043 (1.10)
MAX.
6° MAX.
.028 (0.70)
.016 (0.40)
TelCom Semiconductor, GmbH
Lochhamer Strasse 13
D-82152 Martinsried
Germany
TEL: (011) 49 89 895 6500
FAX: (011) 49 89 895 6502 2
7
.008 (0.20)
.005 (0.13)
Dimensions: inches (mm)
TelCom Semiconductor H.K. Ltd.
10 Sam Chuk Street, Ground Floor
San Po Kong, Kowloon
Hong Kong
TEL: (011) 852-2350-7380
FAX: (011) 852-2354-9957
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