Datasheet sud40n10 Datasheet

Page 1
N-Channel 100-V (D-S) 175 °C MOSFET
T
SUD40N10-25
Vishay Siliconix
PRODUCT SUMMARY
VDS (V) R
100
DS(on)
0.025 at V
0.028 at V
GS
GS
(Ω)I
= 10 V
= 4.5 V
D
(A)
40
38
FEATURES
• TrenchFET® Power MOSFET
• 175 °C Maximum Junction Temperature
• 100 % R
Tested
g
Available
RoHS*
COMPLIANT
T O-252
D
Drain Connected to T a b
S GD
T op V i e w
Ordering Information: SUD40N10-25 SUD40N10-25-E3 (Lead (Pb)-free)
G
S
N-Channel MOSFE
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
= 175 °C)
J
b
TC = 25 °C
T
= 125 °C
C
Pulsed Drain Current
Continuous Source Current (Diode Conduction)
Avalanche Current
Single Pulse Avalanche Energy (Duty Cycle ≤ 1 %) L = 0.1 mH
= 25 °C
T
Maximum Power Dissipation
C
= 25 °C
T
A
Operating Junction and Storage Temperature Range
V
DS
V
GS
I
D
I
DM
I
S
I
AS
E
AS
P
D
, T
T
J
stg
100
± 20
40
23
70
40
40
80 mJ
b
136
3
a
W
- 55 to 175 °C
V
A
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Junction-to-Ambient
a
t ≤ 10 s
Steady State
Junction-to-Case
Notes: a. Surface Mounted on 1" x 1" FR4 board. b. See SOA curve for voltage derating.
* Pb containing terminations are not RoHS compliant, exemptions may apply.
Document Number: 71140 S-81732-Rev. E, 04-Aug-08
R
thJA
R
thJC
15 18
40 50
0.85 1.1
°C/W
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1
Page 2
SUD40N10-25
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ.a Max. Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
b
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
a
b
Input Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
c
c
c
Gate Resistance
Tur n -O n De l ay Ti m e
Rise Time
c
Turn-Off Delay Time
Fall Time
c
c
c
b
V
DS
V
GS(th)
I
GSS
I
DSS
I
V
D(on)
R
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Qgd
R
g
t
d(on)
t
r
t
d(off)
t
f
Source-Drain Diode Ratings and Characteristics TC = 25 °C
Pulsed Current
Diode Forward Voltage
b
Source-Drain Reverse Recovery Time
I
SM
V
SD
t
rr
Notes: a. Guaranteed by design, not subject to production testing. b. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %. c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
VGS = 0 V, ID = 250 µA
V
= VGS, ID = 250 µA
DS
VDS = 0 V, VGS = ± 20 V
V
= 100 V, V
DS
V
= 100 V, V
DS
V
= 100 V, V
DS
= 5 V, V
DS
V
= 10 V, ID = 40 A
GS
V
= 10 V, ID = 40 A, TJ = 125 °C
GS
V
= 10 V, ID = 40 A, TJ = 175 °C
GS
V
= 4.5 V, ID = 20 A
GS
GS
= 0 V, TJ = 125 °C
GS
= 0 V, TJ = 175 °C
GS
GS
VDS = 15 V, ID = 40 A
VGS = 0 V, V
VDS = 50 V, V
V
DD
≅ 40 A, V
I
D
IF = 40 A, V
= 25 V, F = 1 MHz
DS
= 10 V, ID = 40 A
GS
= 50 V, RL = 1.25 Ω
= 10 V, Rg = 2.5 Ω
GEN
GS
IF = 40 A, dI/dt = 100 A/µs
= 0 V
= 10 V
= 0 V
100
1.0 3.0
± 100 nA
1
50
250
70 A
0.02 0.025
0.05
0.063
0.022 0.028
70 S
2400
290
120
40 60
11
9
13.5Ω
813
40 60
15 25
80 120
70 A
1.0 1.5 V
75 120 ns
V
µA
Ω
pFOutput Capacitance
nC
ns
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Document Number: 71140
S-81732-Rev. E, 04-Aug-08
Page 3
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
20
SUD40N10-25
Vishay Siliconix
160
VGS = 10 thru 6 V
120
80
- Drain Current (A)I
D
40
0
0246810
VDS- Drain-to-Source Voltage (V)
5 V
Output Characteristics
100
TC = - 55 °C
80
60
25 °C
125 °C
4 V
3 V
100
80
60
40
- D r a i n C urrent (A)I
D
20
