Insulating voltage = 2000 V DC
Capacitance = 12 pF
■ Avalanche capability specified
A1
K
A2
K
A2
A1
DPAK
STPS640CB
TO-220AB
STPS640CT
A2
K
A1
A1
A2
K
TO-220FPAB
STPS640CFP
Description
Dual Schottky rectifier suited to Switch Mode
Power Supplies and other Power Converters.
This device is intended for use in low and medium
voltage operation, and particulary, in high
frequency circuitries where low switching losses
are required (free wheeling and polarity
protection).
March 2007 Rev 71/9
www.st.com
9
Page 2
CharacteristicsSTPS640C
1 Characteristics
Table 1.Absolute ratings (limiting values, per diode)
SymbolParameterValueUnit
V
I
F(RMS)
I
F(AV)
I
I
P
T
dV/dtCritical rate of rise of reverse voltage10000V/µs
To evaluate the conduction losses use the following equation:
P = 0.42 x I
F(AV)
+ 0.050 I
F2(RMS)
V
2/9
Page 3
STPS640Characteristics
Figure 1.Average forward power
dissipation versus average
forward current (per diode)
P(W)
F(AV)
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
0.00.51.01.52.02.53.03.54.0
δ = 0.05
δ = 0.1
δ = 0.2
I(A)
F(AV)
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Figure 3.Normalized avalanche power
derating versus pulse duration
P(t)
ARM p
P(1µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.011
p
101001000
Figure 5.Non repetitive surge peak forward
current versus overload duration.
(Maximum values, per diode)
(TO-220AB / DPAK)
Figure 2.Average forward current versus
ambient temperature
(
δ = 0.5, per diode)
I(A)
F(AV)
4.0
3.5
3.0
2.5
2.0
1.5
δ
=tp/T
T
tp
1.0
0.5
0.0
0255075100125150
R=R
th(j-a) th(j-c)
T(°C)
amb
TO-220FPAB
R =15°C/W
th(j-a)
TO-220AB / DPAK
Figure 4.Normalized avalanche power
derating versus junction
temperature
P(t)
ARM p
P(25°C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
255075100125150
T (°C)
j
Figure 6.Non repetitive surge peak forward
current versus overload duration.
(Maximum values, per diode)
(TO-220FPAB)
I (A)
M
45
40
35
30
25
20
15
10
IM
5
0
1E-31E-21E-11E+0
δ=0.5
t
t(s)
T =75°C
C
T =100°C
C
T =135°C
C
I (A)
M
40
35
30
25
20
15
10
IM
5
0
1E-31E-21E-11E+0
δ=0.5
t
t(s)
T =75°C
C
T =100°C
C
T =130°C
C
3/9
Page 4
CharacteristicsSTPS640C
Figure 7.Relative variation of thermal
transient impedance junction to
case versus pulse duration
(TO-220AB/DPAK)
Z/R
th(j-c) th(j-c)
1.0
0.8
δ = 0.5
0.6
0.4
δ = 0.2
δ = 0.1
0.2
Single pulse
0.0
1E-31E-21E-11E+0
t (s)
p
δ
T
=tp/T
Figure 9.Reverse leakage current versus
reverse voltage applied (typical
values, per diode)
I (A)
R
1E-2
1E-3
T =150°C
j
T =125°C
j
T =100°C
j
Figure 8.Relative variation of thermal
impedance junction to case versus
pulse duration
(TO-220FPAB)
Z/R
th(j-c) th(j-c)
1.0
0.8
0.6
δ = 0.5
0.4
δ = 0.2
δ = 0.1
0.2
t (s)
tp
Single pulse
0.0
1E-31E-21E-11E+01E+1
p
Figure 10. Junction capacitance versus
reverse voltage applied (typical
values, per diode)
C(pF)
500
100
δ
=tp/T
T
F=1MHz
V =30mV
OSCRMS
T =25°C
j
tp
1E-4
1E-5
0510152025303540
T =75°C
j
V (V)
R
Figure 11. Forward voltage drop versus
forward current (maximum values,
per diode)
I (A)
FM
10.0
T =150°C
j
(typical values)
T =25°C
j
1.0
V (V)
0.1
0.00.10.20.30.40.50.60.70.80.91.0
FM
V (V)
10
1251020 50
R
Figure 12. Thermal resistance junction to
ambient versus copper surface
under tab (Epoxy printed circuit
board FR4, copper thickness:
35 µm)
R(°C/W)
th(j-a)
80
70
60
50
40
30
20
10
0
0481216202428323640
S(Cu)(cm²)
4/9
Page 5
STPS640Package information
2 Package information
●Epoxy meets UL94, V0
●Cooling method: by conduction (C)
●Recommended torque value: 0.55 Nm
●Maximum torque value: 0.70 Nm
Table 4.TO-220FPAB dimensions
Dimensions
Ref
MillimetersInches
Min.Max.Min.Max.
A 4.4 4.6 0.173 0.181
A
H
B
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.018 0.027
Dia
L6
L2
L3
L5
F1
L4
F2
D
L7
F 0.75 1 0.030 0.039
F1 1.15 1.70 0.045 0.067
F2 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.205
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 Typ. 0.63 Typ.
G1
F
E
L3 28.6 30.6 1.126 1.205
L4 9.8 10.6 0.386 0.417
G
L5 2.9 3.6 0.114 0.142
L6 15.9 16.4 0.626 0.646
L7 9.00 9.30 0.354 0.366
Dia. 3.00 3.20 0.118 0.126
5/9
Page 6
Package informationSTPS640C
Table 5.DPAK dimensions
Dimensions
Ref
A 2.20 2.40 0.086 0.094
E
B2
L2
H
L4
B
G
A1
A
C2
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035
R
D
R
C
B2 5.20 5.40 0.204 0.212
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
0.60 MIN.
A2
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397
V2
L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039
V2 0° 8° 0° 8°
Figure 13. Footprint (dimensions in millimeters)
MillimetersInches
Min.Max.Min.Max.
6.7
6.733
1.6
2.3
2.3
1.6
6/9
Page 7
STPS640Package information
Table 6.TO-220AB dimensions
Dimensions
L2
F2
F1
F
G1
H2
Dia
Ref
MillimetersInches
Min.Max.Min.Max.
A 4.40 4.60 0.173 0.181
A
C
L5
L6
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
L7
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
L9
L4
D
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ.
M
E
G
L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. 3.75 3.85 0.147 0.151
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
7/9
Page 8
Ordering informationSTPS640C
3 Ordering information
Ordering typeMarkingPackageWeight Base qtyDelivery mode
STPS640CT STPS640CTTO-220AB 2.20 g50Tube
STPS640CB S640C DPAK 0.30 g75Tube
STPS640CB-TR S640C DPAK 0.30 g2500Tape and reel
STPS640CFP STPS640CFPTO-220FPAB 2.08 g50Tube
4 Revision history
DateRevisionDescription of Changes
Aug-20036BLast release.
22-Mar-20077Removed ISOWATT package.
8/9
Page 9
STPS640
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