This Power MOSFET is the second generation of
STMicroelectronics unique ” Single Feature
Size
”
strip-based process. The resulting
transistor shows extremely high packing density
forlowon-resistance,ruggedavalanche
characteristics and less critical alignment steps
thereforearemarkablemanufacturing
reproducibility.
APPLICATIONS
■ DC MOTOR DRIVE
■ DC-DCCONVERTERS
■ BATTERYMANAGMENTIN NOMADIC
EQUIPMENT
■ POWERMANAGEMENT IN
PORTABLE/DESKTOPPC
s
SO-8
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symb o lParameterValueUnit
V
V
V
I
DM
P
(•) Pulse width limited by safeoperating area
May 1999
Drain-source Voltage (VGS=0)30V
DS
Drain- gat e Voltage (RGS=20kΩ)30V
DGR
Gate-s ource Voltage± 20V
GS
Drain Current (co nt inu ous ) at Tc = 25oC
I
D
Drain Current (co nt inu ous ) at T
(•)Drain Current (pulsed)48A
Tot al Dissipat ion at Tc=25oC2.5W
tot
=100oC
c
12
7.5
A
A
1/8
Page 2
STS12NF30L
THERMAL DATA
R
thj-amb
T
Tj
(*)T hermal R es istance Junction-am bie nt
Maximum O perating Juncti on Temperat ur e
stg
St orage Tempe ra tur e
50
150
-55 to 150
o
C/W
o
o
C
C
(*)
Mountedon FR-4board (t
ELECTRICAL CHARACTERISTICS (T
≤ 10
sec)
=25oC unless otherwisespecified)
case
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
ID=250µAVGS=030V
Break dow n Volt age
I
DSS
I
GSS
Zero Gate Voltage
Drain Current (V
GS
Gat e- bod y Leakage
Current (V
DS
=0)
=0)
V
=MaxRating
DS
=MaxRatingTc=125oC
V
DS
V
=± 20 V
GS
1
10
100nA
±
ON (∗)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage VDS=VGSID= 250µA11.62.5V
Sta t ic Drain-sour c e On
Resistance
VGS=10V ID=6A
=4.5V ID=6A
V
GS
On State Drain Current VDS>I
D(on)xRDS(on )max
0.0085
0.01
12A
0.01
0.012ΩΩ
VGS=10V
DYNAMIC
µA
µA
SymbolParameterTest ConditionsMin.Typ.Max.Unit
g
(∗)Forward
fs
VDS>I
D(on)xRDS(on )maxID
=6A20S
Tr ansc on duc tance
C
C
C
Input Capacit ance
iss
Out put Capacitance
oss
Reverse Transfer
rss
VDS=25V f=1MHz VGS= 0 V2400
590
200
Capacit a nc e
2/8
pF
pF
pF
Page 3
STS12NF30L
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHING ON
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
Tur n-on Delay Time
Rise Time
t
r
VDD=15VID=6A
R
=4.7
G
Ω
VGS=4.5V
35
90
(Resis t iv e Load, see f ig. 3 )
Q
Q
Q
Tot al Gate Char ge
g
Gat e- Source Charge
gs
Gate-Drain Charge
gd
VDD=24V ID=12A VGS=4.5V35
9
18
50nC
SWITCHING OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(off)
Tur n-of f Delay Time
t
Fall T ime
f
VDD=15VID=6A
=4.7 ΩVGS=4.5V
R
G
90
45
(Resis t iv e Load, see f ig. 3 )
t
r(Voff)
t
t
Off-volt age Rise Time
Fall T ime
f
Cross-over Time
c
V
=24VID=12A
clamp
=4.7 ΩVGS=4.5V
R
G
(Indu ct iv e Load, see fig . 5)
35
35
80
SOURCEDRAINDIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
I
V
I
SDM
SD
Q
I
RRM
SD
t
Source-drain Current
(•)
Source-drain Current
12
48
(pulsed)
(∗)ForwardOnVoltage ISD=12A VGS=01.2V
Reverse Recovery
rr
Time
Reverse Recovery
rr
ISD= 12 Adi/dt = 100 A /µs
=15VTj=150oC
V
DD
(see test circuit, fig. 5)
45
70
Charge
Reverse Recovery
3
Current
ns
ns
nC
nC
ns
ns
ns
ns
ns
A
A
ns
nC
A
(∗) Pulsed:Pulse duration = 300 µs, duty cycle 1.5%
(•) Pulse width limited by safe operating area
SafeOperating AreaThermalImpedance
3/8
Page 4
STS12NF30L
OutputCharacteristics
Transconductance
TransferCharacteristics
Static Drain-sourceOn Resistance
Gate Charge vs Gate-sourceVoltage
4/8
CapacitanceVariations
Page 5
STS12NF30L
NormalizedGate ThresholdVoltage vs
Temperature
Source-drainDiode Forward Characteristics
NormalizedOn Resistancevs Temperature
5/8
Page 6
STS12NF30L
Fig. 1:
UnclampedInductiveLoad TestCircuit
Fig. 3: SwitchingTimes Test Circuits For
ResistiveLoad
Information furnishedis believed tobeaccurateand reliable.However, STMicroelectronics assumesno responsibilityfor the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licenseis
granted by implication or otherwise under anypatent or patent rights of STMicroelectronics. Specificationmentioned in this publication are
subjecttochange withoutnotice.Thispublication supersedes and replaces all informationpreviously supplied. STMicroelectronicsproducts
are not authorized for use as critical components in lifesupportdevices or systemswithout express written approval of STMicroelectronics.
The STlogo is a trademark of STMicroelectronics
1999 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
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8/8
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