Datasheet STS7PF30L Datasheet (SGS Thomson Microelectronics)

Page 1
STS7PF30L
P-CHANNEL 30V - 0.016-7ASO-8
STripFET™ II POWER MOSFET
PRELIMINARY DATA
TYPE V
STS7PF30L 30 V < 0.021 7A
STANDARD OUTLINE FOR EASY
DSS
(on) = 0.016
DS
R
DS(on)
I
D
AUTOMATED SURFACE MOUNT ASSEMBLY
LOW THRESHOLD DRIVE
DESCRIPTION
This Power Mosfet is the latest development of ST­Microelectronics unique “Single Feature Size
™”
strip-based proc es s . The resulting transistor shows extremely high packing density for low on-resis­tance, rugged avalanche characteristics and less critical alignment stepstherefore a remarkable man­ufacturing reproducibility.
APPLICATIONS
BATTERY MANAGEMENT IN NOMADIC
EQUIPMENT
POWER MANAGEMENT IN CELLULAR
PHONES
SO-8
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
() Pulse width limited by safe operating area
December 2002
Drain-source Voltage (VGS=0) Drain-gate Voltage (RGS=20kΩ) Gate- source Voltage ±20 V Drain Current (continuous) at TC= 25°C Drain Current (continuous) at TC= 100°C Drain Current (pulsed) 28 A Total Dissipation at TC= 25°C
Note: For the P-CHANNEL MOSFET actual polarity of voltages and
30 V 30 V
7A
4.4 A
2.5 W
current has to be reversed
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STS7PF30L
THERMAL DATA
Rthj-amb(#) Thermal Re sistance Junction-ambient Max 50 °C/W
Tj Maxim um Lead Temperature For Soldering Purpose Typ 150 °C
T
stg
(#) When mounted on 1 inch2FR4 Board, 2 oz of Cu and t10s
ELECTRICAL CHARACTERISTICS (TJ= 25 °C UNLESS OTHERRWISE SPECIFIED) OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
ON (1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Storage Temperature –55 to 150 °C
Drain-source
ID= 250 µA, VGS= 0 30 V
Breakdown Voltage Zero Gate Voltage
Drain Current (V
GS
=0)
Gate-body Lea kage Current (V
DS
=0)
Gate Threshold Voltage Static Drain-source On
Resistance
V
= Max Rating
DS
V
= Max Rating , TC= 125 °C
DS
V
= ± 20V ±100 nA
GS
V
DS=VGS,ID
VGS=10V,ID= 3.5A
= 4.5V, ID= 3.5A
V
GS
= 250µA
1 1.6 2.5 V
0.011 0.016 0.021
0.016 0.022 0.028
A
10 µA
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
fs
C
iss
C
oss
C
rss
Forward Transconductanc e VDS=10V,ID= 3.5A 16 S
V
Input Capacitance
=25V,f=1MHz,VGS=0
DS
2600 pF Output Capacitance 523 pF Reverse Transfer
174 pF
Capacitance
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Page 3
STS7PF30L
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON(2)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
d(on)
Q
Q
Q
t
r
g
gs
gd
Turn-on Delay Time Rise Time 54 ns Total Gate Charge
Gate-Source Charge Gate-Drain Charge
SWITCHING OFF(2)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
t
f
Turn-off-Delay Time Fall Time
SOURCE DRAIN DIODE (2)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD(2)
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse w idth limited by safe operating area.
Source-drain Current 7 A
(1)
Source-drain Current (pulsed) 28 A Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge Reverse Recovery Current
=15V,ID= 3.5A
DD
= 4.7VGS=4.5V
R
G
(Resistive Load, Figure 3)
=15V,ID=7A,
V
DD
V
= 4.5V
GS
VDD=15 V,ID= 3.5 A, RG=4.7Ω, VGS= 4.5 V (Resistive Load, Figure 3)
ISD= 7 A, VGS=0
= 7A, di/dt = 100A/µs,
I
SD
VDD=24V,Tj= 150°C (see test circuit, Figure 5)
68 ns
28
38
8.8 12
65 23
1.2 V
40 46
2.3
nC nC nC
ns ns
ns
nC
A
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STS7PF30L
Fig. 2: Unclam ped Inductive WaveformFig. 1: Unclamped Inducti ve Load T es t Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
4/6
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0016023
SO-8 MECHANICAL DATA
STS7PF30L
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A1.750.068 a1 0.1 0.25 0.003 0.009 a2 1.65 0.064 a3 0.65 0.85 0.025 0.033
b 0.35 0.48 0.013 0.018 b1 0.19 0.25 0.007 0.010
C 0.25 0.5 0.010 0.019 c1 45 (typ.)
D 4.8 5.0 0.188 0.196
E 5.8 6.2 0.228 0.244
e1.27 0.050 e3 3.81 0.150
F 3.8 4.0 0.14 0.157
L 0.4 1.27 0.015 0.050
M0.60.023
S 8 (max.)
mm inch
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STS7PF30L
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of su ch in formation nor for any in fringement of patents or other rights of third parties w hich may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously suppli ed. STMi croelect ronics pr oducts are not author ized for use as cr itical component s in li fe suppo rt devi ces or systems without express written approval of STMicroelectronics.
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