
SV05..F
SV05..F
Fast Recovery Diode
Advance Information
Replaces March 1998 version, DS4144-3.4 DS4144-4.0 January 2000
APPLICATIONS
■ Induction Heating
■ A.C. Motor Drives
■ Snubber Diode
■ Welding
■ High Frequency Rectification
■ UPS
FEATURES
■ Double Side Cooling
■ High Surge Capability
■ Low Recovery Charge
VOLTAGE RATINGS
Type Number Repetitive Peak
Reverse Voltage
V
RRM
V
SV05 25F M or K
SV05 24F M or K
SV05 22F M or K
SV05 20F M or K
2500
2400
2200
2000
Conditions
= V
V
RSM
RRM
+ 100V
KEY PARAMETERS
V
I
F(AV)
I
FSM
Q
t
rr
RRM
r
2500V
145A
2500A
150µC
2.2µs
For 1/2" 20 UNF thread, add suffix K, e.g. SV05 25FK.
For M12 thread, add suffix M, e.g. SV05 25FM.
For stud anode add 'R' to type number, e.g. SV05 25FMR.
For outline DO8C add suffix 'C' to typ number,
e.g. SV05 25FKC.
Outline type codes: DO8 and DO8C.
See Package Details for further information.
CURRENT RATINGS
Symbol Parameter Conditions UnitsMax.
I
F(AV)
I
F(RMS)
I
Mean forward current
RMS value
F
Continuous (direct) forward current
Half wave resistive load, T
T
= 65oC 225 A
case
T
= 65oC 195 A
case
= 65oC 145 A
case
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SV05..F
SURGE RATINGS
ParameterSymbol
FSM
FSM
Surge (non-repetitive) forward currentI
Surge (non-repetitive) forward currentI
THERMAL AND MECHANICAL DATA
Symbol
th(j-c)
th(c-h)
T
vj
T
stg
Thermal resistance - junction to caseR
Thermal resistance - case to heatsinkR
Virtual junction temperature
Storage temperature range -55 150
Parameter
Conditions
Max. Units
2.5 kA
10ms half sine; with 0% V
RRM, Tj
= 150oC
31 x 10
2.0 kA
10ms half sine; with 50% V
RRM, Tj
= 150oC
20 x 103A2sI2t for fusingI2t
Conditions Max. Units
dc
Min.
- 0.23oC/W
Mounting torque 15Nm
with mounting compound
On-state (conducting) - 150
16.513.5Mounting torque-
3
A2sI2t for fusingI2t
o
C/W- 0.02
o
C
o
C
Nm
CHARACTERISTICS
Symbol Typ. Units
V
FM
I
RRM
t
rr
Q
RA1
I
RM
Forward voltage
Peak reverse current
Reverse recovery time
Recovered charge (50% chord)
Reverse recovery current
K Soft factor
V
TO
r
T
V
FRM
Threshold voltage
Slope resistance
Forward recovery voltage di/dt = 1000A/µs, Tj = 125oC - 250 V
Parameter
Conditions Max.
At 600A peak, T
At V
, T
RRM
case
= 25oC - 2.8 V
case
= 150oC-mA
50
2.2 -
= 600A, diRR/dt = 80A/µs
I
F
T
= 150oC, VR = 100V
case
- 150 µC
- 140 A
---
At Tvj = 150oC - 1.4 V
At T
= 150oC - 2.5 mΩ
vj
µs
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SV05..F
DEFINITION OF K FACTOR AND Q
Q
= 0.5x IRR(t1 + t2)
RA1
dIR/dt
0.5x I
t
1
RR
I
RR
k = t
t
2
1/t2
CURVES
1000
- (A)
F
Measured under pulse conditions
900
RA1
τ
800
700
Tj = 150˚C
Tj = 25˚C
Instantaneous forward current I
600
500
2.0 2.5 3.0 3.5 4.0
Instantaneous forward voltage V
Fig.1 Maximum (limit) forward characteristics
- (V)
F
4.5
3/8

SV05..F
500
Measured under pulse
conditions
400
- (A)
F
Tj = 25˚C
300
200
Instantaneous forward current I
100
Tj = 150˚C
0
1.0 1.5 2.0 2.5 3.0
Instantaneous forward voltage V
- (V)
F
Fig.2 Maximum (limit) forward characteristics
4/8

SV05..F
10000
I
F
tp = 1ms
- (µC)
S
1000
dIR/dt
100
Reverse recovered charge Q
10
1 10 100 1000
Rate of rise of reverse current dI
50µs
QS =
∫
0
Q
S
I
RR
Fig.3 Recovered charge
IF = 200A
IF = 100A
/dt - (A/µs)
R
Conditions:
= 150 ˚C,
T
j
= 100V
V
R
IF = 1000A
IF = 500A
1000
Conditions:
= 150˚C,
T
- (A)
RR
j
= 100V
V
R
IF = 1000A
100
Reverse recovery current I
10
1 10 100 1000
Rate of rise of reverse current dI
/dt - (A/µs)
R
Fig.4 Typical reverse recovery current vs rate of rise of reverse current
5/8

SV05..F
0.1
d.c.
0.01
Thermal impedance - (˚C/W)
0.001
1010.10.01
Time - (s)
Fig.5 Maximum (limit) transient thermal impedance - junction to case - (˚C/W)
100
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SV05..F
PACKAGE DETAILS - DO8 and DO8C
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Ø8.4 ± 0.3
8 min
20 max
163 ± 10
3.17 max
Nominal weight: 120g
Mounting torque: 15Nm ±10%
Package outine type code: DO8
Thread M12
1/2" 20 UNF
Ø27 max
8 min
Type No + K - 20.6 ± 0.6
Type No + M - 18.0 ± 0.5
Ø5.2 ± 0.2
60 max
3.17 max
Mounting torque: 15Nm ±10%
Package outine type code: DO8C
12 ± 0.5
Nominal weight: 120g
12 ± 0.5
Ø27 max
Thread M12
1/2" 20 UNF
8 min
Type No + K - 20.6 ± 0.6
Type No + M - 18.0 ± 0.5
7/8

SV05..F
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
HEATSINKS
Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
http://www.dynexsemi.com
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
8/8
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SALES OFFICES
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Germany Tel: 07351 827723
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.
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These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS4144-4 Issue No. 4.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM