Datasheet STQ-3016 Datasheet (Stanford Microdevices)

Page 1
Product Description
The STQ-3016 uses silicon germanium device technology and delivers a typical output power of -13dBm with 50dB IM3 suppression. A shutdown feature is included that, when enabled, attenuates the output by 60dB.
Functional Block Diagram
BBQP
VCC
VEE
LOP
LON
VEE
BBIP
1
2
3
4
5
6
7
8
LO
QUADRATURE
GENERATOR
16
BBQN
15
VCC
14
VEE
13
RFP
12
RFN
11
VEE
10
VCCSD
9
BBIN
Advanced Data Sheet
STQ-3016
2500 - 4000 MHz Direct Quadrature Modulator
16 pin TSSOP with Exposed Pad
Package Body: 0.20 x 0.17 x 0.04 (inches)
5.0 x 4.4 x 1.0 (mm)
Product Features
2500-4000 MHz operating frequency
No external IF filter
Very low noise floor performance
Excellent carrier and sideband suppression
Low LO drive requirements
Shut-down feature
Single 5 volt supply
Supports wideband baseband input
Applications
Digital communication system
Spread spectrum communication systems
GMSK, QPSK, QAM, SSB moduators
Fixed wireless communication systems
Key Specifications
Parameters Test Conditions (Vs=5.0V, I=82mA, T=25ºC) Unit Min. Typ. Max.
Frequency Range MHz 2500 4000 Output P1dB f Carrier Feedthrough f Sideband Suppression f
Broadband Noise Floor LO Drive Level dBm-9-6-3
See page 2 for general test conditions
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions. Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the c ircuits described herein are implied or granted to any third party. S tanford Mi crodevices does no t authorize or warrant any Stanford M icrodevices product for use in life-support devices and/or systems. Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.
522 Almanor Ave., Sunnyvale, CA 94086 Phone: (800) SMI-MMIC http://www.stanfordmicro.com
= 3500 MHz dBm +1
LO
= 3500 MHz, unoptimized dBm -40
LO
= 3500 MHz dB 33
LO
= 3500 MHz, baseband inputs tied to 1.9VDC,
f
LO
-20 MHz offset from carrier
1 05/07/01 rev 2.0
dBm/Hz -153
Page 2
Advanced Data Sheet
Absolute Maximum Ratings
Parameters Value Unit
Supply Voltage 6.0 V LO, RF Input +10 dBm Min Input Voltage (BBIP, BBIN, BBQP, BBQN) 0 V Max Input Voltage (BBIP, BBIN, BBQP, BBQN) 3 V Operating Temperature -40 to +85 ºC Storage Temperature -65 to +150 ºC
Product Specifications – RF Output
Parameters Additional Test Conditions Unit Min. Typ. Max.
Frequency Range MHz 2500 4000 Output Power dBm -13 RF Port Return Loss 3.2 to 3.8 GHz, matched to 50 ohm ref. on evaluation board dB 14 Output P1dB dBm +1 Carrier Feedthrough unoptimized dBm -40 Sideband Suppression dB 33 IM3 Suppression two-tone baseband input @ 600mVp-p differential per tone dB 50 Broadband Noise Floor baseband inputs tied to 1.9V Quadrature Phase Error deg -3 +3 I/Q Amplitude Balance dB -0.2 +0.2
Product Specifications - Modulation Input
Parameters Additional Test Conditions Unit Min. Typ. Max.
Baseband Frequency Input -3dB bandwidth, baseband inputs terminated in 50 ohms MHz DC 1000 Baseband Input Resistance per pin kohms 4.4 Baseband Input Capacitance per pin pF 0.5
Product Specifications - LO Input
Parameters Additional Test Conditions Unit Min. Typ. Max.
Usable LO Fr equency MHz 2500 4000 LO Drive Level dBm-9-6-3 LO Port Return Loss 3.2 to 3.8 GHz, matched to 50 ohm ref. on evaluation board dB 14
674'LUHFW4XDGUDWXUH0RGXODWRU
T est Conditi ons
V
DC
DC DC
, -20 MHz offset from carrier dBm/Hz -153
DC
S
TA +25ºC
Baseband Inputs
LO Input -5dBm @ 3500 MHz
+5V
1.9V DC bias, 200kHz fre­quency, 300mVp-p per pin = 600mVp-p differential drive, I and Q signals in quadrature
Product Specifications – Miscellaneous
Parameters Additional Test Conditions Unit Min. Typ. Max.