0
012345
VGS- Gate-to-Source Voltage (V)
TC = 125 °C
25 °C
-55 °C
Transfer Characteristics
0.05
0.04
0.03 V
= 4.5 V
GS
40
Transconductance (S)g
-
fs
20
0
0 102030405060
- Drain Current (A)
I
D
Transconductance
4000
3000
C
iss
2000
C - Capacitance (pF)
1000
C
rss
0
0 20406080100
VDS- Drain-to-Source Voltage (V)
C
oss
Capacitance
0.02
- On-Resistance (Ω)
DS(on)
R
0.01
0.00
16
12
- Gate-to-Source Voltage (V)
GS
V
V
= 10 V
GS
0 2 04 06 08 0 100
I
- Drain Current (A)
D
On-Resistance vs. Drain Current
V DS = 50 V I
= 40 A
D
8
4
0
0 2 04 06 080
Qg- Total Gate Charge (nC)
Gate Charge
Document Number: 71140 S-81732-Rev. E, 04-Aug-08
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3
Page 4
SUD40N10-25
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
3.0
VGS= 10 V
I
= 40 A
D
2.5
2.0
1.5
- On-Resistance (Normalized)
1.0
DS(on)
R
0.5
Source Current (A)I
-
S
100
T
= 175 °C
J
10
TJ= 25 °C
0.0
- 50 - 25 0 25 50 75 100 125 150 175
TJ- J unction Temperature ( )°C
On-Resistance vs. Junction Temperature
THERMAL RATINGS
50
40
30
20
Drain Current (A)
-
D
I
10
0
0 25 50 75 100 125 150 175
TC- Case Temperature (°C)
Maximum Avalanche Drain Current
vs. Case Temperature
2
1
Duty Cycle = 0.5
1
0
0.3 0.6 0.9 1.2
VSD - Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
100
DS(on)
10 µs
100 µs
1 ms
10 ms
100 ms 1 s, DC
100
is specified
00010111.0
Limited by R
10
- Drain Current (A)I
D
1
0.1
* V
DS(on)*
TC = 25 °C
Single Pulse
VDS- Drain-to-Source Voltage (V)
> minimum VGSat which R
GS
Safe Operating Area
0.2
0.1
0.1
Thermal Impedance
Normalized Effective Transient
0.01
-4
10
0.02
0.05
Single Pulse
-3
10
-2
10
Square Wave Pulse Duration (s)
-1
10
1
10 30
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?71140.
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Document Number: 71140
S-81732-Rev. E, 04-Aug-08
Page 5
TO-252AA CASE OUTLINE
Package Information
Vishay Siliconix
E
b2
L2
D
L1
L3
b
e1
E1
b1
e
D1
A
C1
H
L
C
A2
A1
gage plane height (0.5 mm)
MILLIMETERS INCHES
DIM. MIN. MAX. MIN. MAX.
A 2.21 2.38 0.087 0.094
A1 0.89 1.14 0.035 0.045
A2 0.030 0.127 0.001 0.005
b 0.71 0.88 0.028 0.035
b1 0.76 1.14 0.030 0.045
b2 5.23 5.44 0.206 0.214
C 0.46 0.58 0.018 0.023
C1 0.46 0.58 0.018 0.023
D 5.97 6.22 0.235 0.245
D1 4.10 4.45 0.161 0.175
E 6.48 6.73 0.255 0.265
E1 4.49 5.50 0.177 0.217
e 2.28 BSC 0.090 BSC
e1 4.57 BSC 0.180 BSC
H 9.65 10.41 0.380 0.410
L 1.40 1.78 0.055 0.070
L1 0.64 1.02 0.025 0.040
L2 0.89 1.27 0.035 0.050
L3 1.15 1.52 0.040 0.060
ECN: T11-0110-Rev. L, 18-Apr-11 DWG: 5347
Note
• Dimension L3 is for reference only.
Document Number: 71197 www.vishay.com 18-Apr-11 1
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
This document is subject to change without notice.
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Page 6
RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)
0.224
(5.690)
Application Note 826
Vishay Siliconix
0.243 (6.180)
Return to Index
Return to Index
0.420 (10.668)
0.180
(4.572)
Recommended Minimum Pads
Dimensions in Inches/(mm)
0.087
0.090
0.055
(1.397)
(2.202)
(2.286)
APPLICATION NOTE
Document Number: 72594 www.vishay.com Revision: 21-Jan-08 3
Page 7
Legal Disclaimer Notice
Vishay

Disclaimer

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