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®
HIGH EFFICIENCY ULTRAFAST DIODE
MAIN PRODUCT CHARACTERISTICS
STTH302S
I
F(AV)
V
RRM
3A
200 V
Tj (max) 175 °C
(max) 0.75 V
V
F
trr (max) 35 ns
FEATURES AND BENEFITS
Very low conduction losses
■
Negligible switching losses
■
Low forward and reverse recovery times
■
High junction temperature
■
DESCRIPTION
The STTH302S, which is using ST’s new 200V
planar technology, is specially suited for switching
mode base drive & transistor circuits.
The device is also intended for use as a free
wheeling diode in power supplies and other power
switching applications.
SMC
ABSOLUTE RATINGS (limiting values)
Symbol Parameter Value Unit
V
RRM
I
F(AV)
I
FSM
T
stg
Repetitive peak reverse voltage 200 V
Average forward current Tl = 107°C δ =0.5 3 A
Surge non repetitive forward current tp = 10 ms Sinusoidal 100 A
Storage temperature range - 65 + 175 °C
Tj Maximum operating junction temperature 175 °C
THERMAL PARAMETERS
Symbol Parameter Maximum Unit
R
th (j-l)
April 2002 - Ed: 1A
Junction to lead 20 °C/W
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STTH302S
STATIC ELECTRICAL CHARACTERISTICS
Symbol Parameter Tests conditions Min. Typ. Max. Unit
I
* Reverse leakage
R
current
V
** Forward voltage drop Tj= 25°C I
F
Tj = 25°C V
R=VRRM
3 µA
Tj = 125°C 4 75
= 3 A 0.95 V
F
Tj = 125°C I
Pulse test: * tp = 5ms, δ <2%
** tp = 380µs, δ <2%
= 3 A 0.66 0.75
F
To evaluate the maximum conduction losses use the following equation :
P=0.60xI
F(AV)
+ 0.05 I
F2(RMS)
DYNAMIC ELECTRICAL CHARACTERISTICS
Symbol Parameter Tests conditions Min. Typ. Max. Unit
trr Reverse recovery
time
tfr Forward recovery
time
V
FP
Forward recovery
Tj = 25°C I
Tj = 25°C I
Tj = 25°C I
=1 A Irr = -50 A/µs
F
VR= 30V
=3A dIF/dt=50A/µs
F
70 ns
VFR=1.1xVFmax
=3A dIF/dt=50A/µs 1.6 V
F
35 ns
voltage
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Page 3
STTH302S
Fig. 1: Average forward power dissipation versus
average forward current.
P (W)F(AV)
3.0
δ = 0.05
2.5
2.0
1.5
1.0
0.5
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
δ = 0.1
I (A)F(AV)
δ = 0.2
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Fig. 3: Relative variation of thermal impedance
junction ambient versus pulse duration (Printed
circuit board epoxy FR4).
Zth(j-a)/Rth(j-a)
1.0
0.9
0.8
0.7
δ = 0.5
0.6
0.5
0.4
δ = 0.2
0.3
δ = 0.1
0.2
0.1
Single pulse
0.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
tp(s)
δ
=tp/T
T
tp
Fig. 2: Average forward current versus ambient
temperature (δ = 0.5)
I (A)F(AV)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0 25 50 75 100 125 150 175
R
th(j-a)=Rth(j-l)
R
=75°C/W
th(j-a)
S=1cm²
T (°C)amb
Fig. 4: Forward voltage drop versus forward
current.
I (A)FM
100.0
Tj=125°C
Tj=125°C
(Maximum values)
(Maximum values)
Tj=125°C
10.0
1.0
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
Tj=125°C
(Typical values)
(Typical values)
Tj=25°C
(Maximum values)
V (V)FM
Fig. 5: Junction capacitance versus reverse
voltage applied (typical values).
C(pF)
100
V (V)R
10
1 10 100 1000
F=1MHz
V
osc
T
=30mV
=25°C
j
Fig. 6: Reverse recovery time versus dIF/dt (90%
confidence).
t (ns)RR
100
90
80
70
60
50
40
30
20
10
0
1 10 100 1000
Tj=125°C
Tj=25°C
dI /dt(A/µs)F
IF=3A
=100V
V
R
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STTH302S
Fig. 7: Peak reverse recovery current versus
/dt (90% confidence).
dI
F
I (A)RM
6.0
IF=3A
=100V
V
R
5.0
4.0
3.0
2.0
1.0
Tj=125°C
Tj=25°C
dI /dt(A/µs)F
0.0
1 10 100 1000
Fig. 9: Relative variations of dynamic parameters
versus junction temperature.
I ;t ; Q [Tj] / I ; t ; Q [Tj = 25°C]RM RR RR RM RR RR
3.5
3.0
2.5
2.0
1.5
1.0
IF=3A
/dt=200A/µs
dI
F
=100V
V
R
Q
RR
t
RR
I
Tj(°C)
25 50 75 100 125 150 175
RM
Fig. 8: Reverse recovery charges versus dIF/dt
(90% confidence).
Q (nC)RR
100
IF=3A
90
=100V
V
R
80
70
60
50
40
30
20
10
0
1 10 100 1000
Tj=125°C
Tj=25°C
dI /dt(A/µs)F
Fig. 10: Thermal resistance junction to ambient
versus copper surface under each lead (epoxy
FR4, e = 35µm).
Rth(j-a)(°C/W)
100
90
80
70
60
50
40
30
20
10
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S(cm²)
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Page 5
PACKAGE MECHANICAL DATA
SMC
E1
D
E
C
L
E2
STTH302S
DIMENSIONS
REF.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 2.90 3.2 0.114 0.126
c 0.15 0.41 0.006 0.016
E 7.75 8.15 0.305 0.321
A1
A2
b
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
D 5.55 6.25 0.218 0.246
L 0.75 1.60 0.030 0.063
Millimeters Inches
Min. Max. Min. Max.
FOOTPRINT
3.3
2.0 4.2 2.0
Ordering code Marking Package Weight Base qty Delivery mode
STTH302S U32 SMC 0.245 g 2500 Tape & reel
■
Epoxy meets UL 94,V0
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