Datasheet T221160A-30J, T221160A-35S, T221160A-35J, T221160A-30S Datasheet (Taiwan Memory Technology)

Page 1
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TE
CH
T221160A

DRAM

FEATURES
High speed access time : 25/30/35/40 ns
Industry-standard x 16 pinouts and tim ing
functions.
Single 5V (±10%) power supply.
All device pins are TTL- compatible.
256-cycle refresh in 4ms.
Refresh modes:
RAS
(CBR) and HIDDEN.
Conventional FAST PAGE MODE access cycle.
BYTE WRITE and BYTE READ access cycles.
RAS
only,
CAS
BEFORE
PART NUMBER EXAMPLES
PART NUMBER
T221160A-30J T221160A-30S
T221160A-35J T221160A-35S
ACCESS TIME PACKAGE
30ns SOJ 30ns TSOP-II
35ns SOJ 35ns TSOP-II
64K x 16 DYNAMIC RAM

FAST PAGE MODE

PIN ASSIGNMENT ( Top View )
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
Vss I/016 I/015 I/014 I/013 Vss I/012 I/011 I/010 I/09 NC CASL CASH OE NC A7 A6 A5 A4 VSS
Vc c I/01 I/02 I/03 I/04 Vc c I/05 I/06 I/07 I/08
NC NC
W E
R A S
NC
A0 A1 A2 A3
Vc c
10 11 12 13 14 15 16 17 18 19 20
1 2 3 4 5 6 7 8 9
SOJ

GENERAL DESCRIPTION

The T221160A is a randomly accessed solid state memory containing 1,048,551 bits organized in a x16 configuration. The T221160A has both BYTE WRITE and WORD WRITE access cycles via two
CAS
pins. It offers Fast Page mode operation
CAS
The T221160A determined by the first by the last to transition back high. Use only one of
CAS
the two
and leave the other staying high
during WRITE will result in a BYTE WRITE.
CASL
transiting low in a WRITE cycle will write data into the lower byte (IO1~IO8), and transiting low will write data into the upper byte (IO9~16).
function and timing are
CAS
to transition low and
CASH
Vcc I/01 I/02 I/03 I/04 Vcc I/05 I/06 I/07 I/08
NC NC
W E
RA S
NC A0 A1 A2 A3
Vcc
1 2 3 4 5 6 7 8 9
10
TSO P (II)
11 12 13 14 15 16 17 18 19 20
40
Vss
39
I/016
38
I/015
37
I/014
36
I/013
35
Vss
34
I/012
33
I/011
32
I/010
31
I/09
30
NC
29
CASL CASH
28
OE
27 26
NC
25
A7
24
A6
23
A5
22
A4
21
VSS
Taiwan Memory Technology, Inc. reserves the right P. 1 Publication Date: FEB. 2002 to change products or specifications without notice. Revision:A
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FUNCTIONAL BLOCK DIAGRAM
CH
T221160A
WE
RAS
A0 A1 A2 A3 A4 A5 A6 A7
CASL CASH
NO.2 CLOCK
GENERATOR
COLUMN.
ADDRESS
8
REFRESH
CONTROLLER
REFRESH
COUNTER
ADDRESS
8
BUFFERS(8)
NO.1 CLOCK
GENERATOR
BUFFER
8
ROW.
CAS
CONTROL
LOGIC
8
DATA-IN BUFFER
DQ01
OE
Vcc
Vss
. .
