Datasheet TC1040CEUA Datasheet (SGS-THOMSON Microelectronics)

Page 1
UA
SOP
TC1040
Linear Building Block – Dual Low Power Comparator and
Voltage Reference with Shutdown
Features
• Combines Two Comparators and a Voltage Reference in a Single Package
• Optimized for SingleSupply Operation
• Small Package: 8-Pin MSOP
• Ultra Low Input Bias Current: Less than100pA
• Rail-to-Rail Inputs and Outputs
•OperatesDowntoV
DD
=1.8V
• Referenceand One Comparator Remain Active in Shutdown to Provide Supervisory Functions
Applications
• Power Supply Circuits
• Battery Operated Equipment
• Consumer Products
• Replacements for Discrete Components
Device Selection Table
Part Number Package
TC1040CEUA 8-Pin MSOP -40°C to +85°C
Temperature
Range
Package Type
General Description
The TC1040 is a mixed-function device combining two comparators and a voltage reference in a single 8-pin package. The inverting input of Comparator A and the non-inverting input of Comparator B are internally connected to thereference.
This increased integration allows the user to replace two packages, which saves space, lowers supply current and increases system performance. The TC1040 operates from two 1.5V alkaline cells down to V
= 1.8V. It requires only 10µA typical of supply
DD
current, which significantly extends battery life. A low power shutdown input (SHDN
) disables one of the comparators, placing its outputs in a high-impedance state. This mode saves battery power and allows comparator outputs to share common analog lines (multiplexing). Shutdown current is 6µA(typical).
Rail-to-rail inputs and outputs allow operation from low supply voltages with large input and output signal swings.
Packaged in an 8-Pin MSOP, the TC1040 is ideal for applicationsrequiring low power leveldetection.
Functional Block Diagram
OUTA
1
TC1040
8
OUTB
-Pin M
OUTB
OUTA
V
SS
INA+
INB-
2002 Microchip TechnologyInc. DS21345B-page 1
TC1040CE
8
7
6
5
V
DD
REF
SHDN
V
INA+
INB-
2
SS
3
4
A
+
Voltage
Reference
B
V
SS
7
V
DD
+
6
REF
5
SHDN
Page 2
TC1040
1.0 ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of t he device at these or any other conditions above those indicated in the
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage......................................................6.0V
Voltage on Any Pin..........(V
– 0.3V) to (VDD+0.3V)
SS
operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affectdevice reliability.
Junction Temperature.......................................+150°C
Operating Temperature Range.............-40°C to +85°C
StorageTemperature Range..............-55°C to +150°C
TC1040 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Typical values apply at 25°C and VDD= 3.0V. Minimum and maximum values apply for TA= -40° to
+85°C and V
Symbol Parameter Min Typ Max Units Test Conditions
V
DD
I
Q
I
SHDN
Shutdown Input
V
IH
V
IL
I
SI
Comparators
(SD) Output Resistance in Shutdown 20 M SHDN =VSS,COMPBonly
R
OUT
(SD) Output Capacitance in Sh utdown 5 pF SHDN =VSS,COMPBonly
C
OUT
T
SEL
T
DESEL
V
IR
V
OS
I
B
V
OH
V
OL
PSRR Power Supply Rejection Ratio 60 dB TA=25°C
I
SRC
I
SINK
t
PD1
t
PD2
Voltage Reference
V
REF
I
REF(SOURCE)
I
REF(SINK)
C
L(REF)
E
VREF
e
VREF
= 1.8V to 5.5V,unless otherwise specified.
DD
Supply Voltage 1.8 5.5 V SupplyCurrent Operating 10 15 µA All outputs unloaded, SHDN =V Supply Current, Shutdown 0.05 0.1 µA SHDN =V
InputHighThreshold 80% V Input Low Threshold 20% V
——V
DD
DD
V
SS
Shutdown Input Current ±100 nA
Select Time (For Valid Output) 20 µsec (SHDN =VIHto V
R
=10kto V
L
Deselect Time 500 nsec (SHDN =VILto V
R
=10kto V
L
)
OUT
COMPB only
SS,
)
OUT
COMPB only
SS,
Input Voltage Range VSS–0.2 VDD+0.2 V Input Offset Voltage -5
-5
—+5+5mV VDD=3V,TA=25°C
T
=-40°Cto85°C
A
Input Bias Current ±100 pA TA= 25°C, INA+, INB-= VDDto V OutputHighVoltage VDD–0.3 V RL=10kΩ to V OutputLow Voltage 0.3 V RL=10kΩ to V
V
=1.8Vto5V
DD
OutputSource Current 1 mA INA+= VDD,INB-=V
OutputShorted to V
SS DD
SS
SS
VDD=1.8V
OutputSinkCurrent 2 mA INA+= VSS,INB-=V
OutputShorted to V VDD=1.8V
DD,
DD
Response Time 4 µsec 100mV Overdrive, CL= 100pF Response Time 6 µsec 10mV Overdrive,CL= 100pF
Reference Voltage 1.176 1.200 1.224 V Source Current 50 µA Sink Current 50 µA Load Capacitance 100 pF Voltage Noise 20 µV
100Hz to 100kHz
RMS
Noise Density 1.0 µV/Hz 1kHz
DD
SS
DS21345B-page 2
2002 Microchip TechnologyInc.
Page 3
2.0 PIN DESCRIPTION
The description of the pins are listed i n Table 2-1.
TABLE 2-1: P IN FUNCTION TABLE
TC1040
Pin No.
(8-Pin MSOP)
1 OUTA Comparator output. 2V 3 INA+ Non-inverting input to Comparator A. 4 INB- InvertinginputtoComparator B. 5 SHDN 6 REF Voltage reference output. 7V 8 OUTB Comparator output.
Symbol Description
SS
DD
Negative power supply.
Shutdown input.
Positive power supply.
2002 Microchip TechnologyInc. DS21345B-page 3
Page 4
TC1040
3.0 DETAILED DESCRIPTION
