Datasheet STPS8L30 Datasheet (ST)

Main product characteristics

STPS8L30

Low drop power Schottky rectifier

I

F(AV)

V

RRM

T

j

(max) 0.40 V

V

F

Features and benefits

■ Low cost device with low drop forward voltage

for less power dissipation and reduced

8 A

30 V

150° C

K

A

NC

DPAK

STPS8L30B

K

K

NC

IPAK

STPS8L30H

heatsink

■ Optimized conduction/reverse losses trade-off

which leads to the highest yield in the
application

■ High power surface mount miniature package

■ Avalanche capability specified

Description

Single Schottky rectifier suited to Switched Mode
Power Supplies and high frequency DC to DC

Order codes

Part Numbers Marking

STPS8L30B LS30

STPS8L30B-TR LS30

STPS8L30H STPS8L30H

converters.

Packaged in DPAK and IPAK, this device is
especially intended for use as a Rectifier at the
secondary of 3.3 V SMPS or DC/DC units.
wheeling and polarity protection applications.

Table 1. Absolute Ratings (limiting values)

Symbol Parameter Value Unit

A

V

RRM

I

F(RMS)

I

F(AV)

I

FSM

I

RRM

I

RSM

P

ARM

T

stg

T

Repetitive peak reverse voltage 30 V

RMS forward voltage 7 A

Average forward current Tc = 135° C δ = 0.5 8 A

Surge non repetitive forward current tp = 10 ms sinusoidal 75 A

Peak repetitive reverse current tp = 2 µs F = 1 kHz square 1 A

Non repetitive peak reverse current tp = 100 µs square 2 A

Repetitive peak avalanche power tp = 1 µs Tj = 25° C 3000 W

Storage temperature range -65 to + 150 °C

Maximum operating junction temperature

j

(1)

150 °C

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

dPtot

1. thermal runaway condition for a diode on its own heatsink

--------------­dTj

1

----------------- --------->
Rth j a–()

March 2006 Rev 4 1/7

www.st.com

7

Characteristics STPS8L30

1 Characteristics

Table 2. Thermal Parameters

Symbol Parameter Value Unit

R

th(j-c)

Table 3. Static Electrical Characteristics

Junction to case 2.5 °C/W

Symbol Parameter Tests conditions Min. Typ Max. Unit

I

R

VF

= 25° C

(1)

Reverse leakage current

j

= 100° C 15 40

T

j

= V

V

R

RRM

Tj = 25° C

= 8 A

I

F

= 16 A

I

F

(1)

Forward voltage drop

T

= 125° C 0.35 0.40

j

T

= 25° C

j

T

= 125° C 0.448 0.57

j

1

0.49

0.63

T

1. Pulse test:* tp = 380 µs, δ < 2%

To evaluate the conduction losses use the following equation: P = 0.23 x I

Figure 1. Average forward power

dissipation versus average

Figure 2. Average forward current versus

ambient temperature (δ = 0.5)

+ 0.021 I

F(AV)

forward current

mA

V

F2(RMS)

P (W)

F(AV)

5.0

4.0

3.0

2.0

1.0

0.0

δ = 0.05

0246810

δ = 0.1

δ = 0.2

I (A)

F(AV)

δ = 0.5

δ

=tp/T

δ = 1

T

tp

I (A)

F(AV)

9

8

7

6

5

4

3

2

1

0

0 25 50 75 100 125 150

R=R

th(j-a) th(j-c)

R =70°C/W

th(j-a)

T (°C)

amb

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STPS8L30 Characteristics

Figure 3. Normalized avalanche power

derating versus pulse duration

P(t)

ARM p

P (1µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Figure 5. Non repetitive surge peak

forward current versus overload
duration (maximum values)

I (A)

M

120

100

80

60

40

IM

20

0

t

δ=0.5

1E-3 1E-2 1E-1 1E+0

t(s)

T =25°C

T =75°C

T =125°C

c

Figure 4. Normalized avalanche power

derating versus junction
temperature

P(t)

ARM p

P (25°C)