DQ16
16
DATA-
OUT
BUFFER
COLUMN
8
DECODER
256
SENSE AMPLIFIERS
256
ROW
DECODER
8
VO GATING
256 x 16
256 x 256 x 16
MEMORY
ARRA
Y
8
16
PIN DESCRIPTIONS
PIN NO. SYM. TYPE DESCRIPTION
16~19,22~25 A0-A7 Input Address Input
14 28 29 13 27
2~5,6~10,31~34,36~39 I/O1 - I/O16 Input/ Output Data Input/ Output
1,6,20 Vcc Supply Power, 5V
21,35,40 Vss Ground Ground
11,12,15,30 NC - No Connect
Taiwan Memory Technology, Inc. reserves the right P. 2 Publication Date: FEB. 2002 to change products or specifications without notice. Revision:A
RAS CASH CASL
WE
OE
Input Row Address Strobe Input Column Address Strobe /Upper Byte Control Input Column Address Strobe /Lower Byte Control Input Write Enable Input Output Enable
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tm

ABSOLUTE MAXIMUM RATINGS*

Voltage on Any pin Relative to VSS… … -1V to 7V Operating Temperature, Ta (ambient)..0°C to +70°C
Storage Temperature (plastic)….... -55°C to +150°C
Power Dissipation ...............................…......... 1.0W
Short Circuit Output Current...................….... 50mA
*Stresses greater than those listed under "Absolute Maxi mum Rat ings" ma y caus e per manent damag e
DC ELECTRICAL CHARACTERISTICS AND RECOMMENDED OPERATING CONDITIONS
(0°C Ta ≤ 70°C; VCC = 5V ± 10 % unless otherwise noted)
DESCRIPTION CONDITIONS SYM. MIN MAX UNITS NOTES
Supply Voltage Vcc 4.5 5.5 V 1 Supply Voltage Vss 0 0 V Input High (Logic) voltage VIH 2.4 Vcc+1 V 1 Input Low (Logic) voltage VIL -1.0 0.8 V 1 Input Leakage Current
Output Leakage Current Output High Voltage IOH = -5 mA VOH 2.4 - V
Output Low Voltage IOL = 4.2 mA VOL - 0.4 V
CH
T221160A
to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
0V VIN 7V 0V V
Output(s) disabled
OUT
7V
ILI -10 10 uA
ILO -10 10 uA
Note: 1.All Voltages referenced to Vss
Taiwan Memory Technology, Inc. reserves the right P. 3 Publication Date: FEB. 2002 to change products or specifications without notice. Revision:A
Page 4
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DC CHARACTERISTICS

(Ta = 0 to 70°C, Vcc = 5V ±10%, Vss = 0V)
CH
T221160A
Parameter
Operating Current
Standby Current
Standby Current
Fast Page Mode Current
RAS
-only refresh
Current
CAS
Before
Refresh Current
RAS
-25 -30 -35 -40
Symbol
Min Max Min Max Min Max Min Max
Icc1 - 170 - 150 - 130 - 120 mA
Icc2 - 4 - 4 - 4 - 4 mA
Icc3 - 2 - 2 - 2 - 2 mA
Icc4 -
Icc5 -
Icc6 -
170
170
170
-
150
-
150
-
150
-
130
-
130
-
130
-
-
-
120
120
120
Unit
mA
mA
mA
Test Condition
RAS, CAS
tRC=min TTL interface,
RAS,CAS
D
OUT
CMOS interface,
RAS, CAS RAS
=VIL,
cycling, tPC= min
CAS
=VIH,
cycling, tRC= min
RAS,CAS
tRC= min
cycling
=VIH,
=High-Z
> Vcc-0.2V
CAS
RAS
cycling,
Note: Icc depends on output load condition when the device is selected. Icc max is specified at the output open condition, Icc is specified as an average current.
