(Refer to the T7234, T7237, and T7256 ISDN transceiver data sheets.)
Telecommunication Standard
The European Telecommunications Standards Institute (ETSI) has identified a change in the requirement of
the power spectral density (PSD) for Basic Rate Interface ISDN.
Section A.12.4, Power Spectral Density, of ETSI TS080 states the following:
■ The upper boundary of the power spectral density of the transmitted signal shall be as shown in Figure 1,
below.
■ Measurements to verify compliance with this requirement are to use a noise power bandwidth of 1.0 kHz.
■ Systems deployed before January 1, 2000 do not have to meet this PSD requirement but shall meet the PSD
requirements as defined in ETR 080 edition 2. It is, however, expected that these systems will also meet the
PSD requirements of TS080 edition 3. Some narrowband violations could occur and should be tolerated.
PSD (dBm/Hz)
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
–140
0.001
0.0101.0000.10010.000
0.050
1.000
0.315
30.000
5.000
100.000
f (MHz)
5-7388F
Figure 1. Upper Boundary of Power Spectral Density from NT1 and LT
The existing SCNT1 family (T7234A, T7237A, and T7256A) of U-interface transceivers fully comply with this
standard.
Conformance to the above requirement has been fully verified, and test reports are available upon request.
Page 2
For additional information, contact your Microelectronics Group Account Manager or the following:
INTERNET:
E-MAIL:
N. AMERICA: Microelectronics Group, Lucent Technologies Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18103
1-800-372-2447
, FAX 610-712-4106 (In CANADA:
1-800-553-2448
, FAX 610-712-4106)
ASIA PACIFIC: Microelectronics Group, Lucent Technologies Singapore Pte. Ltd., 77 Science Park Drive, #03-18 Cintech III, Singapore 118256
Tel. (65) 778 8833
, FAX (65) 777 7495
CHINA:Microelectr on ic s G r ou p, Lucent Tec hnologies (China) Co., Ltd., A-F2, 23/F, Zao Fong Univer s e B ui lding, 1800 Zhong Shan Xi Road, Shanghai
200233 P. R. China
Tel . ( 86) 21 6440 0468, ext. 316
, F A X ( 86) 21 6440 0652
JAPAN:Microelectronics Group, Lucent Technologies Japan Ltd., 7-18, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo 141, Japan
EUROPE:Data Requests: MICROELECTRONICS GROUP DATALINE:
Tel. (81) 3 5421 1600
Technical Inquiries: GERMANY:
Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No
rights under any patent accompany the sale of any such product(s) or information.
November 1998
AY99-004ISDN
(Must accompany DS97-410ISDN, DS97-411ISDN, DS97-412ISDN, and AY98-025ISDN)
Page 3
Advisory
July 1998
T7234, T7237, and T7256
Data Sheet Advisory
(Refer to the T7234, T7237, and T7256 ISDN transceiver data sheets.)
The Technology and Telecommunications Standard sections below denote th e diff erenc es betw een the T723 4,
T7237, and T7256 and the T7234A, T7237A, and T7256A.
Technology
The T-7234- - -ML, T-7237- - -ML, and T-7256- - -ML2 are 0.9 µm CMOS technology devices.
■
The T-7234A- -ML, T-7237A- -ML, and T-7256A- -ML are 0.6 µm CMOS technology devices.
■
Telecommunication Standard
In 1996, the European Telecommunications Standards Institute (ETSI) added a microinterruption immunity
requirement to ETR 080 (Sections 5.4.5 and 6.2.5).
Section 5.4.5 in ETSI ETR 080 states the following:
A microinterruption is a temporary line interruption due to external mechanical activity on the copper wires
■
constituting the transmission path.
The effect of a microinterruption on the transmission system can be a failure of the digital transmission link.
■
The objective of this requirement is that the presence of a microinterruption of specified maximum length
■
shall not deactivate the sy stem , and the sy stem shal l acti vate if it has deactivated due to longer interruption.
Section 6.2.5 in ETSI ETR 080 states that:
A system shall tolerate a microinterruption up to t = 5 ms, when simulated with a repetition interval of
■
t = 5 ms.
The SCNT1 family of U-interface transceivers was upgraded to fully comply with this standard. The devices
have been given an A suffix (T7234A, T7237A, and T7256A).
A proposal was added to the Living List (which is intended to collect issues and observations for a possible
future update of ETSI ETR 080) to change the value of the microinterruption from 5 ms to 10 ms. The current
SCNT1 family of U-interface transceivers (T7234A/T7237A/T7256A) from Lucent Technologies Microelectronics Group meets and exceeds this new requirement.
The above change to the SCNT1 family of transceivers has been fully verified, and test reports are available
upon request.
Page 4
T7234, T7237, and T7256
Data Sheet Advisory
Advisory
July 1998
Application Circuit
Please change the v alu e of ca paci tor C 15 from 0.1 µF to 1 .0 µF in Fi gure 11 of the T7234 data sheet, Figure 17 of
the T7237 data sheet, and Figure 20 of the T7256 data sheet. The following schematic shows the correct value
(1.0 µF) for C15.
+5 V
SCNT1
OPTOIN
PIN
R8
17.8 kΩ
10 kΩ
6
5
R9
2.2 MΩ
R10
8
7
MLT CIRCUIT
U2
2
3
HCPL-0701
CA
1.0 µF
C15
1.0 µF
FOR NORTH AMERICAN
APPLICATIONS ONLY
(PLACE THIS CAPACITOR AS
CLOSE AS POSSIBLE TO THE LH1465)
R11
137 Ω
R12
137 Ω
ZD
8
TC
7
RS
6
PD
5
COM
LH1465AB
U3
PR+
PR–
T
R
1
2
3
4
RINGTIP
R14
1.1 kΩ
2 W
R15
1.1 kΩ
2 W
5-7034(C)
Figure 1. MLT Circuit Showing New Placement of Zener Diode (ZD) and Capacitor (CA)
In the ILOSS mode (refer to ANSI T1.601 1992, Section 6.5.2), the NT generates a scrambled, framed, 2B1Q signal such as SN1 and SN2. When the ILOSS mode is applied to circuits with the LH1465, it was observed that for
some short loop lengths, the NT, once in the ILOSS mode, would not respond to further maintenance pulses until
the ILOSS timer expired. It was discovered that there is some portion of the transmitted 2B1Q signal from the NT
that passes through the LH1465 to the optoisolator. This causes the optoisolator to report incorrect dial pulses at
its output, and thus prevent the NT from properly exiting the ILOSS mode.
To correct this situation, the dropout voltage (voltage at the Tip/Ring needed to turn on the optoisolator) of the
optoisolator driver o n the LH 1465 is ra ised using the 3.6 V zener diode Z
Capacitor C
is a 1.0 µF ±10% tantalum chip capacitor, with a voltage rati ng of at least 16 V. CA is added to provide
A
(for e x ampl e ,
D
Motorola
* MMSZ4685T1).
a level of filtering for the transition points (turn-on or turn-off) of the optoisolator input voltage, which increases the
robustness of the circuit.
*
Motorola
is a registered t r a demark of Motorola Inc .
For additional information, contact your Microelectronics Group Account Manager or the following:
INTERNET:
E-MAIL:
N. AMERICA: Microelectronics Group, Lucent Technologies Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18103
ASIA PACIFIC: Microelectronics Group, Lucent Technologies Singapore Pte. Ltd., 77 Science Park Drive, #03-18 Cintech III, Singapore 118256
CHINA:Microelectronics Group, Lucent Technologies (China) Co., Ltd., A-F2, 23/F, Zao Fong Universe Building, 1800 Zhong Shan Xi Road,
JAPAN:Microelectronics Group, Lucent Technologies Japan Ltd., 7-18, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo 141, Japan
EUROPE:Data Requests: MICROELECTRONICS GROUP DATALINE:
Lucent Technologies Inc. reserves the right to make changes to the product(s) or information c ontained herein without notice. No liability is assumed as a result of their use or application. No
rights under any patent accompany the sale of any such product(s) or information.
S/T-interface
— Conforms to ANSI T1.605 standard, ITU-T I.430
recommendation, and ETSI ETS 300 012 for NT
operation
Description
The Lucent Technologies Microelectronics Group
T7234 Single-Chip NT1 (SCNT1) Transceiver integrated circuit provides data (2B+D) and control information conversion between 2-wire (U-interface) and
4-wire (S/T-interface) digital subscriber loops on the
integrated services digital network (ISDN). The
T7234 conforms to the ANSI T1.601 standard and
ETSI ETR 080 technical report for the U-interface
and the ITU-T I.430 recommendation, ANSI T1.605
standard, and ETSI ETS 300 012 for the S/T-interface. The single +5 V CMOS device is packaged in a
44-pin plastic leaded chip carrier (PLCC).
■
Other
— Single +5 V ( ± 5%) supply
— –40 ° C to +85 ° C
— 44-pin PLCC
Features ....................................................................................................................................................................1
Pin Information ..........................................................................................................................................................4
Bit Assignments.................................................................................................................................................9
eoc State Machine Description................................................................................................................................17
ANSI Maintenance Control Description...........................................................................................................17
Absolute Maximum Ratings.....................................................................................................................................24
Power Consumption.........................................................................................................................................25
Questions and Answers...........................................................................................................................................29
Figure 3. U-Interface Frame and Superframe ........................................................................................................ 8
Figure 4. U-Interface Superframe Bit Groups......................................................................................................... 9
Figure 5. Frame Structures of NT and TE Frames...............................................................................................10
Figure 6. Details of NT and TE Frames................................................................................................................ 11
Table 7. Power Consumption............................................................................................................................... 25
Table 8. Digital dc Characteristics (Over Operating Ranges)............................................................................... 25
Table 13. Power Dissipation Variation.................................................................................................................. 48
Table 14. Power Dissipation of CKOUT............................................................................................................... 48
Table 15. Power Consumption............................................................................................................................. 49
streams. These pulse streams typically are generated by an optoisolator
that is monitoring the U loop. Pulse patterns on this pin are digitally filtered
for 20 ms before being considered valid and are then decoded and interpreted using the ANSI maintenance state machine requirements. If the OPTOIN
pin is being used for implementing maintenance functions, the ILOSS
should not be used (i.e., it should be held high). An internal 100 k Ω pull-up
resistor is on this pin. For applications outside of North America, leave this
pin unconnected.
3STLEDO Status LED Driver. Output pin for driving an LED (source/sink 4.0 mA) that
indicates the device status. The four defined states are low, high,
1 Hz flashing, and 8 Hz flashing (flashing occurs at 50% duty cycle). See the
STLED Description section for a detailed explanation of these states.
Also, this pin indicates device sanity upon power-on/RESET, as follows:
■
If AUTOACT = 0 (pin 15) after a device RESET, STLED will toggle at an
8 Hz rate for at least 0.5 s, signifying an activation attempt. If the activation attempt succeeds, it will continue to flash per the normal start-up
sequence (see STLED Description section).
pin
■
If AUTOACT = 1 (pin 15) after a de vice RESET, STLED will go low for 1 s
(flash of life), indicating that the device is operational, and no activation
attempt will be made.
4SYN8K/LBINDO Synchronous 8 kHz Clock or Loopback Indicator. Pin function is select-
ed via SYN8K_CTL (pin 12) state at the end of external RESET
. As SYN8K
(SYN8K_CTL = 0), this pin can be used as a reference clock or for synchronization in device performance testing (i.e., it reflects the recovered timing
from the U-interface). SYN8K is always present, even when the chip is in its
low-power (deactivated) mode. As LBIND (SYN8K_CTL = 1), this pin indicates a 2B+D loopback:
0—No loopback.
1—eoc requested 2B+D loopback in progress.
5, 13V
6ILOSS
DDD
Digital Power. 5 V ± 5% power supply pins for digital circuitry.
u
Insertion Loss Test Control (Active-Low) . The ILOSS
I
pin is used to control SN1 tone transmission for maintenance. The OPTOIN and ILOSS pins
should not be used at the same time (i.e., OPTOIN should be held high when
ILOSS is active). This pin would typically be used if an external ANSI maintenance decoder is being used, in which case the decoder output drives the
ILOSS pin. Internal 100 k Ω pull-up resistor on this pin.
0—U transmitter sends SN1 tone continuously.
1—No effect on device operation.
Power Status #2. This is an input for the PS2 bit in transmit U-interface data
I
stream. If the PS2E functionality is not used, this input must be pulled up externally
with a 10 k Ω or less resistor to set the U-interface PS2 bit to the inactive state. An
internal 100 k Ω pull-down resistor is on this pin.
9PS1E
d
Power Status #1. This is an input for the PS2 bit in transmit U-interface data
I
stream. If the PS1E functionality is not used, this input must be pulled up externally
with a 10 k Ω or less resistor to set the U-interface PS1 bit to the inactive state. An
internal 100 k Ω pull-down resistor is on this pin.
11ACTMODE
u
ACT Bit Mode.
I
0—act = 0 during loopback 2 (per ANSI T1.601). The data received at the NT is
looped back towards the LT as soon as the 2B+D loopback is enabled.