ARM

1.2

1

0.8

0.6

0.4

0.2

0

25 50 75 100 125 150

T (°C)

j

Figure 6. Relative variation of thermal

impedance junction to ambient
versus pulse duration

Z/R

th(j-c) th(j-c)

1.0

0.8

c

c

0.6

δ = 0.5

0.4

δ = 0.2

δ = 0.1

0.2

t (s)

Single pulse

0.0
1E-4 1E-3 1E-2 1E-1 1E+0

p

δ

T

=tp/T

tp

Figure 7. Reverse leakage current versus

reverse voltage applied (typical
values)

I (mA)

R

3E+2

1E+2

1E+1

1E+0

1E-1

1E-2

1E-3

0 5 10 15 20 25 30

T=150°C

j

T=125°C

j

T=25°C

j

V (V)

R

Figure 8. Junction capacitance versus

reverse voltage applied (typical
values)

C(pF)

2000

1000

500

200

V (V)

100

11040

R

3/7

F=1MHz

V =30mV

OSC RMS

T=25°C

j

Packaging information STPS8L30

Figure 9. Forward voltage drop versus

forward current

I (A)

FM

100.0

T=150°C

j

(typical values)

10.0

T=125°C

j

(maximum values)

T=25°C

1.0

0.1

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

j

(maximum values)

V (V)

FM

2 Packaging information

Table 4. DPAK dimensions

Figure 10. Thermal resistance junction to

ambient versus copper surface
under tab (epoxy printed board
FR4, Cu = 35 µm) (DPAK)

R (°C/W)

th(j-a)

100

80

60

40

20

0

02468101214161820

S(mm²)

DIMENSIONS

REF.

Millimeters Inches

Min. Max Min. Max.

E

B2

L2

C2

A

A 2.20 2.40 0.086 0.094

A1 0.90 1.10 0.035 0.043

A2 0.03 0.23 0.001 0.009

B 0.64 0.90 0.025 0.035

B2 5.20 5.40 0.204 0.212

D

A1

R

C 0.45 0.60 0.017 0.023

C2 0.48 0.60 0.018 0.023

R

C

D 6.00 6.20 0.236 0.244

E 6.40 6.60 0.251 0.259

H

L4

B

G

G 4.40 4.60 0.173 0.181

0.60 MIN.

A2

H 9.35 10.10 0.368 0.397

L2 0.80 typ. 0.031 typ.

V2

L4 0.60 1.00 0.023 0.039

V2 0° 8° 0° 8°

4/7

STPS8L30 Packaging information

Figure 11. DPAK footprint dimensions (in mm)

6.7

Table 5. IPAK Dimensions

E

B2

L2

6.7 3 3

A

C2

D

1.6

2.3

2.3

1.6

DIMENSIONS

REF.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 2.20 2.40 0.086 0.094

A1 0.90 1.10 0.035 0.043

A3 0.70 1.30 0.027 0.051

B 0.64 0.90 0.025 0.035

B2 5.20 5.40 0.204 0.212

B3 0.95 0.037

B5 0.30 0.035

C 0.45 0.60 0.017 0.023

H

L1

L

B3

B

V1

B5

e

G

A1

C

A3

C2 0.48 0.60 0.019 0.023

D 6 6.20 0.236 0.244

E 6.40 6.60 0.252 0.260

e 2.28 0.090

G 4.40 4.60 0.173 0.181

H 16.10 0.634

L 9 9.40 0.354 0.370

L1 0.8 1.20 0.031 0.047

L2 0.80 1 0.031 0.039

V1 10° 10°

In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.

5/7

Ordering information STPS8L30

3 Ordering information

Ordering type Marking Package Weight Base qty Delivery mode

STPS8L30B LS30

STPS8L30B-TR LS30 2500 Tape and reel

STPS8L30H STPS8L30H IPAK 0.35 g 75 Tube

4 Revision history

Date Revision Description of Changes

Jul-2002 2A Previous update.

16-Apr-2005 3 IPAK package added.

01-Mar-2006 4

DPAK 0.30 g

75 Tube

IPAK connector identifiers corrected on page 1. Ecopack
statement added. Document reformatted to current standard.

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STPS8L30

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