The T221160A is a randomly accessed solid state
memory containing 1,048,551 bits organized in a
x16 configuration. The T221160A has both BYTE
WRITE and WORD WRITE access cycles via two
CAS
pins. It offers Fast Page mode operation
CAS
The T221160A
determined by the first
by the last to transition back high. Use only one of
CAS
the two
and leave the other staying high
during WRITE will result in a BYTE WRITE.
CASL
transiting low in a WRITE cycle will write
data into the lower byte (IO1~IO8), and
transiting low will write data into the upper byte
(IO9~16).
function and timing are
CAS
to transition low and
CASH
Vcc
I/01
I/02
I/03
I/04
Vcc
I/05
I/06
I/07
I/08
NC
NC
W E
RA S
NC
A0
A1
A2
A3
Vcc
1
2
3
4
5
6
7
8
9
10
TSO P (II)
11
12
13
14
15
16
17
18
19
20
40
Vss
39
I/016
38
I/015
37
I/014
36
I/013
35
Vss
34
I/012
33
I/011
32
I/010
31
I/09
30
NC
29
CASL
CASH
28
OE
27
26
NC
25
A7
24
A6
23
A5
22
A4
21
VSS
Taiwan Memory Technology, Inc. reserves the right P. 1 Publication Date: FEB. 2002
to change products or specifications without notice. Revision:A
Page 2
TE
tm
FUNCTIONAL BLOCK DIAGRAM
CH
T221160A
WE
RAS
A0
A1
A2
A3
A4
A5
A6
A7
CASL
CASH
NO.2 CLOCK
GENERATOR
COLUMN.
ADDRESS
8
REFRESH
CONTROLLER
REFRESH
COUNTER
ADDRESS
8
BUFFERS(8)
NO.1 CLOCK
GENERATOR
BUFFER
8
ROW.
CAS
CONTROL
LOGIC
8
DATA-IN BUFFER
DQ01
OE
Vcc
Vss
.
.
DQ16
16
DATA-
OUT
BUFFER
COLUMN
8
DECODER
256
SENSE AMPLIFIERS
256
ROW
DECODER
8
VO GATING
256 x 16
256 x 256 x 16
MEMORY
ARRA
Y
8
16
PIN DESCRIPTIONS
PIN NO. SYM. TYPE DESCRIPTION
16~19,22~25 A0-A7 Input Address Input
14
28
29
13
27
2~5,6~10,31~34,36~39 I/O1 - I/O16 Input/ Output Data Input/ Output
1,6,20 Vcc Supply Power, 5V
21,35,40 Vss Ground Ground
11,12,15,30 NC - No Connect
Taiwan Memory Technology, Inc. reserves the right P. 2 Publication Date: FEB. 2002
to change products or specifications without notice. Revision:A
Supply Voltage Vcc 4.5 5.5 V 1
Supply Voltage Vss 0 0 V
Input High (Logic) voltage VIH 2.4 Vcc+1 V 1
Input Low (Logic) voltage VIL -1.0 0.8 V 1
Input Leakage Current
Output Leakage Current
Output High Voltage IOH = -5 mA VOH 2.4 - V
Output Low Voltage IOL = 4.2 mA VOL - 0.4 V
CH
T221160A
to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions above those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
reliability.
0V ≤ VIN ≤ 7V
0V ≤ V
Output(s) disabled
OUT
≤ 7V
ILI -10 10 uA
ILO -10 10 uA
Note: 1.All Voltages referenced to Vss
Taiwan Memory Technology, Inc. reserves the right P. 3 Publication Date: FEB. 2002
to change products or specifications without notice. Revision:A
Page 4
TE
tm
DC CHARACTERISTICS
(Ta = 0 to 70°C, Vcc = 5V ±10%, Vss = 0V)
CH
T221160A
Parameter
Operating Current
Standby Current
Standby Current
Fast Page Mode Current
RAS
-only refresh
Current
CAS
Before
Refresh Current
RAS
-25 -30 -35 -40
Symbol
Min Max Min Max Min Max Min Max
Icc1 - 170 - 150 - 130 - 120 mA
Icc2 - 4 - 4 - 4 - 4 mA
Icc3 - 2 - 2 - 2 - 2 mA
Icc4 -
Icc5 -
Icc6 -
170
170
170
-
150
-
150
-
150
-
130
-
130
-
130
-
-
-
120
120
120
Unit
mA
mA
mA
Test Condition
RAS, CAS
tRC=min
TTL interface,
RAS,CAS
D
OUT
CMOS interface,
RAS, CAS
RAS
=VIL,
cycling, tPC= min
CAS
=VIH,
cycling, tRC= min
RAS,CAS
tRC= min
cycling
=VIH,
=High-Z
> Vcc-0.2V
CAS
RAS
cycling,
Note: Icc depends on output load condition when the device is selected.
