■ Single Frequ enc y, Se lf Adapt ive Os c illa tor.
■ TTL compatible positive going sync.
■ Chip does not accept sync on RGB or any video
signal.
2
■ I
C controlled: H-position, pin cushion,
keystone, parallelogram, side pin balance.
2
■ I
C controlled EW corner : top and bottom
corrections.
2
■ I
C controlled corner: top and bottom phase
corrections.
■ EW output
2
■ I
C controlled H-amplitude
■ DC controlled H-width breath ing comp ensation
■ Xray shut-down on ABL, H output latch, reset by
■ Soft start on H-duty.
Ver tical deflection
■ Vertical ramp generator.
■ Wide range AGC loop.
■ TTL compatible positive going sync, no extra
■ I
■ I
■ DC controlled height breathing compensation
■ Vertical dynamic focus output with fixed
Video preamplifier
■ 3-Channel 120MHz bandwidth video amplifier.
■ 3.5ns typical rise and fall time at 2.5V
■ I
■ I
■ Activation of ABL results in contrast gain
2
with I
C controlled gain (0.5x to 2x).
power OFF/ON.
pulses.
2
C controlled vertical position.
2
C controlled S linearity correction.
2
with I
C controlled gain (0.5X TO 2X).
amplitude (1Vpp).
.
2
C controlled individual RGB contrast
PP
(8bit)>8db
2
C controlled overall brightness.
decrease.
■ Gain window (1.5X) controlled by input pulse
2
and I
C. Pulse height controls the gain variation
from 1x to 1.5x.
■ 0.514V typical video input signal for normal
display.
2
■ I
C controlled contrast (7bits) update during
vertical retrace time.
2
C main features
I
2
■ I
C interface (slave) 100kHz max.
2
■ All I
C controlled DAC are 7 bits, except R GB
gain.
■ Power on reset on 5 V (V
DD
).
Supply voltage & power
■ 5 V/10.5 V dual supply.
■ Max power consumption: 1.2W
DESCRIPTION
The STV2001 is an I2C-controlled monolithic
integrated circuit assembled in a TQF P44 plastic
package. It combines both a deflection block
(horizontal and vertical, single frequency with very
powerful geometry correction) and a 120MHz
RGB pre-amplifier.
TQFP44/SLUG DOWN
ORDER CODE :
Version 1.2
May 20001/46
This is preliminary information on a new product now in development. Details are subject to change without notice.
MinDMin Hin pulse duration0.7us
MdutyMax Hin Duty Cycle25%
VSVRVoltage on Vin05V
VSWMin Vin pulse duration5us
VSDMax Vin Duty Cycle15%
Electrical Characteristics (VDD = 5V, T
V
INTH
RINHorizontal & Vertical Pull-Up Resistor200kΩ
Horizontal & Vertical Input Logic LevelLow Level
= 5V, T
DD
amb
= 25°C)
= 25°C)
amb
0.8V
High Level2.2
o
C/W
V
7/46
Page 8
STV2001
7 - I2C READ /WRITE
Electrical Characteristics (VDD = 5V, T
amb
= 25°C)
SymbolParameterTest ConditionsMinTypMaxUnit
F
T
T
HIGH
V
V
V
SCL
LOW
INL
INH
ACK
Maximum Clock Frequency100kHz
Low Period of the SCL Clock1.3us
High Period of SCL Clock0.6us
SDA & SCL Input Low Level Voltage1.5V
SDA & SCL Input High Level Voltage3V
Typical power supply voltages are 10.5 V for the
Deflection and Preamplifier sections (SAV
VAV
(Vdd). Optimum operation is obtained
and 11.5 for V
V
V
and PVCC) and 5.0 V for the logic section
CC
, and between 4.5 and 5.5 V for
.
DD
is monitored during the transient phase whe n
CC
CC
between 9.5
switched either on or off, to avoid erratic operation
of the circuit. If V
is inferior to 5.0 V typ., the cir-
CC
cuit outputs are inhibited. Similarly, before V
reaches 4 V, all the I2C registers are reset to their
default value (see I
2
C Control Table).