CAPACITANCE
(Ta =25°C, Vcc =5V, f = 1M HZ)
Parameter Symbol Typ Max Unit
Input Capacitance
(address)
Input Capacitance
RAS,CAS,WE,OE
(
Output Capacitance
(data-in/out)
)
CI1 - 5 pF
CI2 - 7 pF
C
- 10 pF
I/O
Taiwan Memory Technology, Inc. reserves the right P. 4 to change products or specifications without notice. Revision:A
Publication Date: FEB. 2002
Page 5
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TE
CH
T221160A
AC CHARACTERISTICS
(note 1,2,3) (Ta = 0 to 70°C)
AC TEST CONDITIONS: Vcc=5V ±10%, input pulse level = 0 to 3V Input rise and fall times: 2ns Output Load: 2TTL gate + CL (50pF)
PARAMETER
SYM
-25 -30 -35 -40 AC CHARACTERISTICS
MIN MAX MIN MAX MIN MAX MIN MAX
Read or Write Cycle Time tRC 43 55 65 75 ns Read-Modify-Write Cycle Time t
65 85 95 105 ns
RWC
Fast-Page-Mode Read or Write Cycle Time tPC 15 20 23 25 ns Fast-Page-Mode Read-Write Cycle Time t
Access Time From Access Time From Access Time From
RAS CAS OE
37 42 49 52 ns
PCM
t
25 30 35 40
RAC
t
7 8 9 10
CAC
t
7 8 9 10
OAC
Access Time From Column Address tAA 12 16 18 20 ns
t
CAS
Access Time From
RAS
Pulse Width
RAS
Pulse Width
RAS
Hold Time
RAS
Precharge Time
CAS
Pulse Width
CAS
Hold Time
CAS
Precharge Time RAS CAS
to
to
CAS
Delay Time
RAS
Precharge Time
Precharge
Row Address Setup Time t Row Address Hold Time t
RAS
to Column Address Delay Time
Column Address Setup Time t Column Address Hold Time t Column Address Hold Time (Reference to
RAS
)
RAS
Column Address to
Lead Time
Read Command Setup Time t
CAS RAS
or
Read Command Hold Time Reference to Read Command Hold Time Reference to
CAS
to Output in Low-Z
Output Buffer Turn-off Delay From
RAS
CAS
14 18 20 22
ACP
t
25 10K 30 10K 35 10K 40 10K
RAS
t
RASC
t
7 8 9 10
RSH
25
100K
30
100K
35
100K
40
tRP 15 20 23 25 t
4 10K 6 10K 8 10K 10 10K
CAS
t
21 26 30 35
CSH
3 3 4 5
tCP t
10 17 10 21 10 25 10 29
RCD
t
3 3 3 5
CRP
0 0 0 0 ns
ASR
5 5 5 5 ns
RAH
t
8 13 8 14 8 16 8 18
RAD
0 0 0 0 ns
ASC
4 4 4 5 ns
CAH
tAR 22 26 30 34 t
12 14 16 18
RAL
0 0 0 0 ns
RCS
t
0 0 0 0
RCH
t
0 0 0 0
RRH
t
3 3 3 3
CLZ
t
3 15 3 15 3 15 3 15
OFF1
100K
UNIT
ns ns ns
ns ns ns ns ns ns ns ns ns ns
ns
ns
ns
ns ns
ns ns
Notes
4 5 13 8
7
8
14 9,14
9
10,16
Taiwan Memory Technology, Inc. reserves the right P. 5
Publication Date: FEB. 2002
to change products or specifications without notice. Revision:A
Page 6
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TE
CH
T221160A
AC CHARACTERISTICS
AC CHARACTERISTICS
PARAMETER
Output Buffer Turn-off OE to Write Command Setup Time
Write Command Hold Time Write Command Hold Time (Reference
RAS
to Write Command Pulse Width tWP 4 4 4 6
Write Command to Write Command to
Data-in Setup Time tDS 0 0 0 0 Data-in Hold Time tDH 4 4 4 5
Data-in Hold Time (Reference to
RAS
Column Address to
CAS
Transition Time (rise or fall) tT 1.5 50 1.5 50 2.5 50 2.5 50 Refresh Period (256 cycles) t
RAS CAS CAS OE
Modify-Write Cycle
OE
Refresh Cycle
)
RAS CAS
WE
to
to
to Setup Time (CBR REFRESH) Hold Time (CBR REFRESH)
Hold Time From
Setup Prior to
Delay Time
WE
Delay Time
CAS
Precharge Time
WE
RAS
Lead Time Lead Time
Delay Time
WE
During Read-
During Hidden
(continued)
RAS
-25 -30 -35 -40
SYM
t
OFF2
t
WCS
t
WCH
t
WCR
t
RWL
t
CWL
t
)
DHR
t
RWD
t
AWD
t
CWD
REF
t
RPC
t
CSR
t
CHR
t
OEH
t
ORD
MIN MAX MIN MAX MIN MAX MIN MAX
- 6 - 8 - 8 - 8
0 0 0 0
4 4 4 6
22 26 30 34
5 6 7 9 5 6 7 8
22 26 30 34
34 46 51 56 21 29 31 35
17 24 25 27
4 4 4 4 10 10 10 10 5 10 10 10
7 10 10 10 4 4 4 5
0 0 0 0
UNIT
ns ns ns ns
ns ns ns ns ns ns ns ns ns ns
ms
ns ns ns ns
ns
Notes
16 11,14
14
14 14 14 12 12
11 11 11 2,3
6 6 15
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Publication Date: FEB. 2002
Page 7
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Notes:
1. An initial pause of 200us is required after power-up followed by eight cycles ( device operation is assured. The eight cycle wake-ups should be repeated any time the t
2. VIH(2.4V) and VIL(0.8V) are reference levels for measuring timing of input signals. Transition times are measured between V
IH(2.4V)
3. In addition to meet the transition rate specification, all input signals must transit between VIH and VIL in a monotonic manner.