1—act = 1 during loopback 2 after INFO 3 is recognized at the S/T-interface (per
ETR 080). The data received by the NT is not looped back towards the LT until
after ACT = 1 is received from the LT. Prior to this time, 2B+D data toward the
LT is all 1s.
12SYN8K_CTL
d
Synchronous 8 kHz Clock Control. If pin is held low during an external RESET
I
the SYN8K/LBIND pin performs the SYN8K function. If held high during an external
RESET, the pin performs the LBIND function. An internal 100 k Ω pull-down resistor
is on this pin.
14NC— No Connect.
15AUTOACT
d
Automatic Activation. If this pin is held low during an external RESET
I
, the AUTOACT bit is written to 0, creating an activation attempt. If pin is held high during external RESET, no activation is attempted. An internal 100 k Ω pull-down resistor is
on this pin.
17NC— No Connect.
18GND
19V
DDO
O
Crystal Oscillator Ground. Ground lead for crystal oscillator.
Crystal Oscillator Power. Power supply lead for crystal oscillator.
20X1O Crystal #1. Crystal connection #1 for 15.36 MHz oscillator.
21X2I Crystal #2. Crystal connection #2 for 15.36 MHz oscillator.
22, 33,
V
DDA
Analog Power. 5 V ± 5% power supply leads for analog circuitry.
39, 42
23TNRO Transmit Negative Rail for S/T-Interface. Negative output of S/T-interface analog
transmitter. Connect to transformer through a 121 Ω
± 1% resistor.
24TPROTransmit Positive Rail for S/T-Interface. Positive output of S/T-interface analog
transmitter. Connect to transformer through a 121 Ω± 1% resistor.
u
* I
= input with internal pull-up; I
d
= input with internal pull-down.
,
6Lucent Technologies Inc.
Page 11
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
Pin Information (continued)
Table 1. Pin Description (continued)
PinSymbolType*Name/Function
25, 34,
40, 41
26RNRIReceive Negative Rail for S/T-Interface. Negative input of S/T-interface analog re-
27RPRIReceive Positive Rail for S/T-Interface. Positive input of S/T-interface analog re-
28VRCM—Common-Mode Voltage Reference for U-Interface Circuits. Connect a
29VRP—Positive Voltage Reference for U-Interface Circuits. Connect a 0.1 µF ± 20% ca-
30VRN—Negative Voltage Reference for U-Interface Circuits. Connect a 0.1 µF ± 20% ca-
31HNIHybrid Negative Input for U-Interface. Connect directly to negative side of
32LOPOLine Driver Positive Output for U-Interface. Connect to the U-interface transformer
35LONOLine Driver Negative Output for U-Interface. Connect to the U-interface transform-
36HPIHybrid Positive Input for U-Interface. Connect directly to positive side of
37SDINNISigma-Delta A/D Negative Input for U-Interface. Connect via an 820 pF ± 5%
38SDINPISigma-Delta A/D Positive Input for U-Interface. Connect via an 820 pF ± 5%
43RESET
44HIGHZ
* Iu = input with internal pull-up; Id = input with internal pull-down.
GNDA—Analog Ground. Ground leads for analog circuitry.
ceiver. Connect to transformer through a 10 kΩ± 10% resistor.
ceiver. Connect to transformer through a 10 kΩ± 10% resistor.
0.1 µF ± 20% capacitor to GNDA (as close to the device pins as possible).
pacitor to GND
A (as close to the device pins as possible).
pacitor to GNDA (as close to the device pins as possible).
U-interface transformer.
through a 16.9 Ω± 1% resistor.
er through a 16.9 Ω± 1% resistor.
U-interface transformer.
capacitor to SDINP.
capacitor to SDINN.
d
Reset (Active-Low). Asynchronous Schmitt trigger input. Reset halts data transmis-
I
sion, clears adaptive filter coefficients, resets the U-transceiver timing recovery circuitry, resets the S/T-interface transceiver, and sets all microprocessor register bits
to their default state. During reset, the U-interface transmitter produces 0 V and the
output impedance is 135 Ω at tip and ring. The RESET pin can be used to implement
quiet mode maintenance testing (refer to pin 2 for more description). The states of
ACTMODE, SYN8K_CTL, and AUTOACT are read upon exiting reset state (see corresponding pin descriptions). An internal 100 kΩ pull-down resistor is on this pin.
RESET must be held low for 1.5 ms after power-on. Device is fully functional after an
additional 1 ms.
u
High-Impedance Control (Active-Low). Control of the high-impedance function. An
I
internal 100 kΩ pull-up resistor is on this pin. Note: This pin does not 3-state the analog outputs.
0—All digital outputs enter high-impedance state.
1—No effect on device operation.
The T7234 device provides two interfaces for information transfer: the U-interface, the S/T-interface.
The ANSI maintenance controller can operate in fully
automatic or in fully manual mode. In automatic mode,
the device decodes and responds to maintenance
states according to the ANSI requirements. In manual
mode, the device is controlled by an external maintenance decoder that drives the RESET and ILOSS pins
to implement the required maintenance states.
When the T7234 is powered on and there is no activity
on the S/T- or U-interfaces (i.e., no pending activation
request), it automatically enters a low-power IDLE
mode in which it consumes an average of 35 mW.
This mode is exited automatically when an activation or
U maintenance request occurs from the S/T- or U-interfaces. The T7234 provides a board-level test capability
that allows functional verification. Finally, an LED driver
output indicates the status of the device during operation.
U-Interface Frame Structure
Data is transmitted over the U-interface in 240-bit
groups called U frames. Each U frame consists of an
18-bit synchronization word or inverted synchronization
word (SW or ISW), 12 blocks of 2B+D data (216 bits),
and six overhead bits (M bits). A U-interface superframe consists of eight U frames grouped together . The
beginning of a U superframe is indicated by the
inverted sync word (ISW). The six overhead bits (M1—
M6) from each of the eight U frames, when taken
together, form the 48 M bits. Figure 3 shows how U
frames, superframes, and M bits are arranged.
Of the 48 M bits, 24 bits form the embedded operations
channel (eoc) for sending messages from the LT to the
NT and responses from the NT to the LT. There are two
eoc messages per superframe with 12 bits per eoc
message (eoc1 and eoc2). Another 12 bits serve as Uinterface control and status bits (UCS). The last 12 bits
form the cyclic redundancy check (CRC) which is calculated over the 2B+D data and the M4 bits of the previous superframe. Figure 4 and Table 2 show the
different groups of bits in the superframe.
U-FRAME SPAN = 1.5 ms
ISW[18](2B+D) x 12 [216 bits]M[6]
U-SUPERFRAME SPAN = 12 ms
U1U2U3U4U5U6U7U8
U-INTERFACE M BITS [48]
Figure 3. U-Interface Frame and Superframe
5-2476 (C)
8Lucent Technologies Inc.
Page 13
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
* LT(NT). Values in parentheses () indicate meaning at the NT.
† cso is fixed at 0 by the device to indicate both cold and warm start capability.
‡ nib is fixed at 1 by the device to indicate the link is normal.
The S/T-interface transfers its subscriber line 2B+D
information as a 192 kbits/s full-duplex signal grouped
into frames of 48 bits with a period of 250 µs, as specified in the ITU-T I.430/ANSI T1.605 standard. Thirty-six
of the 48 bits sent in each direction convey user information (two 8-bit occurrences of each of the two B
channels, and four D-channel bits). The remaining
12 bits per frame are used for framing, control, dc balance, and maintenance. The frame structures are
shown in each direction in Figure 5.
In the bit stream transmitted from the terminal endpoint
(TE) to the network termination (NT), 4 bits are used for
framing (F and FA, each with a dc balancing bit L),
eight additional L bits are used to balance the 32 Bchannel bits, and 4 bits are D-channel bits.
For the NT-to-TE transmission, 4 bits (F with dc balancing bit L, FA, and N) are used for framing, one M bit
marks the start of a 20-frame multiframe, four E bits
ONE FRAME = 48 bits IN 250 µs
form an echo channel for retransmission of the D-channel bits received from the TE, one additional L bit is
used to balance the contents of the entire frame, and
1 bit (A) is set to one when bit synchronization is
achieved between TE and NT as part of the INFO 4
state. One S bit is used for transmitting S-subchannel
messages in an NT-to-TE multiframe.
The framing procedure uses bipolar line-code violations to establish synchronization. Since the last binary
0 of any frame is a positive pulse and the F bit is also
defined to be a positive pulse (see Figure 6), the first bit
of each frame represents a coding violation. In addition, the second bit of each frame, a balance bit, is a
negative pulse, and the next binary 0 in the frame is
forced to be negative, causing another violation. Both
bipolar violations allow framing and provide dc balance.
All other pulses follow the alternating convention.
NT-TO-
TE
FRAME
TE-TO-
NT
FRAME
FL
EIGHT
B1 BITS
FL
EDAFAN
EIGHT
B1 BITS
EIGHT
B2 BITS
LDLFAL
EDMEDSED
EIGHT
B2 BITS
BANDWIDTH = 192 kbits/s
EIGHT
B1 BITS
LDLLDLLDL
Figure 5. Frame Structures of NT and TE Frames
EIGHT
B1 BITS
EIGHT
B2 BITS
L
EIGHT
B2 BITS
5-2479 (C)
10Lucent Technologies Inc.
Page 15
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
S/T-Interface Frame Structure (continued)
In the TE-to-NT direction, in at least f our of fiv e fr ames , this second violation occurs within 13 bits of the F bit. If this
coding algorithm is not maintained, the receiver loses synchronization, but the T7234 continues transmitting. Multiframing is not supported in the T7234.
TIME
B1L F L B1B1 B1 E D A FA N B2 B2B2 E D M B1 B1B1 E D S B2 B2B2 E D L F L
F = Framing bitFA = Auxiliary framing bit or Q-channel bitM = Multiframe synchronization bit
L = dc balancing bitN = Bit set to binary value N = FAB1 = Bit within B channel 1
D = D-channel bitA = Activation bitB2 = Bit within B channel 2
E = Echo D-channel bitS = S-channel bit
Signals from NT to TESignals from TE to NT
INFO 0No signal.INFO 0No signal.
INFO 2Frame with all bits of B, D, and D echo (E) channels set to
binary ZERO; bit A set to binary ZERO; N and L bits set according to the normal coding rules.
MULTIFRAME SYNC
BIT (OPTIONAL, ONCE
IN 20 FRAMES)
INFO 1A continuous signal with the following pattern:
B1 B1
27 28
B2
38 39
(TE TO NT)
positive ZERO, negative ZERO, six ONEs.
48
INFO 4Frames with operational data on B, D, and E channels; bit
A set to binary ONE.
INFO 3Synchronized frames with operational data on B
At the U-interface, the T7234 conforms to ANSI T1.601
and ETSI ETR 080 when used with the proper line
interface circuitry. The T7234 Reference Circuit
description in the Application Briefs section of this document describes a detailed example of a U-interface
circuit design.
The 2B1Q line code provides a four-level (quaternary)
pulse amplitude modulation code with no redundancy.
Data is grouped into pairs of bits for conversion to quaternary (quat) symbols. Figure 7 shows an example of
this coding method.
The U-interface transceiver section provides the 2B1Q
line coder (D/A conversion), pulse shaper, line driver,
first-order line balance network, clock regeneration,
and sigma-delta A/D conversion. The line driver, when
connected to the proper transformer and interface circuitry , generates pulses which meet the required 2B1Q
templates. The A/D converter is implemented by using
a double-loop, sigma-delta modulator.
The U-transceiver block also takes input from the data
flow matrix and formats this information for the U-interface (see Figure 1). During this formatting, synchronization bits for U framing are added and a scrambling
algorithm is applied. This data is then transferred to the
2B1Q encoder for transmission over the U-interface.
Signals received from the U-interface are first passed
through the sigma-delta A/D converter, and then sent
to the digital signal processor for more extensiv e signal
processing. The block provides decimation of the
sigma-delta output, linear and nonlinear echo cancellation, automatic gain control, signal detection, phase
shift interpolation, decision feedback equalization, timing recovery, descrambling, and line-code polarity
detection. The decision feedback equalizer circuit provides the functionality necessary for proper operation
on subscriber loops with bridged taps.
A crystal oscillator provides the 15.36 MHz master
clock for the device. The on-chip, phase-locked loop
provides the ability to synchronize the chip to the line
rate.
The U-interface provides rapid cold start and warm
start operation. F rom a cold start, the device is typically
operational within four seconds. The interface supports
activation/deactivation, and when properly deactivated,
it stores the adaptive filter coefficients permitting a
warm start on the next activation request. A w arm start
typically requires 200 ms for the device to become
operational.
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
S/T-Interface Description
At the S/T-interface, the 4-wire line transceiver meets
the ANSI T1.605 standard, ITU-T I.430 recommendation, and ETSI ETS 300 012 when used with the proper
line interface circuitry. Refer to the March 1996, T7903
ISA Multiport Wide Area Connection (ISA-MWAC)
Device Data Sheet (DS96-084ISDN). Appendix F of
the ISA-MWAC data sheet is an application brief that
contains detailed information concerning guidelines for
S/T line interface circuit design.