The circuit is internally supplied by several voltage
references (typ. value: 8 V) to ensure a good power supply rejection. Two of these voltage references are externally accessible respectively for the
vertical and horizont al part s. They c an be used to
bias external circuitry if I
is in ferior to 5 mA.
LOAD
To minimize the noise and consequently the "jitter"
on vertical and horizontal output signals, the reference voltages must be filtered by ex ternal capacitors connected to the ground.
To further improve the jitter on both vertical and
horizontal sections, FCAP and FILTER pins are
used to filter the internal 5V regulator wi th exte rnal
decoupling capacitors.
14.1.2 - I
STV2001 belongs to the I
2
C Control
2
C-controlled device
family. Each adjustment can be mad e via the I
Interface, instead of being controlled by DC voltages on dedicated control pins. The I
2
C bus is a serial bus with a clock and a data input. General
function and bus protocol are specified in the
Philips-bus data sheets. The interface (Data an d
Clock) is TTL-compatible. Spikes u p to 50 ns are
filtered by an integrator and the maximum clock
speed is limited to 100 kHz.
The data line (SDA) can be used bidirectionally. In
read mode, the IC sends reply information (1 byte)
to the micro-processor.
The bus protocol prescribes a full-byte transmission in all cases. T he first by te af ter t he start condition is used to transm it t he IC a ddres s (hex a 8 C
for write, 8D for read).
CC
DD
2
All bytes are sent MSB bit first and the write data
transfer is closed by a stop.
14.1.3 - Write Mode
,
In write mode, the second byte contains the subaddress of the selected function to adjust (or controls to effect) and the third byte the corresponding
data byte. More than one data byte can be sent to
the IC. If after the third byte no stop or start condition is detected, the circuit automatically increments the momentary subaddress in the subaddress counter (auto-increment mode) by one.
Thus it is poss ible to immediately transm it the following data bytes without sending the IC address
or subaddress. This can be us eful for reinitializing
all the controls very quickly (flash manner). This
procedure is ended with a stop condition.
There are 22 adjustment capabilities for the circuit:
3 for the horizontal part, 3 for the vertical, 3 for the
E/W correction, 2 for the dynamic horizontal phase
control, 5 for the pream plifier, 4 for the c orners, 2
for EHT compen sa tion a nd 1 for the blanking DC.
14 bits are also dedicated to several controls (ON/
OFF).
14.1.4 - Read Mode
In the read mode the second byte transmits the reply information. The reply byte contains t he horizontal and vertical lock/unlock status, the XRAY
activation status. A stop condition always stops all
the activities of the bus decoder and switches both
the data and clock line (SDA and SCL) to high im-
C
pedance. See I
2
C subaddress and control tables.
14.1.5 - Sync Processor
The internal sync processor allows the device to
receive separate horizontal & vertical TTL-compatible sync signals.
14.1.6 - IC Status
The IC informs the MCU about both the 1st horizontal PLL (locked or not) and t he XRAY protection (activated or not). The XRAY internal la tch is
reset either directly via the I
creasing the V
CC
supply.
2
C interface or by de-
14.1.7 - Sync Inputs
Both HIN and VIN inputs are TTL compatible triggers with hysterisis to avoid erratic detection. Both
inputs include a pull-up resistor connected to V
Synchro pulses must be positive.
DD
.
24/46
5
Page 25
STV2001
14.1.8 - Sync Processor Output
The sync processor indicates whether 1st PLL is
locked to an incomi ng horizont al sync or not. This
is indicated on the D8 bit of the status register .
PLL1 level is low when locked.
14.2 - HORIZONTAL PART
14.2.1 - Internal Input Conditions
A digital signal (horizontal sync pulse) is sent by
the sync processor to the horizontal input. It must
be positive (see Figure 5).
Synchronization occurs on the leading edge of the
internal sync signal.
The minimum value of Z is 0.7 µs.
Vertical synchro extraction is not allowed.
Figure 5.
