These miniature surface mount MOSFETs utilize a high cell density
trench process to provide low R
and to ensure minimal power
DS(on)
loss and heat dissipation. Typical applications are DC-DC converters
and power management in portable and battery-powered products
such as computers, printers, PCMCIA cards, cellular and cordless
telephones.
FEATURES
Low R
Low thermal impedance copper leadframe TSOP-6 saves board space.
Fast switching speed.
High performance trench technology.
provides higher efficiency and extends battery life.
DS(on)
F
D G
REF.
PRODUCT SUMMARY
PRODUCT SUMMARY
V
(V) R
DS
30
-30
0.090@VGS= 4.5V
0.112@V
0.172@VGS= -4.5V -2.2
(on) ( I
DS
0.063@V
= 10V 3.7
GS
= -10V
GS
D1 S1 D2
6
4
5
2
1 3
G1 S2 G2
(A)
D
3.1
-2.7
Gate
Drain
Gate
Source
ABSOLUTE MAXIMUM RATINGS(TA=25℃ UNLESS OTHERWISE NOTED)
Parameter Symbol
Drain-Source Voltage V
Gate-Source Voltage V
Continuous Drain Current a
Pulsed Drain Current
b
I
Continuous Source Current (Diode Conduction) a I
Power Dissipation a
ID @TA=25℃
I
@TA=70℃
D
P
@TA=25℃ 1.15
D
P
@TA=70℃ 0.7
D
30 -30 V
DS
±20 ±20 V
GS
8 -8 A
DM
1.05 -1.05 A
S
N-Channel P-Channel
Operating Junction and Storage Temperature RangeTj, Tstg -55 ~ +150℃
Ratings
3.7 -2.7
2.9 -2.1
THERMAL RESISTANCE RATINGS
Parameter Symbol
Maximum Junction to Ambient
t ≦ 10 sec
a
Steady State 130 150 130 150
RJA
N-Channel P-Channel
Typ Max Typ Max
93 110 93 110
Notes
DS(ON)
DS(ON)
TSOP-6
A
E
L
B
Millimeter
Min. Max. Min. Max.
A 2.70 3.10 G 00.10
B 2.60 3.00 H 0.60 REF.
C 1.40 1.80 J 0.12 REF.
D 1.10 MAX. K 0°10°
E 1.90 REF. L 0.95 REF.
F 0.30 0.50
Drain
Source
63 m
112 m
K
Millimete
REF.
HC
J
Unit
A
W
Unit
℃ / W
a. Surface Mounted on 1” x 1” FR4 Board.
b. Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually.
19-Jul-2010 Rev. A Page 1 of 7
Page 2
Elektronische Bauelemente
ELECTRICAL CHARACTERISTICS (T
Parameter Symbol Min.Typ.Max.UnitTest Conditions
(N-Ch) 3.7 A, 30 V, R
(P-Ch) -2.7 A, -30 V, R
N & P-Channel Enhancement Mode Mos.FET
= 25°C unless otherwise specified)
A
STT3599C
DS(ON)
DS(ON)
63 m
112 m
Gate-Threshold Voltage
Gate-Body Leakage Current
Zero Gate Voltage Drain
Current
On-State Drain Current a
Drain-Source
On-Resistance
a
Forward Transconductance
N-Ch
V
P-Ch -1 -1.6 -2.5 VDS=VGS, ID= -250uA
GS(th)
N-Ch
I
P-Ch - -4.5nA-100VDS= 0 V, VGS= -20 V
GSS
N-Ch
1 1.6 2.5
- 4.5nA100
- 12nA1
VDS=VGS, ID=250uA
V
V
= 0 V, VGS= 20 V
uA
DS
VDS=24 V, VGS=0 V
P-Ch - -12nA-1 VDS=-24V, VGS=0 V
I
N-Ch - - 10 VDS=24V, VGS=0 V, TJ=55℃
DSS
uA
P-Ch - - -10 VDS= -24V, VGS=0 V, TJ=55℃
N-Ch
I
P-Ch -5 - - V
D(on)
N-Ch
5 - -
- 0.0570.063
V
5V, VGS=10 V
A
DS =
= -5V, VGS= -10 V
DS
VGS=10V, ID= 3.7A
P-Ch - 0.1000.112VGS=-10V, ID= -2.7A
R
N-Ch - 0.0750.090VGS=4.5V, ID= 3.1A
DS(ON)
Ω
P-Ch - 0.1480.172VGS=-4.5V, ID= -2.2A
N-Ch
a
P-Ch - 5 - VDS= -5V, ID= 3.1A
g
fs
- 10 -
VDS= 5V, ID= 3.7A
S
Diode Forward Voltage a
N-Ch
VSD
- 0.80 S
I
= 1.05A, VGS= 0V
S
P-Ch - -0.83- IS= -1.05A, VGS= 0V
http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually.
