Datasheet STPS8H100 Datasheet (ST)

Main product characteristics

I

F(AV)

V

RRM

T

j

(max) 0.58 V

V

F

Features and benefits

8 A

100 V

175° C

STPS8H100

High voltage power Schottky rectifier

K

A

NC

D2PAK

STPS8H100G

■ Negligible switching losses

■ High junction temperature capability

■ Low leakage current

■ Good trade off between leakage current and

A

K

TO-220AC

STPS8H100D

TO-220FPAC

STPS8H100FP

A

K

forward voltage drop

■ Insulated package:

– TO-220FPAC

Insulating voltage = 2000 V DC

Order Codes

Typical package capacitance = 12 pF

■ Avalanche capability specified

Description

Schottky barrier rectifier designed for high
frequency compact Switched Mode Power

Part Number Marking

STPS8H100D STPS8H100D

STPS8H100G STPS8H100G

STPS8H100G-TR STPS8H100G

STPS8H100FP STPS8H100FP

Supplies such as adaptators and on board
DC/DC converters.

Table 1. Absolute ratings (limiting values)

Symbol Parameter Value Unit

V

RRM

I

F(RMS)

I

F(AV)

I

FSM

P

ARM

T

Repetitive peak reverse voltage 100

RMS forward voltage 30

2

Average forward current
δ = 0.5

TO-220AC, D

DO-15 TC = 150° C

PA K TC = 165° C

Surge non repetitive forward current tp = 10 ms sinusoidal 250

Repetitive peak avalanche power tp = 1 µs Tj = 25° C 10800

Storage temperature range -65 to + 175 ° C

stg

Maximum operating junction temperature 175 ° C

T

j

8

V

A

A

A

W

June 2006 Rev 10 1/9

www.st.com

9

Characteristics STPS8H100

=tp/T

t

p

1 Characteristics

Table 2. Thermal resistance

Symbol Parameter Value Unit

R

th(j-c)

Table 3. Static electrical characteristics (per diode)

Junction to case

TO-220FPAC 4

TO-220AC, D

2

PA K 1 . 6

Symbol Parameter Tests conditions Min. Typ Max. Unit

T

(1)

I

R

V

F

Reverse leakage current

(2)

Forward voltage drop

1. tp = 5 ms, δ < 2%

= 380 µs, δ < 2%

2. t

p

= 25° C

j

T

= 125° C 2 6.0 mA

j

= 25° C

T

j

T

= 125° C 0.56 0.58

j

T

= 25° C

j

T

= 125° C 0.59 0.64

j

T

= 25° C

j

T

= 125° C 0.65 0.68

j

= V

V

R

= 8 A

I

F

= 10 A

I

F

= 16 A

I

F

RRM

4.5 µA

0.71

0.77

0.81

° C/W

V

To evaluate the conduction losses use the following equation:
P = 0.48 x I

+ 0.0125 I

F(AV)

F2(RMS)

Figure 1. Average forward power

dissipation versus average
forward current

P (W)

F(av)

6.0

5.5

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0
012345678910

δ = 0.05

δ = 0.1

I (A)

F(av)

δ = 0.2

δ = 0.5

δ

=tp/T

δ = 1

T

Figure 2. Normalized avalanche power

derating versus pulse duration

P(t)

ARM p

P (1µs)

ARM

1

0.1

0.01

t

p

0.001

0.10.01 1

t (µs)

p

10 100 1000

2/9

STPS8H100 Characteristics

=tp/T

t

p

=tp/T

t

p

=tp/T

t

p

Figure 3. Normalized avalanche power

derating versus junction
temperature

P(t)

ARM p

P (25°C)

ARM

1.2

1

0.8

0.6

0.4

0.2

0

25 50 75 100 125 150

T (°C)

j

Figure 5. Average forward current versus

ambient temperature, δ = 0.5,
(TO-220FPAC)

I

(A)

F(av)

10

8

6

4

2

δ

0

0 20 40 60 80 100 120 140 160 180

=tp/T

T

R

th(j-a)=Rth(j-c)

t

p

R

th(j-a)

T

amb

=50°C/W

(°C)

Figure 4. Average forward current versus

ambient temperature, δ = 0.5,

T

amb

2

PAK)

R

th(j-a)

(°C)

R

th(j-a)=Rth(j-c)

=15°C/W

(TO-220AC, D

I

(A)

F(av)

10

8

6

4

2

0

0 20 40 60 80 100 120 140 160 180

=tp/T

δ

T

t

p

Figure 6. Non repetitive surge peak

forward current versus overload
duration - maximum values, per
diode (TO-220AC, D

IM(A)

160

140

120

100

80

60

40

IM

20

0

1E-3 1E-2 1E-1 1E+0

δ=0.5

t

t(s)

2

Tc=100°C

PAK)

Tc=75°C

Tc=125°C

Figure 7. Non repetitive surge peak forward

current versus overload duration

- maximum values (TO-220FPAC)

IM(A)

100

90
80
70
60
50
40
30

IM

20
10

0
1E-3 1E-2 1E-1 1E+0

δ=0.5

t

Tc=100°C

t(s)

Tc=75°C

Tc=125°C

Figure 8. Relative variation of thermal

impedance junction to case versus

δ

=tp/T

T

2

PAK)

t

p

pulse duration (TO-220AC, D

Z

th(j-c)/Rth(j-c)