Z
T
(VCO). The phase comparator is a "phase frequency" type designed i n CM OS t echnolo gy . This
kind of phase detector avoids locking on wrong
frequencies. It is followed by a "charge pump",
composed of two current sources: sunk and
sourced (typically I =1 mA when locked and
I=40µA when unlocked). This difference be-
tween lock/unlock allows smooth catching o f the
horizontal frequency by PLL1. This effect is reinforced by an internal original slow down system
when PLL1 is locked, preventing the horizontal frequency from changing too quickly. The dynamic
behaviour of PLL1 is fixed by an external filter
which integrates the current of the charge pump. A
"CRC" filter is generally used (see Figu re 6 ). One
2
C Ipump is used to set the pump current to
bit I
1mA or 0.3mA in locked condition.
Figure 6.
PLL1F
40
1.8kΩ
10nF
14.2.2 - PLL1
The PLL1 consists of a phase comparator, an external filter and a voltage-controlled oscillator
Figure 7. Block Diagram ²&
LOCKDET
High
1
COMP1
Low
Lock/Unlock
Status
Ipump
CHARGE
PUMP
2
I
4.7µF
C
44 FILTER
PHASE
ADJUST
PLL1FR0 C0
404142
VCO
OSC
2
C
I
HPOS
Adj.
FC1
43
25/46
Page 26
STV2001
Figure 8. Det ai ls of VCO
PLL1F
(Loop Filter)
(1.4V<V
40
7
<6.4V)
41
R0
I
0
I
2
0
4 I
0
42
6.4V
1.6V
C0
6.4V
1.6V
0
FLIP FLOP
0.875T
RS
T
H
H
The VCO uses an external RC network. It delivers
a linear sawtooth resulting from the capacitor
charge and discharge . The current is proportional
to the one in the resistor. Typical thresholds for the
sawtooth are 1.6 V and 6.4 V.
The VCO control voltage varies between 3.0 V
and 3.8 V (see Figure 8). This VCO frequency
range is very small. The small effective frequency
is due to clamp intervention on the lowest filter value. The PLL1F filter voltage is set by a 4-bit DA C
with a voltage range of 3.0 to 3.8 V.
The sync frequency must always be hig her than
the free running frequency. For example, when using a 60 kHz synchro range, the suggested free
running frequency is 56 kHz.
Figure 9. PLL1 Timing Diagram
HO
SC
Sawtooth7/8 TH
Phase REF1
1/8 TH
PLL1 ensures the coincidence between the leading edge of the sync signal and a phase reference
resulting from the comparison of:
– the VCO sawtooth
– an internal DC voltage I2C adjustable within the
range of 2.9V to 4.2V (corresponding to ±10%)
(see Figure 9 ).
A Lock/Unlock identification block, also included,
detects in real time whether PLL1 is locked on the
incoming horizontal sync signal or not.
The lock/unlock information is available through
2
the I
C read.
The FC1 Pin (Pin 43) is used for decoupling the internal 6.4 V reference by a capacitor.
6.4V
3.4V (Reference for H Position)
Vb
(2.8V<Vb<4.2V)
1.6V
HSynchro
Phase REF1 is obtained by comparison between the sawtooth and a DC voltage adjustable between 2.9 V and 4.2 V.
The PLL1 ensures the exact coincidence between the signal phase REF and HSYNC.
A ±10% T
26/46
phase adjustment is possible around the 3.5V point.
H
Page 27
STV2001
14.2.3 - PLL2
PLL2 ensures a constan t position of the shape d
flyback signal in comparison with th e sawtooth of
the VCO, taking into account the saturation t ime
Ts (see Figure 10).
Figure 10. PLL2 Timing Diagram
H Osc
Sawtooth
7/8T
H
1/8T
H
6.4V
4.0V
1.6V
Flyback
Internally
Shaped
Flyback
H Drive
Ts
set) is 85% in order to avoid having too long a conduction period of t he horizontal scanning transistor.
The maximum storage time (Ts Max.) is :
- T
0.44T
H
Typically, T
FLY
FLY/TH
/2).
corresponds to around 20 %
which means that Ts max represents approxim
tively 34 % of T
.
