Datasheet STW6NC90Z Datasheet (SGS Thomson Microelectronics)

Page 1
STW6NC90Z
N-CHANNEL 900V - 2.1- 5. 2A TO-247
Zener-Protected PowerMESH™III MOSFET
TYPE V
DSS
STW6NC90Z 900 V < 2.5
TYPICAL R
EXTREMELY HIGH dv /d t C APABILITY
100% AVALANCHE TESTED
VERY LOW INTRINSIC CAPAC ITANCES
GATE CHARGE MINIMIZED
(on) = 2.1
DS
R
DS(on)
I
D
5.2A
DESCRIPTION
The third generation of MESH O VERLAY™ Power MOSFETs for very high voltage exhibits unsur­passed on-resistance per unit area while integrating back-to-back Zener diodes between gate and source. Such arrangement gives extra ESD capabil­ity with higher ruggedness performance as request­ed by a large variety of single-switch applications.
APPLICATIONS
SINGLE-ENDED SMPS IN MONITORS,
COMPUTER AND INDUSTRIAL APPLICATION
WELDING EQUIPMENT
TO-247
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
(1)
j
Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 kΩ)
900 V 900 V
Gate- source Voltage ±25 V
Drain Current (continuos) at TC = 25°C Drain Current (continuos) at TC = 100°C
5.2 A
3.3 A Drain Current (pulsed) 21 A Total Dissipation at TC = 25°C
160 W Derating Factor 1.52 W/°C Gate-source Current (*) ±50 mA Gate source ESD(HBM-C=100pF, R=15K
Ω)
4KV
Storage Temperature –65 to 150 °C Max. Operating Junction Temperature 150 °C
(*) Limited by maximum temperature allowed
, Tj ≤ T
(BR)DSS
JMAX.
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
I
GS
V
ESD(G-S)
dv/dt Peak Diode Recovery voltage slope 3 V/ns
T
stg
T
(•)Pu l se width limi te d by safe oper ating area
≤5.2A, di/ dt ≤100A/µs, VDD ≤ V
(1)I
SD
1/8October 2000
Page 2
STW6NC90Z
THERMA L D ATA
Rthj-case Thermal Resistance Junction-case Max 0.78 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 30 °C/W
Rthc-sink Thermal Resistance Case-sink Typ 0.1 °C/W
T
l
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED) OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
BV
DSS
I
DSS
I
GSS
Maximum Lead Temperature For Soldering Purpose 300 °C
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy (starting T
Drain-source Breakdown Voltage
Breakdown Voltage Temp.
/∆T
J
Coefficient Zero Gate Voltage
Drain Current (V Gate-body Leakage
Current (V
= 25 °C, ID = IAR, VDD = 50 V)
j
I
I V
= 0)
DS
GS
= 0)
V V
= 250 µA, VGS = 0
D
= 1 mA, VGS = 0
D
= Max Rating
DS
= Max Rating, TC = 125 °C
DS
= ±20V
GS
900 V
5.2 A
200 mJ
1 V/°C
A
50 µA
±10 µA
ON
(1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage Static Drain-source On
Resistance
On State Drain Current
= VGS, ID = 250µA
DS
= 10V, ID = 2.5A
V
GS
V
> I
D(on)
=10V
x R
DS
V
GS
DS(on)max,
345V
2.1 2.5
5.2 A
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
> I
V
g
(1)
fs
C
iss
C
oss
C
rss
Forward Transconductance Input Capacitance
Output Capacitance 116 pF Reverse Transfer
Capacitance
I
D
V
DS
=2.5A
DS
x R
D(on)
DS(on)max,
= 25V, f = 1 MHz, VGS = 0
5.6 S
1840 pF
12 pF
2/8
Page 3
STW6NC90Z
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON (RESISTIVE LOAD)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
d(on)
Q Q Q
t
r
g gs gd
Turn-on Delay Time Rise Time 8 ns Total Gate Charge
Gate-Source Charge 9 nC Gate-Drain Charge 15 nC
SWITCHING OFF (INDUCTIVE LOAD)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
r(Voff)
t t
f
c
Off-voltage Rise Time Fall Time 13 ns Cross-over Time 20 ns
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD (1)
t
rr
Q
rr
I
RRM
Source-drain Current 5.2 A
(2)
Source-drain Current (pulsed) 21 A Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge 4 µC Reverse Recovery Current 15 A
= 450V, ID = 2.5A
DD
RG= 4.7Ω VGS = 10V (see test circuit, Figure 3)
V
= 720V, ID = 5 A,
DD
VGS = 10V
V
= 720V, ID = 5 A,
DD
RG=4.7Ω, V
GS
= 10V
(see test circuit, Figure 5)
ISD = 5 A, VGS = 0 ISD = 5 A, di/dt = 100A/µs,
VDD = 50 V, Tj = 150°C (see test circuit, Figure 5)
24 ns
40 56 nC
12 ns
1.6 V
510 ns
GATE-SOURCE ZENER DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
BV
GSO
α
T Voltage Thermal Coefficient T=25°C Note(3) 1.3
Rz Dynamic Resistance
Note: 1. Pulsed: Pu l se duration = 300 µs, duty cycle 1.5 %.
2. Pulse width li mited by safe operating area.
3. ∆
Gate-Source Breakdown Voltage
= αT (25°-T) BV
V
BV
GSO
(25°)
Igs=± 1mA (Open Drain) 25 V
10
I
= 50 mA
GS
90
-4
/°C
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specif ically been designed to enhanc e not only t he dev ice’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to souce. In this respect the 25V Zener voltage is appropiate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrat ed Z ener diodes thus avoi d t he usage of external components.
3/8
Page 4
STW6NC90Z
Safe Operating Area
Output Characteristics
Ther m al Impeda n c e
Transfer Characteristics
Transconductance Static Drain-source On Resistance
4/8
Page 5
STW6NC90Z
Gate Charge vs Gate-source Voltage
Capacitance Variations
Normalized On Resistance vs Temperatur eNormalized Gate Threshold Volta ge vs Temp.
Source-drain Diode Forward Characteristics
5/8
Page 6
STW6NC90Z
Fig. 2: Unclamped Inductive WaveformFig. 1: Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
6/8
Page 7
TO-247 MECHANICAL DATA
STW6NC90Z
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.7 5.3 0.185 0.209 D 2.2 2.6 0.087 0.102 E 0.4 0.8 0.016 0.031
F 1 1.4 0.039 0.055 F3 2 2.4 0.079 0.094 F4 3 3.4 0.118 0.134
G 10.9 0.429
H 15.3 15.9 0.602 0.626
L 19.7 20.3 0.776 0.779 L3 14.2 14.8 0.559 0.582 L4 34.6 1.362 L5 5.5 0.217
M 2 3 0.079 0.118
mm inch
P025P
7/8
Page 8
STW6NC90Z
8/8
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such informa tion n or for an y infring ement of patent s or other rig hts of third part ies which may resu lt from its use . No l i cen se i s granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical compo nents in life support devices or systems without express written approval of STMicroelectronics.
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco -
The ST logo is a trademark of STMicroelectronics
© 2000 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://www.st.com
Loading...