Datasheet STS6PF30L Datasheet (SGS Thomson Microelectronics)

Page 1
STS6PF30L
c
n
u
The ST log o i s registered trademark of ST
h
All other names are the property of their re
O
Australi a - Brazil - China - Finland - France - G ermany - Ho ng K ong - In
Singapor e - Spain - Sweden - Switze rl and - Un
P-CHANNEL 30V - 0.027 Ω - 6A SO-8
STripFET™ POWER MOSFET
TYPE
V
DSS
STS6PF30L 30 V <0.030
TYPICAL R
(on) = 0.027
DS
R
DS(on)
I
D
6 A
AUTOMATED SURFACE MOUNT ASSEMBLY
LOW THRESHOLD DRIVE
DESCRIPTION
This Power MOSFET is the latest dev elo pment of
STMicroelectronis unique "Single Feature Size™" strip-based process. The resulting transistor shows extremely high packing density for low on­resistance, rugged avalanche characteristics and less critical alignment steps therefore a remark­able manufacturing reproducibility.
APPLICATIONS
MOBILE PHONE APPLICATIONS
DC-DC CONVERTERS
BATTERY MANAGEMENT IN NOMADIC
EQUIPMENT
SO-8
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DS
V
DGR
V
GS
I
D
I
D
(
I
DM
P
tot
(
Pulse widt h l i m i ted by safe operating area. Note: For the P-CHANNEL MOSFET actual polarity of
•)
.
Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 kΩ) Gate- source Voltage ± 16 V
Drain Current (continuous) at TC = 25°C Drain Current (continuous) at TC = 100°C
•)
Drain Current (pulsed) 24 A Total Dissipation at TC = 25°C
Information furnished is believed to be accurate an d rel i able. However, STMicroel of use of such information nor for any infringement of patents or other rights of third by implic ation or otherwise under any patent or patent ri ghts of STM i croelectr oni to change without notice. This publication supersedes and replaces all informatio authoriz ed for use as c ri t i cal components in life support dev i ces or systems witho
30 V 30 V
2003 STMicroelectronics - All Rig
6A
3.8 A
2.5 W
voltages and current has to be reversed
STMicroelectronics GROUP OF C
http://www.st.com
1/8May 2003
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STS6PF30L
THERMA L D ATA
Rthj-amb
T
T
stg
Thermal Resistance Junction-ambient Maximum Lead Temperature For Soldering Purpose
j
storage temperature
Max
Typ
50
150
-55 to 150
°C/W
°C °C
ELECTRICAL CHARACTERISTICS (T
= 25 °C unless otherwise specified)
case
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
= 250 µA, VGS = 0
D
V
= Max Rating
DS
V
= Max Rating TC = 125°C
DS
V
= ± 16 V
GS
30 V
1
10
±100 nA
ON
V
(BR)DSS
I
DSS
I
GSS
(*)
Drain-source Breakdown Voltage
Zero Gate Voltage Drain Current (V
GS
Gate-body Leakage Current (V
DS
= 0)
= 0)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
V
GS(th)
R
DS(on)
Gate Threshold Voltage Static Drain-source On
Resistance
= VGS I
DS
= 10 V ID = 3 A
V
GS
V
= 5 V ID = 3 A
GS
= 250 µA
D
1 1.6 2.5 V
0.027
0.034
0.030
0.042
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(*)
g
fs
C
iss
C
oss
C
rss
Forward Transconductance Input Capacitance
Output Capacitance Reverse Transfer Capacitance
V
=10 V ID=3 A
DS
= 25V, f = 1 MHz, VGS = 0
V
DS
12 S
1670
345 120
µA µA
Ω Ω
pF pF pF
2/8
Page 3
STS6PF30L
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
t
r
Q
g
Q
gs
Q
gd
(*)
Turn-on Delay Time Rise Time
Total Gate Charge Gate-Source Charge Gate-Drain Charge
= 15 V ID = 3 A
V
DD
R
= 4.7 Ω VGS = 5 V
G
(Resistive Load, Figure 1)
= 24V ID= 6A VGS=5V
V
DD
(see test circuit, Figure 2)
62
140
21
3.9
8.6
28 nC
ns ns
nC nC
SWITCHING OFF
(*)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
Turn-off Delay Time
t
f
Fall Time
V
DD
R
= 4.7Ω, V
G
GS
= 5 V
57 19
= 24 V ID = 3 A
(Resistive Load, Figure 1)
SOURCE DRAIN DIODE
(*)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
rr
Q
rr
I
RRM
(*)
Pulse wi dth [ 300 µs, duty cycle 1.5 %.
(
•)Pulse width limited by T
Source-drain Current
(•)
Source-drain Current (pulsed)
(*)
Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge Reverse Recovery Current
JMAX
I
= 6 A VGS = 0
SD
= 6 A di/dt = 100A/µs
I
SD
V
= 15 V Tj = 150°C
DD
(see test circuit, Figure 3)
6 4
1.2 V
37
46.3
2.5
ns ns
A A
ns
nC
A
Safe Operating Area Thermal Impedance
3/8
Page 4
STS6PF30L
Output Characteristics Transfer Characteristics
Transconductance Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage Capacitance Variations
4/8
Page 5
STS6PF30L
Normalized Gate Threshold Voltage vs Temperature Normalized on Resistance vs Temperature
Source-drain Diode Forward Characteristics Normalized Breakdown Voltage vs Temperature
. .
5/8
Page 6
STS6PF30L
Fig. 1: Switching Times Test Circuits For Resistive
Load
Fig. 3: Test Circuit For Diode Recovery Behaviour
Fig. 2: Gate Charge test Circuit
6/8
Page 7
SO-8 MECHANICAL DATA
STS6PF30L
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A1.750.068 a1 0.1 0.25 0.003 0.009 a2 1.65 0.064 a3 0.65 0.85 0.025 0.033
b 0.35 0.48 0.013 0.018 b1 0.19 0.25 0.007 0.010
C 0.25 0.5 0.010 0.019 c1 45 (typ.)
D 4.8 5.0 0.188 0.196
E 5.8 6.2 0.228 0.244
e1.27 0.050 e3 3.81 0.150
F 3.8 4.0 0.14 0.157
L 0.4 1.27 0.015 0.050
M0.60.023
S 8 (max.)
mm inch
0016023
7/8
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STS6PF30L
Information furnished is believed to be accurate an d rel i able. However, STMicroelectro ni cs assumes no responsibility for the consequen ces of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implic ation or otherwise under any patent or patent ri ghts of STM i croelectr onics. Sp ecifications mentioned in thi s publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics product s are not authorized for use as cri tical comp onents in lif e support devi ces or systems without express written approv al of STMicroel ectronics.
The ST log o i s registered trademark of STMicroelectronics
2003 STMi croelectronics - All Ri ghts Rese rved
All other names are the property of their respective ow ners.
Australi a - Brazil - Canada - China - Finland - France - Germ any - Hong Kong - India - Israel - Ital y - Japan - Malay sia - Malta - Morocco -
Singapor e - S pai n - Sweden - S witzerland - United Kingdom - United States.
STMicroelect ro n ics GRO UP OF COMPANI ES
http://www.st.com
8/8
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