The S/T transceiver interprets the frames received from
the line and generates frames to be transmitted onto
the S/T link. It exchanges full-duplex 2B+D information
with the data flow matrix. The transceiver consists of
two sections: the transmitter and the receiver. The
transmitter is a voltage-limited current source. The
transmitted bits are timed by an internal 192 kHz clock
derived from the U-interface.
The transmitter employs a line coding technique
referred to in the standards as “pseudo-ternary coding
with 100% pulse width,” which is often referred to as
alternate space inversion (ASI) coding. ASI coding represents a logical 1 by the absence of a pulse and a logical 0 by alternating positive and negative pulses. ASI
is a differential strategy, with positive and negative rails
connecting to the transformer. Current flows through
the transformer only when there is a voltage difference
on the two rails. When a logical one or mark is being
sent, meaning no current is desired, both rails go to a
high-impedance condition. When a positive logical zero
(space) is transmitted, the positive rail f orces current to
the negative rail through the transformer. The reverse
occurs for a negative zero. Table 3 and Figure 8 illustrate the ASI coding method.
The line receiver is more complex. Since the loop
length to the subscriber(s) is variable, as is the number
of TEs on the loop (1 to 8), the receiver must be sufficiently intelligent to adjust for widely varying input
waveforms. The receiver uses a self-adjusting voltage
threshold comparator to adapt to various loop lengths.
It also features a digital timing recovery circuit employing either adaptive or fixed timing modes.
The adaptive timing mode can be used on any loop
configuration (point-to-point, extended passive bus,
short passive bus) in which round trip delays are
between 0 µs and 42 µs and differential delays
between TEs are between 0 µs and 3.1 µs. This
exceeds the requirement in the standards, which is
0—2 µs (see, for example, ITU-T I.430 section A.2.1.3,
p. 58). A differential delay of 0 µs is meaningful in the
case of a line transmitter and line receiver directly connected externally in a loopback configuration, so the
receiver can extract the 2B+D information correctly
from the transmitted stream.
A short passive bus configuration permits TEs to be
connected anywhere along the full length of the cable,
with the restriction that the total round trip delay must be
between 10 µs and 14 µs for all TEs. Thus, worst-case
differential delay between TEs can be as much as 4 µs.
If the differential delay is more than 3.1 µs, adaptive timing mode cannot be used. A fixed timing mode is available for this case. When using fixed timing, the input
stream is sampled 4.2 µs after the leading edge of each
192 kHz transmit bit interval. The fixed/adaptive timing
mode is controlled via the FTE pin.
The figure below shows the Layer-1 loopbacks that
are defined in ITU-T I.430, Appendix I and ANSI Specification T1.605, Appendix G. A complete discussion
of these loopbacks is presented in ITU-T I.430, Appendix I.
TE1
4A
R
S
TATE2
A
S
4
NT2NT1
If a U-interface transparent B1 or B2 loopback is
requested via an eoc message, the proper channel is
looped upstream of the data flow matrix. All other
device functions are unaffected.
If a U-interface transparent 2B+D loopback is
requested via an eoc message, the 2B+D data will be
looped as close to the S/T-interface as possible. The
device forces all 0s in the echo channel towards the
TE.
TU
LT2CB13B2
LoopbackChannel(s) Looped
TE1 = ISDN terminalR = R reference point22B+D channels
TE2 = Non-ISDN terminalS = S reference point32B+D channels
TA = Terminal adapterT = T reference point4B1, B2
NT2 = Network termination 2U = U reference pointCB1, B2
NT1 = Network termination 1B1 or B22B+D, B1, B2
LT = Line terminationA2B+D, B1, B2
Figure 9. Location of the Loopback Configurations (Reference ITU-T I.430 Appendix I)
5-2482.a (C)
14Lucent Technologies Inc.
Page 19
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
STLED Description
The STLED pin is used to drive an LED and provides a
visual indication of the current state of the T7234. The
STLED control is typically configured to illuminate the
LED when STLED is LOW. This convention will be
assumed throughout this section.
Table 4 describes the four states of STLED, the list of
system conditions that produce the state, and the corresponding ANSI states, as defined in ANSI T1.6011992 (Tables C1 and C4) and ETSI ETR 080-1992
(Tables A3 and I2).
Table 4. STLED States
STLED StateList of System Conditions that
Can Cause STLED State
High (LED off)RESET (pin 43) = 0
AUTOCTL = 0 or
AUTOEOC = 0 or
STOA = 0
U and S/T not activeH0, H1, H10, H12
8 Hz FlashingRESET = 0
Quiet mode active, or
ILOSS mode active
U activation attempt in progressH2, H3, H4
AIB = 0 H7, H8
eoc-initiated 2B+D loopback activeNT6A*, NT7A*, NT8A*
NT instead of H. Also, the ETSI state tables
do not include a state NT11 because it is considered identical to state NT6. Table A3 of the
ETSI standard contains the additional states
NT6A, NT7A, and NT8A to describe state
related to the eoc loopback 2 (2B+D loopback). The most likely ANSI state for each
STLED state is shown in bold typeface, in
Table 4.
The flow chart in Figure 10 illustrates the priority of the
logic signals which control the STLED pin. Note that
quiet mode and ILOSS mode are ANSI maintenance
modes, and aib is a U-interface overhead bit.
Corresponding ANSI States
NA
NA
H8(b), H8(c)
* These are ETSI DTR/TM-3002 states not yet defined in ANSI T1.601, although the y are defined in re vised ANSI tables which are currently on
the living list (i.e., not yet an official part of the standards document).
† State H8(a) is most likely when U-interface bit uoa = 0.
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
eoc State Machine Description
The following list shows the eight eoc states defined in
ANSI T1.601 and ETSI ETR 080. The bit pattern below
represents the state of U-interface overhead bits
eoci1—eoci8, respectively (see Table 2).
01010000—Operate 2B+D loopback.
01010001—Operate B1 channel loopback.
01010010—Operate B2 channel loopback.
01010011—Request corrupt CRC.
01010100—Notify of corrupted CRC.
11111111—Return to normal (default).
00000000—Hold state.
10101010—Unable to comply.
The T7234 automatically handles the eoc channel processing per the ANSI and ETSI standards.
ANSI Maintenance Control Description
The ANSI maintenance controller of the T7234 can
operate in fully automatic or in fully manual mode.
Automatic mode can be used in applications where
autonomous control of the metallic loop termination
(MLT) maintenance is desired. The MLT capability
implemented with the Lucent LH1465AB and an optocoupler provides a dc signature, sealing current sink,
and maintenance pulse-level translation for the testing
facilities. Maintenance pulses from the U-interface MLT
circuit are received by the OPTOIN pin and digitally filtered for 20 ms. The device decodes these pulses
according to ANSI maintenance state machine requirements and responds to each request automatically.
For example, the T7234 will place itself in the quiet
mode if six pulses are received from the MLT circuitry.
Manual mode can be used in applications where an
external maintenance decoder is used to drive the
RESET and ILOSS pins of the T7234. In this mode, the
RESET pin places the device in quiet mode and the
ILOSS pin controls SN1 tone transmission.
Board-Level T esting
For board-level testing during manufacturing, the
HIGHZ pin 3-states all digital outputs.
A reference circuit illustrating the T7234 in a standalone NT1 application is shown in Figures 11 and 12.
This depicts a complete stand-alone NT1 design with
the exception of power supply circuitry and power status monitoring circuitry. A bill of materials for the schematic is shown in Table 5. Note that specific
applications may vary depending on individual requirements.
U-Interface
The U-Interface attaches to the board at RJ-45 connector J1 (see Figure 11). F1 and VR2 provide overcurrent
and overvoltage protection, respectively. These two
devices in combination with transformer T1 provide
protection levels required by FCC Part 68 and UL*
1459. For an in-depth discussion of protection issues,
the following application notes are helpful.
1.“Overvoltage Protection of Solid-State
Subscriber Loop Circuits,” Lucent Analog Line
Card Products Data Book (CA97-006ALC) 800372-2447.
2.Protection of Telecommunications Customer
Premises Equipment, Raychem
415-361-6900.
C16 is a 1.0 µF dc blocking capacitor that is required
per ANSI T1.601, Section 7.5.2.3. The 250 V rating of
C16 is governed by the maximum breakdown voltage
of VR2, since the capacitor must not break do wn before
VR2. The resistance of R13 (21 Ω) and F1 (12 Ω) provides a total line-side resistance of 33 Ω, which is
required when using the Lucent 2754H2 transformer
(see the note at the end of Table 5 for information on
R13 values when using other transformers).
On the device side of the U-interface transformer, VR1
provides secondary overvoltage protection of 6.8 V.
Optional capacitors C13 and C14 provide commonmode noise suppression for applications that are
required to operate in the presence of high commonmode noise. R6 and R7 provide the necessary external
hybrid resistors.
S/T-Interface
The S/T-interface attaches to the board at RJ-45 connector J2 (see Figure 12). L1 is a high-frequency common-mode choke used to minimize EMI. R24 and R25
are 100 Ω terminations required by ITU I.430 Section
8.4. Jumper-selectable resistors R26 and R27 provide
†
Corporation,
for a 50 Ω termination option instead of the standard
100 Ω termination. This is useful in configurations
where none of the TEs have terminating resistors.
Dual-transformer T2 has a standard footprint that can
accept ISDN transformers from several vendors. On
the device side of the S/T-interface transformer, D2—
D11 and VR3—4 provide o v ervoltage protection f or the
device pins. R20—23 provide current limiting for cases
where one or more of the protection diodes conducts
due to an overvoltage condition. Capacitor C17 provides suppression of common-mode noise that might
otherwise be introduced onto the receiver input pins,
effectively increasing the receiver's CMRR. Note that
the S/T transformer must have a center tap on the
device side in order to use this scheme. R16 and R17
in combination with R20 and R21, respectively, provide
the 121 Ω of resistance required by the T7234 on each
transmitter output pin. R18 and R19 are the 10 kΩ,
10% resistors required on the receiver input pins.
MLT Circuit
The metallic loop termination (MLT) circuit (U3 and
related components in Figure 11) provides a dc termination for the loop per ANSI T1.601, Section 7.5. R14
and R15 are power resistors used to sink current during overvoltage fault conditions. The optoisolater (U2)
provides signal isolation and voltage translation of the
signaling pulses used for NT maintenance modes, per
T1.601, Section 6.5. The T7234 interprets these pulses
via an internal ANSI maintenance state machine, and
responds accordingly. For applications outside North
America, the MLT circuit is not required.
Status LED
D1 in Figure 11 is an LED that is controlled by the
STLED pin of the T7234 and indicates the status of the
device (activating, out-of-sync , etc.). Table 4 and Figure
10 of this data sheet details the possible states of the
STLED pin and the meaning of each state.
Fixed/Adaptive Timing Control
As detailed in Table 1, pin 7 of the T7234 controls
whether the S/T-interface will use fixed or adaptive timing recovery. When there is no connection to pin 7, an
internal 100 kΩ pull-up holds the pin high, which
causes the chip to default to adaptive timing recovery.
JMP1 is provided (see Figure 11) to change the timing
recovery mode to fixed timing by pulling pin 7 down
through a 5.1 kΩ resistor.
* UL is a registered trademark of Underwriters Laboratories, Inc.
† Raychem is a registered trademark of Raychem Corporation.
18Lucent Technologies Inc.
Page 23
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
1. Kemet is a registered trademark of Kemet Laboratories Company, Inc.
2. Philips is a registered trademark of Philips Manufacturing Company.
3. Vitramon is a registered trademark of Vitramon, Inc.
4. Hewlett Packard is a registered trademark of Hewlett-Packard Company.
5. Polyswitch is a registered trademark of Raychem Corporation.
6. Bel and Bel Fuse are registered trademarks of Bel Fuse, Inc.
7. Molex is a registered trademark of Molex, Inc.
8. Pulse Engineering is a registered trademark of Pulse Engineering, Inc.
9. Dale is a registered trademark of Dale Electronics, Inc.
10.Valor is a registered trademark of Valor Electronics, Inc.
11.Advanced Power Components is a registered trademark of Advanced Power Technology, Inc.
12.Vacuumschmelze is a registered trademark of Vacuumschmelze GmbH.
13.SGS-Thomson is a registered trademark of SGS-Thomson Microelectronics, Inc.
14.Teccor is a registered trademark of Teccor, Inc.
15.MTRON is a registered trademark of MTRON Industries, Inc., a wholly owned subsidiary of Lynch* Corporation.
* Lynch is a registered trademark of Lynch Corporation.
Note:The Lucent 2754K2 and the Valor PT4084 have different winding resistances than the Lucent 2754H2, and therefore require a change
to the line-side resistor (R15). In addition, if the Bel Fuse is used in place of the Raychem TR600-150 PTC at location F1 (which will
sacrifice the resettable protection that the PTC provides), the line-side resistors must be adjusted to compensate for reduced resistance
due to the removal of the PTC (12 Ω). The following table lists the necessary resistor values for these cases. Note that R15 is specified
at 1%. This is due to the fact that the values were chosen from standard 1% resistor tables. When a PTC is used, the overall tolerance
will be greater than 1%. This is acceptable, as long as the total line-side resistance is kept as close as possible to the ideal value. See
Questions and Answers section, #6 for more details.