Icc max is specified at the output open condition, Icc is specified as an average current.
CAPACITANCE
(Ta =25°C, Vcc =5V, f = 1M HZ)
Parameter Symbol Typ Max Unit
Input Capacitance
(address)
Input Capacitance
RAS,CAS,WE,OE
(
Output Capacitance
(data-in/out)
)
CI1 - 5 pF
CI2 - 7 pF
C
- 10 pF
I/O
Taiwan Memory Technology, Inc. reserves the right P. 4
to change products or specifications without notice. Revision:A
Publication Date: FEB. 2002
Page 5
tm
TE
CH
T221160A
AC CHARACTERISTICS
(note 1,2,3) (Ta = 0 to 70°C)
AC TEST CONDITIONS:
Vcc=5V ±10%, input pulse level = 0 to 3V
Input rise and fall times: 2ns
Output Load: 2TTL gate + CL (50pF)
PARAMETER
SYM
-25 -30 -35 -40 AC CHARACTERISTICS
MIN MAX MIN MAX MIN MAX MIN MAX
Read or Write Cycle Time tRC 43 55 65 75 ns
Read-Modify-Write Cycle Time t
65 85 95 105 ns
RWC
Fast-Page-Mode Read or Write Cycle Time tPC 15 20 23 25 ns
Fast-Page-Mode Read-Write Cycle Time t
Access Time From
Access Time From
Access Time From
RAS
CAS
OE
37 42 49 52 ns
PCM
t
25 30 35 40
RAC
t
7 8 9 10
CAC
t
7 8 9 10
OAC
Access Time From Column Address tAA 12 16 18 20 ns
t
CAS
Access Time From
RAS
Pulse Width
RAS
Pulse Width
RAS
Hold Time
RAS
Precharge Time
CAS
Pulse Width
CAS
Hold Time
CAS
Precharge Time
RAS
CAS
to
to
CAS
Delay Time
RAS
Precharge Time
Precharge
Row Address Setup Time t
Row Address Hold Time t
RAS
to Column Address Delay Time
Column Address Setup Time t
Column Address Hold Time t
Column Address Hold Time (Reference to
RAS
)
RAS
Column Address to
Lead Time
Read Command Setup Time t
CAS
RAS
or
Read Command Hold Time Reference to
Read Command Hold Time Reference to
CAS
to Output in Low-Z
Output Buffer Turn-off Delay From
RAS
CAS
14 18 20 22
ACP
t
25 10K 30 10K 35 10K 40 10K
RAS
t
RASC
t
7 8 9 10
RSH
25
100K
30
100K
35
100K
40
tRP 15 20 23 25
t
4 10K 6 10K 8 10K 10 10K
CAS
t
21 26 30 35
CSH
3 3 4 5
tCP
t
10 17 10 21 10 25 10 29
RCD
t
3 3 3 5
CRP
0 0 0 0 ns
ASR
5 5 5 5 ns
RAH
t
8 13 8 14 8 16 8 18
RAD
0 0 0 0 ns
ASC
4 4 4 5 ns
CAH
tAR 22 26 30 34
t
12 14 16 18
RAL
0 0 0 0 ns
RCS
t
0 0 0 0
RCH
t
0 0 0 0
RRH
t
3 3 3 3
CLZ
t
3 15 3 15 3 15 3 15
OFF1
100K
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Notes
4
5
13
8
7
8
14
9,14
9
10,16
Taiwan Memory Technology, Inc. reserves the right P. 5
Publication Date: FEB. 2002
to change products or specifications without notice. Revision:A
Page 6
tm
TE
CH
T221160A
AC CHARACTERISTICS
AC CHARACTERISTICS
PARAMETER
Output Buffer Turn-off OE to
Write Command Setup Time
Write Command Hold Time
Write Command Hold Time (Reference
RAS
to
Write Command Pulse Width tWP 4 4 4 6
Write Command to
Write Command to
Data-in Setup Time tDS 0 0 0 0
Data-in Hold Time tDH 4 4 4 5
Data-in Hold Time (Reference to
RAS
Column Address to
CAS
Transition Time (rise or fall) tT 1.5 50 1.5 50 2.5 50 2.5 50
Refresh Period (256 cycles) t
RAS
CAS
CAS
OE
Modify-Write Cycle
OE
Refresh Cycle
)
RAS
CAS
WE
to
to
to
Setup Time (CBR REFRESH)
Hold Time (CBR REFRESH)
Hold Time From
Setup Prior to
Delay Time
WE
Delay Time
CAS
Precharge Time
WE
RAS
Lead Time
Lead Time
Delay Time
WE
During Read-
During Hidden
(continued)
RAS
-25 -30 -35 -40
