Datasheet T405Q-600H, T405Q-600B-TR Datasheet (SGS Thomson Microelectronics)

Page 1
®
T405Q-600B-TR & T405Q-600H
Sensitive 4Q 4A TRIAC
MAIN FEATURES
A2
Symbol Value Unit
I
T(RMS)
V
DRM/VRRM
I
GT
4A
600 V
5mA
A2
G
A1
A2
DESCRIPTION
G
DPAK (T4-B)
A1
A2
A1
IPAK
(T4-H)
The T405Q-600B-TR and the T405Q-600H 4 quadrants sensitive TRIACs are intended in gen­eral purpose applications where high surge cur­rent capability is required, such as irrigation systems. These TRIACs feature a gate current ca­pability sensitivities of 5mA.
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
I
T(RMS)
I
TSM
2
tI
I
dI/dt Critical rate of rise of on-state current
I
GM
P
G(AV)
T
stg
T
j
current (Full cycle, T
2
t Value for fusing tp = 10 ms 6 A2s
initial = 25°C )
j
F = 50Hz t = 20ms 35 A F = 60Hz t = 16.7ms 38
Repetitive F = 100 Hz 50 A/µs
=2xIGT,tr100ns
I
G
Peak gate current tp = 20µs Tj= 125°C 4 A Average gate power dissipation Tj = 125°C 0.5 W Storage junction temperature range
Operating junction temperature range
-40to+150
-40to+125
G
A2
°C
July 2002 - Ed: 1A
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Page 2
T405Q-600B-TR & T405Q-600H
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
Symbol Test Conditions Quadrant T405Q Unit
(1)
I
GT
VD=12V RL=30
I-II-III
IV
MAX. 5
10
mA
V
GT
V
GD
(2)
I
H
I
L
(2)
dV/dt (dV/dt)c
(2)
VD=V
DRMRL
=3.3kTj = 125°C ALL MIN. 0.2 V IT= 100mA MAX. 10 mA IG= 1.2I
VD=67% V
GT
Gate open Tj = 125°C MIN. 10 V/µs
DRM
(dI/dt)c = 1.8 A/ms Tj = 125°C MIN. 2 V/µs
ALL MAX. 1.3 V
I-III-IV
II
MAX. 10
15
STATIC CHARACTERISTICS
Symbol Test Conditions Value Unit
(2)
V
TM
V
TO
R
d
I
DRM
I
RRM
Note 1:MinimumIGT is guaranted at 5% of IGT max. Note 2: For both polarities of A2 referenced to A1.
ITM= 5 A tp = 380µs Tj = 25°C MAX. 1.5 V
(2)
Threshold voltage Tj = 125°C MAX. 0.85 V
(2)
Dynamic resistance Tj = 125°C MAX. 100 m V
DRM=VRRM
Tj = 25°C
Tj = 125°C
MAX 5
1
mA
mA
µA
THERMAL RESISTANCES
Symbol Parameter Value Unit
Rth(j-c) Junction to case (AC) 3 °C/W Rth(j-a) Junction to ambient S = 0.5 cm² DPAK 70 °C/W
IPAK 100
PRODUCT SELECTOR
Part Number Voltage Sensitivity Type Package
T405Q-600B-TR 600V 5 mA Sensitive DPAK
T405Q-600H 600V 5 mA Sensitive IPAK
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Page 3
ORDERING INFORMATION
T 4 05 Q - 600 B (-TR)
T405Q-600B-TR & T405Q-600H
TRIAC SERIES
Current: 4A
Sensitivity: 5mA (Q1-Q2-Q3) 10mA (Q4)
Number of quadrants: 4
OTHER INFORMATION
Part Number Marking Weight Base quantity Packing mode
T405Q-600B-TR T405Q600 0.3 g 2500 Tape & reel
T405Q-600H T405Q600 0.4 g 75 Tube
Package: B: DPAK H: IPAK
Voltage: 600V
Packing mode: Blank:Tube
-TR: DPAKTape &reel
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Page 4
T405Q-600B-TR & T405Q-600H
Fig. 1: Maximum power dissipation versus RMS
on-state current.
