The third generation of MESH O VERLAY™ Power
MOSFETs for very high voltage exhibits unsurpassed on-resistance per unit area while integrating
back-to-back Zener diodes between gate and
source. Such arrangement gives extra ESD capability with higher ruggedness performance as requested by a large variety of single-switch applications.
APPLICATIONS
■ SINGLE-ENDED SMPS IN MONITORS,
COMPUTER AND INDUSTRIAL APPLICATION
■ WELDING EQUIPMENT
TO-247
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
I
GS
V
ESD(G-S)
dv/dt (1)Peak Diode Recovery voltage slope3V/ns
T
stg
T
j
(•)Pu l se width limited by safe operating area
≤6A, di/dt ≤100A/µs, VDD ≤ V
(1)I
SD
Drain-source Voltage (VGS = 0)
Drain-gate Voltage (RGS = 20 kΩ)
800V
800V
Gate- source Voltage±25V
Drain Current (continuos) at TC = 25°C
Drain Current (continuos) at TC = 100°C
(●)
Drain Current (pulsed)24A
Total Dissipation at TC = 25°C
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
∆
BV
DSS
I
DSS
I
GSS
Maximum Lead Temperature For Soldering Purpose300°C
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
max)
j
Single Pulse Avalanche Energy
(starting T
Drain-source
Breakdown Voltage
Breakdown Voltage Temp.
/∆T
J
Coefficient
Zero Gate Voltage
Drain Current (V
Gate-body Leakage
Current (V
= 25 °C, ID = IAR, VDD = 50 V)
j
I
D
I
D
V
= 0)
DS
GS
= 0)
V
V
= 250 µA, VGS = 0
= 1 mA, VGS = 0
= Max Rating
DS
= Max Rating, TC = 125 °C
DS
= ±20V
GS
800V
6A
250mJ
0.9V/°C
1µA
50µA
±10µA
(1)
ON
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage
Static Drain-source On
Resistance
On State Drain Current
= VGS, ID = 250µA
DS
= 10V, ID = 3A
V
GS
V
> I
D(on)
=10V
x R
DS
V
GS
DS(on)max,
345V
1.51.8
6A
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
> I
g
(1)
fs
C
iss
C
oss
C
rss
Forward Transconductance
Input Capacitance
Output Capacitance125pF
Reverse Transfer
Capacitance
D(on)
x R
DS(on)max,
V
DS
I
=3A
D
VDS = 25V, f = 1 MHz, VGS = 0
7S
1600pF
12pF
Ω
2/8
Page 3
STW7NC80Z
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON (RESISTIVE LOAD)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
t
d(on)
Q
Q
Q
t
r
gs
gd
Turn-on Delay Time
Rise Time10ns
Total Gate Charge
g
Gate-Source Charge12nC
Gate-Drain Charge19nC
SWITCHING OFF (INDUCTIVE LOAD)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
r(Voff)
t
t
f
c
Off-voltage Rise Time
Fall Time13ns
Cross-over Time19ns
SOURCE DRAIN DIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
I
SD
I
SDM
VSD (1)
t
rr
Q
I
RRM
Source-drain Current6A
(2)
Source-drain Current (pulsed)24A
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge8.1µC
rr
Reverse Recovery Current19A
= 400V, ID = 3A
DD
RG= 4.7Ω VGS = 10V
(see test circuit, Figure 3)
V
= 640V, ID = 6 A,
DD
V
= 10V
GS
VDD = 640V, ID = 6 A,
RG=4.7Ω, V
GS
= 10V
(see test circuit, Figure 5)
ISD =6 A, VGS = 0
ISD = 6 A, di/dt = 100A/µs,
VDD = 100V, Tj = 150°C
(see test circuit, Figure 5)
26ns
4563nC
11ns
1.6V
850ns
GATE-SOURCE ZENER DIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
BV
GSO
α
TVoltage Thermal CoefficientT=25°C Note(3)1.3
RzDynamic Resistance
Note: 1. Pulsed: Pu l se duration = 300 µs, duty c yc l e 1.5 %.
2. Pulse width li mited by safe operating area.
3. ∆
Gate-Source Breakdown
Voltage
= αT (25°-T) BV
V
BV
GSO
(25°)
Igs=± 1mA (Open Drain)25V
10
I
= 50 mA
GS
90
-4
/°C
Ω
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specif ically been designed to enhanc e not only t he dev ice’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to souce. In this respect the 25V Zener voltage is appropiate to achieve an efficient and
cost-effective intervention to protect the device’s int egrity. These integrated Zener diode s thus avoid the
usage of external components.
3/8
Page 4
STW7NC80Z
Ther m al Imp e d anceSafe Operating Area
Output Characteristics
Transfer Characteristics
Static Drain-source On ResistanceTransconductance
4/8
Page 5
STW7NC80Z
Gate Charge vs Gate-source Voltage
Capacitance Variations
Normalized On Resistance vs Temperatur eNormalized Gate Threshold Volta ge vs Temp.
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