Shut-Down Attenuation dB 60 Shut-Down Pin Resistance @ 1MHz kohm 6.1 Shut-Down Pin Capacitance @ 1MHz pF 0.7 Shut-Down Input Thresholds CMOS Shut-Down Settling Time ns <500 Supply Voltage V +4.75 +5 +5.25 Supply Current mA 82 Device Thermal Resistance junction-case ºC/W TBD
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions. Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the users own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices product for use in life-support devices and/or systems. Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.
522 Almanor Ave., Sunnyvale, CA 94086 Phone: (800) SMI-MMIC http://www.stanfordmicro.com
2 05/07/0 1 rev 2.0
Page 3
674'LUHFW4XDGUDWXUH0RGXODWRU
Typical Device Performance
Advanced Data Sheet
Fig. 1: SSB Powe r vs. LO Freque ncy
-8
-10
-12
-14
SSB Power (dBm)
-16
-18 2500 2750 3000 3250 3500 3750 4000
LO Frequency (MHz)
Fig. 3: Carrier Feedthrough vs. LO Frequency
-40
-42
-44
-46
-48
Carrier Feedthrough (dBm)
-50 2500 2750 3000 3250 3500 3750 4000
LO Frequency (MHz)
Fig. 2: Output P1dB vs. LO Frequ e ncy
5
3
1
-1
Output P1dB (dBm)
-3
-5 2500 2750 3000 3250 3500 3750 4000
LO Frequency (MHz)
Fig. 4: Sideband Suppression vs. LO Frequency
40
38
36
34
32
Sideband Suppression (dB)
30
2500 2750 3000 3250 3500 3750 4000
LO Freque ncy (MHz)
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions. Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the users own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices product for use in life-support devices and/or systems. Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.
522 Almanor Ave., Sunnyvale, CA 94086 Phone: (800) SMI-MMIC http://www.stanfordmicro.com
3 05/07/0 1 rev 2.0
Page 4
674'LUHFW4XDGUDWXUH0RGXODWRU
Small Signal S-Parameters
Advanced Data Sheet
RF Port
Frequency
(MHz)
2500 0.364 124.9 0.320 55.75 2600 0.367 123.1 0.330 54.86 2700 0.370 121.3 0.339 53.98 2800 0.373 119.6 0.349 53.12 2900 0.376 117.8 0.358 52.29 3000 0.379 116.1 0.366 51.48 3100 0.383 114.4 0.375 50.69 3200 0.386 112.8 0.384 49.92 3300 0.390 111.1 0.392 49.17 3400 0.393 109.5 0.400 48.44 3500 0.397 107.9 0.408 47.73 3600 0.401 106.4 0.416 47.04 3700 0.405 104.8 0.424 46.36 3800 0.409 103.3 0.432 45.7 3900 0.414 101.8 0.440 45.06 4000 0.418 100.3 0.447 44.43
Single-Ended Differential
Mag. Ang. Mag. Ang.
LO Port
Frequency
(MHz)
2500 0.303 68.71 0.695 -109.9 2600 0.315 67.80 0.681 -114.4 2700 0.327 66.89 0.667 -118.9 2800 0.339 65.97 0.654 -123.4 2900 0.351 65.05 0.641 -127.9 3000 0.363 64.12 0.629 -132.5 3100 0.375 63.19 0.618 -137.0 3200 0.387 62.26 0.607 -141.6 3300 0.399 61.32 0.597 -146.2 3400 0.411 60.37 0.588 -150.8 3500 0.423 59.43 0.580 -155.3 3600 0.434 58.48 0.573 -159.9 3700 0.446 57.53 0.566 -164.5 3800 0.458 56.57 0.561 -169.0 3900 0.469 55.61 0.556 -173.5 4000 0.480 54.65 0.552 -178.0
Single-Ended Differential
Mag. Ang. Mag. Ang.
