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SPECIFICATION
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TACT SWITCH
1. GENERAL
1.1 Application : This specification is applied to low current circuit tactile switch for electronic equipment.
1.2 Operating temperature range : -20~70℃, 45~85% RH
1.3 Storage temperature range : -30~80℃ However, 96 hours maximum for continuous storage over a range
-20~-30℃ and a range 70~80℃
1.4 Test conditions : The standard test conditions shall be 5~35℃ in temperature, 45~85% RH and 860~1060mbar
in atmospheric pressure. Should any doubt arise in judgement, test shall be conducted
at 20±2℃, 65±5% RH and 860~1060mbar.
2. RATED VOLTAGE AND CURRENT.
DC 12V 50mA
3. ELECTRICAL PERFORMANCE
PROPERTY TEST CONDITIONS PERFORMANCE
Contact *1 pole, 1 throw
3.1
arrangement
Contact Measured at DC 5V 100mA or by ohmmeter allowing a small *less than 100mΩ
3.2
resistance current at 1KHz with a load of twice of the actuating force.
Insulation DC 100V is applied between terminals and between *greater than 100MΩ
3.3
resistance terminals and cover for 1 minute ± 5 seconds.
Dielectric AC 250V (50~60Hz) is applied between terminals and *No insulation defect shall
3.4
strength between terminals and cover for 1 minute. be observed.
Bounce Measured by lightly striking the center of the stem at *less than 10m sec.
3.5
a rate of 3 operations/sec..
ZONESYMB DATE APPD CHKDDSGD
APPD
CHKD
DSGD
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TITLE
JTP 1138 SERIES
DOCUMENT
JT 0105LF
NO.
Page 3
SPECIFICATION
TACT SWITCH
4. MECHANICAL PERFORMANCE
PROPERTY TEST CONDITIONS PERFORMANCE
Actuating force A gradually increasing load is applied to the center of the *As per individual
4.1
stem. manufactured drawing.
Return force After actuating, the load is gradually decreased until the *160gf, 260gf :
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4.2
Stop strength A static force of 3Kgf shall be applied to the direction of *Shall be free from
4.3
Stem withdrawal A static load of 500gf is applied to the direction of the stem *Shall be free from
4.4
force pulling for 3 seconds. mechanical and electrical
Solderability Dip in the solder bath of temperature 230±2℃ for 2±0.5
4.5
4.6
Travel *0.25 mm
Arrangement of *Tactile feed-back.
4.7
action
stem returns to its free position. greater than 50gf.
*100gf : greater than 30gf.
the stem operation for 3 seconds. mechanical and electrical
abnormalities.
degradation.
sec after dipping in the flux of room temperature for 5 sec
to 10 sec.
The solder shall be covered on 90% min of dipping area
on the plating surface.
+0.2
-0.1
5. DURABILITY
PROPERTY TEST CONDITIONS PERFORMANCE
Operating life 100,000 cycles operation with a load of 150% of actuating *Contact resistance :
force a rate of 2 cycles/sec. 200mΩ max.
5.1
ZONESYMB DATE APPD CHKDDSGD
With a resistive load supplying DC 12V 50mA. *Bounce : 20m sec max.
APPD
DSGDCHKD
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*Actuating force : within
±30% of the initial value.
TITLE
JTP 1138 SERIES
DOCUMENT
JT 0105LF
NO.
Page 4
SPECIFICATION
TACT SWITCH
6. WEATHER PROOF
PROPERTY TEST CONDITIONS PERFORMANCE
Cold heat proof After testing at -30℃ for 96hours, the sample is allowed to
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6.1
Dry heat proof After testing at 85℃ for 96hours, the sample is allowed to
6.2
Damp heat proof After test at 60±2℃ and 90~95% in relative humidity for *Insulation resistance :
6.3
Thermal cycling *The requirement in item
stand under normal temperature and humidity conditions
for 1hour and measurement is performed within 1hour after
that. Water drops should be wiped off.
stand under normal temperature for 1hour and measurement
is performed within 1hour after that.
96hours, the sample is allowed to stand under normal 10MΩ min.
temperature and humidity conditions for 1hour, and *Dielectric strength :
measurement is performed within 1hour after that. same as item 3.4.
Water drops should be wiped off. *Contact resistance :
same as item 3.2.
1 cycle
3 and 4 shall be met.
+65℃
-10℃
6.4
After the test conducted under 5 cycles the sample is
allowed to stand under normal temperature and humidity
conditions for 1 hour, and the measurement is performed
within 1 hour.
ZONESYMB DATE APPD CHKDDSGD
2H 2H 1H1H
APPD CHKD
DSGD
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TITLE
JTP 1138 SERIES
DOCUMENT
JT 0105LF
NO.
Page 5
SPECIFICATION
TACT SWITCH
7. REFLOW SOLDERING
7.1 Reflow soldering conditions
1) Preheat ------------ 150℃ ~ 200℃, 120 ±20 (sec)
2) Peak temperature --- 260℃ max. 10 (sec)
3) Soldering area temperature ------ 217℃, 90 ~ 120 (sec)
Temp.
℃
260
220
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Peak Temperature
150
25
Preheating area
< Temperature profile >
Soldering area
time(sec)
APPD
ZONESYMB DATE APPD CHKDDSGD
DSGDCHKD
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TITLE
JTP 1138 SERIES
DOCUMENT
JT 0105LF
NO.
Page 6
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Page 7
재 질 증 명 서
(CERTIFICATION OF MATERIAL)
작 성 검 토 승 인
결
재
일 자
DATE
제품명
ITEM
제품 번호
MODEL No.
상기 제품은 하기재료를 사용하고 있음을 증명합니다.
(The above item is certified to use with following materials.)
No.
구성부품명
(Part name)
1
CASE
2
COVER
3
STEM
4TERMINAL
2005년 10월 26일
TACT SWITCH
JTP-1138 SERIES
원재료(Material)
Material name Treatment Manufacturer Nationality
PPS
TIN PLATE DONG BU
PPS
BRASS Ag plating
LG CHEMICAL
PHILLIPS
LG CHEMICAL
PHILLIPS
POONG SAN KOREA
KOREA
JAPAN
KOREA
KOREA
JAPAN
난연성
(Flame cless)
UL94V-0
UL94V-0
UL
(File No.)
E67171(M)
E54702(N)
E67171(M)
E54702(N)
색상
(Color)
BROWN
BLACK
5CONTACT PLATE
6
7
8
9
10
11
12
13
14
PHOSPHOR
BRONZE
Ag clad
CHANG SUNG KOREA
15
NAMAE ELECTRONICS INC.
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