Datasheet T15M64A-100N, T15M64A-100P, T15M64A-100J, T15M64A-100D Datasheet (Taiwan Memory Technology)

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Preliminary T15M64A
SRAM
FEATURES
High speed access time: 50/70/85/100ns
Low power supply current :
- Operating : 35mA(max)
- Standby : 50uA
Power supply : 5V (± 10%)
Fully static operation – No clock or refreshing
required
All inputs and outputs directly LVTTL
compatible
Common I/O capability
Data retention voltage : 1.5V (min)
Available packages :
28-pin DIP(600mil),SOJ, SOP, TSOP-I (8x13.4mm).
Operating temperature : 0 ~ +70 °C
PART NUMBER EXAMPLES
PART NO.
T15M64A-100N T15M64A-100J T15M64A-100D
PACKAGE
CODE
N=DIP J=SOJ D=SOP
ACCESS
TIME
100ns

8K X 8 LOW POWER

CMOS STATIC RAM

GENERAL DESCRIPTION
The T15M64A is a low power CMOS static RAM. organized as 8,192 x 8 bits that operates on a single 5-volt power supply. Low operating and standby current . Data retention is guaranteed at a power supply voltage as low as 1.5V. This device is packaged in a standard 28-pin DIP(600mil), SOJ, SOP, TSOP-I type.
BLOCK DIAGRAM
Vcc
V
SS
A 0
.
.
.
A 12
CS
OE
WE
DECODER
CONTROL
CORE
ARRAY
DATA I/O
I/O 1
.
.
.
I/O 8
T15M64A-100P
TSOP-I
P=
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PIN CONFIGURATION
CH
Preliminary T15M64A
NC A1 2 A7 A6 A5 A4 A3 A2 A1 A0
I/O1 I/O2 I/O3
Vs s
OE
A11
A9 A8
NC
WE
VCC
NC
A12
A7 A6 A5 A4 A3
1 2 3 4 5 6 7 8
9 10 11 12 13 14
1 2 3 4 5 6 7 8
9 10 11 12 13 14
DIP
&
SOJ
TSOP-I
28
Vcc WE
27 26
NC
25
A8
24
A9
23
A11 OE
22 21
A10 CS
20 19
I/O 8
18
I/O 7
17
I/O 6
16
I/O 5
15
I/O 4
28 27 26 25 24 23 22 21 20 19 18 17 16 15
N C A 1 2 A 7 A 6 A 5 A 4 A 3 A 2 A 1 A 0 I/O1 I/O2 I/O3 V s s
A10
CS I/O8 I/O7 I/O6 I/O5 I/O4 VSS I/O3 I/O2 I/O1
A0
A1
A2
10 11 12 13 14
1 2 3 4 5 6 7 8 9
SOP
28 27 26 25 24 23 22 21 20 19 18 17 16 15
Vcc WE NC A8 A9 A11 OE A10 CS I/O 8 I/O 7 I/O 6 I/O 5 I/O 4
PIN DESCRIPTION
SYMBOL DESCRIPTION A0 - A12 Address Inputs I/O1 - I/O8 Data Inputs/Outputs
CS
WE OE
Chip Select Inputs Write Enable
Output Enable
Vcc Power Supply Vss Ground
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DC CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS
Supply Voltage to Vss Potential -0.5 to + 7V V Inputs to Vss Potential -0.5 to Vcc +0.5 V Power Dissipation 0.7 W Storage Temperature -60 to +150 °C
RECOMMENDED OPERATING CONDITIONS
Supply Voltage Vcc 4.5 5 5.5 V Input Voltage, low Input Voltage, high Ambient Temperature
TRUTH TABLE
CH
Preliminary T15M64A
PARAMETER RATING UNIT
PARAMETER SYM MIN TYP MAX UNIT
V V
IL
IH
T
A
-0.3 - 0.8 V
2.2 - Vcc+0.3 V
0 - +70 °C
CS OE WE
H X X Not Selected High-Z Standby L H H Output Disable High-Z Active L L H Read Data Out
L X L Write Data In
MODE I/O1- I/O8 Power
Active Active
OPERATING CHARACTERISTICS
(Vcc = 5V / ± 10%, Vss = 0V, Ta = 0 ~ +70 °C)

