Datasheet sum110n05-06l Datasheet

Page 1
SUM110N05-06L
N-Channel 55-V (D-S), 175 °C MOSFET
Vishay Siliconix
PRODUCT SUMMARY
V
(V) r
(BR)DSS
55
Ordering Information: SUM110N05-06L
DS(on)
0.006 at V
0.0085 at V
(Ω)I
GS
GS
SUM110N05-06L-E3 (Lead (Pb)-free)
= 10 V
= 4.5 V
TO-263
Top View
(A) Qg (Typ)
D
110
92
SDG
65
FEATURES
• TrenchFET® Power MOSFET
• 175 °C Junction Temperature
• Low Thermal Resistance Package
APPLICATIONS
• Industrial
D
G
S
N-Channel MOSFET
Available
RoHS*
COMPLIANT
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
= 175 °C)
J
Pulsed Drain Current
Avalanche Current
Repetitive Avalanche Energy
a
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
= 25 °C
T
C
= 125 °C
T
C
L = 0.1 mH
T
= 25 °C
C
= 25 °C
T
A
V
DS
V
GS
I
D
I
DM
I
AR
E
AR
P
c
D
T
, T
J
stg
55
± 20
110
63
240
60
180 mJ
b
158
3.7
W
- 55 to 175 °C
V
A
THERMAL RESISTANCE RATINGS
Parameter Symbol Limit Unit
Junction-to-Ambient
PCB Mount
Junction-to-Case
Notes: a. Duty cycle ≤ 1 %. b. See SOA curve for voltage derating. c. When Mounted on 1" square PCB (FR-4 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply.
c
R
thJA
R
thJC
40
0.95
°C/W
Document Number: 72005 S-80108-Rev. C, 21-Jan-08
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Page 2
SUM110N05-06L
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
b
a
Input Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Tur n -O n De l ay T i m e
Rise Time
Turn-Off Delay Time
Fall Time
c
c
c
c
c
c
c
V
(BR)DSS
V
GS(th)
I
GSS
I
DSS
I
V
D(on)
a
r
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Qgd
t
d(on)
t
r
t
d(off)
t
f
Source-Drain Diode Ratings and Characteristics TC = 25 °C
Continuous Current
Pulsed Current
Forward Voltage
a
Reverse Recovery Time
Peak Reverse Recovery Charge
Reverse Recovery Charge
I
S
I
SM
V
SD
t
rr
I
RM(REC)
Q
rr
Notes: a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature.
VDS = 0 V, ID = 250 µA
V
= VGS, ID = 250 µA
DS
VDS = 0 V, VGS = ± 20 V
V
= 55 V, V
DS
V
= 55 V, V
DS
V
= 55 V, V
DS
≥ 5 V, V
DS
V
= 10 V, ID = 30 A
GS
V
= 4.5 V, ID = 20 A
GS
V
= 10 V, ID = 30 A, TJ = 125 °C
GS
V
= 10 V, ID = 30 A, TJ = 175 °C
GS
GS
= 0 V, TJ = 125 °C
GS
= 0 V, TJ = 175 °C
GS
GS
VDS = 15 V, ID = 30 A
VGS = 0 V, V
VDS = 30 V, V
V
DD
≅ 110 A, V
I
D
b
IF = 110 A, V
= 25 V, f = 1 MHz
DS
= 10 V, ID = 110 A
GS
= 30 V, RL = 0.27 Ω
= 10 V, Rg = 2.5 Ω
GEN
GS
IF = 110 A, di/dt = 100 A/µs
= 0 V
= 10 V
= 0 V
55
13
V
± 100 nA
1
50
µA
250
120 A
0.0047 0.006
0.0066 0.0085
0.0102
Ω
0.0132
30 S
3300
625
pFOutput Capacitance
310
65 100
15
nC
16
15 25
15 25
35 55
ns
15 25
110
240
A
1.0 1.5 V
70 125 ns
2.5 5 A
0.09 0.31 µC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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Document Number: 72005
S-80108-Rev. C, 21-Jan-08
Page 3
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
SUM110N05-06L
Vishay Siliconix
250
200
150
100
- Drain Current (A)I
D
50
0
0246810
VGS = 10 thru 5 V
4 V
2, 3 V
VDS - Drain-to-Source Voltage (V)
Output Characteristics
200
160
120
80
- Transconductance (S)g
fs
40
TC = - 55 °C
25 °C
125 °C
- Drain Current (A)I
D
Ω)
- On-Resistance (r
DS(on)
250
200
150
100
50
0
0123456
TC = 125 °C
25 °C
- 55 °C
VGS - Gate-to-Source Voltage (V)
Transfer Characteristics
0.015
0.012
0.009
VGS = 4.5 V
0.006
0.003
VGS = 10 V
0
0 153045607590
VGS - Gate-to-Source Voltage (V)
5000
4000
3000
2000
C - Capacitance (pF)
1000
0
0 1122334455
C
rss
VDS - Drain-to-Source Voltage (V)
Document Number: 72005 S-80108-Rev. C, 21-Jan-08
Transconductance
C
iss
C
Capacitance
oss
0.000 0 20 40 60 80 100 120
ID - Drain Current (A)
On-Resistance vs. Drain Current
20
VGS = 30 V
16
I
= 110 A
D
12
8
- Gate-to-Source Voltage (V)
GS
4
V
0
0 20 40 60 80 100 120