Notes:
1. VCC = +5.0V, T = +25ºC.
2. For single-ended S-parameters, the corresponding differential pin is left floating.
3. Data is referenced to the foot of the package lead and does not include the applications circuit.
4. All data simulated.
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions. Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the users own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices product for use in life-support devices and/or systems. Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.
522 Almanor Ave., Sunnyvale, CA 94086 Phone: (800) SMI-MMIC http://www.stanfordmicro.com
4 05/07/0 1 rev 2.0
Page 5
Advanced Data Sheet
674'LUHFW4XDGUDWXUH0RGXODWRU
Pin Out Description
Pin # Function Description Additional Comments
1 BBQP Q-channel baseband input, positive terminal Nominal DC bias voltage is 1.9V (biased internally) 2 VCC Positive supply (+5V) 3 VEE Ground 4 LOP Local oscillator input, positive terminal Nominal DC voltage is 2.0V. Input should be AC-coupled. 5 LON Local oscillator input, negative terminal Nominal DC voltage is 2.0V. Input should be AC-coupled. 6 VEE Ground
7 SD Shut-down control 8 BBIP I-channel baseband input, positive terminal Nominal DC bias voltage is 1.9V (biased internally)
9 BBIN I-channel baseband input, negative terminal Nominal DC bias voltage is 1.9V (biased internally) 10 VCC Positive supply (+5V) 11 VEE Ground 12 RFN RF output, negative terminal Nominal DC voltage is 2.4V. Output should be AC-coupled. 13 RFP RF output, positive terminal Nominal DC voltage is 2.4V. Output should be AC-coupled. 14 VEE Ground 15 VCC Positive supply (+5V) 16 BBQN Q-channel baseband input, negative terminal Nominal DC bias voltage is 1.9V (biased internally)
CMOS logic levels. Logic high = normal operation; logic low = shut-down enabled.
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions. Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the users own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices product for use in life-support devices and/or systems. Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.
522 Almanor Ave., Sunnyvale, CA 94086 Phone: (800) SMI-MMIC http://www.stanfordmicro.com
5 05/07/0 1 rev 2.0
Page 6
Caution: ESD Sensitive
Appropriate precaution in handling, packaging and testing devices must be observed.
Package Dimensions
Advanced Data Sheet
674'LUHFW4XDGUDWXUH0RGXODWRU
Part Number Ordering Information
Part Number Reel Size Devices/Reel
STQ-3016 TBD TBD
Part Symbolization
The part will be symbolized with a “TBD” marking designator on the top surface of the package.
NOTE
1. PACKAGE BODY SIZES EXCLUDE MOLD FLASH PROTRUSIONS OR GATE BURRS
2. TOLERANCE ±0.1 mm UNLESS OTHERWISE SPECIFIED
3. COPLANARITY : 0.1 mm
4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED INCH DIMENSIONS ARE NOT NECESSARILY EXACT.
5. FOLLOWED FROM JEDEC MO-153
12°(4X)
SYMBOLS
θ
DIMENSIONS IN MILLIMETERS
MIN
A −−−
0.00A1
A2
0.80
0.19
b C
0.09
D
4.90
D1 2.80 0.110
−−− −−− −−− −−−
E
−−−
4.30
E1 E2 2.80 0.110
−−− −−− −−− −−−
e
−−−
L y
−−−
θ 0°
NOM
−−− 0.10
1.00
−−−
−−−
5.00
6.40
4.40
0.65
−−−
MAX
1.15−−−
1.05
0.30
0.20
5.10
−−−
4.50
−−−
0.10−−−
8°
DIMENSIONS IN IN CHES
MIN
−−−
0.000
0.031
0.007
0.004
0.193
−−−
0.169
−−−
0.018
−−−
0°
NOM
MAX
−−− 0.045
0.004−−−
0.039
0.041
0.012
−−−
−−−
0.008
0.197
0.201
0.252
0.173
0.177
0.026
0.0300.0240.60 0.750.45
−−−
0.004
−−− 8°
−−−
−−−
Test PCB Pad Layout
1.25
0.30
0.35
0.62
3.0
- Indicates metalization - vias connect pad to underlying ground plane
3.0
0.62
φ0.25 via
6.9
all units are in mm
0.7
0.9
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions. Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the users own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices product for use in life-support devices and/or systems. Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.
