The third generation of MESH O VERLAY™ Power
MOSFETs for very high voltage exhibits unsurpassed on-resistance per unit area while integrating
back-to-back Zener diodes between gate and
source. Such arrangement gives extra ESD capability with higher ruggedness performance as requested by a large variety of single-switch applications.
APPLICATIONS
■ SINGLE-ENDED SMPS IN MONITORS,
COMPUTER AND INDUSTRIAL APPLICATION
■ WELDING EQUIPMENT
TO-247
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
(1)
j
Drain-source Voltage (VGS = 0)
Drain-gate Voltage (RGS = 20 kΩ)
900V
900V
Gate- source Voltage±25V
Drain Current (continuos) at TC = 25°C
Drain Current (continuos) at TC = 100°C
5.2A
3.3A
Drain Current (pulsed)21A
Total Dissipation at TC = 25°C
160W
Derating Factor1.52W/°C
Gate-source Current (*)±50mA
Gate source ESD(HBM-C=100pF, R=15K
Ω)
4KV
Storage Temperature–65 to 150°C
Max. Operating Junction Temperature150°C
(*) Limited by maximum temperature allowed
, Tj ≤ T
(BR)DSS
JMAX.
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
I
GS
V
ESD(G-S)
dv/dtPeak Diode Recovery voltage slope3V/ns
T
stg
T
(•)Pu l se width limi te d by safe oper ating area
VDD = 50 V, Tj = 150°C
(see test circuit, Figure 5)
24ns
4056nC
12ns
1.6V
510ns
GATE-SOURCE ZENER DIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
BV
GSO
α
TVoltage Thermal CoefficientT=25°C Note(3)1.3
RzDynamic Resistance
Note: 1. Pulsed: Pu l se duration = 300 µs, duty cycle 1.5 %.
2. Pulse width li mited by safe operating area.
3. ∆
Gate-Source Breakdown
Voltage
= αT (25°-T) BV
V
BV
GSO
(25°)
Igs=± 1mA (Open Drain)25V
10
I
= 50 mA
GS
90
-4
/°C
Ω
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specif ically been designed to enhanc e not only t he dev ice’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to souce. In this respect the 25V Zener voltage is appropiate to achieve an efficient and
cost-effective intervention to protect the device’s integrity. These integrat ed Z ener diodes thus avoi d t he
usage of external components.
3/8
Page 4
STW6NC90Z
Safe Operating Area
Output Characteristics
Ther m al Impeda n c e
Transfer Characteristics
TransconductanceStatic Drain-source On Resistance
4/8
Page 5
STW6NC90Z
Gate Charge vs Gate-source Voltage
Capacitance Variations
Normalized On Resistance vs Temperatur eNormalized Gate Threshold Volta ge vs Temp.
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