P(W)
5
α=180°
4
3
2
180°
1
I (A)T(RMS)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
α
α
Fig. 3: Relative variation of thermal impedance versus pulse duration.
K=[Zth/Rth]
1.E+00
Z
th(j-c)
1.E-01
Z
th(j-c)
Fig. 2: RMS on-state current versus case tem­perature.
I (A)T(RMS)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0 0 25 50 75 100 125
Tc(°C)
α=180°
Fig. 4: On-state characteristics (maximum val­ues).
I (A)TM
100
Tj=25°C
Tj=125°C
10
1.E-02
t (s)P
1.E-03
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Fig. 5:Surge peak on-state currentversusnumber
of cycles.
I (A)TSM
40
35
Repetitive
=110°C
T
C
Non repetitive T
initial=25°C
j
Number of cycles
30
25
20
15
10
5
0
1 10 100 1000
t=20ms
One cycle
Tjmax. :
= 0.85V
V
to
= 100 m
R
V (V)TM
1
012345678910
d
Fig. 6: Non repetitive surge peak on-state current
for a sinusoidal pulse with width tp<10ms, and corresponding value of I
I (A), I²t(A²s)TSM
1000
dI/dt limitation:
100
10
1
0.01 0.10 1.00 10.00
50A/µs
2
t.
tp(ms)
Tjinitial=25°C
I
TSM
I²t
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Page 5
T405Q-600B-TR & T405Q-600H
Fig. 7: Relative variation of gate trigger current,
holding current and latching current versus junc­tion temperature (typical values).
I , I ,I [Tj] / I , I , I [Tj = 25°C]GT H L GT H L
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130
IH& I
I
GT
L
Tj(°C)
Fig.9:Relative variation ofcriticalrate of decrease
of main current versus junction temperature.
(dI/dt)c [Tj] / (dI/dt)c [Tj = 125°C]
8
7
6
5
4
3
2
1
0
25 50 75 100 125
Tj(°C)
Fig.8:Relative variation ofcriticalrate of decrease
of main current versus reapplied dV/dt (typical val­ues).
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.1 1.0 10.0
(dV/dt)c (V/µs)
Fig. 10: Relative variation of static dV/dt immunity
versus junction temperature.
dV/dt [Tj] / dV/dt [Tj = 125°C]
8
7
6
5
4
3
2
1
0
25 50 75 100 125
Tj(°C)
VD=VR=400V
Fig. 11: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board FR4, Cu = 35µm).
Rth(j-a)(°C/W)
100
90 80 70 60 50 40 30 20 10
0
02468101214161820
S(cm²)
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Page 6
T405Q-600B-TR & T405Q-600H
PACKAGE MECHANICAL DATA
DPAK
DIMENSIONS
REF.
Millimeters Inches
Min. Max Min. Max.
A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212
C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397 L2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2
FOOTPRINT
6.7
6.7
3
3
1.61.6
2.32.3
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PACKAGE MECHANICAL DATA
IPAK
E
B2
H
L1
L
B6
G
L2
B3 B
V1
B5
T405Q-600B-TR & T405Q-600H
DIMENSIONS
REF.
A
C2
A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051
B 0.64 0.9 0.025 0.035 B2 5.2 5.4 0.204 0.212 B3 0.85 0.033
D
B5 0.3 0.035 B6 0.95 0.037
C 0.45 0.6 0.017 0.023
C2 0.48 0.6 0.019 0.023
A1
D 6 6.2 0.236 0.244
E 6.4 6.6 0.252 0.260
G 4.4 4.6 0.173 0.181 H 15.9 16.3 0.626 0.641
C A3
L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039 V1 10° 10°
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
Informationfurnished is believedto be accurate andreliable. However, STMicroelectronicsassumes no responsibility forthe consequences of useof such informationnor for anyinfringement of patentsor other rights ofthird parties whichmay result fromits use. Nolicenseis granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap­proval of STMicroelectronics.
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