H
14.2.4 - Output Section
The H-drive signal is sent to the output through a
shaping stage which also controls the fixed Hdrive duty cycle (see Figure 10). In order to secure
the scanning power part operation, the output is inhibited in the following cases :
-when V
is too low,
CC
-when the ABL protection is activated,
-during the Horizontal flyback,
-when the HDrive I
2
C bit control is off.
The output stage con sists of a NPN bipolar transistor. Only the collecto r is ac cessible
(see Figure 12). E mitter is connected directly to a
separate ground pin.
Figure 12.
V
CC
Duty Cycle
The phase comparator of PLL2 (phas e type com parator) is followed by a charge pump (typical output current: 0.5 mA).
VBCAP pin is used to filter noise on PLL2 top comparator via an external capacitor.
The flyback input consists of an NPN transistor.
This input must be current driven. The maximum
recommended input current is 5 mA
(see Figure 11).
Figure 11. Flyback Input Electrica l Diagram
400Ω
HFLY
36
20kΩ
GND 0V
Q1
The duty cycle is fixed at 55%. For a safe start-up
operation, the initial duty cycle (after power-on re-
Hout
34
HDGND
33
This output stage is intended for "reverse" base
control, where setting the output NPN in off-state
will control the power scanning transistor in offstate.
The maximum output current is 15 mA, and the
corresponding voltage drop of the output V
CEsat
is
0.4 V Max.
Obviously, the power scanning transistor cannot
be directly driven by the integrated circuit. An interface either bipolar or MO S type has to be added
between the circuit and the power transistor.
27/46
Page 28
STV2001
14.2.5 - X-RAY Protection
X-Ray protection is activated when the ABL input (1 V on Pin 20) is at a low level. It inhibits both H-Drive,
and Vout while Video goes into off-mode.
This activation is internally delayed by 2 lines to avoid erratic detection (short parasitics).
This protection is latched; it may be reset either by switching V
Figure 13. Safety Functions Block Diagram
Checking
V
CC
V
+1V
CC
VSCinh
off or by I2C (see Figure 13).
CC
2
C Drive on/off
I
HORIZONTAL
OUTPUT
INHIBITION
XRAY Protection
+
20
ABL
VCC off or I2C Reset
Horizontal Flyback
0.7V
14.3 - VERTICAL PART
14.3.1 - Function
When the synchronization pulse is not present, an
internal current source sets the free runni ng frequency. For an external capacitor, C
OSC
= 150nF,
the typical free running frequency is 100Hz.
The typical free running frequency can be calculat-
ed according to:
fo(Hz) = 1.5
.
10
-5 .
1
C
OSC
A positive TTL level pulse applied on Pin 2 (Vin) is
used to synchronize the ramp in t he range [fmin,
fmax] (see Figure 14). This frequency range depends on the external capacitor connected on
Pin 6 (VCAP). A 150nF (
± 5%) capacitor is recom-
mended for 50 Hz to 165 Hz applications.
The typical maximum and minimum frequency, at
o
25
C and without any correction (S correction),
can be calculated as follows:
f(Max.) = 3.5 x f
and f(Min.) = 0.33 x f
o
o
When an S correction is applied, these values are
slightly modified.
With a synchronization p ulse, the internal oscillator is synchonized immediately but its amplitude
2
I
C Ramp on/off
S
Q
R
VERTICAL
OUTPUT
INHIBITION
Video-off
changes. An internal correc tion then adjusts it in
less than half a second. The ramp top value (P in 6)
is sampled on the AGC capacitor (Pin 4) at each
clock pulse. A transconductance amplifier modifies the charge current of the capacitor so as t o
make the amplitude constant again. We recommend using an AGC cap acitor with a low leakage
current. A value lower than 100nA is mandatory.
A good level of stability for the internal closed loop
is obtained by a 470nF
± 5% capacitor value on
Pin 4 (VAGC).
VRB (Pin 8) is used for decoupling the internal 2V
reference voltage by a capacitor.
14.3.2 - I
2
C Control Adjustments
S correction shapes can then be added to this
ramp. This frequency -independent S correction is
generated internally. Its amplitudes is adjustable
via the I
2
C. S correction can be inhibited by apply-
ing the selected bits.