The TC1040 i s oneof a series of v ery lowpower, linear building block products targeted at low voltage, single supply applications. The TC1040 minimum operating voltage is 1.8V and typical supply current is only 10µA (fully enabled). It combines two comparators and a voltage reference in a single package. A shutdown mode is incorporated for easy adaptation to system power management schemes. During shutdown, one comparatoris disabled (i.e., powered down with output at a high impedance).The“stillawake”comparatorand voltage reference can be used as a wake-up timer, power supply monitor, LDO controller or other continuous duty circuit function.
3.1 Comparators
The TC1040 contains t wo comparators. The compara­tor’s inputrange extends beyond both supply voltages by 200mV and the outputs will swing to within several millivolts of thesupplies,depending on theload current being driven. The inverting input of Comparator A and the non-inverting input of Comparator B are internally connected to the output of the voltage reference.
The comparators exhibit a propagation delay and supply current which are largely independent of supply voltage. The low input bias current and offset voltage make them suitable f or high impedance precision applications.
Comparator B is disabled during shutdown and has a high impedance output. Comparator COMPA remains active.
3.2 Voltage Reference
A 2.0 percent tolerance, internally biased, 1.20V bandgap voltage reference is included in the TC1040. It has a push-pull output capable of sourcing and sinking 50µA. The voltage reference remains fully enabled during shutdown.
4.0 TYPICAL APPLICATIONS
The TC1040 lends itself to a wide variety of applications,particularlyin battery powered systems. It typically finds application in power management, processor supervisory and interface circuitry.
4.1 Wake-Up Timer
Many microcontrollers havea l ow-power “sleep” mode thatsignificantly reduces their supply current. Typically, the microcontrolleris placedin thismode via a software instruction, and returns to a fully-enabled state upon reception of an external signal (“wake-up”). Thewake­up signal isusually supplied by a hardware timer. Most system applicationsdemandthatthis timer have along duration (typically seconds or minutes), and consume as l ittle supply current aspossible.
The circuit shown in Figure 4-1 is a wake-up timer made from Comparator A. (Comparator A is used because the wake-up timer must operate when SHDN is active.) Capacitor C1 charges through R1 until a voltage equal to V “wake-up” is driven active. Upon wake-up, the microcontroller resets the timer by forcing a logic low on a dedicated,opendrainI/Oportpin. Thisdischarges C1 through R4 (the value of R4 is chosen to limit maximum current sunk by the I/O port pin). With a 3V supply, the circuit as shown consumes typically 8µA and f urnishes a nominal timer duration of25 seconds.
FIGURE 4-1: WAKE-UP TIMER
R1 5M
C
1
10µF
is reached, at which point the
R
Microcontroller
I/O*
Wake-Up
1/2
R4
V
DD
V
DD
COMPA
+
3.3 Shutdown Input
SHDN at VILdisablesonecomparator.TheSHDN input cannot be allowed to float; whennotused, connect it to V
. The disabled comparator’s output is in a high
DD
impedance state when shutdown is active. The disabledcomparator’s inputsandoutputscan bedriven from rail-to-rail by an external voltage when the TC1040 is inshutdown.No latchup wi ll occurwhen the device is driven to its enabled state when SHDN to V
.
IH
DS21345B-page 4
is set
*Open Drain Port Pin
V
R
TC1040
2002 Microchip TechnologyInc.
Page 5
TC1040
4.2 Precision Battery Monitor
Figure 4-2 is a precision battery low/battery dead monitoring circuit. Typically, the battery low output warns the user that a battery dead condition i s imminent. Battery dead typically initiates a forced shutdown to prevent operation at low internal supply voltages(whichcan cause unstable system operation).
The circuit in Figure 4-2 uses a single TC1040, one­half of a TC1029, and only six external r esistors. COMPA and COMPB provide precision voltage detection using V R4 set the detection threshold for BATT LOW
as a reference. Resistors R2 and
R
, while Resistors R1 and R7 set the detection threshold for BATT FAIL. The component values shown assert BATT LOW
at 2.2V (typical) and BATT FAIL at 2.0 (typical). Total current consumed by this circuit is typically 22µA at 3V. Resistors R5 and R6 provide hysteresis for comparators COMPA and COMPB, respectively.
4.3 External Hysteresis (Comparator)
Hysteresis can be set externally with two resistors using positive f eedback techniques (see Figure4-3). The design procedure for setting external comparator hysteresis is as follows:
1. Choose the feedback resistor R
input bias current of the comparator is at most 100pA, the current through R 100nA (i.e., 1000 times the input bias current) and retain excellent accuracy. The current through R R
where VRis a stable reference voltage.
C
at the comparator’s trip point is VR/
C
2. Determinethehysteresisvoltage(V
the upper andlower thresholds.
.Sincethe
C
canbesetto
C
)between
HY
3. Calculate R
as follows:
A
EQUATION 4-1:
V
HY