SYM
t
OFF2
t
WCS
t
WCH
t
WCR
t
RWL
t
CWL
t
)
DHR
t
RWD
t
AWD
t
CWD
REF
t
RPC
t
CSR
t
CHR
t
OEH
t
ORD
MIN MAX MIN MAX MIN MAX MIN MAX
- 6 - 8 - 8 - 8
0 0 0 0
4 4 4 6
22 26 30 34
5 6 7 9
5 6 7 8
22 26 30 34
34 46 51 56
21 29 31 35
17 24 25 27
4 4 4 4
10 10 10 10
5 10 10 10
7 10 10 10
4 4 4 5
0 0 0 0
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
ns
ns
ns
ns
ns
Notes
16
11,14
14
14
14
14
12
12
11
11
11
2,3
6
6
15
Taiwan Memory Technology, Inc. reserves the right P. 6
to change products or specifications without notice. Revision:A
Publication Date: FEB. 2002
Page 7
TE
tm
Notes:
1. An initial pause of 200us is required after
power-up followed by eight
cycles (
device operation is assured. The eight
cycle wake-ups should be repeated any time
the t
2. VIH(2.4V) and VIL(0.8V) are reference levels
for measuring timing of input signals.
Transition times are measured between
V
IH(2.4V)
3. In addition to meet the transition rate
specification, all input signals must transit
between VIH and VIL in a monotonic manner.
4. Assume that t
greater than the maximum recommended value
shown in this table, t
amount that t
5. Assume that t
6. Enables on-chip refresh and address counters.
7. Operation within the t
that t
specified as a reference point only; if t
greater than the specified t
access time is controlled by t
8. Operation within the t
t
RAC
specified as a reference point only; if t
greater than the specified t
access time is controlled by tAA.
9. Either t
READ cycle.
10. t
OFF1
output achieves the open circuit condition; it is
not a reference to V
CH
T221160A
RAS
refresh
RAS
only or CBR) before proper
RAS
refresh requirement is exceeded.
REF
and V
IL(0.8V)
< t
RCD
exceeds the value shown.
RCD
≥
RCD
(max) can be met. t
RAC
(max) can be met. t
or t
RCH
(max) defines the time at which the
RRH
.
(max). If t
RCD
will increase by the
RAC
t
(max) .
RCD
(max) limit ensures
RCD
RCD
CAC
limit ensures that
RAD
RAD
RAD
must be satisfied for a
or VOL.
OH
RCD
(max) is
RCD
RCD
(max) limit,
.
(max) is
RAD
(max) limit,
is
is
is
11. t
12. These parameters are referenced to
13. During a READ cycle, if
14. WRITE command is defined as
15. LATE WRITE and READ-MODIFY-WRITE
16. The I/Os open during READ cycles once
, t
WCS
restrictive operating parameters in LATE
WRITE and READ-MODIFY-WRITE cycles
only. If t
EARLY WRITE cycle and the data output will
remain an open circuit throughout the entire
cycle. If t
t
(min) and t
AWD
cycle is READ-WRITE and the data output
will contain data read from the selected cell. If
neither of the above conditions is met, the state
of I/O (at access time and until
RAS
or OE go back to VIH) is indeterminate.
OE
held high and
goes low result in a LATE WRITE (
controlled) cycle.
leading edge in EARLY WRITE cycles and
WE
leading edge in LATE WRITE or READ-
MODIFY-WRITE cycles.
taken HIGH before
open, if
WRITE or READ-MODIFY-WRITE
operation is not possible.
low.
cycles must have both t
OE
(
ensure that the output buffers will be open
during the WRITE cycles.
t
OFF1
OE
high during WRITE cycle) in order to
or t
, t
RWD
t
≥
WCS
RWD
is tied permanently low, a LATE
occur.