Finally, the amplitude of the S corrected ramp is
adjustable via the verti cal ramp amplitude cont rol
register.The adjusted ramp is a vailable on Pin 7
) to drive an external power stage.
(V
OUT
28/46
Page 29
STV2001
The gain of this stage can be adjusted (± 25%) depending on its register value.
The mean value of this ramp is driven by its own
2
C register (vertical position) with :
I
VPOS = 7/16 x
V
REF-V
= ± 300 m V.
Figure 14. AGC Loop Block Diagram
DISCH.
VSYNCIN
2
SYNCHROOSCILLATOR
Usually V
is sent through a resistive divider to
OUT
the inverting input of the booster. Since VPOS derives from V
the bias voltage sent to the non-
REF-V,
inverting input of the booster should also derive
from V
to optimize the accuracy
REF-V
(see Figure 14).
TRANSCONDU CTANCE
CHARGE CURR ENT
6
OSC
CAP
Vlow
Sawth
Disch
VPOSITION
SUB09/7bits
SAMPLING
.
VERT AMP
SUB08/7bits
AMPLIFIER
REF
4
SAMPLING
CAPACITANCE
S CORRECTION
VS AMP
SUB0A/7bits
24
BREATH
I2C
sub14
/6bits
VOUT
7
14.3.3 - Basic Equations
As a first approximation, the amplitude of the ramp
on Pin 7 (VOUT) is calculated as follows:
V
- VPOS = (V
OUT
OSC
- V
) x (1 + 0.25 (V
DCMID
AMP
))
where :
V
DCMID
= 7/16 x V
(middle value of the ramp on
REF
Pin 5, typically 3.6V)
= V5 (ramp with fixed amplitude)
V
OSC
= -1 as minimum vertical amplitude register
V
AMP
value and +1 as maximum value.
VPOS is calculated according to:
VPOS = V
where V
P
+ (0.4 x VP )
DCMID
= -1 and +1 as respectively minimum
and maximum vertical position register value.
The current available on Pin 6 is:
3
= x V
I
OSC
where
C
OSC
8
= capacitor connected on Pin 6
REF
x C
OSC
x f
f = synchronization frequency.
14.3.4 - Geometric Corrections
The principle is represented in Figure 15.
Starting from the vertical ramp, a parabola-shaped
current is generated for E/W correction (also
known as Pin Cushion correction), dynamic horizontal phase control correction.
The parabola generator consists of an analog multiplier, the output current of which is equal to :
∆I = k x (V
where V
- V
OUT
is the vertical output ramp (typically
OUT
between 2 and 5 V) and V
(for V
ly centered on 3.6 V. By c hanging the v ertical po-
= 8.2V). The VOUT sawtooth is typical-
REF-V
sition, the sawtooth shifts by
DCMID
)
2
DCMID
±0.4 V.
is 3.6 V
The "geometry tracking" feature ensures a correct
screen geometry for any end user adjustment. It
generates non-symmetric parab ola dependent on
the vertical position. To avoid Vertical EHT compensation (VBreathing) from affecting the geometry correction, an additional Buffer Amplifier is
used for VBreathing.
29/46
Page 30
STV2001
Due to the large output stage voltage ran ge (E/W
Pin Cushion, Keystone), the combination of the
tracking function, maximum vertical amplitude,
maximum or minimum vertical position and max imum gain on the DAC control may lead to output
stage saturation. This m us t be avoided by li miting
the output voltage with appropriate I
2
C register
values. For the E/W part and the dynamic horizontal phase control part, a sawtooth-shaped differential current in the following form is generated:
.
(V
∆I’ = k’
OUT
- V
DCMID
).
Then ∆I and ∆I’ are added and converted into voltage for the E/W part.
Each of the two E/W comp onents or the two dynamic horizontal phase control components may
be inhibited by their own I
2
C select bit.
EW output voltage is available at EWout pin directly. External buffer circuit is required to drive Darlington pair transistor, which is sinking the DI ODE
MODULATOR current in order to achieve EW correction. Additionally, an I
2
C contro lled DC sh ift is
used for H-width.