=
-----------
C

V
DD
SRC
RAR
4. Choose the rising threshold voltage for V (V
).
THR
5. Calculate R
as follows:
B
EQUATION 4-2:
R
-----------------------------------------------------------=
B
---------------------
VRRA×
6. Verify the threshold voltages with these formulas:
V
rising:
SRC
V
THR
1
1
1
-------
-------
R
R
A
C
EQUATION 4-3:
V
V
SRC
THR
falling:
VR()RA()
 
------­R
1
A
1

-------
++=

R
B
1

-------

R
C
EQUATION 4-4:
RAVDD×

V
THFVTHR
--------- ------------- ---
=

R
C
2002 Microchip TechnologyInc. DS21345B-page 5
Page 6
TC1040
FIGURE 4-2: PRECISION BATTERY MONITOR
3V
Alkaline
+
TC1034
TC1040
V
+
AMP1
DD
To System DC/DC
Converter
R2, 330k, 1%
R1, 270k, 1%
V
R
R4, 470k, 1%
R5, 7.5M
V
DD
+
COMPA
V
DD
COMPB
+
R6, 7.5M
R3, 470k, 1%
BATTLOW
BATTFAIL
FIGURE 4-3: COMPARATOR
EXTERNAL HYSTERESIS CONFIGURATION
R
C
V
SRC
TC1040
R
A
R
B
V
DD
+
COMPA
1/2
V
R
V
OUT
DS21345B-page 6
2002 Microchip TechnologyInc.
Page 7
TC1040
5.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this noteare astatistical summary based ona limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range ( e.g., outside specified power supplyrange) and therefore outside the warranted range.
Comparator Propagation Delay
vs. Supply Voltage
7
= 25
T
°C
A
= 100pF
C
L
sec)
µ
6
Overdrive = 10mV
5
4
3.5
4 4.5 5 5.5
3
DELAY TO RISING EDGE (
2
1.5
2
Overdrive = 50mV
2.5 3
SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V)
Comparator Propagation Delay
vs. Temperature
7
Overdrive = 100mV
sec)
µ
6
V
DD
V
5
4
DELAY TO FALLING EDGE (
3
-40°C85°C25°C TEMPERATURE (°C)
DD
V
DD
V
DD
= 5V
= 4V
= 3V
= 2V
Comparator Propagation Delay
vs. Supply Voltage
7
= 25
T
°C
A
= 100pF
C
L
sec)
µ
6
Overdrive = 10mV
5
4
Overdrive = 50mV
3
DELAY TO FALLING EDGE (
2
1.5
2
Overdrive = 100mV
2.5 3
3.5
4 4.5 5 5.5
Comparator Output Swing vs. Output Source Current
2.5
= 25
°C
T
A
2.0
(V)
OUT
- V
DD
V
1.5
1.0
.5
V
= 1.8V
DD
0
0
12345 6
I
(mA)
SOURCE
V
V
DD
DD
= 3V
= 5.5V
Comparator Propagation Delay
vs. Temperature
7
Overdrive = 100mV
sec)
µ
6
5
4
DELAY TO RISING EDGE (
3
-40°C85°C25°C TEMPERATURE (°C)
V
DD
V
DD
V
DD
V
DD
Comparator Output Swing
vs. Output Sink Current
2.5
= 25
T
°C
A
2.0
(V)
1.5
SS
- V
1.0
OUT
V
.5
0
012 345
V
I
SINK
DD
= 1.8V
V
DD
(mA)
V
DD
= 5.5V
= 5V
= 4V
= 2V
= 3V
= 3V
6
Comparator Output Short-Circuit
Current vs. Supply Voltage
60
50
40
30
20
10
Sourcing
0
OUTPUT SHORT-CIRCUIT CURRENT (mA)
0
2002 Microchip TechnologyInc. DS21345B-page 7
T
Sinking
12345 6
SUPPLY VOLTAGE (V)
= 85°C
A
TA = -40°C
TA = 25°C
= -40
A
T
= 85°C
T
A
T
A
C
°
= 25°C
1.240
1.220
1.200
1.180
1.160
REFERENCE VOLTAGE (V)
1.140
Reference Voltage vs.
Load Current
V
V
= 1.8V
DD
V
= 1.8V
DD
0
24
LOAD CURRENT (mA)
DD
= 3V
V
DD
Sinking
Sourcing
V
DD
V
= 3V
DD
6
8
= 5.5V
= 5.5V
4
3
2
1
0
10
0
SUPPLY AND REFERENCE VOLTAGES (V)
Line Transient
Response of V
V
DD
V
REF
100 200
TIME (µsec)
REF
300
400
Page 8
TC1040
T
25
5.0 TYPICAL CHARACTERISTICS (CONTINUED)
Reference Voltage
vs. Supply Voltage
1.25
1.20
1.15
1.10
REFERENCE VOLTAGE (V)
1.05 1
23
SUPPLY VOLTAGE (V)
Supply Current vs. Supply Voltage