4. Assume that t greater than the maximum recommended value shown in this table, t amount that t
5. Assume that t
6. Enables on-chip refresh and address counters.
7. Operation within the t that t specified as a reference point only; if t greater than the specified t access time is controlled by t
8. Operation within the t t
RAC
specified as a reference point only; if t greater than the specified t access time is controlled by tAA.
9. Either t READ cycle.
10. t
OFF1
output achieves the open circuit condition; it is not a reference to V
CH
T221160A
RAS
refresh
RAS
only or CBR) before proper
RAS
refresh requirement is exceeded.
REF
and V
IL(0.8V)
< t
RCD
exceeds the value shown.
RCD
RCD
(max) can be met. t
RAC
(max) can be met. t
or t
RCH
(max) defines the time at which the
RRH
.
(max). If t
RCD
will increase by the
RAC
t
(max) .
RCD
(max) limit ensures
RCD
RCD
CAC
limit ensures that
RAD
RAD
RAD
must be satisfied for a
or VOL.
OH
RCD
(max) is
RCD
RCD
(max) limit,
.
(max) is
RAD
(max) limit,
is
is
is
11. t
12. These parameters are referenced to
13. During a READ cycle, if
14. WRITE command is defined as
15. LATE WRITE and READ-MODIFY-WRITE
16. The I/Os open during READ cycles once
, t
WCS
restrictive operating parameters in LATE WRITE and READ-MODIFY-WRITE cycles only. If t EARLY WRITE cycle and the data output will remain an open circuit throughout the entire cycle. If t t
(min) and t
AWD cycle is READ-WRITE and the data output will contain data read from the selected cell. If neither of the above conditions is met, the state of I/O (at access time and until
RAS
or OE go back to VIH) is indeterminate.
OE
held high and goes low result in a LATE WRITE ( controlled) cycle.
leading edge in EARLY WRITE cycles and
WE
leading edge in LATE WRITE or READ-
MODIFY-WRITE cycles.
taken HIGH before open, if WRITE or READ-MODIFY-WRITE operation is not possible.
low.
cycles must have both t
OE
( ensure that the output buffers will be open during the WRITE cycles.
t
OFF1
OE
high during WRITE cycle) in order to
or t
, t
RWD
t
WCS
RWD
is tied permanently low, a LATE
occur.
