Datasheet STQ1NC45 Datasheet (STMicroelectronics)

Page 1
STD2NC45-1
STQ1NC45
N-CHANNEL 450V - 4.1- 1 .5 A IPAK / TO-92
SuperMESH™Power MOSFET
TYPE V
STD2NC45-1 STQ1NC45
TYPICAL R
100% AVALANCHE TESTED
GATE CHARGE MINIMIZED
NEW HIGH VOLTAGE BENCHMARK
450 V 450 V
(on) = 4.1
DS
DSS
R
DS(on)
< 4.5 < 4.5
I
D
1.5 A
0.5 A
Pw
30 W
3.1 W
DESCRIPTION
The SuperMESH™ series is obtained through an extreme optimization of ST’s we ll established strip­based PowerMESH™ layout. In addition to pushing on-resistance significantly down, special careis tak­en to ensure a very good dv/dt capability for the most demanding applications. Such series comple­ments ST full range of high voltage MOSFETs in­cluding revolutionary MDm es h™ products.
APPLICATIONS
SWITCH MODE LOW POWER SUPPLIES
(SMPS)
LOW POWER, LOW COST CFL (COMPACT
FLUORESCENT LAMPS)
LOW POWER BATTERY CHARGERS
3
2
1
IPAK
TO-92
TO-92 (Ammopack)
INTERNAL SCHEMATIC DIAGRAM
ORDERING INFORMATION
SALES TYPE MARKING PACKAGE PACKAGING
STD2NC45-1 D2NC45 IPAK TUBE
STQ1NC45 Q1NC45 TO-92 BULK
STQ1NC45-AP Q1NC45 TO-92 AMMOPAK
1/11June 2003
Page 2
STD2NC45-1, STQ1NC45
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STD2NC45-1 STQ1NC45
V
DS
V
DGR
V
GS
I
D
I
D
IDM()
P
TOT
dv/dt (1) Peak Diode Recovery voltage slope 3 V/ns
T
j
T
stg
() Pulse width limited by safe operating area (1) I
0.5A, di/dt 100A/µs, VDD≤ V
SD
THERMAL DATA
Rthj-case Thermal Resistance Junction-case Max 4.1 °C/W Rthj-amb Thermal Resistance Junction-ambient Max 100 120 °C/W Rthj-lead Thermal Resistance Junction-lead Max 40 °C/W
T
l
Drain-source Voltage (VGS=0) Drain-gate Voltage (RGS=20kΩ)
450 V
450 V Gate- source Voltage ± 30 V Drain Current (continuos) at TC= 25°C Drain Current (continuos) at TC= 100°C
1.5 0.5 A
0.95 0.315 A Drain Current (pulsed) 6 2 A Total Dissipation at TC= 25°C
30 3.1 W
Derating Factor 0.24 0.025 W/°C
Operating Junction Temperature Storage Temperature
(BR)DSS,Tj≤TJMAX.
-65 to 150
-65 to 150
IPAK TO-92
Maximum Lead Temperature For Soldering
275 260 °C
Purpose
°C °C
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
IPAK TO-92
1.5 A
25 mJ
2/11
I
AR
E
AS
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy (starting T
= 25 °C, ID=IAR,VDD=50V)
j
Page 3
STD2NC45-1, STQ1NC45
ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OT HERWISE SPECIFIED)
ON/OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source Breakdown Voltage
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Zero Gate Voltage Drain Current (V
GS
=0)
Gate-body Leakage Current (V
DS
=0) Gate Threshold Voltage Static Drain-source On
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS>I
g
fs
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
ID= 250 µA, VGS= 0 450 V
V
= Max Rating
DS
VDS= Max Rating, TC= 125 °C V
= ± 30V ±100 nA
GS
V
DS=VGS,ID
= 250µA
2.3 3 3.7 V
1
50
VGS=10V,ID= 0.5 A 4.1 4.5
D(on)xRDS(on)max,
1.1 S
ID= 0.5 A
=25V,f=1MHz,VGS=0
V
DS
160
27.5
4.7
µA µA
pF pF pF
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
Turn-on Delay Time
t
r
Rise Time
VDD=225V,ID= 0.5 A R
= 4.7VGS=10V
G
6.7 4
(Resistive Load see, Figure 3)
Q
g
Q
gs
Q
gd
Total Gate Charge Gate-Source Charge Gate-Drain Charge
=360V,ID= 1.5 A,
V
DD
VGS=10V,RG= 4.7
7
1.3
3.2
10
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
= 360V, ID= 1.5 A,
t
r(Voff)
t
t
Off-voltage Rise Time
f
c
Fall Time Cross-over Time
V
DD
R
=4.7Ω, VGS= 10V
G
(Inductive Load see, Figure 5)
8.5
12 18
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
Source-drain Current
(2)
Source-drain Current (pulsed)
(1)
Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge Reverse Recovery Current
ISD= 1.5 A, VGS=0 I
SD
VDD=100V,Tj=150°C (see test circuit, Figure 5)
= 1.5 A, di/dt = 100A/µs
225 530
4.7
1.5
6.0
1.6 V
ns ns
nC nC nC
ns ns ns
A A
ns
µC
A
3/11
Page 4
STD2NC45-1, STQ1NC45
Safe Operating Area For IPAK
Thermal Imped ance For IPAK
Thermal Impedance For TO-92Safe Operating Area For TO-92
Output Characteristics
4/11
Transfer Characteristics
Page 5
STD2NC45-1, STQ1NC45
Transconductance Static Drain-source On Resistance
Gate Charge vs Gate-so urce V oltage
Normalized Gate Threshold Voltage v s Temp. Normalized On Resi stance vs Temper ature
Capacitance Variations
5/11
Page 6
STD2NC45-1, STQ1NC45
Source-drain Diode Forward Characteristics
Max Id Current vs Tc
Normalized BVDSS vs Temperature
Maximum Avalanche Energy vs Temperature
6/11
Page 7
STD2NC45-1, STQ1NC45
Fig. 2: Unclamped Inductive WaveformFig. 1: Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Induct ive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge tes t Circuit
7/11
Page 8
STD2NC45-1, STQ1NC45
TO-251 (IPAK) MECHANI CAL DAT A
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
mm inch
A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051
B 0.64 0.9 0.025 0.031 B2 5.2 5.4 0.204 0.212 B3 0.85 0.033 B5 0.3 0.012 B6 0.95 0.037
C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023
D 6 6.2 0.236 0.244
E 6.4 6.6 0.252 0.260
G 4.4 4.6 0.173 0.181
H 15.9 16.3 0.626 0.641
L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039
H
8/11
A
C2
L2
E
B2
= =
= =
D
B3
2
1 3
L1
A1
L
B6
C
A3
B
B5
G
= =
0068771-E
Page 9
TO-92 MECHANICAL DATA
STD2NC45-1, STQ1NC45
DIM.
A 4.32 4.95 0.170 0.194 b 0.36 0.51 0.014 0.020 D 4.45 4.95 0.175 0.194 E 3.30 3.94 0.130 0.155 e 2.41 2.67 0.094 0.105
e1 1.14 1.40 0.044 0.055
L 12.70 15.49 0.50 0.610
R 2.16 2.41 0.085 0.094 S1 0.92 1.52 0.036 0.060 W 0.41 0.56 0.016 0.022
V5° 5°
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
9/11
Page 10
STD2NC45-1, STQ1NC45
10/11
Page 11
STD2NC45-1, STQ1NC45
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11/11
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