Datasheet STW26NM60 Datasheet (SGS Thomson Microelectronics)

Page 1
1/8September 2002
STW26NM60
N-CHANNEL 600V - 0.125- 26A TO-2 47
Zener-Protected MDmesh™Power MOSFET
n
TYPICAL RDS(on) = 0.125
n
HIGH dv/dt AND AVALANCHE CAPABILITIES
n
IMPROVED ESD CAPABILITY
n
LOW INPUT CAPACITANCE AND GATE CHARGE
n
LOW GATE INPUT RESIST ANC E
DESCRIPTION
The MDmesh
is a new revolutionary MOSFET
technology that associates the Multiple Drain pro­cess with the Company’s PowerMESH™ horizontal layout. The resulting product has an outstanding low on-resistance, impressively high dv/dt and excellent avalanche characteristics. The adoption of the Company’s proprietary strip technique yields overall dynamic performance that is significantly better than that of similar competition’s products.
APPLICATIONS
The MDmesh™ family is very suitable for increasing power density of high voltage converters allowing system miniaturization and higher efficiencies.
ORDERING INFORMATION
TYPE V
DSS
R
DS(on)
I
D
STW26NM60 600 V < 0.135 30 A
SALES TYPE MARKING PACKAGE PACKAGING
STW26NM60 W26NM60 TO-247 TUBE
TO-247
INTERNAL SCHEMATIC DIAGRAM
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STW26NM60
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ABSOLUTE MAXIMUM RATINGS
(l) Pulse wi dth limited by safe operating area (1) I
SD
26A, di/dt 200A/µs, VDD V
(BR)DSS
, Tj T
JMAX.
THERMA L D ATA
AVALANCHE CHARACTERISTICS
GATE-SOURCE ZENER DIODE
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components.
Symbol Parameter Value Unit
V
DS
Drain-source Voltage (VGS = 0)
600 V
V
DGR
Drain-gate Voltage (RGS = 20 k)
600 V
V
GS
Gate- source Voltage ± 30 V
I
D
Drain Current (continuous) at TC = 25°C
30 A
I
D
Drain Current (continuous) at TC = 100°C
18.9 A
I
DM
(l)
Drain Current (pulsed) 120 A
P
TOT
Total Dissipation at TC = 25°C
313 W
Derating Factor 2.5 W/°C
V
ESD(G-S)
Gate source ESD(HBM-C=100pF, R=1.5KΩ) 6000 V
dv/dt (1) Peak Diode Recovery voltage slope 15 V/ns
T
j
T
stg
Operating Junction Temperature Storage Temperature
-55 to 150 °C
Rthj-case Thermal Resistance Junction-case Max 0.4 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
T
l
Maximum Lead Temperature For Soldering Purpose 300
°C
Symbol Parameter Max Value Unit
I
AR
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
j
max)
13 A
E
AS
Single Pulse Avalanche Energy (starting T
j
= 25 °C, ID = IAR, VDD = 50 V)
740 mJ
Symbol Parameter Test Conditions Min. Typ. Max. Unit
BV
GSO
Gate-Source Breakdown Voltage
Igss=± 1mA (Open Drain) 30 V
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3/8
STW26NM60
ELECTRICAL CHARACTERISTICS (T
CASE
=25°C UNLESS OTHERWISE SPECIFIED)
ON/OFF
DYNAMIC
SWITCHING ON
SWITCHING OFF
SOURCE DRAIN DIODE
Note: 1. Pulsed: Pu l se duration = 300 µs, duty c ycle 1.5 %.
2. Pulse width li mited by safe operating area.
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source Breakdown Voltage
ID = 250 µA, VGS = 0 600 V
I
DSS
Zero Gate Voltage Drain Current (V
GS
= 0)
V
DS
= Max Rating
VDS = Max Rating, TC = 125 °C
10
100
µA µA
I
GSS
Gate-body Leakage Current (V
DS
= 0)
V
GS
= ± 20V ±10 µA
V
GS(th)
Gate Threshold Voltage
V
DS
= VGS, ID = 250µA
345V
R
DS(on)
Static Drain-source On Resistance
VGS = 10V, ID = 13 A 0.125 0.135
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
fs
(1) Forward Transconductance VDS = 15 V, ID= 13 A 20 S
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
V
DS
= 25V, f = 1 MHz, VGS = 0 2900
900
40
pF pF pF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
t
r
Turn-on Delay Time Rise Time
VDD = 300V, ID = 13 A RG= 4.7 VGS = 10 V (Resistive Load see, Figure 3)
35 22
ns ns
Q
g
Q
gs
Q
gd
Total Gate Charge Gate-Source Charge Gate-Drain Charge
VDD = 480V, ID = 26 A, V
GS
= 10V
73 20 37
102
nC nC nC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
r(Voff)
t
f
t
c
Off-voltage Rise Time Fall Time Cross-over Time
V
DD
= 480V, ID = 26 A,
RG=4.7Ω, V
GS
= 10V
(Inductive Load see, Figure 5)
14 20 40
ns ns ns
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
(2)
Source-drain Current Source-drain Current (pulsed)
26
104
A A
VSD (1)
Forward On Voltage
ISD = 26 A, VGS = 0
1.5 V
t
rr
Q
rr
I
RRM
Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current
I
SD
= 26 A, di/dt = 100A/µs
V
DD
= 100 V, Tj = 25°C
(see test circuit, Figure 5)
450
7
30.5
ns
µC
A
t
rr
Q
rr
I
RRM
Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current
I
SD
= 26 A, di/dt = 100A/µs VDD = 100 V, Tj = 150°C (see test circuit, Figure 5)
560
9
32.5
ns
µC
A
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STW26NM60
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Safe Operating Area For TO-247 Thermal Impedance For TO -247
Transfer Characteristics
Static Drain-source On Resistance
Output Characteristics
Transco nductance
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STW26NM60
Capacitance VariationsGate Charge vs Gate-source Voltage
Normalized Gate Threshold Voltage vs Temp.
Source-drain Diode Forw ard Ch aracteristi cs
Normalized On Resistance vs Temperature
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Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
Fig. 2: Unclamped Inductive WaveformFig. 1: Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
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STW26NM60
DIM.
mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 4.85 5.15 0.19 0.20 D 2.20 2.60 0.08 0.10 E 0.40 0.80 0.015 0.03 F 1 1.40 0.04 0.05
F1 3 0.11 F2 2 0.07 F3 2 2.40 0.07 0.09 F4 3 3.40 0.11 0.13
G 10.90 0.43 H 15.45 15.75 0.60 0.62
L 19.85 20.15 0.78 0.79
L1 3.70 4.30 0.14 0.17 L2 18.50 0.72 L3 14.20 14.80 0.56 0.58 L4 34.60 1.36 L5 5.50 0.21
M 2 3 0.07 0.11 V
5º5º
V2
60º 60º
Dia 3.55 3.65 0.14 0.143
TO-247 MECHANICAL DATA
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