Datasheet sum27n20-78 Datasheet

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N-Channel 200-V (D-S) 175_C MOSFET
PRODUCT SUMMARY
V
(BR)DSS
(V) r
200
TO-263
0.078 @ VGS = 10 V 27
(W) I
DS(on)
0.083 @ VGS = 6 V 26
G
D
D
(A)
Vishay Siliconix
FEATURES
D TrenchFETr Power MOSFET D 175_C Junction Temperature D New Low Thermal Resistance Package D PWM Optimized for Fast Switching
APPLICATIONS
D Isolated DC/DC Converters
- Primary-Side Switch
SDG
Top View
SUM27N20-78
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TC = 25_C UNLESS OTHERWISE NOTED)
Parameter Symbol Limit Unit
Drain-Source Voltage V Gate-Source Voltage V
Continuous Drain Current (TJ = 175_C)
Pulsed Drain Current I Avalanche Current I Repetitive Avalanche Energy
Maximum Power Dissipation
Operating Junction and Storage Temperature Range TJ, T
_
a
a
TC = 25_C
TC = 125_C
L = 0.1 mH E
TC = 25_C
TA = 25_C
c
P
I
DM AR
DS GS
D
AR
D
stg
200
"20
27
15.5 60 18
16.2 mJ
150
3.75
-55 to 175 _C
THERMAL RESISTANCE RATINGS
V
A
b
W
Parameter Symbol Limit Unit
Junction-to-Ambient PCB Mount (TO-263) Junction-to-Case (Drain) R
Notes a. Duty cycle v 1%. b. See SOA curve for voltage derating. c. When mounted on 1” square PCB (FR-4 material).
Document Number: 72108 S-31511—Rev. B, 14-Jul-03
c
R
thJA thJC
40
1.0
_C/W
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Page 2
V
g
DSS
m
DS
,
GS
,
D
VDD = 100 V, RL = 5 W
F
, m
Vishay Siliconix
SPECIFICATIONS (TJ =25_C UNLESS OTHERWISE NOTED)
Parameter Symbol T est Condition Min Typ Max Unit
Static
Drain-Source Breakdown V oltage V Gate-Threshold Voltage V
Gate-Body Leakage I
(BR)DSS
GS(th)
GSS
VDS = 0 V, I
VDS = VGS, I
= 250 mA 200
D
= 250 mA 2 4
D
VDS = 0 V, VGS = "20 V
"100 nA
VDS = 160 V, VGS = 0 V 1
Zero Gate Voltage Drain Current I
DSS
VDS = 160 V, VGS = 0 V, TJ = 125_C 50 VDS = 160 V, VGS = 0 V, TJ = 175_C 250
On-State Drain Current
a
I
D(on)
VDS w 15 V, VGS = 10 V 60 A
VGS = 10 V, ID = 20 A 0.064 0.078
Drain-Source On-State Resistance
a
r
DS(on)
VGS = 10 V, ID = 20 A, TJ = 125_C 0.160
VGS = 10 V, ID = 20 A, TJ = 175_C 0.205 Drain-Source on State Resistance VGS = 6 V, ID = 15 A 0.068 0.083 W Forward Transconductance
Dynamic
b
Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Total Gate Charge Gate-Source Charge Gate-Drain Charge
Gate Resistance R Turn-On Delay Time
Rise Time
c
Turn-Off Delay Time
c
Fall Time
Source-Drain Diode Ratings and Characteristics (TC = 25_C)
a
c
c
c
c
c
Q Q
t
d(on)
t
d(off)
g
fs
iss
oss
rss
Q
g gs gd
G
VDS = 15 V, ID = 30 A 15 S
2150
VGS = 0 V, VDS = 25 V, f = 1 MHz
215 pF
90 40 60
V
= 100 V, VGS = 10 V, ID = 20 A
DS
11 14
2 W
15 25
t
r
t
f
VDD = 100 V, RL = 5 W
ID ^ 20 A, V
GEN
= 10 V, RG = 2.5 W
35 55 40 60 30 45
b
mA
W
nC
ns
Continuous Current I Pulsed Current I Forward Voltage
a
Reverse Recovery Time t Peak Reverse Recovery Current I
RM(REC)
Reverse Recovery Charge Q
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature.