OFF2
and t
AWD
(min), the cycle is an
WCS
t
≥
CWD
WE
CAS
(min), t
RWD
t
≥
CWD
taken low after
OE
is low then
goes high, I/O goes
and t
OFF2
CWD
AWD
(min), the
CAS
WE
OEH
are
≥
and
CAS
OE
-
CAS
going
met
Taiwan Memory Technology, Inc. reserves the right P. 7
to change products or specifications without notice. Revision:A
Publication Date: FEB. 2002
Page 8
tm
V
RAS
V
V
CAS
V
WE
I/O
OE
RAS
RAS
WE
I/O
OE
V
V
V
V
IOH
V
IOL
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
ADDR
ADDR
IH
IL
IH
IL
IH
IL
IH
IL
IH
IL
IH
IL
IH
IH
IL
IH
IOH
IOL
IH
TE
CH
T221160A
READ CYCLE
t
RC
t
RAS
t
t
t
RAL
CAH
t
t
t
t
t
RAC
CAC
CLZ
AA
CSH
RSH
t
CAS
VAILD DATA
t
OAC
t
t
CRP
ASR
t
t
RAD
RAH
t
RCD
t
AR
t
ASC
COLUMNROWROW
t
RCS
EARLY WRITE CYCLE
t
RC
t
RAS
t
CSH
t
RSH
t
t
t
t
t
t
DHR
DH
t
CAS
t
RAL
t
CSH
CWL
RWL
WCR
WCH
t
WP
t
CRP
IL
t
ASR
IL
IL
t
t
RAD
RAH
t
RCD
t
AR
t
ASC
COLUMNROWROW
t
WCS
t
DS
VAILD DATA
t
OFF2
t
RP
t
CRP
t
RRH
t
RCH
NOTE1
t
OFF1
OPENOPEN
t
RP
t
CRP
DON'T CARE
UNDEFINED
Note: t
is referenced from the rising edge of
OFF1
RAS
or
, whichever occurs last.
CAS
Taiwan Memory Technology, Inc. reserves the right P. 8 Publication Date: FEB. 2002
to change products or specifications without notice. Revision:A
Page 9
tm
V
RAS
V
WE
I/O
OE
RAS
CAS
V
V
V
V
V
V
V
V
V
V
V
V IL
V
V
V
V IL
CAS
ADDR
ADDR
IH
IL
IH
IL
IH
IL
IH
IL
IOH
IOL
IH
IL
IH
IH
IL
IH
TE
CH
T221160A
READ WRITE CYCLE
(LATE WRITE and READ-MODIFY-WRITE CYCLES)
t
RWC
t
RAS
t
CSH
t
RSH
t
CRP
t
AR
t
t
ASR
RAD
t
RAH
t
RCD
t
ASC
t
RCS
t
CAS
t
RAL
t
CAH
t
RWD
t
CWD
t
AWD
t
AA
t
RAC
t
CAC
t
CLZ
VAILD D
OUT
t
OAC
t
OFF2
FAST-PAGE-MODE READ CYCLE
t
RASC
t
t
CRP
t
t
ASRtRAHtASC
RAD
t
t
RCD
AR
CSH
t
CAH
t
CAS
ROWCOLUMNCOLUMNCOLUMNROW
t
RCS
t
PC
t
CP
t
ASCtCAH
t
CAS
t
CP
t
ASC
t
DS
t
VAILD D
CAH
t
RAL
t
CWL
t
RWL
t
t
RSH
t
CAS
WP
t
DH
IN
t
OEH
t
RCH
t
RP
t
CRP
ROWCOLUMNROW
t
RP
t
CRP
t
CPN
t
RRH
IH
WE
I/O
OE
V
V
V
IO H
V IO L
V
V IL
t
CLZ
t
AA
t
ACP
t
CAC
t
OAC
t
OFF1
VAILD
DATA
t
OFF2
t
t
CLZ
AA
t
RAC
t
CAC
t
OAC
t
VAILD
DATA
OFF1
t
OFF2
IL
OPENOPEN
IH
t
CLZ
t
AA
t
ACP
t
CAC
t
OAC
VAILD
DATA
t
OFF2
t
OFF1
DON'T CARE
UNDEFINED
Note: 1. t
2. t
is referenced from the rising edge of RAS or CAS , whichever occurs last.