PARAMETER SYM. TEST CONDITIONS MIN. TYP. MAX. UNIT

I
Input Leakage Current
Output Leakage Current
Output Low Voltage Output High Voltage
Operating Power Supply Current
Standby Power Supply Current
Vin=Vss to Vcc - - 1 uA
=Vss to Vcc ,
V
I/O
IOH= - 1.0mA
= VIH or WE = VIL
OE
I
= + 2.1mA
OL
V V
LI
I
LO
OL
OH
CS=
Icc
I
SB
I
SB1
Cycle = MIN. Duty = 100%
CS
CS
=VIH, Cycle=min, Duty=100%
V
, I/O=0mA
IL
V
cc
-0.2V
CS
V
=
or
IH
-50 - - 35 mA
-70 - - 30 mA
-85 - - 25 mA
-100
- - 1 uA
- - 0.4 V
2.4 - - V
- - 20 mA
- - 0.3 mA
- - 50 uA
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CAPACITANCE
CH
Preliminary T15M64A
(Vcc = 5V /
± 10%
, Ta = 25°C, f = 1 MHz)
PARAMETER SYMBOL CONDITION MAX. UNIT
Input Capacitance Input/ Output Capacitance
C
IN
C
I/O
V V
IN
OUT
= 0V
Note: These parameters are sampled but not 100% tested.
AC TEST CONDITIONS
PARAMETER CONDITIONS
Input Pulse Levels 0V to 3V Input Rise and Fall Times 3 ns Input and Output Timing Reference Level 1.5V Output Load See Fig. 1,2
AC TEST LOADS AND WAVEFORM
5V
R1 - 1928 ohm
OUTPUT
30pF Including Jig and Scope
5V
OUTPUT
R2 1020 ohm
= 0V
R1- 1928 ohm
5pF Including Jig and Scope
6 pF 8 pF
R2 1020 ohm
CLZ
OLZ
CHZ
OHZ
, T
WHZ
, TOW )
Fig 1
(For T
, T
, T
, T
Fig 2
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AC CHARACTERISTICS
CH
Preliminary T15M64A
(
V
cc
= 5V /
± 10%
, Vss = 0V, Ta =
0 ~ +70 °C
)
(1) READ CYCLE
PARAMETER SYM.
Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Chip Selection to Output in Low Z Output Enable to Output in Low Z Chip Deselection to Output in High Z Output Disable to Output in High Z Output Hold from Address Change
* These parameters is measured with 5pF test load.
t
RC
t
AA
t
ACS
t
AOE
t
CLZ*
t
OLZ*
t
CHZ*
t
OHZ*
t
OH
MIN MAX MIN. MAX. MIN. MAX. MIN. MAX.
50 - 70 - 85 - 100 - ns
10 - 10 - 10 - 10 - ns
(2)WRITE CYCLE
-50ns -70ns
- 50 - 70 - 85 - 100 ns
- 50 - 70 - 85 - 100 ns
- 25 - 35 - 40 - 50 ns 7 - 10 - 10 - 10 - ns 5 - 5 - 5 - 5 - ns
- 20 - 25 - 30 - 30 ns
- 20 - 25 - 30 - 30 ns
-85ns -100ns