522 Almanor Ave., Sunnyvale, CA 94086 Phone: (800) SMI-MMIC http://www.stanfordmicro.com
6 05/07/0 1 rev 2.0
Page 7
Demo Test Board Schematic
Advanced Data Sheet
674'LUHFW4XDGUDWXUH0RGXODWRU
VCC
BBI+
P12
R9
1
BBQP
2
VCC
3
VEE
4
LOP
5
LON
6
VEE
7
SD
8
BBIP
R1
P10
P14
STQ-3016
BBQN
VCC VEE
RFP
RFN
VEE
VCC
BBIN
P13
P11
BBQ-
R10
Lumped
C18
Element Balun
L3
C21
C20
R3
RF
P8
L6
R4
L2
C4
C5
VCC
C17
16 15 14 13 12 11 10
9
VCC
R7
BBI-
LO
BBQ+
C19
C10
C16
C9
VCC
SH1
VCC
H1
1 2
Lumped
Element Balun
L5
C22
L4
C23
R8
+5V
L1
C3
R5
L7
P9
R6
H2
1 2
Bill of Materials (for evaluation at 3.5GHz)
Component
Designator
P14 1 SMDI STQ-3016 STQ-3016 SiGe Direct Quadrature Modulator
P8, P9, P10,
P11, P12 , P13
H1, H2 2 AMP 640453-2 2-pin header, right angle
L1 1uH 1 Panasonic ELJ-FA1R0KF2 Inductor, 1210 footprint, ±10% tolerance
R1, R7, R9, R10 200 ohm 4 Venkel CR1206-8W-2000FT Resistor, 1206 footprint, ± 1% tolerance
R8 10 kohm 1 Venkel CR0603-16W-1002FT Resistor, 0603 footprint, ±1% tolerance
C9, C17 1nF 2 Venkel C0603COG500-102JNE Capacitor, 0603 footprint, COG dielectric, ±5% tolerance
C3 2.2uF 1 Venkel C1206Y5V160-225ZNE Capacitor, 1206 footprint, Y5V dielectric, 16V rating
C4, C5, C10,
C16, C18, C19
SH1 1 3M 929950-00 Shunt for 2-pin header
L2, L3, L4, L5,
L6, L7
C20, C21, C22,
C23
R3, R4, R5, R6 0 ohm 4 Venkel CR0603-16W-000T Resistor, 0603 footprint
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions. Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the users own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices product for use in life-support devices and/or systems. Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.
522 Almanor Ave., Sunnyvale, CA 94086 Phone: (800) SMI-MMIC http://www.stanfordmicro.com
Value Qty Vendor Part Number Description
Johnson
6
Components
142-0701-851 SMA connector, end launch with tab, for .062 thick board
1.0pF 6 Venkel C0603COG500-100JNE Capacitor, 0603 footprint, COG dielectric, ±5% tolerance
2.2nH 6 TOKO LL1608FS -F2N2S Inductor, 0603 footprint, ±0.3nH tolerance
0.5pF 4 Venkel C0603COG500-0R5CNE
Capacitor, 0603 footprint, COG dielectric, ±0.25pF toler­ance
7 05/07/0 1 rev 2.0
Page 8
Demo Te st Board
(Fully Assembled PCB)
P12
1 2
H1
Advanced Data Sheet
674'LUHFW4XDGUDWXUH0RGXODWRU
2"
P13
SH1
C3
L1
C22
L7
R5
R6
H2
1
2
P10
L5
C23
C19
C10
C16
R8
R9
C9
R1
P14
R10
R7
C17
C18
L3
C20
C4
C5
C21
R3
R4
L6
L2L4
P11
P8
8 05/07/0 1 rev 2.0
2"
P9
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or ommisions. Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the users own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices product for use in life-support devices and/or systems. Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.
522 Almanor Ave., Sunnyvale, CA 94086 Phone: (800) SMI-MMIC http://www.stanfordmicro.com
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