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STT3405P
-4.9 A, -20 V, R
Elektronische Bauelemente
P-Channel Enhancement Mode MOSFET
RoHS Compliant Product
A suffix of “-C” specifies halogen and lead-free
DS(ON)
56 m
DESCRIPTION
These miniature surface mount MOSFETs utilize
a high cell density process. Low R
assures minimal
DS(on)
power loss and conserves energy, making this device
ideal for use in power management circuitry. Typical
applications are PWMDC-DC converters, power management
in portable and battery-powered products such as computers,
printers, battery charger, telecommunication power system,
and telephones power system.
FEATURES
Low R
battery life.
Miniature TSOP-6 surface mount package saves
board space.
High power and current handling capability.
provides higher efficiency and extends
DS(on)
PACKAGE INFORMATION
Package MPQ LeaderSize
TSOP-6 3K 7’ inch
TSOP-6
A
E
L
5
6
4
B
1
23
F
D G
Millimete
REF.
Min. Max. Min. Max.
A 2.70 3.10 G 0 0.10
B 2.60 3.00 H 0.60 REF.
C 1.40 1.80 J 0.12 REF.
D1.10 MAX. K 0° 10°
E 1.90 REF. L 0.95 REF.
F 0.30 0.50
D
DD
K
REF.
Millimete
HC
J
D
G
ABSOLUTE MAXIMUM RATINGS (T
Parameter Symbol Ratings Unit
Drain-Source Voltage V
Gate-Source Voltage V
Continuous Drain Current 1
Pulsed Drain Current
Continuous Source Current (Diode Conduction) 1 I
Power Dissipation 1
Operating Junction and Storage Temperature Range Tj, Tstg -55 ~ 150 °C
Maximum Junction to Ambient 1 t ≦ 5 sec R
2
I
=25°C unless otherwise specified)
A
DS
GS
= 25°C
T
A
TA= 70°C -4.0
= 25°C
T
A
TA= 70°C 1.3
ID
DM
-1.7 A
S
P
D
Thermal Resistance Ratings
JA
-20 V
±12 V
-4.9
-20 A
2
62.5
110
Notes:
1. Surface Mounted on 1” x 1” FR4 Board.
2. Pulse width limited by maximum junction temperature.
S
A
W
°C / W
http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually.
06-Jan-2011 Rev. A Page 1 of 4
Page 2
Elektronische Bauelemente
ELECTRICAL CHARACTERISTICS (T
Parameter Symbol Min. Typ. Max. Unit Test Conditions
P-Channel Enhancement Mode MOSFET
= 25°C unless otherwise specified)
A
Static
STT3405P
-4.9 A, -20 V, R
DS(ON)
56 m
Gate-Threshold Voltage V
Gate-Body Leakage I
Zero Gate Voltage Drain Current I
On-State Drain Current 1 I
Drain-Source On-Resistance 1 R
GS(th)
GSS
DSS
D(on)
DS(ON)
-0.7 - - V VDS= VGS, ID= -250μA
- - ±100 nA VDS= 0V, VGS= ±12V
- - -1
VDS= -16V, VGS= 0V
μA
- - -5
-15 - - A V
- - 56
- - 80 VGS= -2.5V, ID= -4.2A
mΩ
= -16V, VGS= 0V, T
V
DS
-4.5V, VGS= -4.5V
DS =
V
= -4.5V, ID= -4.9A
GS
- - 150 VGS= -1.8V, ID= -3.1A
Forward Transconductance 1 g
fs
- 11 - S VDS= -10V, ID= -4.9A
Diode Forward Voltage VSD - -0.8 - V IS= 1.7A, VGS= 0V
Dynamic
2
Total Gate Charge Qg - 8 -
= -10V, VGS= -4.5V,
V
Gate-Source Charge Qgs - 1.8 -
Gate-Drain Charge Q
- 1.9 -
gd
nC
DS
I
= -4.9A
D
= 55°C
J
Turn-on Delay Time T
- 22 -
d(on)
Rise Time Tr - 35 -
Turn-off Delay Time T
- 45 -
d(off)
Fall Time Tf - 25 -
Notes:
1. Pulse test：PW ≦ 300 us duty cycle ≦ 2%.
2. Guaranteed by design, not subject to production testing.
nS
= -10V, V
V
DD
R
= 6, ID= -1A
L
= -4.5V,
GEN
http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually.
06-Jan-2011 Rev. A Page 2 of 4
Page 3
Elektronische Bauelemente
CHARACTERISTICS CURVE
STT3405P
-4.9 A, -20 V, R
P-Channel Enhancement Mode MOSFET
DS(ON)
56 m
http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually.
06-Jan-2011 Rev. A Page 3 of 4
Page 4
Elektronische Bauelemente
CHARACTERISTICS CURVE
STT3405P
-4.9 A, -20 V, R
P-Channel Enhancement Mode MOSFET
DS(ON)
56 m
http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually.
06-Jan-2011 Rev. A Page 4 of 4
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