Datasheet sum110n03-04p Datasheet

Page 1
SUM110N03-04P
N-Channel 30-V (D-S) 175_C MOSFET
PRODUCT SUMMARY
V
(BR)DSS
(V) r
30
DS(on)
0.0042 @ VGS = 10 V 110
0.0065 @ VGS = 4.5 V 77
TO-263
(W) I
New Product
FEATURES
D TrenchFETr Power MOSFET D 175_C Junction Temperature D Optimized for Low-Side Synchronous Rectifier Operation
(A)
D
D New Package with Low Thermal Resistance D 100% Rg Tested
D DC/DC Converters D Synchronous Rectifier
Vishay Siliconix
D
G
SDG
Top View
Ordering Information: SUM110N03-04P
SUM110N03-04P-E3 (Lead Free)
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter Symbol Limit Unit
Drain-Source Voltage V
Gate-Source Voltage V
Continuous Drain Current (TJ = 175_C)
Pulsed Drain Current I
Avalanche Current I
Repetitive Avalanche Energy
Maximum Power Dissipation
Operating Junction and Storage Temperature Range TJ, T
_
a
a
TC = 25_C
TC = 100_C
L = 0.1 mH E
TC = 25_C
TA = 25_C
c
P
I
DM
AR
DS
GS
D
AR
D
stg
30
"20
110
88
300
55
151 mJ
120
3.75
−55 to 175 _C
THERMAL RESISTANCE RATINGS
V
A
b
W
Parameter Symbol Limit Unit
Junction-to-Ambient PCB Mount
Junction-to-Case R
Notes a. Duty cycle v 1%. b. See SOA curve for voltage derating. c. When mounted on 1” square PCB (FR-4 material).
Document Number: 72366 S-32523—Rev. B, 08-Dec-03
c
R
thJA
thJC
40
1.25
_C/W
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1
Page 2
SUM110N03-04P
V
g
DSS
m
DS
,
GS
,
D
VDD = 15 V, RL = 0.3 W
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New Product
SPECIFICATIONS (TJ =25_C UNLESS OTHERWISE NOTED)
Parameter Symbol Test Condition Min Typ Max Unit
Static
Drain-Source Breakdown Voltage V
Gate-Threshold Voltage V
Gate-Body Leakage I
Zero Gate Voltage Drain Current I
On-State Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
b
a
a
a
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
Gate-Resistance R
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
b
b
b
b
b
b
b
(BR)DSS
GS(th)
GSS
DSS
I
D(on)
r
DS(on)
g
fs
iss
oss
rss
g
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
Source-Drain Diode Ratings and Characteristics (TC = 25_C)
VDS = 0 V, I
VDS = VGS, I
= 250 mA 30
D
= 250 mA 1 3.0
D
VDS = 0 V, VGS = "20 V
VDS = 30 V, VGS = 0 V 1
VDS = 30 V, VGS = 0 V, TJ = 125_C 50
VDS = 30 V, VGS = 0 V, TJ = 175_C 250
VDS w 5 V, VGS = 10 V 120 A
VGS = 10 V, ID = 20 A 0.0033 0.0042
VGS = 10 V, ID = 20 A, TJ = 125_C 0.0063
VGS = 10 V, ID = 20 A, TJ = 175_C 0.0076
VGS = 4.5 V, ID = 20 A
VDS = 15 V, ID = 20 A 20 S
VGS = 0 V, VDS = 25 V, f = 1 MHz
V
= 15 V, VGS = 4.5 V, ID = 50 A
DS
VDD = 15 V, RL = 0.3 W
ID ^ 50 A, V
= 10 V, Rg = 2.5 W
GEN
c
"100 nA
0.0052 0.0065
5100
860 pF
430
0.5 1.0 1.7 W
40 60
18
16
12 20
12 20
40 60
10 15
mA
W
nC
ns
Continuous Current I
Pulsed Current I
Forward Voltage
a
Reverse Recovery Time t
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Independent of operating temperature. c. Guaranteed by design, not subject to production testing.