19-Jul-2010 Rev. A Page 2 of 7
Page 3
STT3599C
(N-Ch) 3.7 A, 30 V, R
Elektronische Bauelemente
(P-Ch) -2.7 A, -30 V, R
N & P-Channel Enhancement Mode Mos.FET
DYNAMIC
b
DS(ON)
DS(ON)
63 m
112 m
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
N-Ch
Qg
P-Ch - 3.8 8
N-Ch
Qgs
P-Ch - 0.6 2
N-Ch
Q
P-Ch - 1.5 3
gd
N-Ch
C
P-Ch - 378 800
iss
N-Ch
C
P-Ch - 126 300
oss
N-Ch
C
P-Ch - 52 300
rss
N-Ch
T
P-Ch - 5 10
d(on)
- 2.2 5
- 0.5 1
- 0.8 2
- 184 400
- 62 200
- 30 200
- 5 10
nC
pF
N-Channel
V
DS
I
= 2.7A
D
P-Channel
V
DS
I
= -3.1A
D
N-Channel
V
DS
f= 1MHz
P-Channel
V
DS
f= 1MHz
N-Channel
N-Ch
Tr
P-Ch - 15 30
N-Ch
T
P-Ch - 20 40
d(off)
N-Ch
- 12 30
- 13 30
- 7 20
nS
V
DD
V
GS
P-Channel
V
DD
V
GS
Tf
P-Ch - 20 40
=15V, VGS= 4.5V,
= -15V, VGS= -4.5V,
= 15V, VGS= 0V,
= -15V, VGS= 0V,
= 15V, R
GEN
= 15 ,
= 4.5V, ID= 1A
= -15V, R
GEN
= 15
= -4.5V, ID= -1A
Notes
a. Pulse test:PW ≦ 300 us duty cycle ≦ 2%.
b. Guaranteed by design, not subject to production testing.
http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually.
19-Jul-2010 Rev. A Page 3 of 7
Page 4
Elektronische Bauelemente
CHARACTERISTIC CURVES (N-Channel)
STT3599C
(N-Ch) 3.7 A, 30 V, R
(P-Ch) -2.7 A, -30 V, R
N & P-Channel Enhancement Mode Mos.FET
DS(ON)
DS(ON)
63 m
112 m
http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually.
19-Jul-2010 Rev. A Page 4 of 7
Page 5
STT3599C
(N-Ch) 3.7 A, 30 V, R
Elektronische Bauelemente
(P-Ch) -2.7 A, -30 V, R
N & P-Channel Enhancement Mode Mos.FET
DS(ON)
DS(ON)
63 m
112 m
http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually.
19-Jul-2010 Rev. A Page 5 of 7
Page 6
Elektronische Bauelemente
CHARACTERISTIC CURVES (P-Channel)
STT3599C
(N-Ch) 3.7 A, 30 V, R
(P-Ch) -2.7 A, -30 V, R
N & P-Channel Enhancement Mode Mos.FET
DS(ON)
DS(ON)
63 m
112 m
http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually.
19-Jul-2010 Rev. A Page 6 of 7
Page 7
STT3599C
(N-Ch) 3.7 A, 30 V, R
Elektronische Bauelemente
(P-Ch) -2.7 A, -30 V, R
N & P-Channel Enhancement Mode Mos.FET
DS(ON)
DS(ON)
63 m
112 m
http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually.
19-Jul-2010 Rev. A Page 7 of 7
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