CURRENT AND FORWARD VOLTAGE DROP
LOW THERMAL RESISTANCE
■
■ HIGH FREQUENCY OPERATION
DESCRIPTION
Dual center tap Schottky rectifiers suited for high
frequency switch mode power supply.
Packaged in TO-247, this devices is intended for
use to enhance the reliability of the application.
ABSOLUTE RATINGS (limiting values, per diode)
SymbolParameterValueUnit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
P
ARM
T
stg
Tj
dV/dt
Repetitive peak reverse voltage
RMS forward current
Average forward currentTc = 150°C
δ = 0.5
Per diode
Per device
Surge non repetitive forward currenttp = 10 ms Sinusoidal
Repetitive peak avalanche powertp = 1µsTj = 25°C
Storage temperature range
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
150V
80A
30
60
500A
31800W
- 65 to + 175°C
175°C
10000V/µs
A
dPtot
*:
<
dTjRth ja
October 2003 - Ed: 1A
thermal runaway condition for a diode on its own heatsink
−1()
1/5
Page 2
STPS61150CW
THERMAL RESISTANCES
SymbolParameterValueUnit
R
th(j-c)
Junction to case
Per diode
Total
R
th(j-c)
Junction to case
Coupling0.3°C/W
When the diodes 1 and 2 are used simultaneously :
∆ Tj(diode 1) = P(diode1) x R
(Per diode) + P(diode 2) x R
th(j-c)
th(c)
STATIC ELECTRICAL CHARACTERISTICS (per diode)
SymbolParameterTests ConditionsMin.Typ.Max.Unit
*
I
R
V
F
Pulse test : *tp = 380 µs, δ <2%
To evaluate the conduction losses use the following equation :
P=0.54xI
Reverse leakage
current
*
Forward voltage dropTj = 25°CI
Tj = 25°CVR=V
Tj = 125°C
Tj = 125°CI
Tj=25°CI
Tj = 125°CI
+ 0.0043 I
F(AV)
F2(RMS)
=30A
F
=30A
F
=60A
F
=60A
F
RRM
0.9
°C/W
0.6
720µA
725mA
0.84V
0.630.67
0.92
0.760.8
Fig. 1: Conduction losses versus average current
(per diode).
P(W)
F(AV)
30
25
20
15
10
5
0
0510152025303540
δ = 0.05
δ = 0.1
δ = 0.2
I(A)
F(AV)
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Fig. 3: Normalized avalanche power derating
versus junction temperature.
P(t)
ARM p
P(25°C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
255075100125150
T (°C)
j
Fig. 2: Normalized avalanche power derating
versus pulse duration.
P(t)
ARM p
P(1µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.011
p
101001000
Fig. 4: Average forward current versus ambient
temperature (δ=0.5, per diode).
I(A)
F(AV)
35
30
25
20
15
10
5
0
0255075100125150175
δ
=tp/T
T
tp
R=R
th(j-a) th(j-c)
R =15°C/W
th(j-a)
T(°C)
amb
2/4
Page 3
STPS61150CW
Fig. 5: Non repetitive surge peak forward current
versus overload duration (maximum values, per
diode).
I (A)
M
400
350
300
250
200
150
100
IM
50
0
1.E-031.E-021.E-011.E+00
δ=0.5
t
t(s)
T =50°C
c
T =75°C
c
T =125°C
c
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values, per diode).
I (µA)
R
1.E+05
T=150°C
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1030507090110130150
j
T=125°C
j
T=100°C
j
T=75°C
j
T=50°C
j
T=25°C
j
V (V)
R
Fig. 6: Relative variation of thermal impedance
junction to case versus pulse duration.
Z/R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
δ = 0.5
0.6
0.5
0.4
δ = 0.2
δ = 0.1
0.3
0.2
Single pulse
0.1
0.0
1.E-031.E-021.E-011.E+00
t (s)
p
δ
=tp/T
T
tp
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values, per diode).
C(pF)
10000
1000
V (V)
100
1101001000
R
F=1MHz
V =30mV
OSCRMS
T=25°C
j
Fig. 9: Forward voltage drop versus forward
current (per diode).
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