OFF1
can be measured from falling edge of CAS to falling edge of CAS , or from rising edge of
PC
CAS to rising edge of CAS . Both measurements must meet the t
specification.
PC
Taiwan Memory Technology, Inc. reserves the right P. 9 Publication Date: FEB. 2002
to change products or specifications without notice. Revision:A
Page 10
tm
TE
CH
T221160A
CAS
ADDR
CAS
ADDR
RAS
WE
I/O
OE
RAS
WE
I/O
OE
FAST-PAGE-MODE EARLY-WRITE CYCLE
t
RASC
IH
V
IL
V
t
CRP
IH
V
IL
V
t
t
ASRtRAH
IH
V
IL
V
IH
V
IL
V
IOH
V
IOL
V
IH
V
IL
V
ROWCOLUMNCOLUMNCOLUMNROW
RAD
t
CSH
t
RCD
t
AR
t
ASC
t
WCS
t
DS
t
CAS,tCLCH
t
CAH
t
CWL
t
WCH
t
WP
t
WCR
t
DHR
t
DH
t
CP
t
ASCtCAH
t
WCS
t
DS
t
PC
t
CAS,tCLCH
t
CWL
t
WCH
t
WP
t
DH
VALID DATAVALID DATAVALID DATA
t
t
t
CAH
t
CAS,tCLCH
RAL
t
CWL
t
WCH
t
WP
t
RWL
t
DH
RSH
t
CP
t
ASC
t
WCS
t
DS
t
RP
t
CRP
t
CPN
FAST-PAGE-MODE READ-WRITE CYCLE
(LATE WRITE and READ-MODIFY-WRITE CYCLES)
t
RASC
IH
V
IL
V
t
CRP
IH
V
IL
V
t
ASRtRAH
IH
V
IL
V
V
IH
V
IL
IOH
V
IOL
V
V
IH
V
IL
ROWCOLUMNCOLUMNCOLUMNROW
t
t
AR
RAD
t
RCD
t
RAC
t
CSH
t
CAS,tCLCH
t
ASC
t
RCS
t
AA
t
CAC
t
CLZ
t
t
AWD
OAC
t
t
CAH
t
CWL
RWD
t
t
WP
CWD
t
DH
t
DS
VAILD
D OUT
t
CAC
t
CLZ
VAILD
D IN
t
OFF2
t
OAC
t
CP
t
ASCtCAH
t
AWD
t
AA
t
ACP
t
PCM
t
CAS,tCLCH
t
CWL
t
WP
t
CWD
t
DS
VAILD
D OUT
t
t
CP
t
ASC
t
t
OFF2
t
t
CAC
CLZ
AA
t
ACP
t
OAC
t
DH
VAILD
D IN
t
CAS,tCLCH
t
RAL
t
CAH
t
CWD
RSH
t
DH
t
DS
VAILD
VAILD
D OUT
D IN
DON'T CARE
t
t
OFF2
OEH
t
RP
t
CRP
t
CPN
t
RWL
t
CWL
t
WP
UNDEFINED
CAS
Note:
can be measured from falling edge to falling edge of
t
PC
CAS
. Both measurements must meet the t
specification.
PC
, or from rising edge to rising edge of
Taiwan Memory Technology, Inc. reserves the right P. 10 Publication Date:FEB. 2002
to change products or specifications without notice. Revision:A
Page 11
tm
V
RAS
V
WE
I/O
V
V
V
V
V
V
V
IO H
V
IO L
CAS
ADDR
IH
IL
IH
IL
IH
IL
IH
IL
TE
CH
T221160A
FAST-PAGE-MODE READ-EARLY-WRITE CYCLE
(Pseudo READ-MODIFY-WRITE)
t
CSH
t
CRP
t
ASRtRAH
ROWCOLUMNCOLUMNCOLUMNROW
t
RAD
t
OPE
t
AR
RCD
N
t
ASC
t
RAC
t
RCS
t
CAS
t
CAH
t
AA
t
CAC
t
OAC
t
PC
t
OFF1
VAILD
DATA(A)
t
RASC
t
CP
t
ASCtCAH
t
ACP
t
t
CAC
t
CLZ
t
RCH
AA
t
CAS
t
PC
t
OFF1
VAILD
DATA(B)
t
WCS
t
CP
t
ASC
t
DS
VAILD
D A T A IN
t
t
DH
t
CAH
t
WCH
RAL
t
RSH
t
CAS
t
RP
t
CRP
t
CP
OE
RAS
CAS
ADDR
I/O
V
IH
V
IL
ONLY REFRESH CYCLE
RAS
(ADDR=A0-A7 ;
IH
V
V
IL
t
CRP
IH
V
IL
V
t
ASR
IH
V
IL
V
OH
V
V
OL
t
RAH
ROWROW
t
OFF
t
RAS
OE,WE
=DON‘T CARE)
t
RC
t
RPC
OPEN
t
RP
DON'T CARE
UNDEFINED
Note1:Do not drive data prior to tristate.