Table 6. Line-Side Resistor Requirements
TransformerWhen Raychem TR600-150 Is UsedWhen Bel Fuse Is Used
Stresses in excess of the absolute maximum ratings can cause permanent or latent damage to the device. These
are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in
excess of those given in the operation sections of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect device reliability.
External leads can be soldered safely at temperatures up to 300 °C.
ParameterSymbolMinMaxUnit
dc Supply Voltage RangeVDD–0.56.5V
Power Dissipation (package limit)PD—800mW
Storage TemperatureTstg–55150°C
Voltage (any pin) with Respect to GND—–0.56.5V
Handling Precautions
Although protection circuitry has been designed into this device, proper precautions should be taken to av oid exposure to electrostatic discharge (ESD) during handling and mounting. Lucent employs a human-body model (HBM)
and charged-device model (CDM) for ESD-susceptibility testing and protection design evaluation. ESD voltage
thresholds are dependent on the circuit parameters used to defined the model. No industry-wide standard has
been adopted for the CDM. Howev er, a standard HBM (resistance = 1500 Ω, capacitance = 100 pF) is widely used
and, therefore, can be used f or comparison. The HBM ESD threshold presented here was obtained by using these
circuit parameters:
ESD Threshold Voltage
DeviceVoltage
T7234-ML2>1000
Recommended Operating Conditions
ParameterSymbolTest ConditionsMinTypMaxUnit
Ambient TemperatureT
Any VDDVDD—4.755.05.25V
GND to GNDVGG—–10—10mV
AVDD = 5 V ± 5%–40—85°C
24Lucent Technologies Inc.
Page 29
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
Electrical Characteristics
All characteristics are for a 15.36 MHz crystal, 135 Ω line load, random 2B+D data, TA = –40 °C to +85 °C,
VDD = 5 V ± 5%, GND = 0 V, and output capacitance = 50 pF.
Power Consumption
Table 7. Power Consumption
ParameterTest ConditionsMinTypMaxUnit
Power ConsumptionOperating, random data—270350mW
Power ConsumptionPowerdown mode—3550mW
Pin Electrical Characteristics
Table 8. Digital dc Characteristics (Over Operating Ranges)
ParameterSymbolTest ConditionsMinMaxUnit
Input Leakage Current:
Low
High
Low
High
Input Voltage:
Low
High
Low-to-high Threshold
High-to-low Threshold
Low
High
Output Leakage Current:
Low
High
Low
High
Low
High
Output Voltage:
Low, TTL
High, TTL
IILPU
IIHPU
IILPD
IIHPD
VIL
VIH
VILS
VIHS
VILC
VIHC
IOZL
IOZH
IOZLPU
IOZHPU
IOZLPD
IOZHPD
VOL
VOH
VIL = 0 (pins 2, 6, 7, 11, 44)
IH = VDD (pins 2, 6, 7, 11, 44)
V
VIL = 0 (pins 8, 9, 12, 15, 43)
VIH = VDD (pins 8, 9, 12, 15, 43)
All pins except 2, 6, 43
All pins except 2, 6, 43
Pin 43
Pin 43
Pins 2, 6
Pins 2, 6
VOL = 0, Pin 44 = 0 (pins 3, 14)
VOH = VDD, Pin 44 = 0 (pins 3, 14)
VOL = 0, Pin 44 = 0 (pin 11)
VOH = VDD, Pin 44 = 0 (pin 11)
VOL = 0, Pin 44 = 0 (pins 4, 8, 9, 17)
VOH = VDD, Pin 44 = 0 (pins 4, 8, 9, 17)
IOL = 4.5 mA (pin 3)
IOL = 19.5 mA (pins 4, 9)
IOL = 8.2 mA (pins 8, 17)
IOL = 6.5 mA (pin 14)
IOL = 3.3 mA (pin 11)
IOH = 32.2 mA (pins 4, 9)
IOH = 13.5 mA (pins 8, 17)
IOH = 10.4 mA (pins 3, 14)
Table 10. Fundamental Mode Crystal Characteristics
These are the characteristics of a parallel resonant crystal for meeting the ±100 ppm requirements of T1.601 f or NT
operation. The par asitic capacitance of the PC board to which the T7234 crystal is mounted must be kept within the
range of 0.6 pF ± 0.4 pF.
ParameterSymbolTest ConditionsSpecificationsUnit
Center FrequencyFOWith 25.0 pF of loading15.36MHz
Tolerance Including Calibration,
Temperature Stability, and Aging
Drive LevelDLMaximum0.5mW
Series ResistanceR
Shunt CapacitanceCO—3.0 ± 20%pF
Motional CapacitanceCM—12 ± 20%fF
TOL—±70ppm
SMaximum20Ω
Table 11. Internal PLL Characteristics
ParameterTest ConditionsMinTypMaxUnit
Total Pull Range—±250——ppm
Jitter Transfer Function–3 dB point (NT), 18 kft 26 AWG—5*—Hz
Jitter Peaking1.5 Hz typical—1.0*—dB
* Set by digital PLL; therefore, variations track U-interface line rate.
26Lucent Technologies Inc.
Page 31
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
Timing Characteristics
Table 12. RESET Timing
ParameterDescriptionMinMaxUnit
tRSLFL, tFLRSHRESET
tRSLRSHRESET Low Time:
From Idle Mode or Normal Operation
From Power-on
SYN8K
Setup and Hold Time60—ns
375
1.5
—
—
µs
ms
tRSLFL
RESET
tRSLRSH
tFLRSH
5-3462 (C)
Figure 13. RESET Timing Diagram
Switching T est Input/Output Waveform
2.4 V
0.4 V
2.0 V
0.8 V
TEST POINTS
2.0 V
0.8 V
Figure 14. Switching Test Waveform
2.4 V
0.4 V
5-2118 (C)
Propagation Delay
The maximum propagation delay from the S/T-interface to the U-interface (upstream direction) is 750 µs . The maximum propagation delay from the U-interface to the S/T-interface (downstream direction) is 550 µs.
T7234A - -ML-DDry Pack—Sticks44-Pin PLCC–40 °C to +85 °C—108051814
T7234A - -ML-DTDry Pack—Tape & Reel44-Pin PLCC–40 °C to +85 °C—108050816
28Lucent Technologies Inc.
Page 33
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
Questions and Answers
Introduction
This section is intended to answer questions that may
arise when using the T7234 Single-Chip NT1 Transceiver.
The questions and answers are divided into three categories: U-interface, S/T-interface, and miscellaneous.
U-Interface
Q1: Is the line interface for the T7234 the same as f or
the T7264?
A1: Yes. The U-interface section on these chips is
identical, so their line interfaces are also identical.
Q2: Why is a higher transformer magnetizing induc-
tance used (as compared to other vendors)?
A2: It has been determined that a higher inductance
provides better linearity. Furthermore, it has been
found that a higher inductance at the far end provides better receiver performance at the near end
and better probability of start-up at long loop
lengths.
Q3: Can the T7234 be used with a transformer that
has a magnetizing inductance of 20 mH?
A3: The echo canceler and tail canceler are opti-
mized for a transformer inductance of approximately 80 mH and will not work with lower
inductance transformers.
Q4: Are the Lucent Technologies U-interface trans-
formers available as surface-mount components?
A4: Not at this time.
Q5: Are there any future plans to make a smaller
height 2-wire transformer?
A5: Due to the rigid design specifications for the
transformer, vendors have found it difficult to
make the transformer any smaller. We are continuing to work with transformer vendors to see if
we can come up with a smaller solution.
Q6: The line interface components’ specifications
require 16.9 Ω resistors on the line side of the
transformer when using the 2754H2. For our
application, we would like to change this value.
Can the U-interface line-side circuit be redesigned to change the value of the line-side resistors?
A6: Yes. For example, the line-side resistances can
be reflected back to the device side of the transformer so that, instead of having 16.9 Ω on each
side of the transformer, there are no resistors on
the line side of the transformer and 24.4 Ω resistors on the device side (16.9 Ω + 16.9 Ω/N
where N is the turns ratio of the transformer).
Note that the reflected resistances should be kept
separate from the device-side 16.9 Ω resistors,
and located between VR1 and T1 in Figure 11.
This is necessary because the on-chip hybrid
network (pins HP, HN) is optimized for 16.9 Ω of
resistance between it and the LOP/LON pins.
Q7: Table 5, T7234 Reference Schematic Parts List,
states the 0.1 µF capacitor that is used with the
LH1465 (C15) must have an insulation resistance
of >2 GΩ. Wh y?
A7: This capacitor is used to set the gate/source volt-
age for the main transistor in the device. The
charging currents for this capacitor are on the
order of microamps. Since the currents are so
small, it is important to keep the capacitor leakage to a minimum.
Q8: The dc blocking capacitor (C16 in Figure 11)
specified is 1.0 µF. Can it be increased to at least
2 µF?
A8: This value can be increased to 2 µF without an
effect on performance. Howev er, for an NT1 to be
compliant with T1.601-1992 Section 7.5.2.3, the
dc blocking capacitor must be 1.0 µF ± 10%.
Q9: Why is the voltage rating on 1 µF dc blocking
capacitor (C16 in Figure 11) so high (250 V)?
A9: In Appendix B of T1.601, the last section states
that consideration should be given to the handling
of three additional environmental conditions. The
third condition listed is maximum accidental ringing voltages of up to –200.5 V peak whose
cadence has a 33% duty cycle over a 6 s period.
This statement could be interpreted to mean that
a protector such as VR2 in Figure 11 should not
trip if subjected to a voltage of that amplitude.
This interpretation sets a lower limit on VR2’s
breakover rating. Since capacitor C16 will be
exposed to the same voltage as VR2, its voltage
rating must be greater than the maximum breakover rating of VR2. This sets an upper limit on the
protector breakover voltage. The result is a need
for a capacitor typically rated at about 250 V.
However, an argument can be made that it
doesn’t matter whether VR2 trips under this condition, since it is a fault condition anyway, and a
tripped protector won’t do any damage to a central office ringer.
The only other similar requirement, then, is found
in Footnote 8, referenced in Section 7.5.3 of ANSI
T1.601. The footnote implies that the maximum
voltage that an NT will see during metallic testing
is 90 V. The breakover v oltage VR2 must be large
enough not to trip during the application of the
test voltage mentioned in the footnote. This
means that a protector with a minimum breakover
voltage of 90 V can be used that would permit a
capacitor of lower voltage rating (e.g., 150 V) to
be used. This is the approach we currently favor,
although Figure 11 illustrates the more conservative approach.
Q10: What is the purpose of the 3300 pF capacitors
(C13 and C14) in Figure 11 in the data sheet?
A10: The capacitors are for common-mode noise
rejection. The ANSI T1.601 specification contains
no requirements on longitudinal noise immunity.
Therefore, these capacitors are not required in
order to meet the specification. However, there
are guidelines in IEC 801-6 which suggest a
noise immunity of up to 10 Vrms between
150 kHz and 250 MHz. At these levels, the
10 kHz tone detector in the T7234 may be desensitized such that tone detection is not guaranteed
on long loops. The 3300 pF was selected to provide attenuation of this common-mode noise so
that tone detector sensitivity is not adversely
affected. Since the 3300 pF capacitor was
selected based only on guidelines, it is not mandatory, but it is recommended in applications
which may be susceptible to high levels of common-mode noise. The final decision depends on
the specific application.
As for the size of the capacitors, lab tests indicate
the following:
1. The performance of the system suffers no
degradation until the values are increased to
about 0.1 µF.
2. The return loss at 25 kHz increases with
increasing capacitor value.
3. The capacitor value has no eff ect on longitudinal balance.
4. A large unbalance in the capacitor values did
not affect return loss, longitudinal balance, or
performance.
Q11: Are there any recommended common-mode fil-
tering parts for the U-interface? I suspect that our
product may have emissions problems, and I
want to include a provision for common-mode filtering on the U-interface.
A11: The only common-mode filtering parts we have
any data on are two common-mode chokes from
Pulse Engineering (
intended to help protect against external common-mode noise. The part numbers are
PE-68654 (12.5 mH) and PE-68635 (4.7 mH),
and in lab experiments, no noticeable degradation in transmission performance was observed.
These chokes are typically effective in the frequency range 100 kHz—1 MHz.
As far as emissions are concerned, we don’t have
a lot of data. We have seen some success with
the use of RJ-45 connectors that have integral
ferrite beads such as those from Corcom*, Inc.,
(708) 680-7400. These provide some flexibility in
that they have the same footprint as some standard RJ-45 connectors.
* Corcom is a registered trademark of Corcom, Inc.
619-674-8100) that are
30Lucent Technologies Inc.
Page 35
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
Questions and Answers (continued)
U-Interface(continued)
Q12: I am planning on using a Raychem PTC (p/n
TR600-150) on the U-interface of the T7234 as
shown in Figure 11. The device is rated at 6 Ω—
12 Ω. I am concerned about the loose tolerance
on the PTC resistance. Will I be able to pass the
return loss requirements in ANSI T1.601 Section
7.1?