OFF2
and t
AWD
(min), the cycle is an
WCS
t
CWD
WE
CAS
(min), t
RWD
t
CWD
taken low after
OE
is low then
goes high, I/O goes
and t
OFF2
CWD
AWD
(min), the
CAS
WE
OEH
are
and
CAS
OE
-
CAS
going
met
Taiwan Memory Technology, Inc. reserves the right P. 7 to change products or specifications without notice. Revision:A
Publication Date: FEB. 2002
Page 8
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V
RAS
V
V
CAS
V
WE
I/O
OE
RAS
RAS
WE
I/O
OE
V V
V
V
IOH
V
IOL
V
V
V
V V
V V
V V
V V
V V
V V
ADDR
ADDR
IH IL
IH IL
IH IL
IH IL
IH IL
IH IL
IH
IH IL
IH
IOH
IOL
IH
TE
CH
T221160A
READ CYCLE
t
RC
t
RAS
t
t t
RAL
CAH
t t
t
t
t
RAC CAC
CLZ
AA
CSH RSH
t
CAS
VAILD DATA
t
OAC
t
t
CRP
ASR
t t
RAD RAH
t
RCD
t
AR
t
ASC
COLUMNROW ROW
t
RCS
EARLY WRITE CYCLE
t
RC
t
RAS
t
CSH
t
RSH
t
t
t t
t
t
DHR
DH
t
CAS
t
RAL
t
CSH
CWL RWL
WCR
WCH
t
WP
t
CRP
IL
t
ASR
IL
IL
t t
RAD RAH
t
RCD
t
AR
t
ASC
COLUMNROW ROW
t
WCS
t
DS
VAILD DATA
t
OFF2
t
RP
t
CRP
t
RRH
t
RCH
NOTE1
t
OFF1
OPENOPEN
t
RP
t
CRP
DON'T CARE
UNDEFINED
Note: t
is referenced from the rising edge of
OFF1
RAS
or
, whichever occurs last.
CAS
Taiwan Memory Technology, Inc. reserves the right P. 8 Publication Date: FEB. 2002 to change products or specifications without notice. Revision:A
Page 9
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V
RAS
V
WE
I/O
OE
RAS
CAS
V V
V V
V V
V V
V V
V V IL
V V
V V IL
CAS
ADDR
ADDR
IH IL
IH IL
IH IL
IH IL
IOH
IOL
IH IL
IH
IH IL
IH
TE
CH
T221160A
READ WRITE CYCLE
(LATE WRITE and READ-MODIFY-WRITE CYCLES)
t
RWC
t
RAS
t
CSH
t
RSH
t
CRP
t
AR
t
t
ASR
RAD
t
RAH
t
RCD
t
ASC
t
RCS
t
CAS
t
RAL
t
CAH
t
RWD
t
CWD
t
AWD
t
AA
t
RAC
t
CAC
t
CLZ
VAILD D
OUT
t
OAC
t
OFF2
FAST-PAGE-MODE READ CYCLE
t
RASC
t
t
CRP
t
t
ASRtRAHtASC
RAD
t
t
RCD
AR
CSH
t
CAH
t
CAS
ROW COLUMN COLUMN COLUMN ROW
t
RCS
t
PC
t
CP
t
ASCtCAH
t
CAS
t
CP
t
ASC
t
DS
t
VAILD D
CAH
t
RAL
t
CWL
t
RWL
t
t
RSH
t
CAS
WP
t
DH
IN
t
OEH
t
RCH
t
RP
t
CRP
ROWCOLUMNROW
t
RP
t
CRP
t
CPN
t
RRH
IH
WE
I/O
OE
V V
V
IO H
V IO L
V V IL
t
CLZ
t
AA
t
ACP
t
CAC
t
OAC
t
OFF1
VAILD
DATA
t
OFF2
t
t
CLZ
AA
t
RAC
t
CAC
t
OAC
t
VAILD
DATA
OFF1
t
OFF2
IL
OPEN OPEN
IH
t
CLZ
t
AA
t
ACP
t
CAC
t
OAC
VAILD
DATA
t
OFF2
t
OFF1
DON'T CARE
UNDEFINED
Note: 1. t
2. t
is referenced from the rising edge of RAS or CAS , whichever occurs last.
OFF1
can be measured from falling edge of CAS to falling edge of CAS , or from rising edge of
PC
CAS to rising edge of CAS . Both measurements must meet the t
specification.
