Datasheet sum23n15-73 Datasheet

Page 1
N-Channel 150-V (D-S) 175_C MOSFET
Conti
t (TJ = 175_C)
I
A
PRODUCT SUMMARY
V
(BR)DSS
(V) r
150
TO-263
0.073 @ VGS = 10 V 23
(W) I
DS(on)
0.077 @ VGS = 6 V 22.5
G
(A)
D
D
SUM23N15-73
FEATURES
D TrenchFETr Power MOSFETS D 175_C Junction Temperature D New Low Thermal Resistance Package D PWM Optimized
APPLICATIONS
D Primary Side Switch
SDG
Top View
Ordering Information: SUM23N15-73
SUM23N15-73
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TC = 25_C UNLESS OTHERWISE NOTED)
Parameter Symbol Limit Unit
Drain-Source Voltage V Gate-Source Voltage V
=
nuous Drain Curren
Pulsed Drain Current I Avalanche Current I Repetitive Avalanche Energy
Maximum Power Dissipation
Operating Junction and Storage Temperature Range TJ, T
_
a
a
TC = 25_C
TC = 125_C
L = 0.1 mH E
TC = 25_C
TA = 25_C
c
P
DS GS
D
DM AR
AR
D
stg
150
"20
23
13.4 35 25 31 mJ
100
3.75
-55 to 175 _C
V
b
W
THERMAL RESISTANCE RATINGS
Parameter Symbol Limit Unit
Junction-to-Ambient (PCB Mount) Junction-to-Case (Drain) R
Notes a. Duty cycle v 1%. b. See SOA curve for voltage derating. c. When mounted on 1” square PCB (FR-4 material).
Document Number: 72143 S-03535—Rev. A, 24-Mar-03
c
R
thJA thJC
40
1.5
_C/W
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Page 2
SUM23N15-73
V
g
DSS
m
DS
,
GS
,
D
VDD = 75 V, RL = 3.26 W
SPECIFICATIONS (TJ =25_C UNLESS OTHERWISE NOTED)
Parameter Symbol T est Condition Min Typ Max Unit
Static
Drain-Source Breakdown V oltage V Gate-Threshold Voltage V
Gate-Body Leakage I
(BR)DSS
GS(th)
GSS
VDS = 0 V, I
VDS = VGS, I
VDS = 0 V, VGS = "20 V "100 nA
VDS = 120 V, VGS = 0 V 1
Zero Gate Voltage Drain Current I
DSS
VDS = 120 V, VGS = 0 V, TJ = 125_C 50 VDS = 120 V, VGS = 0 V, TJ = 175_C 250
On-State Drain Current
a
I
D(on)
VDS w 5 V, VGS = 10 V 35 A
VGS = 10 V, ID = 15 A 0.059 0.073
Drain-Source On-State Resistance
a
r
DS(on)
VGS = 10 V, ID = 15 A, TJ = 125_C 0.140 VGS = 10 V, ID = 15 A, TJ = 175_C 0.168
VGS = 6 V, ID = 10 A 0.062 0.077
Forward Transconductance
Dynamic
b
Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C Total Gate Charge Gate-Source Charge Gate-Drain Charge
Gate Resistance R Turn-On Delay Time
Rise Time
c
Turn-Off Delay Time
c
Fall Time
a
c
c
c
c
c
Q Q
t
d(on)
t
d(off)
g
fs
iss
oss
rss
Q
g gs gd
G
t
r
VDS = 15 V, ID = 25 A 10 S
VGS = 0 V, VDS = 25 V, f = 1 MHz
V
= 75 V, VGS = 10 V, ID = 23 A
DS
VDD = 75 V, RL = 3.26 W
ID ^ 23 A, V
t
f
Source-Drain Diode Ratings and Characteristics (TC = 25_C)
= 250 mA 150
D
= 250 mA 2 4
D
= 10 V, RG = 2.5 W
GEN
b
1290
160 pF
70 22 35
6
7.5
4.0 W 10 15
60 90 30 43 45 70
mA
W
nC
ns
Continuous Current I Pulsed Current I Forward Voltage
a
Reverse Recovery Time t Peak Reverse Recovery Current I Reverse Recovery Charge Q
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature.