A12: The NT1 impedance limits looking into tip/ring are
derived from the T1.601 return loss requirements
(Figure 9 in T1.601). At the narrowest point in the
templates, the permissible range is between
111 Ω to 165 Ω. The tolerance on the PTC will
reduce the impedance margin somewhat, but
should still be acceptable.
10000
Figure 15 is derived from the return loss template
in ANSI T1.601. Return loss is a measure of the
match between two impedances on either side of
a junction point. The following equation is an
expression of return loss in terms of the complex
impedances of the two halves of the circuit Z
1Z2+
Z
RL (dB) = 20 log
------------------ -
1Z2–
Z
1, Z2.
When the impedances are not matched, the junction becomes a reflection point. For a perfectly
matched load, the return loss is infinite, whereas
for an open or short circuit, the return loss is zero.
The return loss expresses the ratio of incident to
reflected signal power and should consequently
be fairly high.
It is desirable to express the return loss in terms of impedance bounds, since an impedance measurement is
relatively simple to make. From the above equation, upper and lower bounds on impedance magnitude can be
derived as follows:
O = return loss reference impedance = 135 Ω
Z
ZU = upper impedance curve
ZL = lower impedance curve
Upper bound (ZU>ZO):
OZU+
Z
1+
==
1–
1–
==
1+
--------------------
U ZO–
Z
Z OZ L+
------------------- -
UZL–
Z
RL–
O
Z
L:
O
Z
---------- -
110
------------------------- 110
110
-------------------------- -
110
20
+
RL–
---------- 20
–
RL–
---------- 20
–
RL–
---------- 20
+
O and Fig-
RL (dB) = 20 log
Lower bound (Z
L < ZO):
RL (dB) = 20 log
Note that the higher the minimum return loss requirement, the tighter the impedance limits will be around
ZO, and vice-versa.
So, for the upper bound, solve for ZU:
RL
------- -
20
Z UZ O
10
---------------------- -
RL
------- 20
10
For the lower bound, solve for Z
RL
------- -
20
ZUZO
10
------------------------
RL
------- 20
10
Plotting the above equations (using 135 for Z
ure 16 in T1.601 for the RL values) results in the graph
shown in Figure 15, which shows the return loss
expressed in terms of impedance upper and lower
bounds.
Q13: Why must secondary protection, such as a SGS-
Thomson SM6T6V8CA protection diode, be
used?
A13: The purpose of the diode is to protect against
metallic surges below the breakdown level of the
primary protector.
Such metallic surges can be coupled through the
transformer and could cause device damage if
the currents are high. The protector does not provide absolute protection for the device, but it
works in conjunction with the built-in protection
on the device leads.
The breakdown voltage level for secondary protection devices must be chosen to be above the
normal working voltage of the signal and typically
below the breakdown voltage level of the next
stage of protection. The SM6T6V8CA has a minimum breakdown voltage level of 6.4 V and a
maximum breakdown voltage of 7.1 V.
The chip pins that the SM6T6V8CA protects are
pins 36 (HP), 31 (HN), 32 (LOP), and 35 (LON).
The 16.9 Ω resistors will help to protect pins 32
and 35, but pins 31 and 36 will be directly
exposed to the voltage across the SM6T6V8CA.
The on-chip protection on these pins consists of
output diodes and a pair of polysilicon resistors.
These pins have been thoroughly tested to
ensure that a 7.1 V level will not damage them;
therefore, no third level of protection is needed
between the SM6T6V8CA and the HP and HN
pins.
The SM6T6V8CA has a maximum reverse surge
voltage level of 10.5 V at 57 A. Sustained currents this large on the device side of the transformer are not a concern in this application.
Thus, there should never be more than 7.1 V
across the SM6T6V8CA, except for possibly an
ESD or lightning hit. In these cases, the T7234 is
able to withstand at least ±1000 V (human-body
model) on its pins.
32Lucent Technologies Inc.
Page 37
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
Questions and Answers (continued)
U-Interface(continued)
Q14: Where can information be obtained on lightning
and surge protection requirements for 2B1Q
products?
A14: Requirements vary among applications and
between countries. ANSI T1.601, Appendix B,
provides a list of applicable specifications to
which you may refer. Also, there are many manufacturers of overvoltage protection devices who
are familiar with the specifications and would be
willing to assist in surge protection design. The
ITU-T K series recommendations are also a good
source of information on protection, especially
recommendation K.11, “Principles of Protection
Against Overvoltages and Overcurrents,” which
presents an overview of protection principles.
Also refer to the application notes mentioned in
the U-interface Description section of this data
sheet.
Q15: ITU-T specification K.21 describes a lightning
surge test for NT1s (see Figure 1/K.21 and Table
1/K.21, Test #1) in which both Tip and Ring are
connected to the source and a 1.5 kV voltage
surge is applied between this point and the GND
of the NT1. What are the protection considerations for this test? Are the HP and HN pins susceptible to damage?
A15: The critical component in this test is the trans-
former since its breakdown voltage must be
greater than 1.5 kV. Assuming this is the case,
the only voltage that will make it through to the
secondary side of the transformer will be primarily due to the interwinding capacitance of the
transformer coils. This capacitance will look like
an impedance to the common-mode surge and
will therefore limit current on the device side of
the transformer. The device-side voltage will be
clamped by the SM6T6V8CA device. The maximum breakdown voltage of the SM6T6V8CA is
7.1 V. The 16.9 Ω resistors will help protect the
LOP and LON pins on the T7234 from this voltage. Howe v er , this voltage will be seen directly on
pins 36 and 31 (HP and HN) on the T7234. The
on-chip protection on these pins consists of output diodes and a pair of polysilicon resistors.
These pins have been thoroughly tested to
ensure that a 7.4 V level will not damage them;
therefore, no third level of protection is needed
between the SM6T6V8CA and the HP and HN
pins.
Q16: Can the range of the T7234 on the U-interface be
specified in terms of loss? What is the range over
straight 24 awg wire?
A16: ANSI Standard T1.601, Section 5.1, states that
transceivers meeting the U-interface standard are
intended to operate over cables up to the limits of
18 kft (5.5 km) 1300 Ω resistance design. Resistance design rules specify that a loop (of singleor mixed-gauge cable; e.g., 22 awg, 24 awg, and
26 awg) should have a maxim um dc resistance of
1300 Ω, a maxim um working length of 18 kft, and
a maximum total bridged tap length of 6 kft.
The standard states that, in terms of loss, this is
equivalent to a maximum insertion loss of 42 dB
@ 40 kHz. Lucent Technologies has found that,
for assessing the condition of actual loops in the
field in a 2B1Q system, specifying insertion loss
as 33.4 dB @ 20 kHz more closely models ANSI
circuit operation. This is equivalent to a straight
26 awg cable with 1300 Ω dc resistance
(15.6 kft).
The above goals are for actual loops in the outside loop plant. These loops may be subjected to
noise and jitter. In addition, as mentioned above,
there may be bridge taps at various points on the
loop. The T1.601 standard defines 15 loops, plus
the null, or 0-length loop, which are intended to
represent a generic cross section of the actual
loop plant.
A 2B1Q system must perform over all of these
loops in the presence of impairments with an
error rate of <1e–7. Loop #1 (18 kft, where
16.5 kft is 26 awg cable and 1.5 kft is 24 awg
cable) is the longest, so it has the most loss
(37.6 dB @ 20 kHz and 47.5 dB @ 40 kHz). Note
that this is more loss than discussed in the preceding paragraph. The diff erence is based on test
requirements vs. field deployment. The test
requirements are somewhat more stringent than
the field goal in order to provide some margin
against severe impairments, complex bridged
taps, etc.
If a transceiver can operate over Loop #1 errorfree, it should have adequate range to meet all
the other loops specified in T1.601. Loop #1 has
no bridged taps, so passing Loop #1 does not
guarantee that a transceiver will successfully
start up on every loop. Also, due to the complex
nature of 2B1Q transceiver start-up algorithms,
there may be shorter loops which could cause
start-up problems if the transceiver algorithm is
not robust. The T7234 has been tested on all of
the ANSI loops per the T1.601 standard and
passes them all successfully. Two loops commonly used in the lab to evaluate the performance of the T7234 silicon are as follows:
Loop
Configuration
18 kft/26 awgNone38.749.5
15 kft/26 awgTwo at near
The T7234 is able to start up and operate errorfree on both of these loops. Neither of these
loops is specified in the ANSI standard, but both
are useful for evaluation purposes. The first loop
is used because it is simple to construct and easy
to emulate using a lumped parameter cable
model, and it is very similar to ANSI Loop #1, but
the loss is slightly worse. Thus, if a transceiver
can start up on this loop and operate error-free,
its range will be adequate to meet the longest
ANSI loop. The second loop is used because,
due to its difficult bridge tap structure and its
length, it stresses the transceiver start-up algorithms more than any of the ANSI-defined loops.
Therefore, if a transceiver can start up on this
loop, it should be able to meet any of the ANSIdefined loops which have bridge taps. Also, on a
straight 26 awg loop, the T7234 can successfully
start up at lengths up to 21 kft. This fact, combined with reliable start-up on the 15 kft 2BT loop
above, illustrates that the T7234 provides ample
start-up sensitivity, loop range, and robustness
on all ANSI loops. Another parameter of interest
is pulse height loss (PHL). PHL can be defined as
the loss in dB of the peak of a 2B1Q pulse relative to a 0-length loop. For an 18 kft 26 awg loop,
Bridge Taps
(BT)
end, each
3 kft/22 awg
Loss
@ 20
kHz
(dB)
37.146.5
Loss
@ 40
kHz
(dB)
the PHL is about 36 dB, which is 2 dB worse than
on ANSI Loop #1. A signal-to-noise ratio (SNR)
measurement can be performed on the received
signal after all the signal processing is complete
(i.e., at the input to the slicer in the decision feedback equalizer). This is a measure of the ratio of
the recovered 2B1Q pulse height vs. the noise
remaining on the signal. The SNR must be
greater than 22 dB in order to operate with a bit
error rate of <1e–7. With no impairments, the
T7234 SNR is typically 32 dB on the18 kft/26 awg
loop. When all ANSI-specified impairments are
added, the SNR is about 22.7 dB, still leaving
adequate margin to guarantee error-free operation over all ANSI loops.
Finally, to estimate range over straight 24 awg
cable, the 18 kft loop loss can be used as a limit
(since the T7234 can operate successfully with
that amount of loss) and the following calculations can be made:
Loss of 18 kft/26 awg loop @ 20 kHz38.7 dB
Loss per kft of 24 awg cable @ 20 kHz1.6 dB
38.7 dB
--------------------------- -24 kft=
1.6 dB
Thus, the operating range over 24 awg cable is
expected to be about 24 kft.
Q17: What does the energy spectrum of a 2B1Q signal
look like?
A17: Figure A1 (curve P1) in the ANSI T1.601 stan-
dard illustrates what this spectrum looks like.
Q18: Please clarify the meaning of ANSI Standard
T1.601, Section 7.4.2, Jitter Requirement #3.
A18: The intent of this requirement is to ensure that
after a deactivation and subsequent activation
attempt (warm start), the phase of the receive
and transmit signals at the NT will be within the
specified limits relative to what they were prior to
deactivation. This is needed so that the LT, upon
a warm-start attempt, can make an accurate
assumption about the phase of the incoming NT
signal with respect to its transmit signal. Note that
the T7234 meets this requirement by design
because the NT phase offset from transmit to
receive is always fixed.
/kft
34Lucent Technologies Inc.
Page 39
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
Questions and Answers (continued)
U-Interface (continued)
Q19: I need a way to generate a scrambled 2B1Q data
stream from the T7234 for test purposes (e.g.,
ANSI T1.601 Section 5.3.2.2, Total Power and
Section 7.2, Longitudinal Output Voltage). How
can I do this?
A19: A scrambled 2B1Q data stream (the “SN1” signal
described in ANSI T1.601 Table 5) can be generated by pulling ILOSS
Q20: We are trying to do a return loss measurement on
the U-interface of the T7234 per ANSI T1.601
Section 7.1. We are using a circuit similar to the
one you recommend in the data sheet. We have
observed the following. When the chip is in FULL
RESET mode (powered on but no activity on the
U- or S/T-interfaces), the return loss is very low,
i.e., the termination impedance appears to be
very large relative to 135 Ω and falls outside the
boundaries of Figure 19 of ANSI T1.601. However, if we inject a 10 kHz tone before making a
measurement, the return loss falls within the template. Why is it necessary to inject the 10 kHz
tone in order to get this test to pass? Shouldn’t a
135 Ω impedance be presented to the network
regardless of the state of the T7234 once it is
powered on?
