Datasheet STS7NF30L Datasheet (SGS Thomson Microelectronics)

Page 1
®
N - CHANNEL 30V - 0.021- 7A SO-8
TYPE V
STS7NF30L 30 V < 0.025 7 A
TYPICAL R
STANDARD OUTLINE FOR EASY
DS(on)
DSS
= 0.021
AUTOMATED SURF ACE MOUNT ASSEMBLY
LOW THRESHOLD DRIVE
DESCRIPTION
This Power MOSFET is the second generation of STMicroelectronics unique " Single Feature Size " strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.
R
DS(on)
I
D
STS7NF30L
STripFET POWER MOSFET
PRELIMINARY DATA
SO-8
APPLICATIONS
DC MOTOR DRIVE
DC-DC CONVERTERS
BATTERY MANAGM ENT IN NOMADI C
INTERNAL SCHEMATIC DIAGRAM
EQUIPMENT
POWER MANAGEMENT IN PORTABLE/DESKTOP PC
s
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
I
V
V
V
DM
P
Drain-source Voltage (VGS = 0) 30 V
DS
Drain- gate Voltage (RGS = 20 k)
DGR
Gate-source Voltage ± 20 V
GS
I
Drain Current (continuous) at Tc = 25 oC
D
Drain Current (continuous) at T
() Drain Current (pulsed) 42 A
Total Dissipation at Tc = 25 oC 2.5 W
tot
= 100 oC
c
30 V
7
4.4
A A
(•) Pulse width limited by safe operating area
May 1999
1/5
Page 2
STS7NF30L
THERMAL DATA
R
thj-amb
T
T
(*)Thermal Resistance Junction-ambient Maximum Operating Junction Temperature
j
Storage Temperature
stg
50
150
-55 to 150
o
C/W
o o
C C
(*)
Mounted on FR-4 board ( (t
ELECTRICAL CHARACTERISTICS
≤ 10sec)
(T
case
= 25 oC unless otherwise specified)
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
I
= 250 µA V
D
GS
= 0
30 V
Breakdown Voltage
I
I
ON (
DSS
GSS
Zero Gate Voltage Drain Current (V
Gate-body Leakage Current (V
)
DS
= 0)
GS
= 0)
= Max Rating
V
DS
V
= Max Rating Tc = 125 oC
DS
V
= ± 20 V
GS
1
10
± 100 nA
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
R
DS(on)
I
D(on)
GS(th)
Gate Threshold Voltage Static Drain-source On
Resistance
V
= VGS ID = 250 µA
DS
VGS = 10 V ID = 3.5 A V
= 4.5 V ID = 3.5 A
GS
On State Drain Current VDS > I
V
= 10 V
GS
D(on)
x R
DS(on)max
1 1.6 2.5 V
0.021
0.025
20 A
0.025
0.032ΩΩ
DYNAMIC
µA µA
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
() Forward
fs
VDS > I
D(on)
x R
DS(on)max
ID = 3.5 A 10 S
Transconductance
C C C
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer
rss
V
= 25 V f = 1 MHz V
DS
= 0 V 1250
GS
230
50
Capacitance
2/5
pF pF pF
Page 3
STS7NF30L
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
Turn-on Delay Time Rise Time
t
r
V
= 15 V ID = 3 A
DD
= 4.7 Ω VGS = 5 V
R
G
(Resistive Load, see fig. 3)
Q Q Q
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain Charge
gd
V
= 24 V ID = 7 A V
DD
= 4.5 V 17
GS
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
Turn-off Delay Time Fall Time
t
f
V
= 15 V ID = 3 A
DD
= 4.7 Ω VGS = 5 V
R
G
(Resistive Load, see fig. 3)
t
r(Voff)
t
t
Off-voltage Rise Time Fall Time
f
Cross-over Time
c
V
= 24 V ID = 7 A
clamp
= 4.7 Ω VGS = 5 V
R
G
(Inductive Load, see fig. 5)
SOURCE DRAIN DIODE
22 30
23 nC 4 6
55 10
10 18 30
ns ns
nC nC
ns ns
ns ns ns
Symbol Parameter Test Conditions Min. Typ. Max. Unit
2 8
I
SDM
I
SD
Source-drain Current
(•)
Source-drain Current (pulsed)
V
(∗) Forward On Voltage ISD = 7 A VGS = 0 1.2 V
SD
t
Q
Reverse Recovery
rr
Time Reverse Recovery
rr
I
= 7 A di/dt = 100 A/µs
SD
V
= 20 V Tj = 150 oC
DD
(see test circuit, fig. 5)
30 30
Charge
I
RRM
Reverse Recovery
2
Current
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % (•) Pulse width limited by safe operating area
A A
ns
nC
A
3/5
Page 4
STS7NF30L
SO-8 MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A1.750.068 a1 0.1 0.25 0.003 0.009 a2 1.65 0.064 a3 0.65 0.85 0.025 0.033
b 0.35 0.48 0.013 0.018 b1 0.19 0.25 0.007 0.010
C 0.25 0.5 0.010 0.019
c1 45 (typ.)
D 4.8 5.0 0.188 0.196
E 5.8 6.2 0.228 0.244
e1.27 0.050 e3 3.81 0.150
F 3.8 4.0 0.14 0.157
L 0.4 1.27 0.015 0.050
M0.60.023
S 8 (max.)
mm inch
4/5
0016023
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STS7NF30L
Information f urnished i s believed t o be accurate an d reliabl e. How ever, STMicroelect ronics assu mes no responsib ility fo r the consequen ces of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to chan ge w ithout notice. This publicatio n su persedes a nd r eplaces al l inf ormati on previ ously suppl ied. STMicroelect ron ics produ cts are not auth ori zed f or use as critical component s in life support devices or systems without exp ress writ te n approval of STMicroelectronics.
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