Qg - Total Gate Charge (nC)
Gate Charge
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Page 4
SUM110N05-06L
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2.5
2.0
1.5
1.0
- On-Resistance (Normalized)
DS(on)
r
0.5
0.0
- 50 - 25 0 25 50 75 100 125 150 175
1000
100
(a)I
10
Dav
V
= 10 V
GS
= 30 A
I
D
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
IAV (A) at T
= 25 °C
J
100
T
= 150 °C
J
10
- Source Current (A)I
S
1
0.2
0.4 0.6 0.8 1.0 1.2
VSD - Source-to-Drain Voltage (V)
T
J
= 25 °C
Source-Drain Diode Forward Voltage
70
ID = 10 mA
65
60
1
IAV (A) at T
0.1
0.00001 0.0001 0.01 1
= 150 °C
J
0.001
0.1
tin (s)
Avalanche Current vs. Time
- On-Resistance (Normalized)
55
DS(on)
r
50
- 50 - 25 0 25 50 75 100 125 150 175
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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Document Number: 72005
S-80108-Rev. C, 21-Jan-08
Page 5
THERMAL RATINGS
SUM110N05-06L
Vishay Siliconix
120
100
80
60
40
- Drain Current (A)I
D
20
0
0 25 50 75 100 125 150 175
TC - Ambient Temperature (°C)
Maximum Drain Current
vs. Case Temperature
2
1
Duty Cycle = 0.5
0.2
0.1
1000
Limited by r
100
10
- Drain Current (A)I
D
1
0.1
0.1 1 10 100
V
* V
> minimum VGS at which r
GS
*
DS(on)
TC = 25 °C
Single Pulse
- Drain-to-Source Voltage (V)
DS
DS(on)
Safe Operating Area
is specified
10 µs
100 µs
1 ms
10 ms 100 ms
DC
0.1
Thermal Impedance
Normalized Effective Transient
0.01 10
4
-
0.02
Single Pulse
0.05
-
3
10
-2
10
Square Wave Pulse Duration (s)
-
1
10
Normalized Thermal Transient Impedance, Junction-to-Case
1
10
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?72005.
Document Number: 72005
www.vishay.com
S-80108-Rev. C, 21-Jan-08
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Page 6
DETAIL A (ROTATED 90°)
SECTION A-A
-A-
-B-
0° - 5°
D1
A
A
L1
L4
e
b2
b
E
A
c2
c
L2
D
L3
L
M
c1
c
b1
b
Detail “A”
E1
E2
K
E3
D2
D3
6
0.010 M A
M
2 PL
Package Information
Vishay Siliconix
TO-263 (D2PAK): 3-LEAD
INCHES MILLIMETERS
DIM. MIN. MAX. MIN. MAX.
A 0.160 0.190 4.064 4.826
b 0.020 0.039 0.508 0.990
b1 0.020 0.035 0.508 0.889
b2 0.045 0.055 1.143 1.397
Thin lead 0.013 0.018 0.330 0.457
c*
Thick lead 0.023 0.028 0.584 0.711
Thin lead 0.013 0.017 0.330 0.431
c1
Thick lead 0.023 0.027 0.584 0.685
c2 0.045 0.055 1.143 1.397
D 0.340 0.380 8.636 9.652
D1 0.220 0.240 5.588 6.096
D2 0.038 0.042 0.965 1.067
D3 0.045 0.055 1.143 1.397
E 0.380 0.410 9.652 10.414
E1 0.245 - 6.223 -
E2 0.355 0.375 9.017 9.525
E3 0.072 0.078 1.829 1.981
e 0.100 BSC 2.54 BSC
K 0.045 0.055 1.143 1.397
L 0.575 0.625 14.605 15.875
L1 0.090 0.110 2.286 2.794
L2 0.040 0.055 1.016 1.397
L3 0.050 0.070 1.270 1.778
L4 0.010 BSC 0.254 BSC
M - 0.002 - 0.050
ECN: T10-0738-Rev. J, 03-Jan-11 DWG: 5843
Notes
1. Plane B includes maximum features of heat sink tab and plastic.
2. No more than 25 % of L1 can fall above seating plane by max. 8 mils.
3. Pin-to-pin coplanarity max. 4 mils.
4. *: Thin lead is for SUB, SYB.
Thick lead is for SUM, SYM, SQM.
5. Use inches as the primary measurement.
6. This feature is for thick lead.
Document Number: 71198 www.vishay.com Revison: 03-Jan-11
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RECOMMENDED MINIMUM PADS FOR D2PAK: 3-Lead
0.420
(10.668)
0.635 (16.129)
0.355
AN826
Vishay Siliconix
(9.017)
Return to Index
0.135
(3.429)
0.200
(5.080)
Recommended Minimum Pads
Dimensions in Inches/(mm)
0.050
(1.257)
0.145
(3.683)
Document Number: 73397 11-Apr-05
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Legal Disclaimer Notice
Vishay

Disclaimer

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Document Number: 91000 www.vishay.com Revision: 11-Mar-11 1
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