PC
Taiwan Memory Technology, Inc. reserves the right P. 9 Publication Date: FEB. 2002 to change products or specifications without notice. Revision:A
Page 10
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TE
CH
T221160A
CAS
ADDR
CAS
ADDR
RAS
WE
I/O
OE
RAS
WE
I/O
OE
FAST-PAGE-MODE EARLY-WRITE CYCLE
t
RASC
IH
V
IL
V
t
CRP
IH
V
IL
V
t
t
ASRtRAH
IH
V
IL
V
IH
V
IL
V
IOH
V
IOL
V
IH
V
IL
V
ROW COLUMN COLUMN COLUMN ROW
RAD
t
CSH
t
RCD
t
AR
t
ASC
t
WCS
t
DS
t
CAS,tCLCH
t
CAH
t
CWL
t
WCH
t
WP
t
WCR
t
DHR
t
DH
t
CP
t
ASCtCAH
t
WCS
t
DS
t
PC
t
CAS,tCLCH
t
CWL
t
WCH
t
WP
t
DH
VALID DATA VALID DATA VALID DATA
t
t
t
CAH
t
CAS,tCLCH
RAL
t
CWL
t
WCH
t
WP
t
RWL
t
DH
RSH
t
CP
t
ASC
t
WCS
t
DS
t
RP
t
CRP
t
CPN
FAST-PAGE-MODE READ-WRITE CYCLE
(LATE WRITE and READ-MODIFY-WRITE CYCLES)
t
RASC
IH
V
IL
V
t
CRP
IH
V
IL
V
t
ASRtRAH
IH
V
IL
V
V
IH
V
IL
IOH
V
IOL
V
V
IH
V
IL
ROW COLUMN COLUMN COLUMN ROW
t
t
AR
RAD
t
RCD
t
RAC
t
CSH
t
CAS,tCLCH
t
ASC
t
RCS
t
AA
t
CAC
t
CLZ
t
t
AWD
OAC
t
t
CAH
t
CWL
RWD
t t
WP CWD
t
DH
t
DS
VAILD D OUT
t
CAC
t
CLZ
VAILD
D IN
t
OFF2
t
OAC
t
CP
t
ASCtCAH
t
AWD
t
AA
t
ACP
t
PCM
t
CAS,tCLCH
t
CWL
t
WP
t
CWD
t
DS
VAILD D OUT
t
t
CP
t
ASC
t
t
OFF2
t t
CAC
CLZ
AA
t
ACP
t
OAC
t
DH
VAILD
D IN
t
CAS,tCLCH
t
RAL
t
CAH
t
CWD
RSH
t
DH
t
DS
VAILD
VAILD
D OUT
D IN
DON'T CARE
t t
OFF2 OEH
t
RP
t
CRP
t
CPN
t
RWL
t
CWL
t
WP
UNDEFINED
CAS
Note:
can be measured from falling edge to falling edge of
t
PC
CAS
. Both measurements must meet the t
specification.
PC
, or from rising edge to rising edge of
Taiwan Memory Technology, Inc. reserves the right P. 10 Publication Date:FEB. 2002 to change products or specifications without notice. Revision:A
Page 11
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V
RAS
V
WE
I/O
V V
V V
V V
V
IO H
V
IO L
CAS
ADDR
IH
IL
IH
IL
IH
IL
IH
IL
TE
CH
T221160A
FAST-PAGE-MODE READ-EARLY-WRITE CYCLE
(Pseudo READ-MODIFY-WRITE)
t
CSH
t
CRP
t
ASRtRAH
ROW COLUMN COLUMN COLUMN ROW
t
RAD
t
OPE
t
AR
RCD
N
t
ASC
t
RAC
t
RCS
t
CAS
t
CAH
t
AA
t
CAC
t
OAC
t
PC
t
OFF1
VAILD
DATA(A)
t
RASC
t
CP
t
ASCtCAH
t
ACP
t
t
CAC
t
CLZ
t
RCH
AA
t
CAS
t
PC
t
OFF1
VAILD
DATA(B)
t
WCS
t
CP
t
ASC
t
DS
VAILD
D A T A IN
t
t
DH
t
CAH
t
WCH
RAL
t
RSH
t
CAS
t
RP
t
CRP
t
CP
OE
RAS
CAS
ADDR
I/O
V
IH
V
IL
ONLY REFRESH CYCLE
RAS
(ADDR=A0-A7 ;
IH
V V
IL
t
CRP
IH
V
IL
V
t
ASR
IH
V
IL
V
OH
V V
OL
t
RAH
ROW ROW
t
OFF
t
RAS
OE,WE
=DON‘T CARE)
t
RC
t
RPC
OPEN
t
RP
DON'T CARE
UNDEFINED
Note1:Do not drive data prior to tristate.