S
SM
V
SD
rr
RM(REC)
rr
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2
IF = 23 A, V
GS
= 0 V
IF = 23 A, di/dt = 100 A/ms
35 23
1.0 1.5 V
100 150 ns
5 8 A
0.25 0.6 mC
Document Number: 72143
S-03535—Rev. A, 24-Mar-03
A
Page 3
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
35
30
25
Output Characteristics Transfer Characteristics
VGS = 10 thru 6 V
SUM23N15-73
35
28
20
15
- Drain Current (A)I
D
10
5
0
0 3 6 9 12 15
VDS - Drain-to-Source Voltage (V) VGS - Gate-to-Source Voltage (V)
Transconductance On-Resistance vs. Drain Current
50
TC = -55_C
40
30
20
- Transconductance (S)g
fs
10
5 V
4 V
25_C
125_C
- Drain Current (A)I
D
W )
- On-Resistance (r
DS(on)
21
14
TC = 125_C
7
25_C
0
0123456
0.12
0.09 VGS = 6 V
0.06 VGS = 10 V
0.03
-55_C
0
0 5 10 15 20 25 30
2000
1600
1200
800
C - Capacitance (pF)
400
0
0 30 60 90 120 150
Document Number: 72143 S-03535—Rev. A, 24-Mar-03
C
rss
V
DS
0.00
0 5 10 15 20 25 30 35
ID - Drain Current (A)
Capacitance Gate Charge
C
iss
C
oss
- Drain-to-Source Voltage (V)
- Gate-to-Source Voltage (V)
GS
V
20
VDS = 75 V
16
I
= 23 A
D
12
8
4
0
0 8 16 24 32 40
- Drain Current (A)
I
D
Qg - Total Gate Charge (nC)
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Page 4
SUM23N15-73
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Junction Temperature Source-Drain Diode Forward Voltage
2.7 V
= 10 V
2.4
2.1
W)
1.8
1.5
1.2
(Normalized)
- On-Resistance (r
0.9
0.6
DS(on)
0.3
0.0
GS
I
= 15 A
D
-50 -25 0 25 50 75 100 125 150 175 TJ - Junction Temperature (_C) VSD - Source-to-Drain Voltage (V)
- Source Current (A)I
S
100
T
= 150_C
10
1
0
J
0.3 0.6 0.9 1.5
T
J
= 25_C
1.2
Drain Source Breakdown vs.
Junction Temperature
190
180
(V)V
170
(BR)DSS
160
150
140
ID = 1.0 mA
-50 -25 0 25 50 75 100 125 150 175 TJ - Junction Temperature (_C)
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Document Number: 72143
S-03535—Rev. A, 24-Mar-03
Page 5
THERMAL RATINGS
SUM23N15-73
Maximum Avalanche and Drain Current
25
vs. Case Temperature
20
15
10
- Drain Current (A)I
D
5
0
0 25 50 75 100 125 150 175
TC - Ambient Temperature (_C)
2
1
Duty Cycle = 0.5
0.2
Normalized Thermal Transient Impedance, Junction-to-Case
100
10
- Drain Current (A)I
1
D
0.1
0.1 1 10 1000
Safe Operating Area
Limited
by r
DS(on)
TC = 25_C
Single Pulse
100
VDS - Drain-to-Source Voltage (V)
10 ms 100 ms
1 ms
10 ms 100 ms
dc
0.1
0.1
Thermal Impedance
Normalized Effective Transient
Single Pulse
0.01
-4
10
0.02
0.05
-3
10
-2
10
Square Wave Pulse Duration (sec)
10
-1
1
10
Document Number: 72143 S-03535—Rev. A, 24-Mar-03
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Page 6
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