12
11
A)
µ
(
10
9
8
SUPPLY CURRENT
7
4
5
6
0123456
SUPPLY VOLTAGE (V)
= 85°C
A
TA = -40°C
=
DS21345B-page 8
2002 Microchip TechnologyInc.
Page 9
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Package marking data not available at this time.
6.2 Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
PIN 1
TC1040
User Direction of Feed
W
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin MSOP 12 mm 8 mm 2500 13 in
6.3 Package Dimensions
8-Pin MSOP
.026 (0.65) TYP.
.122 (3.10) .114 (2.90)
P
Standard Reel Component Orientation for TR Suffix Device
PIN 1
.122 (3.10) .114 (2.90)
.197 (5.00) .189 (4.80)
.043 (1.10)
MAX.
.016 (0.40) .010 (0.25)
2002 Microchip TechnologyInc. DS21345B-page 9
.006 (0.15) .002 (0.05)
6° MAX.
.028 (0.70) .016 (0.40)
Dimensions: inches (mm)
.008 (0.20) .005 (0.13)
Page 10
TC1040
NOTES:
DS21345B-page 10
2002 Microchip TechnologyInc.
Page 11
TC1040
Sales and Support
Data Sheets
Products supportedby a preliminary DataSheetmayhave an erratasheetdescribing minor operational differences and recom­mendedworkarounds.To determine if an errata sheetexists for a particulardevice, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip CorporateLiterature Center U.S. FAX: (480)792-7277
3. The Microchip Worldwide Site (www .microchip.com) Pleasespecify which device, revision of silicon and Data Sheet (includeLiterature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn)to receivethe most currentinformation on our products.
2002 Microchip Technology Inc. DS21345B-page11
Page 12
TC1040
NOTES:
DS21345B-page12 2002 Microchip Technology Inc.
Page 13
TC1040
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. Itis your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use ofsuch information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical com­ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con­veyed, implicitly orotherwise, under any intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, F ilterLab, K
EELOQ,microID,MPLAB,PIC,PICmicro,PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedde d Control SolutionsCompany areregiste red trademarksof MicrochipTech­nologyIncorp or ated in the U.S.A. and other countries .
dsPIC, ECONOMONITOR, FanSense, Fle xRO M , fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and TotalEndurancearetrademarksofMicrochipTechnology Incorporated in theU.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark of Microchip TechnologyIncorporated in t he U.S.A.
All other trademarks mentioned herein are property of their respective companies.
© 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona inJuly 1999 and Mountain View, California inMarch 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its
®
PICmicro devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systemsisISO 9001certified.
2002 Microchip TechnologyInc. DS21345B-page 13
8-bit MCUs, KEELOQ®code hopping
Page 14
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03/01/02
DS21345B-page 14
*DS21345B*
2002 Microchip Technology Inc.
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