This Power MOSFET is the secondgeneration of
STMicroelectronics unique ” Single Feature
Size
”
strip-based process. The resulting
transistor shows extremely high packing density
forlowon-resistance,ruggedavalanche
characteristics and less critical alignment steps
thereforearemarkablemanufacturing
reproducibility.
R
DS(on)
I
D
STS7DNF30L
STripFET POWER MOSFET
PRELIMINARY DATA
SO-8
APPLICATIONS
■ DC MOTOR DRIVE
■ DC-DCCONVERTERS
■ BATTERYMANAGMENTIN NOMADIC
INTERNAL SCHEMATIC DIAGRAM
EQUIPMENT
■ POWERMANAGEMENTIN
PORTABLE/DESKTOPPC
s
ABSOLUTE MAXIMUM RATINGS
Symb o lParameterValueUnit
V
V
V
I
DM
P
(•) Pulse width limited by safeoperating area
Drain-source Volt age (VGS=0)30V
DS
Drain- gate Voltage (RGS=20kΩ)30V
DGR
Gate-s ource Voltage± 20V
GS
Drain Current (co ntinuous) at Tc = 25oC
I
D
Single Operat ion
Drain Current (co ntinuous) at T
Single Operat ion
(•)Drain Current (puls ed)28A
Tot al Di ssipation at Tc=25oC Dual Opera tion
tot
Tot al Di ssipation at T
=25oCSinlgeOperation
c
=100oC
c
7
4
2
1.6
A
A
W
W
November 1999
1/6
Page 2
STS7DNF30L
THERMAL DATA
R
thj-amb
T
Tstg
(*)Mountedon FR-4 board (Steady State)
*Ther mal Resistan c e Junction-amb ient S ingle Opera ti on
Maximum Operating Ju nc t ion T emperat ure
j
Sto rage Temperature
Dual Operation
78
62.5
150
-65 to 150
o
C/W
o
C/W
o
o
C
C
ELECTRICAL CHARACTERISTICS
=25oC unless otherwisespecified)
(T
case
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
ID=250µAVGS=030V
Break dow n Voltage
I
DSS
I
GSS
Zero Gate Voltage
Drain Cur rent ( V
GS
Gat e- bod y L eakage
Current (V
DS
=0)
=0)
V
=MaxRating
DS
=MaxRatingTc=125oC
V
DS
V
=± 20 V
GS
1
10
100nA
±
ON (∗)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage VDS=VGSID= 250 µA11.62.5V
Sta t ic Drain -s ource On
Resistance
VGS=10V ID=3.5A
=4.5V ID=3.5A
V
GS
On State Drain Current VDS>I
D(on)xRDS(on )max
0.018
0.021
7A
0.022
0.026ΩΩ
VGS=10V
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
g
(∗)Forward
fs
Tr ansc on duc tance
C
C
C
Input Capac i t ance
iss
Out put Capacitance
oss
Reverse Tr ansfer
rss
Capacit a nc e
VDS>I
D(on)xRDS(on )maxID
=3.5A10S
VDS=25V f=1MHz VGS= 0 V1050
250
85
µA
µA
pF
pF
pF
2/6
Page 3
STS7DNF30L
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHINGON
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
Tur n-on Delay Time
Rise Ti me
t
r
VDD=15VID=3.5A
R
=4.7
G
Ω
VGS=4.5V
22
60
(Resis t iv e Loa d, see fig. 3)
Q
Q
Q
Tot al Gat e Charge
g
Gat e- Source Charg e
gs
Gate-Drain Charge
gd
VDD=24V ID=8A VGS= 5 V17.5
4
7
23nC
SWITCHINGOFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(off)
Tur n-of f Delay Time
t
Fall T ime
f
VDD=15VID=3.5A
=4.7 ΩVGS=4.5V
R
G
42
10
(Resis t iv e Loa d, see fig. 3)
t
r(Voff)
t
t
Off-volt age Rise T im e
Fall T ime
f
Cross-over Time
c
V
=24VID=7A
clamp
=4.7 ΩVGS=4.5V
R
G
(Indu ct iv e Load , s e e fig. 5)
11
12
25
SOURCEDRAINDIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
(∗) Pulsed:Pulse duration = 300µs, duty cycle 1.5%
(•) Pulse width limited by safe operating area
Source-drain Current
(•)
Source-drain Current
8
32
(pulsed)
(∗)ForwardOnVoltage ISD=7A VGS=01.2V
Reverse Recovery
rr
Time
Reverse Recovery
rr
ISD=7Adi/dt=100A/µs
=20VTj=150oC
V
DD
(see test circuit, fig. 5)
50
40
Charge
Reverse Recovery
1.6
Current
ns
ns
nC
nC
ns
ns
ns
ns
ns
A
A
ns
nC
A
3/6
Page 4
STS7DNF30L
Fig. 1:
UnclampedInductiveLoad TestCircuit
Fig. 3: SwitchingTimes Test Circuits For
ResistiveLoad
Information furnishedis believed to be accurateand reliable.However, STMicroelectronics assumes no responsibilityfor the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under anypatent or patent rights of STMicroelectronics. Specificationmentioned in this publication are
subjecttochange withoutnotice.Thispublication supersedes and replaces all informationpreviously supplied. STMicroelectronicsproducts
are not authorized for use as critical components in lifesupport devices or systemswithout express written approval of STMicroelectronics.
The STlogo is a trademark of STMicroelectronics
1999 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan- Malaysia - Malta - Morocco -
6/6
Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://www.st.com
.
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