Taiwan Memory Technology, Inc. reserves the right P. 11 Publication Date:FEB. 2002 to change products or specifications without notice. Revision:A
Page 12
tm
IH
V
RAS
CAS
IL
V
IH
V
IL
V
TE
CH
T221160A
CBR REFRESH CYCLE
t
CPN
t
OFF
t
RPC
(A0-A7 ;
t
RP
t
CSR
t
CHR
t
RAS
=DON‘T CARE)
OE
t
RC
t
RPC
t
RP
t
CSR
t
CHR
t
RAS
WE
CAS
ADDR
I/O
RAS
I/O
OE
OPEN
IH
V
IL
V
HIDDEN REFRESH CYCLE
=HIGH ;
(
WE
(R EA D )
t
RC
t
RAS
V
IH
V
IL
t
RAH
t
RAD
t
RCD
t
AR
t
ASCtCAH
t
RAC
t
CRP
IH
V V
IL
t
ASR
IH
V V
IL
V
IO H
V
IO L
V
IH
V
IL
ROW COLUM N
t
RAL
t
OE
t
t
t
CAC
CLZ
RSH
AA
=LOW)
t
OAC
t
ORD
(R EF R E SH )
t
t
RP
VAILD DATA
t
RAS
t
CHR
RC
t
OFF2
t
RP
NOTE1
t
OFF1
OPENOPEN
DON'T CARE
UNDEFINED
Note: 1. t
is referenced from the rising edge of
OFF1
RAS
or
, whichever occurs last.
CAS
Taiwan Memory Technology, Inc. reserves the right P. 12 Publication Date: FEB. 2002 to change products or specifications without notice. Revision:A
Page 13
TE
tm
PACKAGE DIMENSIONS 40-LEAD SOJ DRAM (400 mil)
B
CH
T221160A
A
2140
1
D
F
C
Seating
Plane
y
10¢X(MAX
E
20
G
K
L
J
)
SYMBOL DIMENSIONS IN INCHES DIMENSIONS IN MM
A 1.025±0.010 26.035±0.254
B 0.400±0.005 10.160±0.127 C 0.045(MAX) 1.143(MAX)
D 0.050±0.006 1.27±0.152
E 0.019±0.003 0.483±0.08
F 0.026±0.003 0.661±0.080 G 0.440±0.010 11.176±0.254 H 0.011±0.003 0.280±0.080
I 0.025(MIN) 0.635(MIN)
J 0.364±0.020 9.246±0.508
K 0.047±0.006 1.194±0.152
L 0.150(MAX) 3.810(MAX)
y 0.004(MAX) 0.102(MAX)
H
I
Taiwan Memory Technology, Inc. reserves the right P. 13 Publication Date: FEB. 2002 to change products or specifications without notice. Revision:A
Page 14
TE
tm
PACKAGE DIMENSIONS 40-LEAD TSOP II DRAM (400 mil)
EE1
CH
T221160A
D
120
2140
be
y
SEATING PLANE
A
A2 A1
SYMBOL DIMENSIONS IN INCHES DIMENSIONS IN MM
A 0.047(max) 1.20(max)
A1 0.004±0.002 0.10±0.05 A2 0.039±0.002 1.00±0.05
b 0.014(typ.) 0.35(typ.) e 0.0315(typ.) 0.80typ.)
D 0.725±0.004 18.41±0.10
E 0.463±0.008 11.76±0.20
E1 0.400±0.004 10.16±0.10 L1 0.031 0.80
L 0.020±0.004 0.500±0.10
y 0.004(max) 0.10(max)
θ
0°~5° 0°~5°
L
L1
θ
Taiwan Memory Technology, Inc. reserves the right P. 14 Publication Date: FEB. 2002 to change products or specifications without notice. Revision:A
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