1.0

0.8

δ = 0.5

0.6

0.4

δ = 0.2

δ = 0.1

0.2

0.0
1E-4 1E-3 1E-2 1E-1 1E+0

3/9

Single pulse

tp(s)

Characteristics STPS8H100

=tp/T

t

p

Figure 9. Relative variation of thermal

impedance junction to case versus
pulse duration (TO-220FPAC)

Z

th(j-c)/Rth(j-c)

1.0

0.8

δ = 0.5

0.6

0.4

δ = 0.2

δ = 0.1

0.2

0.0
1E-3 1E-2 1E-1 1E+0 1E+1

Single pulse

tp(s)

δ

T

=tp/T

Figure 11. Junction capacitance versus

reverse voltage applied (typical
values)

C(pF)

1000

500

F=1MHz
Tj=25°C

Figure 10. Reverse leakage current versus

reverse voltage applied (typical
values)

IR(µA)

5E+3

1E+3

Tj=125°C

1E+2

1E+1

1E+0

Tj=25°C

1E-1

t

p

1E-2

0 102030405060708090100

VR(V)

Figure 12. Forward voltage drop versus

forward current (maximum values)

IFM(A)

50.0

10.0

Tj=125°C

Tj=25°C

200

VR(V)

100

1 10 100

Figure 13. Thermal resistance junction to

ambient versus copper surface
under tab - Epoxy printed circuit
board FR4, e

R

(°C/W)

th(j-a)

80

70

60

50

40

30

20

10

0

0 4 8 12 16 20 24 28 32 36 40

= 35 µm (D2PA K)

cu

S

(cm²)

(Cu)

1.0

VFM(V)

0.1
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6

4/9

STPS8H100 Package information

2 Package information

Epoxy meets UL94, V0.

Table 4 . D

2

PAK Dimensions

Dimensions

REF.

Millimeters Inches

Min. Max. Min. Max.

L2

A

E

C2

A 4.40 4.60 0.173 0.181

A1 2.49 2.69 0.098 0.106

A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037

D

L

L3

A1

B2

B

G

2.0 MIN.
FLAT ZONE

C

A2

R

B2 1.14 1.70 0.045 0.067

C 0.45 0.60 0.017 0.024

C2 1.23 1.36 0.048 0.054

D 8.95 9.35 0.352 0.368

E 10.00 10.40 0.393 0.409

G 4.88 5.28 0.192 0.208

L 15.00 15.85 0.590 0.624

L2 1.27 1.40 0.050 0.055

L3 1.40 1.75 0.055 0.069

V2

M 2.40 3.20 0.094 0.126

R 0.40 typ. 0.016 typ.

V2 0° 8° 0° 8°

Figure 14. D2PAK footprint dimensions (in mm)

16.90

10.30

8.90

5/9

5.08

1.30

3.70

Package information STPS8H100

Table 5. TO-220AC Dimensions

Dimensions

L2

F1

REF.

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

H2

Ø I

L5

A

C

L7

C 1.23 1.32 0.048 0.051

D 2.40 2.72 0.094 0.107

E 0.49 0.70 0.019 0.027

F 0.61 0.88 0.024 0.034

L6

F1 1.14 1.70 0.044 0.066

G 4.95 5.15 0.194 0.202

L9

D

H2 10.00 10.40 0.393 0.409

L2 16.40 typ. 0.645 typ.

L4

F

M

E

G

L4 13.00 14.00 0.511 0.551

L5 2.65 2.95 0.104 0.116

L6 15.25 15.75 0.600 0.620

L7 6.20 6.60 0.244 0.259

L9 3.50 3.93 0.137 0.154

M 2.6 typ. 0.102 typ.

Diam. I 3.75 3.85 0.147 0.151

6/9

STPS8H100 Package information

Table 6. TO-220FPAC Dimensions

Dimensions

L3

L2

L4

G1

REF.

Millimeters Inches

Min. Max. Min. Max.

A

H

B

A 4.4 4.6 0.173 0.181

B 2.5 2.7 0.098 0.106

D 2.5 2.75 0.098 0.108

Dia

L6

E 0.45 0.70 0.018 0.027

F 0.75 1 0.030 0.039

F1 1.15 1.70 0.045 0.067

L7

G 4.95 5.20 0.195 0.205

G1 2.4 2.7 0.094 0.106

H 10 10.4 0.393 0.409

F1

L5

D

L2 16 Typ. 0.63 Typ.

L3 28.6 30.6 1.126 1.205

F

E

L4 9.8 10.6 0.386 0.417

L5 2.9 3.6 0.114 0.142

G

L6 15.9 16.4 0.626 0.646

L7 9.00 9.30 0.354 0.366

Dia. 3.00 3.20 0.118 0.126

In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.

7/9

Ordering information STPS8H100

3 Ordering information

Ordering type Marking Package Weight Base qty Delivery mode

STPS8H100D STPS8H100D TO-220AC 1.86 g 50 Tube

STPS8H100FP STPS8H100FP TO-220FPAC 1.9 g 50 Tube

STPS8H100G STPS8H100G D

2

PAK 1.48 g 50 Tube

STPS8H100G-TR STPS8H100G D2PAK 1.48 g 500 Tape and reel

4 Revision history

Date Revision Description of Changes

Jul-2003 6D Last update.

Reformatted to current standard. Added ECOPACK statement.

1-June-2006 10

Changed nF to pF in Figure 11. Revision number set to 10 to align
with on-line versioning.

8/9

STPS8H100

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