Datasheet STS10NF30L Datasheet (SGS Thomson Microelectronics)

Page 1
N - CHANNEL 30V - 0.011Ω - 10A SO-8
TYPE V
ST S10NF30L 30 V < 0.0135 10 A
TYPICALR
STANDARD OUTLINE FOR EASY
DS(on)
DSS
AUTOMATEDSURFACEMOUNTASSEMBLY
LOW THRESHOLDDRIVE
DESCRIPTION
This Power MOSFET is the secondgeneration of STMicroelectronics unique ” Single Feature Size
strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.
R
DS(on)
I
D
STS10NF30L
STripFET POWER MOSFET
PRELIMINARY DATA
SO-8
APPLICATIONS
DC MOTOR DRIVE
DC-DCCONVERTERS
BATTERYMANAGMENTIN NOMADIC
INTERNAL SCHEMATIC DIAGRAM
EQUIPMENT
POWERMANAGEMENTIN
PORTABLE/DESKTOPPC
s
ABSOLUTE MAXIMUM RATINGS
Symb o l Parameter Value Unit
V
V
V
I
DM
P
() Pulse width limited by safeoperating area
Drain-source Voltage (VGS=0) 30 V
DS
Drain- g at e Voltage (RGS=20kΩ)30V
DGR
Gate-s ource Voltage ± 20 V
GS
Drain Cur rent (co nt inuous) at T c = 25oC
I
D
Drain Cur rent (co nt inuous) at T
() Drain Curr ent (pulsed) 40 A
Tot al Dissi pat ion at Tc = 25oC 2.5 W
tot
=100oC
c
10
6.5
A A
June 2000
1/6
Page 2
STS10NF30L
THERMAL DATA
R
thj-amb
Tj
T
(*)
Mountedon FR-4board (t
(*)T hermal Resist ance Junction-ambient
Maximum Operating J unct ion Tem p er at ure
stg
St orage Tem pe ra tur e
≤ 10
sec)
50
150
-55 to 150
o
C/W
o o
C C
ELECTRICAL CHARACTERISTICS (T
=25oC unless otherwisespecified)
case
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
ID=250µAVGS=0 30 V
Break dow n Vo lt age
I
I
ON (
DSS
GSS
Zero Gate Voltage Drain Curre nt (V
Gat e- bod y Leakag e Current (V
)
DS
=0)
GS
=0)
V
=MaxRating
DS
=MaxRating Tc=125oC
V
DS
V
= ± 20 V ± 100 nA
GS
1
10
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage VDS=VGSID= 250 µA11.62.5V Sta t ic Drain-s our c e On
Resistance
On State Drain Current VDS>I
VGS=10V ID=5A V
=4.5V ID=5A
GS
D(on)xRDS(on )max
0.011
0.016
0.0135
0.0220
10 A
VGS=10V
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
(∗)Forward
fs
Tr ansc on duc tance
C
C
C
Input Capaci t ance
iss
Out put Capac itance
oss
Reverse Transfer
rss
Capacit a nc e
VDS>I
D(on)xRDS(on )maxID
=5A 20 S
VDS=25V f=1MHz VGS= 0 V 1450
390 150
µA µ
Ω Ω
pF pF pF
A
2/6
Page 3
STS10NF30L
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHINGON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
Tur n-on Delay T ime Rise Time
t
r
VDD=15V ID=5A R
=4.7
G
VGS=4.5V
25
280
(Resis t iv e Load, see fig. 3)
Q Q Q
Tot al Gate Charge
g
Gat e- Source Charge
gs
Gate-Drain Charge
gd
VDD=24V ID=10A VGS=10V 25
11 12
35 nC
SWITCHINGOFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
Tur n-of f Dela y Tim e
t
Fall T ime
f
VDD=15V ID=5A
=4.7 VGS=4.5V
R
G
40 60
(Resis t iv e Load, see fig. 3)
SOURCEDRAINDIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % (•) Pulse width limited by safe operatingarea
Source-drain Current
(•)
Source-drain Current
10 40
(pulsed)
(∗)ForwardOnVoltage ISD=10A VGS=0 1.2 V
Reverse Recovery
rr
Time Reverse Recovery
rr
ISD= 10 A di/dt = 100 A/µs
=15V Tj=150oC
V
DD
(see test circuit, fig. 5)
45
52 Charge Reverse Recovery
2.3
Current
ns ns
nC nC
ns ns
A A
ns
nC
A
3/6
Page 4
STS10NF30L
Fig. 1:
UnclampedInductiveLoad TestCircuit
Fig. 3: SwitchingTimes Test Circuits For ResistiveLoad
Fig. 2:
UnclampedInductiveWaveform
Fig. 4: Gate Chargetest Circuit
Fig. 5:
Test CircuitFor InductiveLoad Switching
And Diode Recovery Times
4/6
Page 5
SO-8 MECHANICALDATA
STS10NF30L
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 1.75 0.068 a1 0.1 0.25 0.003 0.009 a2 1.65 0.064 a3 0.65 0.85 0.025 0.033
b 0.35 0.48 0.013 0.018 b1 0.19 0.25 0.007 0.010
C 0.25 0.5 0.010 0.019 c1 45 (typ.)
D 4.8 5.0 0.188 0.196
E 5.8 6.2 0.228 0.244
e 1.27 0.050 e3 3.81 0.150
F 3.8 4.0 0.14 0.157
L 0.4 1.27 0.015 0.050
M 0.6 0.023
S 8 (max.)
mm inch
0016023
5/6
Page 6
STS10NF30L
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implicationor otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in thispublication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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