The dynamic horizontal phase control drives the
H-position internally, moving the HFLY position on
the horizontal sawtooth in the range of
± 2.8 %T
both for side pin balance and parallelogram.
H
30/46
Page 31
Figure 15. Geometric Corrections Principle
V
VOSC
3.5V
V
DCMID
V
POS
AMP
V
OUT
From VB r e ath
STV2001
V
OUT
7
VDFocus
3.5V
3.5V
I - V
EW
2
1
X
AMP
23
R
Keystone
3.5V
EW
EWDC
2
1
X
Corner Top
+
I - V
OUT
27
R
Corner Bot.
Corner Top
3.5V
2
1
X
Corner Bot.
R
S.P.B.
+
To Horizontal Phase
Parallelog.
3.5V
31/46
Page 32
STV2001
14.3.5 - E/W
EWOUT = EW
+ K1 (V
DC
OUT
- V
DCMID
) +K2 (V
OUT
- V
K1 is adjustable via the keystone I2C register. K2 is adjustable via the E/W amplitude I2C register.
14.3.6 - Dynamic Horizontal Phase Control
I
OUT
= K4 (V
OUT
- V
DCMID
) + K5 (V
OUT
- V
DCMID
2
)
K4 is adjustable via the parallelogram I2C register.
2
K5 is adjustable via the side pin balance I
C register.
14.3.7 - Vertical Dynamic Focus
Vertical Dynamic Focus waveform is available on
Pin 23. It is the parabolic waveform with downwards concavity, at vertical frequency . Its amplitude is fixed at 1 Vpp.
14.3.8 - Corner Correction
There are 4 types of corner correction in the device: EW Corner Top, EW Corner Bottom, Corner
Phase Top and Corner Phase Bottom. EW Corner
Top and EW Corner Bottom are used to modu late
the EW amplitude. Corner P has e To p and Corner
Phase Bottom are used to modulate the Horizontal
Phase. These 4 types of correction are used to
compensate the distortion appearing at the corners of the CRT.
EW Corner Top and EW Corner Bottom corrections add a half parabola current to the EW voltage. Since the E/W output voltage range is limited,
it was necessary to add EW Corner Correction to
decrease both EW amplitude and Keystone by
2
C.
I
2
)
DCMID
Corner Phase Top and Corner Phase Bottom corrections add a half parab ola current to the Horizontal Phase. Top and Bottom Corrections can be
adjusted separately by I
2
C with 7 Bits DAC.
14.3.9 - Horizontal Breathing
Horizontal breathing is performed through the E W
stage with V-I Converter and an I
2
C controlled variable gain stage. This DC controlled input provides
the Horizontal Width correction required to offset
width changes due to EHT variat ion. Gain attenuation is set by a 7 bits DAC with I
2
C.
14.3.10 - Vertical Breathing
Vertical breathing compensation is performed
through gain modulat ion o f the ve rtical ramp . This
DC-controlled input allows the vertical height corrections needed to offset height cha nges due to
EHT variations. Input is received at the output of
the EHT compensation Amplifier. Gain attenuation
is set by 6 Bits DAC via I
2
C.
PRE-AMPLIFIER PART
14.4 - GENERAL CONSIDERATIONS
14.4.1 - Input Stage
The R, G and B signal s must be supplied to the
three inputs through coupling capacitors (100nF).
The maximum input peak-to-peak video amplitude
is 1 V.
Figure 16. .
HSYNC
BPCP
Internal pulse width is fixed at 1µs
In both cases, BPCP width is fixed.
32/46
The input stage includes a clamping function. This
clamp uses the i nput serial capacitor a s "memory
capacitor" and is gated by an internally generated
"Back-Porch-Clamping-Pulse (BPCP)".
The BPCP is synchronized on the second edge of
the horizontal pulse HIN inputs on Pin 1.
Page 33
STV2001
14.4.2 - Contrast Adjustment (7 bits)
The contrast adjustment is made by simultaneously controlling the gain of three internal variable
gain amplifiers through the I
2
C bus interface. The
contrast adjustment allows covering a range higher than 40 dB. This adjustment is refreshed during
the vertical retrace time.