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2
S
SM
V
SD
rr
IF = 20 A, V
IF = 50 A, di/dt = 100 A/ms
rr
GS
= 0 V
1.0 1.5 V
115 170 ns
7.5 12 A
0.43 1.02 mC
27 60
A
Document Number: 72108
S-31511—Rev. B, 14-Jul-03
Page 3
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
60
VGS = 10 thru 7 V
50
Output Characteristics Transfer Characteristics
6 V
Vishay Siliconix
60
50
40
30
- Drain Current (A)I 20
D
10
0
012345678910
VDS - Drain-to-Source Voltage (V) VGS - Gate-to-Source Voltage (V)
5 V
3 V, 4 V
40
30
- Drain Current (A)I 20
D
10
0
01234567
TC = 125_C
25_C
-55_C
Transconductance On-Resistance vs. Drain Current
80
60
40
- Transconductance (S)g
20
fs
TC = -55_C
25_C
125_C
W )
- On-Resistance (r
DS(on)
0.16
0.12
0.08
0.04
VGS = 6 V
VGS = 10 V
0
0 102030405060
3000
2500
2000
1500
1000
C - Capacitance (pF)
C
500
0
Document Number: 72108 S-31511—Rev. B, 14-Jul-03
rss
0 40 80 120 160 200
V
DS
0.00 0 102030405060
ID - Drain Current (A)
Capacitance Gate Charge
C
iss
C
oss
- Drain-to-Source Voltage (V)
- Gate-to-Source Voltage (V)
GS
V
20
VDS = 100 V
16
I
= 20 A
D
12
8
4
0
0 102030405060
- Drain Current (A)
I
D
Qg - Total Gate Charge (nC)
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Page 4
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Junction Temperature Source-Drain Diode Forward Voltage
3.0 V
= 10 V
GS
I
= 20 A
D
2.5
W)
2.0
1.5
(Normalized)
- On-Resistance (r
DS(on)
1.0
0.5
- Source Current (A)I
S
100
T
= 150_C
10
J
T
J
= 25_C
0.0
-50 -25 0 25 50 75 100 125 150 175 TJ - Junction Temperature (_C) VSD - Source-to-Drain Voltage (V)
1000
100
(a)I
10
Dav
1
0.1
0.00001 0.001 0.1 1
Avalanche Current vs. Time
IAV (A) @ T
IAV (A) @ T
0.0001
= 150_C
A
= 25_C
A
0.01
1
0
0.3 0.6 0.9 1.2
Drain Source Breakdown vs.
Junction Temperature
260
240
(V)V
220
(BR)DSS
200
180
ID = 1.0 mA
-50 -25 0 25 50 75 100 125 150 175 TJ - Junction Temperature (_C)tin (Sec)
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Document Number: 72108
S-31511—Rev. B, 14-Jul-03
Page 5
THERMAL RATINGS
Vishay Siliconix
Maximum Avalanche and Drain Current
30
vs. Case Temperature
25
20
15
- Drain Current (A)I
10
D
5
0
0 25 50 75 100 125 150 175
TC - Ambient Temperature (_C)
2
1
Duty Cycle = 0.5
Normalized Thermal Transient Impedance, Junction-to-Case
100
Limited by r
10
- Drain Current (A)I
1
D
0.1
0.1 1 10 1000
Safe Operating Area
DS(on)
TC = 25_C
Single Pulse
100
VDS - Drain-to-Source Voltage (V)
10 ms
100 ms
1 ms 10 ms
100 ms, dc
0.2
0.1
Thermal Impedance
Normalized Effective Transient
0.01
Single Pulse
-4
10
0.02
0.05
0.1
-3
10
Square Wave Pulse Duration (sec)
-2
10
-1
10
1
Document Number: 72108 S-31511—Rev. B, 14-Jul-03
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Page 6
Legal Disclaimer Notice
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Disclaimer

All product specifications and data are subject to change without notice.
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Document Number: 91000 www.vishay.com Revision: 18-Jul-08 1
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