A20: The return loss is only relevant when the trans-
mitter section is powered on. When the transmitter is powered, it presents a low-impedance
output to the U-interface. The transmitter m ust be
held in this low-impedance state when the return
loss and longitudinal balance tests are performed. This can be accomplished by pulling
RESET
low, the transmitter is held in a low-impedance
state where each of its differential outputs drives
DV. In this state, it is prevented from transmitting
any 2BIQ data and won’t respond to any incoming wakeup tones. This is different than the ANSIdefined FULL RESET state that the chip enters
after power-on or deactivation. In FULL RESET,
the transmitter is powered down and in a highimpedance state, with only the tone detector
powered on and looking for a far-end wakeup
tone. The transmitter powers down when in FULL
RESET state to save power and maximize the
tone detector sensitivity. The reason that the chip
behaves as it does in your tests is that your test
begins with the transmitter in its FULL RESET
state, causing the return loss to be very low. If a
10 kHz signal is applied, the tone detector
low (pin 43). With the RESET pin held
(pin 6) low on the T7234.
senses the applied signal and triggers. This
causes the transmitter to enter its low-impedance
state, where it will remain until the T7234 start-up
state machine times out (typically within 1.5 seconds, depending on the signal from the far end).
Q21: What are the average cold start and warm start
times?
A21: Lab measurements have shown the average cold
start time to be about 3.3 s—4.2 s over all loop
lengths, and the average warm start time to be
around 125 ms—190 ms over all loop lengths.
Q22: What is the U-interface’s response time to an
incoming wakeup tone from the LT?
A22: Response time is about 1 ms.
Q23: What is the minimum time for a U-interface
reframe after a momentary (<480 ms) loss of synchronization?
A23: Five superframes (60 ms).
Q24: Where is the U-interface loopback 2 (i.e., eoc
2B+D loopback) performed in the T7234?
A24: It is performed just inside the chip at the S/T-inter-
face. The S/T receiver is disconnected internally
from the chip pins, and the S/T transmit signal is
looped back to the receiver inputs so the S/T section synchronizes to its own signal. This ensures
that as much of the data path as possible is being
tested during the 2B+D loopback.
Q25: Are the embedded operations channel (EOC) ini-
tiated B1 and B2 channel loopbacks transparent?
A25: Yes, the B1 and B2 channel loopbacks are trans-
parent, as is the 2B+D loopback.
Q26: How can proprietary messages be passed across
the U-interface?
A26: The embedded operations channel (EOC) pro-
vides one way of doing this. ANSI standard
T1.601 defines 64 8-bit messages which can be
used for nonstandard applications. They range in
value from binary 00010000 to 01000000.
There is also a provision for sending bulk data
over the EOC . Setting the data/message indicator
bit to 0 indicates the current 8-bit EOC word contains data that is to be passed transparently without being acted on. Note that there is no
response time requirement placed on the NT in
this case (i.e., the NT does not have to echo the
message back to the LT). Also note that this is
currently only an ANSI provision and is not an
ANSI requirement. The T7234 does support this
provision.
Q27: What is the value of the ANSI T1.601 cso and nib
bits in the 2B1Q frame?
A27: cso and nib are fixed at 0 and 1, respectively, by
the device. This is because the device alwa ys has
warm start capability (CSO = 0), and NT1s are
required to have nib = 1 per T1.601-1992.
Q28: It looks like the U-interface sai and act bits that
the T7234 transmits towards the LT always track
one another. If this is the case, I don’t understand
why they are both needed. Can you explain the
purpose of the sai bit and how it relates to the act
bit?
A28: The sai bit is equal to 1 when there is activity
(INFO 1 or INFO 3) on the S/T-interface. The act
bit is 1 whenever layer 1 transparency is established. Most of the time these bits are the same,
but there are two situations where they will be different.
1. The sai bit can be used in conjunction with the
uoa bit from the LT to support DSL-only activation as described in the ANSI and ETSI standards. The LT can request a U-only activation
by setting uoa = 0, which will cause the S/Tinterface to remain in a deactivated state. If the
TE requests an activation under these conditions by transmitting INFO 1 to the T7234, the
sai bit will change from 0 to 1, indicating to the
LT that there is activity on the S/T-interface so
that the LT can respond accordingly. Typically,
this means that LT will set uoa = 1 to exit the
DSL-only condition so that layer-1 transparency can be established from TE to LT. Thus, in
the case of a DSL-only activation, the T7234's
sai bit is 1 and its act bit is 0 from the time a TE
requests an activation until the following
events occur:
A. LT sets uoa = 1 towards the NT.
B. The T7234 detects uoa = 1 and transmits
INFO 2 on the S/T-interface.
2. If a link is fully active, then the LT detects a
transition of the NT act bit from 1 to 0, it is an
indication of loss of layer-1 transparency. This
can be caused by either (a) S/T loss of sync or
(b) NT1 received INFO 0. Case (a) will result in
an act = 0/sai = 1 combination, i.e., S/T sync is
lost but there is still activity on the S/T-interface, meaning the TE is having trouble staying
synchronized. Case (b) will result in an act = 0/
sai = 0 combination, i.e., no activity on the S/Tinterface (INFO 0), meaning the TE has been
disconnected (there is no way the TE can legally send INFO 0 when the link is fully active
because the TE is not allowed to initiate deactivation—only the LT is—so the only other possibility is that it has been disconnected or has
failed). Note that this procedure allows the CO
to determine whether the cause of loss of
layer-1 transparency is a TE that is having synchronization problems or a TE that has been
disconnected, based on the state of the sai bit
when act = 0.
The ANSI T1.601 and ETSI ETR 080 standards contain finite state matrices that describe DSL-only operation. The T7234 follows
the behavior described in the matrices. Refer
to those tables for detailed information on each
of the states.
S/T-Interface
Q29: What is the S/T transformer’s inductance?
A29: For Lucent transformers 2768A or 2776, a mini-
mum inductance of 22 mH is guaranteed.
Q30: Can the S/T-interface leads be short-circuited
together without harming the device?
A30: Yes, this will not cause any harm to the device.
Q31: What is the common-mode rejection of the S/T
receiver?
A31: The common-mode rejection of the S/T receiver
is 400 mV. Refer to the Electrical Characteristics
described in the data sheet.
C. The TE synchronizes and transmits INFO
3 on the S/T-interface.
D. Upon reception of the INFO 3 signal, the
T7234 sets act = 1.
36Lucent Technologies Inc.
Page 41
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
Questions and Answers (continued)
S/T-Interface (continued)
Q32: I notice that the application note entitled Design
an S/T Line Interface Circuitry Using the T7250C/
T7259 recommends relays on both the transmitter and receiver outputs that disconnect the
device when power is removed from the chip. Is
this necessary for an NT using the T7234?
A32: The relay on the TE transmitter output is neces-
sary to pass the peak current test (ITU-T I.430
Section 8.5.1.2 and ANSI T1.605-1991, section
9.5.1.2) when the TE is powered down. For the
NT, there is no equivalent test, so the relay is not
necessary. The relay on the TE receiver input is
also necessary to pass the peak current test
(ITU-T I.430 Sections 8.5.1.2 and 8.6.1.1, and
ANSI T1.605-1991 Sections 9.5.1.2 and 9.6.1.1).
For the NT, however, there is enough margin in
the line interface capacitance circuitry such that
the peak current requirement (ITU-T I.430 Section 8.6.1.2 and ANSI T1.605-1991 Section
9.6.1.2) can be met without using relays. This
assumes, of course, that sound layout practices
have been applied to keep parasitic capacitance
of the line interface circuitry to a minimum (of primary importance is making sure there is no
ground plane under the S/T line interface). The
reason the TE needs a rela y on its receiv er is that
the TE tests assume a 350 pF cord connected to
the line, and this extra capacitance can cause the
peak current requirement to be exceeded. So
even though the NT peak current requirement
is slightly more stringent (0.5 mA as opposed to
0.6 mA), the TE peak current test is the most difficult to meet due to the 350 pF cord capacitance.
Q33: The T7234 reference design in Figure 12 shows
100 Ω termination resistors in parallel with a second pair of optional 100 Ω resistors that can be
inserted or removed by installing/removing jumpers from JMP1 and JMP2. What is the purpose of
this second pair of resistors?
A33: Typically, a TE or group of TEs connected to an
NT1 will have a 100 Ω termination located at the
interface point of the TE farthest from the NT1
(refer to ITU-T I.430 Figure 2 and Section 4 or
T1.605 Figure 2 and Section 5). However, in
some cases it may be desirable to operate an
NT1 with a TE that does not provide the 100 Ω
termination impedance. In this case, the provisional 100 Ω resistors shown in Figure 12 may be
installed to provide the extra termination impedance required.
Q34: I would like to integrate a T7234-based NT1 onto
both a T7250C-based 4-wire TE product and a
T7903-based 4-wire TE product in order to provide a U-interface on these products. I realize this
can be done by simply incorporating my external
NT1 design directly onto the TE board, but is
there a simpler approach in which I can avoid
having two sets of S/T transformers and associated line interface circuitry?
A34: Yes. First note Figures 17, 18, and 19, which
show examples S/T line interface circuits for the
T7234, T7903, and T7250C, respectively. If no
external S/T-interface connection is required, the
T7234 can be directly connected to the T7903
and T7250C as shown in Figures 20 and 21. If
there is a requirement for connecting external
TEs, the circuits shown in Figures 22 and 23 can
be used. These two circuits show a hybrid
scheme in which a direct connect between the
T7234 and T7903/T7250C is implemented while
providing for an external S/T-interface (thus
requiring only one set of S/T transformers rather
than the two sets that would be required if the
T7234 and T7903/T7250C were transformer-coupled to one another instead directly connected).
The direct connect circuits were derived as
shown in Figures 20 and 21 and the following te xt
sections:
Note: In all of these analyses, the final value of
resistance chosen may be slightly different than the ideal value computed
because standard resistance values
were used.
T7903/T7250C Transmit to T7234 Receive
a) Transmitter Load:
T7903: The line interface transformer has a
turns ratio of 2.0, and the transmitter drives a
total line-side load of 50 Ω. Reflecting this
impedance to the device side of the transformer results in 200 Ω (50 Ω x N
resistance, combined with the 40 Ω total
resistance of the device-side resistors,
results in a total of 240 Ω that the transmitter
typically drives.
So, to optimize the transmitter part of the circuit based on the load the transmitter expects
to drive, the transmitter should see a total
resistance of approximately 240 Ω.
T7250C: The line interface transformer has a
turns ratio of 2.5, and the transmitter drives a
line-side load of 50 Ω. Reflecting this imped-
ance to the device side of the transformer
results in 312.5 Ω (50 Ω x N
tance, combined with the 113 Ω total resistance of the device-side resistors, results in a
total of 425.5 Ω that the transmitter typically
drives. So, to optimize the transmitter part of
the circuit based on the load the transmitter
expects to drive, the transmitter should see a
total resistance of approximately 425 Ω.
b) Receiver Levels:
The T7234 S/T line interface transformer has
a turns ratio of 2.5. The receiver expects to
see nominal pulse levels of 750 mV x 2.5 =
1.875 V.
T7903: The transmitter circuit is a current
source of 7.5 mA. To generate a voltage of
1.875 V with 7.5 mA requires a resistance of
1.875/0.0075 = 250 Ω.
T7250C: The transmitter circuit is a current
source of 6 mA. To generate a voltage of
1.875 V with 6 mA requires a resistance of
1.875/0.006 = 312.5 Ω.
2
). This resis-
CHIP PIN
transmitter drove 6 mA through 312.5 Ω. So,
the total transmit path resistance should be
divided into three resistors. The first is the
resistor across which the receiver is connected and should be approximately 312.5 Ω
so that the receiver sees the correct levels. A
standard 309 Ω value is adequate for this
case. The remainder of the 425 Ω should be
divided equally between two other series
resistors in the transmit path, and (425 Ω –
309 Ω)/2 is 58.0 Ω, so a standard 57.6 Ω
value is chosen for the two other series resistors as illustrated in Figure 21.
d) Receiver Bias:
Normally, the transmitter of theT7903/
T7250C is biased at 5 V through 100 kΩ pullup, and the receiver of the T7234 is biased at
2.16 V through a resistor network that can be
simplified as shown in Figure 16 (A). When
the direct-connect scheme is implemented,
the resulting network between the T7903/
T7250C transmitter and the T7234 receiv er is
as shown in Figure 16 (B).
5 V
100 kΩ
CHIP PIN
10 kΩ100 kΩ
CHIP PIN
100 kΩ
5 V
30 kΩ
2.16 V
23 kΩ
5 V
30 kΩ
2.33 V
23 kΩ
c) Resistor Selection:
In this section, the term receiver implies not
only the receive section on the chip, but also
the external 10 kΩ resistors connected to the
(A)(B)
5-4726
Figure 16. Receiver Bias
receiver. These resistors remain unchanged
from the standard line interface circuit in
order to maintain the same total receiver
impedance.
T7903: Ideally, the transmitter should be driving into 240 Ω, and the T7234 receiv er wants
to see the levels that would result if the transmitter drove 7.5 mA through 250 Ω. Since
these resistance values are so close, 249 Ω
is chosen as the resistor across which the
receiver is connected, and no other series
Note that the receiver bias in Figure 16 (B) is
increased to 2.33 V (from 2.16 V in Figure 16
(A)). This is an increase of about 8% (0.67 dB).
This will decrease the overall receiver sensitivity
slightly. Normally, the receiver must have a sensitivity to signals down to –7.5 dB of nominal.
Therefore, in the case of a direct connect, the
sensitivity is not an issue since the receiver will
always see a large input signal.
resistance is needed in the transmit path, as
Figure 20 illustrates.
T7250C: Ideally, the transmitter should be
driving into 425 Ω, and the T7234 receiver
wants to see the lev els that would result if the
38Lucent Technologies Inc.
Page 43
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
Questions and Answers (continued)
S/T-Interface (continued)
A34: (continued)
T7234 Transmit to T7903/T7250C Receive
a) Transmitter Load:
The T7234 S/T line interface transformer has
a turns ratio of 2.5, and the transmitter drives
a line-side load of 50 Ω. Reflecting this imped-
ance to the device side of the transformer
results in 312.5 Ω (50 Ω x N
tance, combined with the 242 Ω total resistance of the device-side resistors, results in a
total of 554.5 Ω that the transmitter typically
drives. So, to optimize the transmitter part of
the circuit based on the load the transmitter
expects to drive, the transmitter should see a
total resistance of approximately 554.5 Ω.
b) Receiver Levels:
T7903: The S/T line interface transformer has
a turns ratio of 2.0. The receiver expects to
see nominal pulse levels of 750 mV x 2.0 =
1.5 V . The T7234 transmitter circuit is a current
source of 6.0 mA. To generate a voltage of
1.5 V with 6.0 mA requires a resistance of
1.5/0.006 = 250 Ω.
2
). This resis-
connected and should be approximately
250 Ω so that the receiver sees the correct
levels . A standard 249 Ω value is adequate f or
this case. The remainder of the 554.5 Ω
should be divided equally between two other
series resistors in the transmit path, and
(554.5 Ω – 249 Ω)/2 is 152.7 Ω, so 150 Ω is
chosen for the two other series resistors as
illustrated in Figure 20.
T7250C: Ideally, the T7234 transmitter should
be driving into 554.5 Ω, and the T7250C
receiver wants to see the levels which would
result if the transmitter drove 6 mA through
312.5 Ω. So, the total transmit path resistance
should be divided into three resistors. The first
is the resistor across which the receiver is
connected and should be approximately
312.5 Ω so that the receiver sees the correct
levels . A standard 309 Ω value is adequate for
this case. The remainder of the 554.5 Ω
should be divided equally between two other
series resistors in the transmit path, and
(554.5 Ω – 309 Ω)/2 is 122.6 Ω, so 121 Ω is
chosen for the two other series resistors as
illustrated in Figure 21.
d) Receiver Bias:
The receiver bias is not an issue for the same
reasons discussed in the T7903/T7250C
Transmit to T7234 Receive section.
T7250C: The S/T line interface transformer
has a turns ratio of 2.5. The receiver expects
to see nominal pulse levels of 750 mV x 2.5 =
1.875 V. The T7234 transmitter circuit is a current source of 6.0 mA. To generate a voltage
of 1.875 V with 6.0 mA requires a resistance
of 1.875/0.006 = 312.5 Ω.
c) Resistor Selection:
In this section, the term receiver implies not
only the receive section on the chip, but also
the external 10 kΩ resistors connected to the
receiver. These resistors remain unchanged
from the standard line interface circuit in order
to maintain the same total receiver impedance.
T7903: Ideally, the T7234 transmitter should
be driving into 554.5 Ω, and the T7903
receiver wants to see the levels that would
result if the transmitter drove 6 mA through
250 Ω. So, the total transmit path resistance
should be divided into three resistors. The first
is the resistor across which the receiver is
T7903/T7250C to T7234 Direct Connect with
External S/T-Interface Provided
First, we need to address the issue of the transformer turns ratio.
T7903: The T7903 uses a 2.0:1 transformer, and
the T7234 uses a 2.5:1 transf ormer . It is desir able
to be able to use a dual transformer, so we want
the transmit- and receive-side transformers to
have the same turns ratio. Also, it may be desirable to use a product with this arrangement as
just a TE (with an external NT1, i.e., no U-interface connected to the integrated NT1). Theref ore ,
we will select a 2.0:1 turns ratio transformer to
ensure T7903 pulses of sufficient amplitude on
the line side of the transformer and ensure that
an external transmitter won’t overdriv e the T7903
receiver inputs.
T7250C: The T7250C and T7234 both use a
2.5:1 transformer, which simplifies the analysis
for this case.
If we use the same S/T-transmitter line interface circuit as in the normal (stand-alone TE)
case, the transmitter will see the load that it
expects to drive and is thus optimized in terms
of the load. The 100 Ω terminations must be
user selected per the following table:
ConfigurationJMP1JMP2
Integrated NT1 Used as NT1
(No External NT1 Connected)
No External TE
Connected
Unterminated
External
TE Connected
Terminated (100 Ω)
External TE
Connected
b) Receiver Levels:
The T7234 S/T line interface transformer has
a turns ratio of 2.5. The T7234 receiver thus
expects to see nominal pulse lev els of 750 mV
x 2.5 = 1.875 V at the device side of the transformer.
InstalledInstalled
InstalledInstalled
InstalledNot
Installed
in a short passive bus (SPB) mode when
using the onboard NT1, because there is a
local TE (the T7903), so any external TE that
is also used will result in a passive bus configuration. ITU-T I.430 states that the maximum
attenuation in SPB configuration is 3.5 dB.
Combining this with the inherent 1.9 dB attenuation results in a total possible signal attenuation of 5.4 dB. The receiver must have a
sensitivity of at least 7.5 dB per ITU-T I.430
Section 8.6.2.3, so 5.4 dB attenuation will
present no problem in this case.
T7250C: The T7250C transmitter (or an external TE on a 0-length loop) will drive 750 mV
pulses on the S/T line, and that voltage
reflected back to the device side of the transformer is 750 mV x 2.5 = 1.875 V. If theT7234
receiver is connected to the device side of the
transformer as shown in Figure 23, it will see
the 1.875 V pulse level it expects when a
750 mV pulse is present on the line.
c) Receiver Bias:
In the T7903 to T7234 Direct-Connect section
we showed that the receiver is biased by
about 0.67 dB from nominal due to the direct
connect of the T7903 to the T7234. Assuming
the receiver sensitivity decreases by this
much and combining this with the maximum
5.4 dB attenuation found in the previous section results in a total of 6.07 dB of required
sensitivity, which is still within the 7.5 dB
requirement on the receiver.
T7234 T ransmit to T7903/T7250C Receive
T7903: The T7903 transmitter (or an external
TE on a 0-length loop) will drive 750 mV
pulses on the S/T line, and that voltage
reflected back to the device side of the transformer is 750 mV x 2.0 = 1.5 V. If the T7234
receiver is connected to the device side of the
transformer as shown in Figure 22, it will see
1.5 V instead of 1.875 V when a 750 mV pulse
is present on the line. Thus, there is an inherent pulse attenuation in this scheme of 1.9 dB
at the T7234 receiver.
We need to be sure that the receiver will ha ve
adequate sensitivity to detect pulses from an
external TE that is some distance a way. Referring to ITU I.430, this circuit can only be used
40Lucent Technologies Inc.
a) Transmitter Load:
The T7234 S/T line interface transformer normally has a turns ratio of 2.5, and the transmitter drives a line-side load of 50 Ω.
Reflecting this impedance to the device side
of the transformer results in 312.5 Ω (50 Ω x
2
). This resistance, combined with the
N
242 Ω total resistance of the device-side
resistors, results in a total of 554.5 Ω that the
transmitter typically drives. So, to optimize the
transmitter part of the circuit based on the
load the transmitter expects to drive, the
transmitter should see a total resistance of
approximately 554.5 Ω.
Page 45
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
Questions and Answers (continued)
S/T-Interface(continued)
A34: (continued)
T7903: In this case, the T7234 transmitter is
driving into a transformer with a turns ratio of
2.0. The pulse amplitude that the transmitter
must generate on the device side of the transformer is 1.5 V (resulting in a 750 mV pulse on
the line in accordance with the standards).
The T7234 transmitter circuit is a current
source of 6.0 mA. To generate a voltage of
1.5 V with 6.0 mA requires a resistance of
1.5/0.006 = 250 Ω, which is 62.5 Ω when
reflected to the device side of the transf ormer .
This impedance should consist of jumperselectable 100 Ω and 167 Ω resistors as illustrated in Figure 22. The table below lists the
jumper settings for each possible configuration.
The total impedance the T7234 must drive
(from the first paragraph of this section) is
554.5 Ω, and the impedance across the trans-
former leads is 250 Ω (from the second paragraph). The remaining 554.5 – 250 = 304.5 Ω
is divided equally between the positive and
negative transmitter outputs, requiring 152 Ω
in each leg. We can accomplish this with a
143 Ω resistor on the device side of the diode
bridge and a 10 Ω resistor on the line side of
the bridge. The resistance is split in this w ay to
provide 10 Ω of current limiting through the
diode bridge when the bridge is conducting
(similar to the T7903 transmitter circuit).
ConfigurationJMP3JMP4
Integrated NT1 Used as NT1
(No External NT1 Connected)
No External TE
Connected
Unterminated
External TE Connected
Terminated (100 Ω)
External TE Connected
InstalledInstalled
InstalledInstalled
InstalledNot
T7250C: Referring to Figure 23, if we use the
same T7234 S/T transmitter line interface circuit
as in the normal (stand-alone NT) case, the
T7234 transmitter will see the 554.5 Ω load that it
normally expects to drive and is thus optimized in
terms of the load. The 100 Ω terminations shown
are user selected per the preceding table.
b) Receiver Levels:
The T7903 will see the correct pulse levels
by design. In the preceding section, the T7234
transmit circuit was designed to produce
750 mV pulses on the line. The T7903
receiver is attached directly to the device side
of the transformer, so it will see the 1.5 V
pulse levels that it expects to see.
T7903: The T7903 S/T line interface transformer has a turns ratio of 2.0. The T7903
receiver thus expects to see nominal pulse
levels of 750 mV x 2.0 = 1.5 V at the device
side of the transformer. The T7234 transmitter
section was designed to produce 750 mV
pulses on the S/T line (as would an external
TE on a 0-length loop). That voltage reflected
back to the device side of the T7901 transformer is 750 mV x 2.0 = 1.5 V, so the T7901
sees the pulse level it e xpects when a 750 mV
pulse is present on the line.
T7250C: The T7250C S/T line interface transformer has a turns ratio of 2.5. The T7250C
receiver thus expects to see nominal pulse
levels of 750 mV x 2.5 = 1.875 V at the device
side of the transformer. The T7234 transmitter
section was designed to produce 750 mV
pulses on the S/T line (as would an external
TE on a 0-length loop). That voltage reflected
back to the device side of the T7250C transformer is 750 mV x 2.5 = 1.875 V, so the
T7250C sees the pulse level it e xpects when a
750 mV pulse is present on the line.
c) Receiver Bias:
The receiver bias is sufficiently small that it is
not an issue (see preceding sections).
* Refer to the T7250 data sheet, Figure F-10 for an example of a switch circuit that can be used here.
D6
6.8 V
ZD2
46.5 Ω
Figure 23. T7250C to T7234 Direct-Connect Scheme with External S/T-Interface
JMP4
100 Ω
5-4727
46Lucent Technologies Inc.
Page 51
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
Questions and Answers (continued)
S/T-Interface (continued)
Q35: In the Analog Interface section of the S/T-inter-
face description in the data sheet, where does
the value of 0 ms—3.1 ms maximum differential
delay in adaptive timing mode come from?
A35: The minimum value of 0 ms is necessary so that
the NT's transmitter and receiver can be directly
connected in a loopback and still synchronize.
The maximum value of 3.1 ms comes about
because the window size needed in the adaptive
timing algorithm is 2.1 ms. The window size is the
time during each bit period in which no transitions
may occur. Since a period is 5.2 ms, the time during which there may be transitions is 5.2 ms –
2.1 ms, or 3.1 ms. This is the same as the maximum differential delay, since the earliest and latest bit transitions represent the nearest and
farthest TEs relative to the NT receiver.
Miscellaneous
quency to be adjusted to compensate for board
parasitics. Can this be done with the T7234 crystal? Also, can we use a crystal from our own
manufacturer?
A38: For the T7234, these capacitors are located on
the chip, so their values are fixed. The advantage
to this is that no external components are
required. The disadvantage is that board parasitics must be very small. The Crystal Characteristics section of the data sheet notes that the board
parasitics must be within the range of 0.6 pF ±
0.4 pF.
Q39: I plan to program the T7234 to output 15.36 MHz
from its CKOUT pin. Is this clock a buffered version of the 15.36 MHz oscillator clock? I am concerned that if it is not buffered, the capacitive
loading on this pin could affect the system clock
frequency.
A39: The 15.36 MHz output is a buffered version of the
XTAL clock and therefore hanging capacitance
on it will not affect the T7234’s system clock frequency.
Q40: How does the filtering at the OPTOIN input work?