Taiwan Memory Technology, Inc. reserves the right P. 11 Publication Date:FEB. 2002
to change products or specifications without notice. Revision:A
Page 12
tm
IH
V
RAS
CAS
IL
V
IH
V
IL
V
TE
CH
T221160A
CBR REFRESH CYCLE
t
CPN
t
OFF
t
RPC
(A0-A7 ;
t
RP
t
CSR
t
CHR
t
RAS
=DON‘T CARE)
OE
t
RC
t
RPC
t
RP
t
CSR
t
CHR
t
RAS
WE
CAS
ADDR
I/O
RAS
I/O
OE
OPEN
IH
V
IL
V
HIDDEN REFRESH CYCLE
=HIGH ;
(
WE
(R EA D )
t
RC
t
RAS
V
IH
V
IL
t
RAH
t
RAD
t
RCD
t
AR
t
ASCtCAH
t
RAC
t
CRP
IH
V
V
IL
t
ASR
IH
V
V
IL
V
IO H
V
IO L
V
IH
V
IL
ROWCOLUM N
t
RAL
t
OE
t
t
t
CAC
CLZ
RSH
AA
=LOW)
t
OAC
t
ORD
(R EF R E SH )
t
t
RP
VAILD DATA
t
RAS
t
CHR
RC
t
OFF2
t
RP
NOTE1
t
OFF1
OPENOPEN
DON'T CARE
UNDEFINED
Note: 1. t
is referenced from the rising edge of
OFF1
RAS
or
, whichever occurs last.
CAS
Taiwan Memory Technology, Inc. reserves the right P. 12 Publication Date: FEB. 2002
to change products or specifications without notice. Revision:A
Page 13
TE
tm
PACKAGE DIMENSIONS
40-LEAD SOJ DRAM (400 mil)
B
CH
T221160A
A
2140
1
D
F
C
Seating
Plane
y
10¢X(MAX
E
20
G
K
L
J
)
SYMBOL DIMENSIONS IN INCHES DIMENSIONS IN MM
A 1.025±0.010 26.035±0.254
B 0.400±0.005 10.160±0.127
C 0.045(MAX) 1.143(MAX)
D 0.050±0.006 1.27±0.152
E 0.019±0.003 0.483±0.08
F 0.026±0.003 0.661±0.080
G 0.440±0.010 11.176±0.254
H 0.011±0.003 0.280±0.080
I 0.025(MIN) 0.635(MIN)
J 0.364±0.020 9.246±0.508
K 0.047±0.006 1.194±0.152
L 0.150(MAX) 3.810(MAX)
y 0.004(MAX) 0.102(MAX)
H
I
Taiwan Memory Technology, Inc. reserves the right P. 13 Publication Date: FEB. 2002
to change products or specifications without notice. Revision:A
Page 14
TE
tm
PACKAGE DIMENSIONS
40-LEAD TSOP II DRAM (400 mil)
EE1
CH
T221160A
D
120
2140
be
y
SEATING PLANE
A
A2A1
SYMBOL DIMENSIONS IN INCHES DIMENSIONS IN MM
A 0.047(max) 1.20(max)
A1 0.004±0.002 0.10±0.05
A2 0.039±0.002 1.00±0.05
b 0.014(typ.) 0.35(typ.)
e 0.0315(typ.) 0.80typ.)
D 0.725±0.004 18.41±0.10
E 0.463±0.008 11.76±0.20
E1 0.400±0.004 10.16±0.10
L1 0.031 0.80
L 0.020±0.004 0.500±0.10
y 0.004(max) 0.10(max)
θ
0°~5° 0°~5°
L
L1
θ
Taiwan Memory Technology, Inc. reserves the right P. 14 Publication Date: FEB. 2002
to change products or specifications without notice. Revision:A
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