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2
S
SM
V
SD
rr
IF = 30 A, V
IF = 50 A, di/dt = 100 A/ms
GS
= 0 V
1.2 1.5 V
40 80 ns
100
300
A
Document Number: 72366
S-32523—Rev. B, 08-Dec-03
Page 3
SUM110N03-04P
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
250
200
150
100
− Drain Current (A)I
D
50
0
0246810
180
150
120
90
60
− Transconductance (S)g
fs
30
Output Characteristics Transfer Characteristics
VGS = 10 thru 5 V
4 V
− Drain Current (A)I
D
2 V
VDS − Drain-to-Source Voltage (V) VGS − Gate-to-Source Voltage (V)
3 V
Transconductance On-Resistance vs. Drain Current
TC = −55_C
25_C
125_C
W )
− On-Resistance (r
DS(on)
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120
100
80
60
40
20
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
0.010
0.008
0.006
0.004
0.002
VGS = 4.5 V
TC = 125_C
25_C
VGS = 10 V
−55_C
0
0 20406080100
8000
7000
6000
5000
4000
3000
C − Capacitance (pF)
2000
1000
C
rss
0
0 6 12 18 24 30
V
DS
Document Number: 72366 S-32523—Rev. B, 08-Dec-03
0.000 0 20406080100
ID − Drain Current (A)
Capacitance Gate Charge
C
iss
C
oss
− Drain-to-Source Voltage (V)
− Gate-to-Source Voltage (V)
V
GS
10
VDS = 15 V
8
I
= 50 A
D
6
4
2
0
0 20406080100
− Drain Current (A)
I
D
Qg − Total Gate Charge (nC)
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Page 4
SUM110N03-04P
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Junction Temperature Source-Drain Diode Forward Voltage
1.8
V
= 10 V
GS
I
= 30 A
D
1.6
W)
1.4
1.2
(Normalized)
− On-Resistance (r
1.0
DS(on)
0.8
0.6
−50 −25 0 25 50 75 100 125 150 175
TJ − Junction Temperature (_C) VSD − Source-to-Drain Voltage (V)
Drain-Source Voltage Breakdown
40
vs. Junction Temperature
100
T
= 150_C
J
10
− Source Current (A)I
S
1
0
0.3 0.6 0.9 1.2 1.5
T
J
= 25_C
ID = 1.0 mA
38
36
(V)
34
(BR)DSS
V
32
30
−50 −25 0 25 50 75 100 125 150 175
TJ − Junction Temperature (_C)
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Document Number: 72366
S-32523—Rev. B, 08-Dec-03
Page 5
SUM110N03-04P
THERMAL RATINGS
Maximum Avalanche Drain Current
vs. Case Temperature
120
100
80
60
40
− Drain Current (A)I
D
20
0
0 25 50 75 100 125 150 175
TC − Case Temperature (_C)
New Product
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1000
− Drain Current (A)I
D
Safe Operating Area, Junction-to-Case
Limited by r
100
10
1
0.1
0.1 1 10 100
DS(on)
TC = 25_C
Single Pulse
VDS − Drain-to-Source Voltage (V)
10 ms
100 ms
1 ms
10 ms
dc, 100 ms
2
1
0.1
Thermal Impedance
Normalized Effective Transient
0.01
−4
10
Duty Cycle = 0.5
0.2
0.1
0.05
0.02
Single Pulse
Normalized Thermal Transient Impedance, Junction-to-Case
−3
10
−2
10
Square Wave Pulse Duration (sec)
10
−1
110
Document Number: 72366 S-32523—Rev. B, 08-Dec-03
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Page 6
Legal Disclaimer Notice
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Disclaimer

All product specifications and data are subject to change without notice.
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Document Number: 91000 www.vishay.com Revision: 18-Jul-08 1
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