UNIT

PARAMETER SYM.
t
Write Cycle Time Chip Selection to End of Write Address Valid to End of Write Address Setup Time Write Pulse Width Write Recovery Time Data Valid to End of Write Data Hold from End of Write Write to Output in High Z Output Active from End of Write
* These parameters is measured with 30pF test load.
WC
t
CW
t
AW
tAS tWP tWR tDW tDH t
WHZ*
t
OW
MIN MAX MIN. MAX. MIN. MAX. MIN. MAX.
50 - 70 - 85 - 100 - ns 40 - 60 - 70 - 80 - ns 40 - 60 - 70 - 80 - ns
0 - 0 - 0 - 0 - ns
30 - 50 - 60 - 70 - ns
0 - 0 - 0 - 0 - ns
25 - 30 - 35 - 40 - ns
0 - 0 - 0 - 0 - ns
- 20 - 25 - 30 - 30 ns 5 - 5 - 5 - 5 - ns
-50ns -70ns -85ns -100ns
UNIT
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DATA RETENTION CHARACTERISTICS
CH
Preliminary T15M64A
Item Symbol Test Condition Min Typ max unit
Vcc for data retention VDR Data retention current IDR Data retention set-up time
t
CDR
CS
V
cc
≥≥≥
=5.0,
V
See data retention waveform
Recovery time
t
R
DATA RETENTION WAVE FORM
Da ta R ete ntio n Mode
VCC
CS
Vcc_typ
t
CDR
V
CS >VCC-0.2V
IH
cc
CS
V
-0.2V
≥≥≥
> 1.5V
DR
-0.2V
V
cc
1.5 - - V
- 50 uA
0 - -
ms
5 - -
Vcc_TYP
t
R
V
IH
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TIMING WAVEFORMS
READ CYCLE 1
(Address Controlled)
CH
Preliminary T15M64A
Address
D
OUT
READ CYCLE 2
(Chip Select Controlled)
CS
D
OUT
t
OH
t
CLZ
t
AA
t
ACS
t
RC
t
CHZ
t
OH
READ CYCLE 3
(Output Enable Controlled)
Address
OE
CS
D
OUT
t
t
AOE
t
OLZ
t
ACS
t
CLZ
AA
t
RC
t
OHZ
t
CHZ
t
OH
DON'T CARE UNDEFINED
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WRITE CYCLE 1 (OE CLOCK)
CH
Preliminary T15M64A
Addr ess
OE
CS
WE
D
OUT
D
IN
t
AS
t
OHZ
(1,4)
t
t
CW
WC
t
t
AW
WP
t
WR
t
DW
t
DH
WRITE CYCLE 2
Address
CS
WE
D
OUT
D
IN
(OE =
t
AS
V
Fixed)
IL
t
WHZ
t
WC
t
CW
t
AW
t
WP
(1 ,4 )
t
DW
t
t
DH
WR
t
OW
t
OH
(2 )
(3 )
DON'T CARE UNDEFINED
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Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the
2. The data output from
3.
4. Transition is measured ± 500 mV from steady state with
CH
Preliminary T15M64A
outputs should not be applied.
D
are the same as the data written to
OUT
D
provides the read data for the next address.
OUT
guaranteed but not 100% tested.
D
during the write cycle.
IN
C
= 5pF. This parameter is
L
5. If tWP or (t
required tDW. If not apply and the write pulse can be as short as the specified tWP.
OE is low during a WE controlled write cycle, the write pulse width must be the larger of
+ tDW) to allow the I/O drivers to turn off and data to be placed on the bus for the
WHZ
OE is high during a WE controlled write cycle, this requirement does
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PACKAGE DIMENSIONS 28-LEAD DIP SRAM (600 mil)
A1
CH
Preliminary T15M64A
A
B
B1
C2
C1
Symbol
A 1.440 1.450 1.460 36.58 36.83 37.08
