Thermal Resistance Junction-case Max
Thermal Resistance Junction-ambient Max
Thermal Resistance Case-sink Typ
Maximum Lead Temperature For Soldering Purpose
l
AVALANCHE CHARACTERIST ICS
SymbolParameterMax ValueUnit
I
AR
E
E
I
AR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
Single Pulse Avalanche Energy
AS
(starting T
Repetitive Avalanche Energy
AR
= 25 oC, ID = IAR, V
j
(pulse width limited by T
max, δ < 1%)
j
DD
max, δ < 1%)
j
Avalanche Current, Repetitive or Not-Repetitive
(T
= 100 oC, pulse width limited by Tj max, δ < 1%)
c
= 25 V)
0.83
62.5
0.5
300
60A
600mJ
150mJ
42A
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
= 25 oC unless otherwise specified)
(T
case
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
ID = 250 µA V
= 060V
GS
Breakdown Voltage
I
DSS
I
GSS
Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage
Current (V
DS
= 0)
= 0)
= Max Rating
V
DS
V
= Max Rating x 0.8 Tc = 125 oC
DS
= ± 20 V± 100nA
V
GS
10
100
ON (∗)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage V
Static Drain-source On
Resistance
= VGS ID = 250 µA234V
DS
VGS = 10V ID = 40 A
V
= 10V ID = 40 A Tc = 100oC
GS
On State Drain Current VDS > I
V
= 10 V
GS
D(on)
x R
DS(on)max
0.00850.01
0.02
80A
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
g
(∗)Forward
fs
Transconductance
C
C
C
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS > I
V
DS
x R
D(on)
DS(on)max
= 25 V f = 1 MHz V
ID = 40 A25S
= 05900
GS
900
230
µA
µA
Ω
Ω
pF
pF
pF
2/5
Page 3
STW80N06-10
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
t
r
Turn-on Time
Rise Time
V
= 30 V ID = 40 A
DD
R
= 4.7 Ω VGS = 10 V
G
(see test circuit, figure 3)
(di/dt)
Turn-on Current SlopeV
on
= 48 V ID = 80 A
DD
R
= 50 Ω VGS = 10 V
G
(see test circuit, figure 5)
Q
Q
Q
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain Charge
gd
VDD = 40 V ID = 80 A V
= 10 V230
GS
SWITCHING OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
r(Voff)
t
t
Off-voltage Rise Time
Fall Time
f
Cross-over Time
c
V
= 48 V ID = 40 A
DD
R
= 4.7 Ω VGS = 10 V
G
(see test circuit, figure 5)
SOURCE DRAIN DIODE
32
16042200
240A/µs
280nC
30
60
35
175
240
46
230
300
ns
ns
nC
nC
ns
ns
ns
SymbolParameterTest ConditionsMin.Typ.Max.Unit
I
SDM
I
SD
Source-drain Current
(•)
Source-drain Current
80
320
(pulsed)
(∗)Forward On VoltageISD = 80 A VGS = 01.5V
V
SD
t
Reverse Recovery
rr
Time
Q
Reverse Recovery
rr
I
= 80 A di/dt = 100 A/µs
SD
V
= 30 V Tj = 150 oC
DD
(see test circuit, figure 5)
125
0.6
Charge
I
RRM
Reverse Recovery
10
Current
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
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