14.4.3 - ABL Control
The STV2001 has an A BL input (automatic beam
limitation) to attenuate RGB v ideo signal s ac cording to beam intensity.
The operating range is typically 2.5 V, from 5 .3 V
to 2.8 V. A typical 12 dB Max. at tenuation is applied to the signal whatever the current gain. Refer
to Figure 16 for ABL input attenuation range.
In the case of software control, the ABL input must
be pulled to AV
through a resistor to limit power
CC
consumption.
ABL input voltage must not exceed V AV
resistor is 10k
Ω.
CC
. Input
Figure 17.
Attenuation (dB)
2
0
-2
-4
-6
-8
-10
-12
-14
12345678
VIN (V)
9
14.4.4 - Brightness Adjustment (6 bits)
As with contrast adjustment, brightness is controlled by I
2
C.
The brightness function consists of adding the
same DC offset to the three R, G, B signals after
contrast amplification. This DC-Offset is present
only outside the blanking pulse (see Figure 19).
The DC output level is forced to "INFRA-BLACK"
level (V
) during the blanking pulse.
DC
14.4.5 - Drive Adjustment (3 x 8 bits)
To adjust the white bal ance, th e device offers t he
possibility of separately ad justing the overall g ain
of each complete video channel. Each channel
gain is controlled by I
2
C (8 bits each). The very
large drive adjustment range (48dB ) allows different standard or custom color temperatures.
The drive adjustment is also used to adjust the
output voltages at the optimum am plitude to drive
the C.R.T drivers, keeping the whole contrast control for end-users only. The drive adjustment is
made after the contrast and brightness so that the
white balance remains correct when BRT is adjusted.
14.4.6 - Output Stage
The three output stages (see Figure 18) incorporate three functions:
•The blanking stage: when the internal
generated blanking pulse is high, the three
outputs are switched to a voltage which is
400 mV lower than the BLACK level. The
black level is the output voltage with minimum
brightness when the input signal video
amplitude is equal to "0".
•The output stage itself: a large bandwidth
output amplifier which can deliver up to 5V
PP
on the three outputs (for 0.7 V video signa l on
the inputs).
•The output CLAMP: the I C also incorporates
three internal output clamps (sample and hold
system) to fix the "INFRA-BLACK" level
(VDC) at 1.1V during blanking.
The overall waveforms of the output signal according to the different adjustments are shown in
Figure 19. and Figure 20.
33/46
Page 34
STV2001
Figure 18.
10
S/H
1.5V
Figure 19. Waveforms VOUT, BRT, CONT
HSYNC
BPCP
BLK
Video IN
V
, V
OUT2
, V
OUT3
V
CONT
OUT1
(4)
Vout
CRT Driver
STV2001
34/46
(3)
V
BRT
(2)
V
BLACK
(1)
V
DC
Note : 1. VDC = 1.5V
BLACK
= V
BRT
CONT
= V
= VDC + 0.4V
2. V
3. V
4. V
CONT
BRT
0.4V fixed
+ BRT (with BRT = 0 to 2.5V)
BLACK
+ CONT with CONT = k x video (CONT = 5VPP max. for VIN = 0.7VPP)
BRT
Page 35
Figure 20. Waveforms (DRIVE adjustment)
HSYNC
BPCP
HFly
Video IN
,
V
V
Note :
OUT1
V
BRT
V
BLACK
V
DC
1. Drive adjustment modifies the following voltages : V
Drive adjustment does not modify the following voltages : V
OUT2
,
V
OUT3
two examples of
drive adjustment
(1)
CONT
V
CONT
, V
DC
.
BRT
and V
STV2001
.
.
BLACK
14.4.7 - Bright Window
Contrast Gain can be increased by 1.5X when the
I2C command “GainWin” is issued or GWIN (Pin
16) pulse value reaches its Turn-ON threshold.
Bright Window gain can be controlled separately
2
C command or pulse voltage at “GAINWIN”
by I
pin. Although both controls are independent, max
gain is still limited to 1.5x, not 1.5x + 1.5x.