A1 0.546 0.550 0.554 13.87 13.97 14.07
B - 0.210 - - 5.33 ­B1 0.100 - - 2.54 - ­B2 0.140 0.150 0.160 3.56 3.81 4.06 B3 0.015 - - 0.38 - -
Dimension in inches Dimension in mm
min. typ. max min. typ. max.
D
B2
B3
C
D1
C - 0.100 - - 2.54 ­C1 0.016 0.018 0.020 0.41 0.46 0.51 C2 - 0.060 - - 1.52 -
D 0.600 0.612 0.624 15.24 15.54 15.85 D1 0.630 0.650 0.670 16.0 16.51 17.0
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PACKAGE DIMENSIONS 28-LEAD SOJ SRAM (300 mil)
CH
Preliminary T15M64A
SYMBOL DIMENSIONS IN INCHES DIMENSIONS IN MM
A 0.710±0.002 18.03±0.05 B 0.300±0.005 7.62±0.13 C 0.060±0.002 1.52±0.05 D 0.050±0.001 1.27±0.03
E 0.063±0.001 1.63±0.03
F 0.015±0.002 0.38±0.05 G 0.030±0.002 0.76±0.05 H 0.050±0.002 1.27±0.05
I 0.018±0.002 0.46±0.05 J 0.028±0.002 0.71±0.05
K 0.337±0.002 8.56±0.05
L 0.010±0.001 0.25±0.03
M 0.026±0.002 0.66±0.05
N 0.268±0.003 6.81±0.08 O 0.300±0.002 7.62±0.05
P 0.053±0.001 1.35±0.03 Q 0.140±0.004 3.56±0.10
y 0.004(MAX) 0.10(MAX)
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PACKAGE DIMENSIONS 28-LEAD SOP
CH
Preliminary T15M64A
e1
Symbol
A A1 A2
b C D E
e
HE
L
28
1
D
S
Seating Plane
Dimension in inches Dimension in mm
min. typ. max min. typ. max.
- - 0.112 - - 2.845
0.004 - - 0.102 - -
0.093 0.098 0.103 2.362 2.489 2.616
0.014 0.016 0.020 0.335 0.406 0.508
0.008 0.010 0.014 0.203 0.254 0.356
- 0.713 0.733 - 18.110 18.618
0.326 0.331 0.336 8.280 8.407 8.534
0.044 0.050 0.056 1.118 1.270 1.422
0.453 0.465 0.477 11.506 11.811 12.116
0.028 0.036 0.044 0.711 0.914 1.117
b
y
15
14
e
EHE
A2
A1
A
De tail F
L
e1
C
Se e D eta il F
Notes :
1. Dimensions D max. & S include mold flash or tie bar burrs.
2. Dimension b does not include dambar protrusion / intrusion.
3. Dimensions D & E include mold mismatch and determined at the mold parting line.
4. controlling dimension : inches
5. general appearance spec should be based on final visual inspection spec.
LE
LE
S y θθθθ
0.059 0.067 0.075 1.499 1.702 1.905
- 39 - - 1.0 -
- - 0.004 - - 0.102
0°
-
10° 0°
-
10°
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PACKAGE DIMENSIONS 28-LEAD TSOP-I (8X13.4mm)
CH
Preliminary T15M64A
D
C
1
14 15
Db
Seating plane
28
"A"
Gauge plane
Detail "A"
b
E
e
A2AA1
Seating plane y
0.010
L
L1
SYMBOL DIMENSIONS IN INCHES DIMENSIONS IN MM
A 0.047(max.) 1.20(max.) A1 0.004±0.002 0.10±0.05 A2 0.039±0.002 1.00±0.05
b 0.008(typ.) 0.20(typ.) c 0.006(typ.) 0.15(typ.)
Db 0.465±0.004 11.80±0.10
E 0.315±0.004 8.00±0.10
e 0.022(typ.) 0.55(typ.)
D 0.528±0.008 13.40±0.20
L 0.020±0.004 0.50±0.10
L1 0.0315±0.004 0.80±0.10
y 0.004(max.) 0.10(max.) θ 0°°°°~5°°°° 0°°°°~5°°°°
TM Technology Inc. reserves the right P. 13 Publication Date: SEP. 2002 to change products or specifications without notice. Revision:0.A
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