Q36: Is the ±100 ppm free-run frequency recommen-
dation met in the T7234?
A36: In the free-run mode, the output frequency is pri-
marily dependent on the crystal, not the silicon
design. For low-cost crystals, initial tolerance,
temperature, and aging effects may account for
two-thirds of this budget, and just a couple of pF
of variation in load capacitance will use up the
rest; therefore, the ±100 ppm goal can be met if
the crystal parameters are well controlled. See
the Crystal Characteristics section in this data
sheet.
Q37: What happens if Co and Cm of the crystal differs
from the specification shown in the Crystal Characteristics table?
A37: None of the parameters should be varied. We
have not characterized any such crystals, and
have no easy method of doing so. A crystal
whose parameters deviate from the requirements
may work in most applications but fail in isolated
cases involving certain loop configurations or
other system variations. Therefore, customers
choosing to vary any of these parameters do so
at their own risk.
Q38: It has been noted in some other designs that the
crystal has a capacitor from each pin to ground.
Changing these capacitances allows the fre-
A40: The signals applied to OPTOIN are digitally fil-
tered for 20 ms. Any transitions under 20 ms will
be ignored.
Q41: What is the isolation voltage of the 6N139
optoisolator used in the dc termination circuit of
the T7234?
A41: 2500 Vac, 1 minute.
Q42: Can the T7234 operate with an external
15.36 MHz clock source instead of using a crystal?
A42: Yes, by leaving X1 disconnected and driving X2
with an external CMOS-level oscillator.
Q43: What is the effect of ramping down the power-
supply voltage on the device? When will it provide
a valid reset? This condition can occur when a
line-powered NT1’s line cord is repeatedly
plugged in and removed and plugged in again
before the power supply has had enough time to
fully ramp-up.
A43: The device’s reset is more dependent on the
RESET pin than the power supply to the device.
As long as the proper input conditions on the
RESET pin (see Table 12) are met, the device will
have a valid reset. Note that this input is a
Schmitt-trigger input.
Q44: Is there a recommended method for powering the
T7234? For example, is it desirable to separate
the power supplies, etc.?
A44: The T7234 is not extremely sensitive to power-
supply schemes. Following standard practices of
decoupling power supplies close to the chip and,
if power and ground planes are not used, keeping
power traces away from high-frequency signals,
etc., should yield acceptable results. Separating
the T7234 analog power supplies from the digital
power supplies near the chip may yield a small
improvement, and the same holds true for using
power and ground planes vs. discrete traces.
Note that if analog and digital power supplies are
separated, the crystal power supply (V
should be tied to the digital supplies (VDDD).
See the SCNTI Family Reference Design Board
Hardware User Manual (MN96-011ISDN),
Appendix A for an example of a board layout that
performs well.
Q45: What are the filter characteristics of the PLL at
the NT?
A45: The –3 dB frequency is approximately 5 Hz,
peaking is about 1.2 dB.
Q46: Can the T7234 operate in the LT mode?
A46: No, the T7234 is optimized for the NT side of the
loop and cannot operate in the LT mode.
Q47: Can you provide detailed information on the
active and idle power consumption of the T7234?
A47: The IDLE power of the T7234 is typically 35 mW.
The IDLE power will be increased if CKOUT or
the TDM highway are active. The discussion
below presents accurate numbers for adding in
the effects of CKOUT and the TDM highway.
When considering active power measurement figures, it is important to note that the conditions
under which power measurements are made are
not always completely stated by 2B1Q IC vendors. For example, loop length is not typically
mentioned in the context of power dissipation, y et
power dissipation on a short loop is noticeably
greater than on a long loop. There are two reasons for the increased power dissipation at
shorter loop lengths:
1. The overall loop impedance is smaller, requiring a higher current to drive the loop.
DDO)
2. The far-end transceiver is closer, requiring the
near-end transceiver to sink more far-end current in order to maintain a virtual ground at its
transmitter outputs.
The following lab measurements provide an
example of how power dissipation varies with
loop length for a specific T7234 with its
15.36 MHz CKOUT output disabled (see the fol-
lowing table for inf ormation on CK OUT). Note that
power dissipation on a 0-length loop (the worstcase loop) is about 35 mW higher than on a loop
of >3 kft length—a significant difference. Thus,
loop length needs to be considered when determining worst-case power numbers.
* This is the configuration used by some IC manufacturers.
Also, in the case of the T7234, the use of the output clock CK OUT (pin 17) needs to be considered
since its influence on power dissipation is significant. Some applications may make use of this
clock, while others may leave it 3-stated. The
power dissipation of CKOUT is shown in Table
14.
Table 14. Power Dissipation of CKOUT
CKOUT
Frequency
(MHz)
15.3621.311.0
10.2417.79.1
Another factor influencing power consumption is
the S/T-interface data pattern. For e xample, when
transmitting an INFO 4 pattern with all 1s data in
the B and D channels, the power consumption is
25 mW lower than it is when transmitting INFO 2,
because INFO 2 is worst case in terms of the
amount of +0 and –0 transitions, and INFO 4 is
best case if the data is all 1s. A typical number
would lie about midway between these two.
Power Due to
CKOUT 40 pF
Load (mW)
278
Power Due to
CKOUT No
Load (mW)
48Lucent Technologies Inc.
Page 53
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
Questions and Answers (continued)
Miscellaneous (continued)
A47: (continued)
Therefore, it is apparent that the conditions under which power is measured must be clearly specified. The
methods Lucent has used to evaluate typical and worst-case power consumption are based on our commitment to provide our customers with accurate and reliable data. Measurements are performed as part of the
factory test procedure using automated test equipment. Bench top tests are performed in actual T7234based systems to correlate the automated test data with an actual implementation. A conservative margin is
then added to the test results for publication in our data sheets.
The following table pro vides pow er-consumption data f or se ver al scenarios so that knowledgeable customers
can fairly compare transceiver solutions. A baseline scenario is presented in the Case 1 column, and then
adders are listed in the Cases 2—6 columns to account for the worst-case condition listed in each column so
that an accurate worst-case figure can be determined based on the conditions that are present in a particular
application. Note that the tests were run at 5 V, so changes in the supply voltage will change the power
accordingly.
Table 15. Power Consumption
VariablesBaselineAdders
Case 1Case 2Case 3Case 4Case 5
Loop Configuration>3 kft,
0 kft*———
26 awg
S/T StateINFO 4 with
—
INFO 2
†
——
all 1s data
CKOUT, MHz
(40 pF load)
‡
3-stated——15.36—
Temperature (°C)25———85
Typical Power Consumption (mW)2543526225
* Some 2B1Q silicon vendors specify power using a configuration in which the IC is active and transmitting into a 135 Ω termination,
with no far-end transmitter attached. This configuration would cause an increase of 9 mW over the Case 1 column, instead of the
35 mW shown here. This highlights the importance of specifying measurement conditions accurately when making comparisons
between chip vendors' power numbers.
† This is a worst-case number representing the state of the S/T-interface where the most +0/–0 transitions occur. In a real application,
this will be a transient state, as INFO 4 will occur as soon as synchronization is achieved. The average power consumed during a typical INFO 4, assuming a 50% mix of 1s and 0s in the B and D channels, would be approximately half this number, or 13 mW.
‡ See the preceding table for a comparison of power dissipation with negligible capacitive loading on CKOUT. The 40 pF figure chosen
here is intended to represent a worst-case condition.
A48: If the T7234 S/T-interface is operating over a long
loop that is outside the range specified in the
I.430/T1.605 standard, the T7234 may go into a
state where it is constantly going in and out of
synchronization. This causes it to cycle between
ANSI states H7 and H8, producing STLED state
changes between 1 Hz flashing and always on.
When the S/T-interface loses synchronization, it
takes about 96 ms before synchronization can be
reacquired. This 96 ms cycle, coupled with the
STLED switching from alwa ys on to 1 Hz flashing,
can appear as 11 Hz or sporadic flashing,
depending on how frequently S/T synchronization
is being lost.
Either of these states could cause potential confusion to maintenance personnel in the event that
a T7234-based NT1 is connected to an S/T loop
that is longer than permitted by the standards.
For example, an 11 Hz rate is difficult to visually
distinguish from the 8 Hz rate, but the 11 Hz case
indicates a problem on the S/T-interface and the
8 Hz case indicates a problem on the U-interface.
To troubleshoot the STLED indication, unplug the
S/T connector and repower the T7234 and initiate
a start-up on the U-interface. If there is no problem on the U-interface, the STLED will reach a
1 Hz flashing state and remain there, indicating
that the fast flashing was a result of S/T-interface
problems.
A49: Yes it should. Referring to the STLED Control
Flow diagram in Figure 10 of this data sheet, it
appears as though you may be receiving aib = 0
from the upstream U-interface element. This will
cause the behavior you are seeing.
Q50: We are testing out T7234-based equipment
against an Lucent SLC Series 5, and performance seems OK except that we get a burst of
errors, and even drop calls, approximately every
15 minutes. Can you explain why?
A50: Check to make sure that your equipment is set-
ting the ps1/ps2 power status bits correctly. The
SLC equipment monitors the ps1/2 bits and, if
they are both zero (meaning all power is lost), it
assumes that there is some sort of terminal error,
since this is not an appropriate steady-state value
for ps1/2. When this condition is detected, the
SLC deactivates and reactivates the line approximately every 15 minutes. This causes the symptoms you describe.
Q51: When I try to activate our T7234-based NT1, it
appears as though the U-interface is synchronizing (i.e., STLED flashes at 1 Hz), but the S/Tinterface won’t activate , and there is not e v en any
signal activity on the S/T-interface (i.e., no INFO 1
or INFO 2). What might the problem be?
A51: The behavior you have observed can be caused
if the uoa bit received on the U-interface from the
network is set to 0. This causes the T7234 to activate the U-interface only, keeping the S/T-interface quiet, per the ANSI and ETSI standards. W e
have heard of some network equipment that
incorrectly sets this bit low.
Q49: The STLED on my T7234-based NT1 behaves in
an unexpected way. When a start-up attempt is
received, it flashes at an 8 Hz rate. Then it
flashes briefly at 1 Hz, indicating synchronization
on the U-interface. This is expected. However,
after this, it starts flashing at 8 Hz, and yet it
appears as though the system is operating fine
(data is being passed end to end, etc.). Shouldn’t
the STLED signal be always low (i.e., ON) at this
point?
50Lucent Technologies Inc.
Page 55
Data Sheet
February 1998T7234 Single-Chip NT1 (SCNT1) Euro-LITE Transceiver
Glossary
ACTMODE/INT:Act bit mode, serial interface
microprocessor interrupt.
ACTR:Receive activation
(register CFR1, bit 0).
ACTSC:Activation/deactivation state
change on U-interface
(register UIR0, bit 1).
ACTSCM:Activation/deactivation state
change on U-interface interrupt
mask (register UIR1, bit 1).
ACTSEL:Act mode select (register
GR2, bit 6).
ACTT:Transmit activation (register
GR1, bit 4).
AFRST:Adaptive filter reset (register
CFR0, bit 1).
AIB:Alarm indication bit (register
CFR1, bit 6).
ANSI:American National Standards In-
stitute.
ASI:Alternate space inversion.
AUTOACT:Automatic activation control
(register GR0, bit 6).
AUTOCTL:Auto control enable
(register GR0, bit 3).
AUTOEOC:Automatic eoc processor
enable (register GR0, bit 4).
A[3:1]R:Receive eoc address (register
ECR2, bits 0—2).
A[3:1]T:Transmit eoc address
(register ECR0, bits 0—2).
BERR:Block error on U-interface
(register UIR0, bit 2).
BERRM:Block error on U-interface inter-
rupt mask (register UIR1, bit 2).
CFR1:Control flow state machine status
register.
CFR2:Control flow state machine
status—reserved bits register.
CKOUT:Clock output.
CODEC:Coder/decoder, typically used for
analog-to-digital conversions or
digital-to-analog conversions.
CRATE[1:0]:CKOUT rate control (register
GR0, bits 2—1).
CRC:Cyclic redundancy check.
DFR0:Data flow control—U and S/T
B-channels register.
DFR1:Data flow control—D-channels
and TDM bus register.
DMR:Receive eoc data or message in-
dicator (register ECR2, bit 3).
DMT:Transmit eoc data or message in-
dicator (register ECR0, bit 3).
DPGS:Digital pair gain system.
ECR0:eoc state machine control—ad-
dress register.
ECR2:eoc state machine status—ad-
dress register.
ECR3:eoc state machine status—infor-
mation register.
EMINT:Exit maintenance mode interrupt
(register MIR0, bit 2).
EMINTM:Exit maintenance mode interrupt
mask (register MIR1, bit 2).
EOC:Embedded operations channel.
EOCSC:eoc state change on U-interface
(register UIR0, bit 0).
EOCSCM:eoc state change on U-interface
mask (register UIR1, bit 0).
CCRC:Corrupt cyclic redundancy check
(register ECR0, bit 7).
CDM:Charged-device model.
CFR0:Control flow state machine con-
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rights under any patent accompany the sale of any such product(s) or information.