14.4.8 - Blanking Generator
A vertical blanking pulse is generated
(see Figure 21). The output level is a positive going pulse of 9.5V. The vertical blanking is started
Figure 21. VBDC (Pin 18) Output Voltage Waveform
DC level controlled by
6-bit DAC
by the vertical sync pulse and by the falling edge of
VFly pulse. If there is no VFly pulse (VFly>6.5V ),
the vertical blanking the vertical blanking start coincides with the beginning of the vertical capacitor
discharge time.
The blanking output generates a superimposed
variable DC voltage. The 6-bit adjustment range is
1 V to 4.5 V. T his is used t o allow brightness control through G1. Addi tionally, this pin is used for
0.8 V
spot killer suppression. The
of Vcc threshold
will trigger the output into a high level sta te resulting from the Vcc decay.
9.5V
4.5 V
1.0 V
35/46
Page 36
STV2001
Table 1:Logic Table
ConditionsHoutVoutVideo-o ffLow Power
at 0 to 6.9V (PD2 mode)nonovideo-offNA (1)
V
cc
at 6.9 V to 8.5 V (PD1 mode)yesyesvideo-offNA(1)
V
cc
Hlock/unlock detection = unlockyesyesvideo-offno
Video ABL input pin < 1 Vnonovideo-offno
5 V POR or I
2
C Hout on/off, (default=1=on)on/offyeson/offno
I
2
C Vout on/off, (default=1=on)yeson/offon/offno
I
2
C Video on/off, (default=0=video-off)yesyeson/offno
I
at >8.5 Vyesyesvideo-on (2)NA (1)
V
cc
at >8.5 V, I2C video=1=onyesyesvideo-on (2)no
V
cc
Note 1 NA= Not applicable.
Note 2 I
2
C POR=1, (default=0)yesyesvideo-offno
2
C video=on will be reset by Low Vcc.
STAND-BY MODE AND PROTECTIONS
14.5 - GENERAL CONSIDERATIONS
2
14.5.1 - POR (Power On Reset) - Subad. 11-D8
POR is activated on 5 V with default values for
each adjustment and in addition video off (see
1.3). It can be activated via the I
2
C command.
14.5.2 - Supply Voltage Threshold.
Two built-in thresholds (see figure 21) are used to
enter the following modes:
•PDI mode:
– Activated for Vcc < 8.5V
– Video off (see 1.13)
•PD2 mode:
– Activated for Vcc < 5.0V
– Video off (see 1.13)
– H
OUT
and V
OUT
disabled
14.5.3 - Video Off (I
Activates blanking of the 3 video output stages.
During this time the outputs are s witched to VDC
level, regardless of the presence of Hsync or Hflyback. Activation time is inferior to 1µs.
This also ac tivates the blanking outpu t at pin 18
into a high level state close to 9.5V as long as
“video off” is activated. When the device enters the
“Video-off” mode, voltage on pin 8 is 8V.
14.5.4 - Vertical Output Off
This command will switch of f output VAMP. The
vertical output swing is reduced to 0V.
14.5.5 - X-Ray, Set Operation - Subad. 09-D8
When ABL voltage is below 1 V threshold, Xray
latch will be activated. This I
the Xray latch. Activation time below 100ms.
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the con sequences of use of suc h informatio n nor for any infringeme nt of patents or other right s of
third parties whi ch ma y res ult fro m its u se. N o licen se is grant ed by implic ation or oth erwi se und er an y patent
or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supe rsedes and repl aces all informa tion previously s upplied. STMicr oelectronics
products are not auth orized for use as critical componen ts in lif e support devices or syst ems with out the e xpress written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
2000 STMicroelectronics - All Rights Reserved.
Purchase of I2C Components by STMicroelectronics conveys a license under the Philips I2C Patent. Rights to use the se compone nt s i n an
Australi a - Brazil - China - Finland - Fr ance - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malt a - Mo rocco - Singa pore - Spain
2
C system is granted pro vi ded that the sy stem confo rm s to the I2C Standard Specification as defined by Philips.
I
STMicroelectronics Grou p of Companie s
Sweden - Switzerland - United K ingdom - U.S .A.
http://www.st.co m
46/46
8
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